WO2009001958A1 - 光モジュール - Google Patents

光モジュール Download PDF

Info

Publication number
WO2009001958A1
WO2009001958A1 PCT/JP2008/061849 JP2008061849W WO2009001958A1 WO 2009001958 A1 WO2009001958 A1 WO 2009001958A1 JP 2008061849 W JP2008061849 W JP 2008061849W WO 2009001958 A1 WO2009001958 A1 WO 2009001958A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical module
packages
lightwave circuit
planar lightwave
waveguide
Prior art date
Application number
PCT/JP2008/061849
Other languages
English (en)
French (fr)
Inventor
Takaharu Ohyama
Yoshiyuki Doi
Ikuo Ogawa
Akimasa Kaneko
Yasuaki Tamura
Yuichi Suzuki
Original Assignee
Nippon Telegraph And Telephone Corporation
Ntt Electronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph And Telephone Corporation, Ntt Electronics Corporation filed Critical Nippon Telegraph And Telephone Corporation
Priority to JP2009520660A priority Critical patent/JP5094860B2/ja
Priority to US12/666,583 priority patent/US8545111B2/en
Publication of WO2009001958A1 publication Critical patent/WO2009001958A1/ja

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G02B6/12019Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/428Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4283Electrical aspects with electrical insulation means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/30Optical coupling means for use between fibre and thin-film device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02208Mountings; Housings characterised by the shape of the housings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02251Out-coupling of light using optical fibres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/02325Mechanically integrated components on mount members or optical micro-benches

Abstract

 光モジュールの構造を、パッケージに加わる応力を緩和する構造とする。平面光波回路(30)の導波路(37)の端面に、光素子を収容した複数のパッケージ(40)が、導波路と光素子とが光学的に結合するように接合された光モジュールにおいて、平面光波回路および複数のパッケージを収容する筐体(3)であって、底部に形成された突出部(270)の上面に平面光波回路(30)を固定する筐体(3)を備え、複数のパッケージ(40)と筐体(3)に配置された電気部品(22)とは、パッケージごとにフレキシブルプリント基板(271a,271b)を介して電気的に接続されている。
PCT/JP2008/061849 2007-06-28 2008-06-30 光モジュール WO2009001958A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009520660A JP5094860B2 (ja) 2007-06-28 2008-06-30 光モジュール
US12/666,583 US8545111B2 (en) 2007-06-28 2008-06-30 Optical module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-171164 2007-06-28
JP2007171164 2007-06-28

Publications (1)

Publication Number Publication Date
WO2009001958A1 true WO2009001958A1 (ja) 2008-12-31

Family

ID=40185764

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061849 WO2009001958A1 (ja) 2007-06-28 2008-06-30 光モジュール

Country Status (3)

Country Link
US (1) US8545111B2 (ja)
JP (1) JP5094860B2 (ja)
WO (1) WO2009001958A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013007797A (ja) * 2011-06-22 2013-01-10 Nippon Telegr & Teleph Corp <Ntt> 平面型光波回路
US9201194B2 (en) 2013-01-10 2015-12-01 Ntt Electronics Corporation Optical module
JP2015219478A (ja) * 2014-05-21 2015-12-07 住友電気工業株式会社 光トランシーバ

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110085773A1 (en) * 2009-10-13 2011-04-14 Electronics And Telecommunications Research Institute Optical waveguide and method of forming the same
US9063310B2 (en) * 2011-04-12 2015-06-23 Sumitomo Electric Industries, Ltd. Optical transceiver implementing with flexible printed circuit connecting optical subassembly to circuit board
US9509433B2 (en) * 2013-05-14 2016-11-29 Applied Optoelectronics, Inc. Aligning and directly optically coupling photodetectors to optical demultiplexer outputs in a multichannel receiver optical subassembly
EP3075082B1 (en) * 2013-11-25 2023-10-18 Applied Optoelectronics, Inc. Photodetectors aligning and coupling optical demultiplexer outputs
KR101906592B1 (ko) * 2014-11-27 2018-10-12 한국전자통신연구원 광모듈
US10088697B2 (en) * 2015-03-12 2018-10-02 International Business Machines Corporation Dual-use electro-optic and thermo-optic modulator
WO2016149289A1 (en) * 2015-03-16 2016-09-22 California Institute Of Technology Differential ring modulator
US9847434B2 (en) 2015-03-23 2017-12-19 Applied Optoelectronics, Inc. Multichannel receiver optical subassembly with improved sensitivity
WO2016191386A1 (en) 2015-05-22 2016-12-01 California Institute Of Technology Optical ring modulator thermal tuning technique
US10996409B2 (en) 2018-10-22 2021-05-04 Ii-Vi Delaware, Inc. Plastic composite lens array in optical networks
KR102457177B1 (ko) * 2020-01-23 2022-10-24 한국전자통신연구원 광 송신 모듈

