WO2008133300A1 - ポリイミド前駆体及びポリイミド並びに画像形成下層膜塗布液 - Google Patents

ポリイミド前駆体及びポリイミド並びに画像形成下層膜塗布液 Download PDF

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Publication number
WO2008133300A1
WO2008133300A1 PCT/JP2008/057959 JP2008057959W WO2008133300A1 WO 2008133300 A1 WO2008133300 A1 WO 2008133300A1 JP 2008057959 W JP2008057959 W JP 2008057959W WO 2008133300 A1 WO2008133300 A1 WO 2008133300A1
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WIPO (PCT)
Prior art keywords
polyimide
polyimide precursor
coating solution
image formation
layer film
Prior art date
Application number
PCT/JP2008/057959
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English (en)
French (fr)
Inventor
Shinichi Maeda
Yosuke Iinuma
Original Assignee
Nissan Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Industries, Ltd. filed Critical Nissan Chemical Industries, Ltd.
Priority to KR1020097022014A priority Critical patent/KR101496701B1/ko
Priority to CN2008800129481A priority patent/CN101663348B/zh
Priority to JP2009511902A priority patent/JP5321839B2/ja
Priority to EP08752050.8A priority patent/EP2147948B1/en
Priority to US12/451,069 priority patent/US8703863B2/en
Publication of WO2008133300A1 publication Critical patent/WO2008133300A1/ja
Priority to US14/175,236 priority patent/US9732253B2/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)
  • Thin Film Transistor (AREA)

Abstract

【課題】少ない紫外線照射量でも容易に形成された硬化膜の膜表面の親疎水性を変化する事ができるポリイミド前駆体及び該ポリイミド前駆体から得られるポリイミドを提供すること。 【解決手段】下記式（１）で表される構造を有するポリイミド前駆体。 （式中、Ａは４価の有機基を表し、Ｂは主鎖にチオールエステル結合を有する２価の有機基を表し、Ｒ1及びＲ2はそれぞれ独立して水素原子又は一価の有機基を表し、ｎは自然数を表す。）
PCT/JP2008/057959 2007-04-25 2008-04-24 ポリイミド前駆体及びポリイミド並びに画像形成下層膜塗布液 WO2008133300A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020097022014A KR101496701B1 (ko) 2007-04-25 2008-04-24 폴리이미드 전구체, 폴리이미드, 및 화상 형성 하층막 도포액
CN2008800129481A CN101663348B (zh) 2007-04-25 2008-04-24 聚酰亚胺前体和聚酰亚胺以及形成图像的下层膜涂布液
JP2009511902A JP5321839B2 (ja) 2007-04-25 2008-04-24 ポリイミド前駆体及びポリイミド並びに画像形成下層膜塗布液
EP08752050.8A EP2147948B1 (en) 2007-04-25 2008-04-24 Polyimide precursor, polyimide, and coating solution for under layer film for image formation
US12/451,069 US8703863B2 (en) 2007-04-25 2008-04-24 Polyimide precursor, polyimide, and coating solution for under layer film for image formation
US14/175,236 US9732253B2 (en) 2007-04-25 2014-02-07 Polyimide precursor, polyimide, and coating solution for under layer film for image formation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007115435 2007-04-25
JP2007-115435 2007-04-25

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/451,069 A-371-Of-International US8703863B2 (en) 2007-04-25 2008-04-24 Polyimide precursor, polyimide, and coating solution for under layer film for image formation
US14/175,236 Division US9732253B2 (en) 2007-04-25 2014-02-07 Polyimide precursor, polyimide, and coating solution for under layer film for image formation

Publications (1)

Publication Number Publication Date
WO2008133300A1 true WO2008133300A1 (ja) 2008-11-06

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PCT/JP2008/057959 WO2008133300A1 (ja) 2007-04-25 2008-04-24 ポリイミド前駆体及びポリイミド並びに画像形成下層膜塗布液

Country Status (7)

Country Link
US (2) US8703863B2 (ja)
EP (1) EP2147948B1 (ja)
JP (1) JP5321839B2 (ja)
KR (1) KR101496701B1 (ja)
CN (1) CN101663348B (ja)
TW (1) TWI461459B (ja)
WO (1) WO2008133300A1 (ja)

Cited By (3)

