WO2008090635A1 - プローブおよびそれを用いた電気的接続装置 - Google Patents
プローブおよびそれを用いた電気的接続装置 Download PDFInfo
- Publication number
- WO2008090635A1 WO2008090635A1 PCT/JP2007/059424 JP2007059424W WO2008090635A1 WO 2008090635 A1 WO2008090635 A1 WO 2008090635A1 JP 2007059424 W JP2007059424 W JP 2007059424W WO 2008090635 A1 WO2008090635 A1 WO 2008090635A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe
- needle tip
- alignment mark
- flat surface
- arm portion
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Definitions
- the present invention relates to a probe suitable for use in an energization test of a semiconductor device such as a semiconductor integrated circuit, and an electrical connection device incorporating the probe.
- Probe card an electrical connection device generally called a probe card.
- the probe card is assembled in a tester for the current test, and a large number of probes (contacts) provided on the probe card are pressed against the corresponding electrodes of the object to be inspected on the stage.
- the object to be inspected is connected to a tester through this probe force mode, and is subjected to an energization test.
- the probe includes a base portion protruding from the probe substrate, an arm portion extending laterally from the base portion along the substrate, and a pad portion (needle tip portion) protruding from the arm portion to the opposite side of the substrate. And a needle tip is formed on the pad portion.
- the pad part prevents the interference between the lower surface of the arm part and the object to be inspected or other electrodes provided on the object when the needle point is pressed against the electrode of the object to be inspected. It is provided to make contact with the electrode.
- An alignment mark used for alignment between each probe of the probe card and a corresponding electrode of the test object is formed on the pad portion (see, for example, Patent Document 1 or 2). From the captured image of the alignment mark, the relative position information between the support base on which the test object is placed and the probe card is obtained, and the position of the probe card is adjusted based on this position information.
- Patent Document 1 Special Table 2 0 0 5— 5 3 3 2 6 3
- Patent Document 2 Japanese Patent Laid-Open No. 2 0 0 4-3 4 0 6 5 4
- the alignment mark provided on the pad section is the height of the needle tip. It will be provided in the vicinity. If the alignment mark is formed close to the height of the needle tip, electrode scraps attached to the needle tip may adhere to the alignment mark. Scraping the electrodes adhering to the alignment mark can make it difficult to accurately determine the image shape of the alignment mark. For this reason, it is sometimes difficult to accurately adjust the position of the conventional electrical connection device. Disclosure of the invention
- the purpose of this book is to provide a probe with an alignment mark that is not easily affected by the shaving of the electrode shaved by the probe tip and an electrical connection that incorporates the probe. To provide an apparatus. Means for solving the problem
- the probe according to the present invention includes a base portion having an attachment end and extending in a direction away from the attachment end, and an arm portion extending in the lateral direction from the base portion with an interval in the extension direction of the base portion. And a needle tip portion that protrudes from the arm portion and has a needle tip formed at the protruding end thereof, and an alignment mark for positioning the needle tip.
- the arm portion has a flat surface region on a side opposite to a side where the mounting end of the base portion is located when viewed along the extending direction of the arm portion, and the needle tip portion is formed so as to protrude from the flat surface region.
- the alignment mark is constituted by at least a part of the flat surface region.
- the distance from the flat surface region where the alignment mark is formed to the needle tip is equal to the height of the needle tip and the needle tip portion (pad portion) where the needle tip is formed. It becomes the sum of the steps. Therefore, since the distance is increased by the level difference of the needle tip portion as compared with the conventional distance, the increase in the level difference makes it difficult for the scraped electrode pad attached to the needle tip to adhere to the alignment mark.
- the probe according to the present invention is formed by forming a recess having the outer shape of a probe with a mask using, for example, photolithography, and depositing a conductive material for the probe in the recess using, for example, an electric plating. Relatively easy to form it can.
- this mask by forming a flat surface portion corresponding to the flat surface region at the edge of the recess that forms the planar shape of the probe, the arm portion is formed with the alignment mark.
- the probe according to the present invention can be easily formed without the need for special marking.
- the normal line of the flat surface region portion constituting the alignment mark be directed in the same direction as the protruding direction of the needle tip of the needle tip portion.
- the needle tip portion is formed so that the reflecting surface to the photographing device for photographing the alignment mark is not formed on the needle tip portion.