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6128240A (ja) * 1984-07-18 1986-02-07 Kuraray Co Ltd 基板間信号伝送方式
JPS63205617A (ja) * 1987-02-20 1988-08-25 Fujitsu Ltd 導波路型光デバイスの構造
JPH0273207A (ja) * 1988-09-09 1990-03-13 Nippon Telegr & Teleph Corp <Ntt> 光導波路部品の実装構造
JPH041604A (ja) * 1990-04-18 1992-01-07 Fujitsu Ltd 光導波路デバイスの固定方法
JPH0667041A (ja) * 1991-08-05 1994-03-11 Nippon Telegr & Teleph Corp <Ntt> 光導波回路モジュールおよび該モジュールを有する導波型光部品
JPH11345932A (ja) * 1998-05-19 1999-12-14 Lucent Technol Inc 集積回路パッケ―ジ
JP2003283075A (ja) * 2002-03-26 2003-10-03 Aica Kogyo Co Ltd 光電気バックプレーンボード及び情報処理装置
JP2004206015A (ja) * 2002-12-26 2004-07-22 Mitsui Chemicals Inc 光電気混載配線板
JP2005084126A (ja) * 2003-09-04 2005-03-31 Ngk Spark Plug Co Ltd 光電気複合基板、光導波路、及び光学素子付光導波路
WO2006035633A1 (ja) * 2004-09-27 2006-04-06 Nec Corporation 光信号入出力機構を有する半導体装置
JP2006243391A (ja) * 2005-03-03 2006-09-14 Nippon Telegr & Teleph Corp <Ntt> 平面光波回路モジュール
WO2007037364A1 (ja) * 2005-09-29 2007-04-05 Nippon Telegraph And Telephone Corporation 光モジュール

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JPH0792342A (ja) * 1993-07-29 1995-04-07 Sumitomo Electric Ind Ltd 光導波路モジュール
JPH08286073A (ja) * 1995-04-18 1996-11-01 Sumitomo Electric Ind Ltd 光導波路の実装用パッケージ構造
US6480639B2 (en) * 1997-09-26 2002-11-12 Nippon Telegraph And Telephone Corp. Optical module
JP3459787B2 (ja) * 1999-04-02 2003-10-27 Nec化合物デバイス株式会社 光半導体モジュール及びその製造方法
US6950314B2 (en) * 2004-02-27 2005-09-27 Infineon Technologies Ag Arrangement for the electrical connection of an optoelectronic component to an electrical component
JP4728625B2 (ja) 2004-10-29 2011-07-20 日本電信電話株式会社 光半導体装置およびそれを用いた光モジュール

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6128240A (ja) * 1984-07-18 1986-02-07 Kuraray Co Ltd 基板間信号伝送方式
JPS63205617A (ja) * 1987-02-20 1988-08-25 Fujitsu Ltd 導波路型光デバイスの構造
JPH0273207A (ja) * 1988-09-09 1990-03-13 Nippon Telegr & Teleph Corp <Ntt> 光導波路部品の実装構造
JPH041604A (ja) * 1990-04-18 1992-01-07 Fujitsu Ltd 光導波路デバイスの固定方法
JPH0667041A (ja) * 1991-08-05 1994-03-11 Nippon Telegr & Teleph Corp <Ntt> 光導波回路モジュールおよび該モジュールを有する導波型光部品
JPH11345932A (ja) * 1998-05-19 1999-12-14 Lucent Technol Inc 集積回路パッケ―ジ
JP2003283075A (ja) * 2002-03-26 2003-10-03 Aica Kogyo Co Ltd 光電気バックプレーンボード及び情報処理装置
JP2004206015A (ja) * 2002-12-26 2004-07-22 Mitsui Chemicals Inc 光電気混載配線板
JP2005084126A (ja) * 2003-09-04 2005-03-31 Ngk Spark Plug Co Ltd 光電気複合基板、光導波路、及び光学素子付光導波路
WO2006035633A1 (ja) * 2004-09-27 2006-04-06 Nec Corporation 光信号入出力機構を有する半導体装置
JP2006243391A (ja) * 2005-03-03 2006-09-14 Nippon Telegr & Teleph Corp <Ntt> 平面光波回路モジュール
WO2007037364A1 (ja) * 2005-09-29 2007-04-05 Nippon Telegraph And Telephone Corporation 光モジュール

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013007797A (ja) * 2011-06-22 2013-01-10 Nippon Telegr & Teleph Corp <Ntt> 平面型光波回路
US9116317B2 (en) 2011-06-22 2015-08-25 Nippon Telegraph And Telephone Corporation Planar lightwave circuit
US9459417B2 (en) 2011-06-22 2016-10-04 Nippon Telegraph And Telephone Corporation Planar lightwave circuit
US9201194B2 (en) 2013-01-10 2015-12-01 Ntt Electronics Corporation Optical module
JP2015219478A (ja) * 2014-05-21 2015-12-07 住友電気工業株式会社 光トランシーバ

Also Published As

Publication number Publication date
US20100322569A1 (en) 2010-12-23
JPWO2009001958A1 (ja) 2010-08-26
JP5094860B2 (ja) 2012-12-12
US8545111B2 (en) 2013-10-01

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