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WO2013089204A1 (ja) 2011-12-15 2013-06-20 旭硝子株式会社 撥液性化合物、撥液性重合体、硬化性組成物、塗布用組成物、ならびに硬化膜を有する物品、親液性領域と撥液性領域とのパターンを有する物品およびその製造方法
WO2013115195A1 (ja) 2012-01-31 2013-08-08 旭硝子株式会社 化合物、重合体、硬化性組成物、塗布用組成物、ならびに硬化膜を有する物品、親液性領域と撥液性領域とのパターンを有する物品およびその製造方法
WO2013133019A1 (ja) * 2012-03-05 2013-09-12 富士フイルム株式会社 パターン形成方法

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WO2008133300A1 (ja) * 2007-04-25 2008-11-06 Nissan Chemical Industries, Ltd. ポリイミド前駆体及びポリイミド並びに画像形成下層膜塗布液
TWI422573B (zh) * 2010-02-11 2014-01-11 Nat Univ Tsing Hua 有機薄膜電晶體暨其製備方法
JP6048143B2 (ja) * 2010-03-15 2016-12-21 日産化学工業株式会社 ポリアミック酸エステルとポリアミック酸とを含有する液晶配向剤及び液晶配向膜
JP5708636B2 (ja) * 2010-03-15 2015-04-30 日産化学工業株式会社 末端を修飾したポリアミック酸エステル含有液晶配向剤、及び液晶配向膜
KR101840416B1 (ko) * 2011-12-06 2018-03-20 주식회사 동진쎄미켐 레이저 열전사용 폴리이미드 감광성 조성물
JP5783380B2 (ja) * 2012-03-23 2015-09-24 Jsr株式会社 液晶配向剤および液晶配向膜の形成方法
JP5928129B2 (ja) * 2012-04-25 2016-06-01 Jnc株式会社 インクジェットインク
TWI483967B (zh) * 2012-12-13 2015-05-11 Chi Mei Corp 軟性基板用組成物及軟性基板
KR102241784B1 (ko) * 2013-10-23 2021-04-16 닛산 가가쿠 가부시키가이샤 액정 배향제, 액정 배향막, 및 액정 표시 소자
US20170165879A1 (en) * 2014-07-17 2017-06-15 Asahi Kasei Kabushiki Kaisha Resin precursor, resin composition containing same, polyimide resin membrane, resin film, and method for producing same
CN107407875B (zh) * 2015-03-16 2021-08-24 太阳控股株式会社 正型感光性树脂组合物、干膜、固化物和印刷电路板
DE102016112975A1 (de) * 2016-07-14 2018-01-18 Osram Oled Gmbh Inkjetdruckbare Zusammensetzung, organisch optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
CN111739918B (zh) * 2020-06-30 2023-01-10 京东方科技集团股份有限公司 显示面板、显示装置及制备方法
CN117343547B (zh) * 2023-12-04 2024-02-27 宁波长阳科技股份有限公司 一种Ag@聚吡咯/聚乙二醇-聚酰亚胺复合材料及制备方法、压力传感器

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Cited By (6)

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WO2013089204A1 (ja) 2011-12-15 2013-06-20 旭硝子株式会社 撥液性化合物、撥液性重合体、硬化性組成物、塗布用組成物、ならびに硬化膜を有する物品、親液性領域と撥液性領域とのパターンを有する物品およびその製造方法
WO2013115195A1 (ja) 2012-01-31 2013-08-08 旭硝子株式会社 化合物、重合体、硬化性組成物、塗布用組成物、ならびに硬化膜を有する物品、親液性領域と撥液性領域とのパターンを有する物品およびその製造方法
WO2013133019A1 (ja) * 2012-03-05 2013-09-12 富士フイルム株式会社 パターン形成方法
JP2013187203A (ja) * 2012-03-05 2013-09-19 Fujifilm Corp パターン形成方法
CN104160487A (zh) * 2012-03-05 2014-11-19 富士胶片株式会社 图案形成方法
US9193180B2 (en) 2012-03-05 2015-11-24 Fujifilm Corporation Pattern formation method

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KR101496701B1 (ko) 2015-03-12
EP2147948A1 (en) 2010-01-27
US20100069569A1 (en) 2010-03-18
US9732253B2 (en) 2017-08-15
KR20100015779A (ko) 2010-02-12
JP5321839B2 (ja) 2013-10-23
TW200911882A (en) 2009-03-16
EP2147948A4 (en) 2013-11-20
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EP2147948B1 (en) 2014-11-12
US8703863B2 (en) 2014-04-22

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