- the side surface of the needle tip portion is formed with an angular relationship exceeding 20 degrees with respect to the flat surface of the needle tip.
- the flat surface region of the arm portion may be formed by a lower surface of the arm portion.
- the lower surface may be formed in a rectangular planar shape that is located on the opposite side of the arm portion from the side where the mounting end of the base portion is located and extends along the extending direction of the arm portion.
- the needle tip portion may be formed on the lower surface so as to divide the lower surface in the extending direction of the arm portion.
- the alignment mark can be constituted by one flat surface region portion divided by the needle tip portion of the lower surface.
- the alignment mark can be constituted by the surface area portion.
- the alignment mark can be formed in a substantially square shape.
- a side wall rising from the flat surface region portion is formed in the needle tip portion adjacent to the flat surface region portion constituting the alignment mark, and a portion of the side wall close to the flat surface region portion is formed as the flat surface region portion. It can be a ⁇ -shaped curve that opens toward the surface area.
- the arm portion may be composed of a pair of arm portions extending in the lateral direction at intervals in the longitudinal direction of the base portion.
- the flat surface region can be formed by the lower surface of the lower arm portion located on the side away from the mounting end of the base portion of the pair of arm portions.
- the probe according to the present invention is a pair of probe boards on which a plurality of wiring paths are formed. By attaching to the probe board so as to be connected to the corresponding wiring path, an electrical connection device can be configured together with the probe board.
- the shavings of the electrode pad are less likely to adhere to the alignment mark, it is less likely that the sharpening of the clear image of the alignment mark is hindered by this shaving.
- the probe tip of the probe can be accurately positioned based on the accurate alignment mark image recognition.
- FIG. 1 is an explanatory diagram showing an example of alignment of the electrical connection device according to the present invention.
- FIG. 2 is a bottom view of the electrical connection apparatus shown in FIG.
- FIG. 3 is an enlarged front view showing the probe of the electrical connection device according to the present invention.
- FIG. 4 is an enlarged side view showing the probe of the electrical connection apparatus according to the present invention.
- FIG. 5 is a perspective view of a probe according to the present invention.
- FIG. 6 is a diagram EI showing an example of an alignment mark photographed image of the probe according to the present invention. .
- FIG. 7 is a front view partially showing another example of the probe according to the present invention.
- the electrical connection device 10 is used for electrical inspection of the semiconductor wafer 12 in the example shown in FIG.
- the semiconductor wafer 12 is detachably held on the chuck top 16 installed on the XYZ ⁇ stage 14 by, for example, suction negative pressure.
- the semiconductor wafer 12 has a large number of IC chip areas arranged in a matrix, and an integrated circuit is built in each IC chip area.
- an electrical connection device 10 is located above the ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ stage 14. It is held by a tester head (not shown).
- the electrical connection device 10 includes a probe board 20 provided with a plurality of wiring paths 18 (see FIGS. 3 and 4), and a large number of probes 22 attached to the probe board.
- each probe 22 is arranged on each straight line (L) so that the probe tip 20 corresponds to the electrode of the semiconductor wafer 12 on the lower surface 20 a of the probe substrate 20. Arranged to align.
- the probe board 20 has the probe tip 2 4 of the probe 2 2 provided on the lower face 20 a directed downward, and the probe board 20 is in the ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ stage 1 4 It is held on the tester head via a circuit board 26 coupled to the upper surface 20 b so as to be parallel to the upper chuck top 16.
- each probe 22 provided on the probe board 20 has a wiring path 18 corresponding to the probe and a conductive path provided on the circuit board 26 corresponding to the wiring path. (Not shown) and connected to each tester land 28 (see FIG. 2) provided on the upper surface 20b of the wiring board. Each tester land 28 is connected to the tester body via a wiring (not shown) as in the prior art. Therefore, each probe 22 is electrically connected to the tester body via the corresponding tester land 28.
- the XYZ 0 stage 14 is, for example, the X-axis direction along the horizontal direction as seen in FIG. 1, the Y-axis direction perpendicular to the X-axis and the paper surface, and the X-axis and Y-axis. Displacement along the Z-axis direction perpendicular to is possible, and rotation around the Z-axis is possible.
- an imaging device 30 such as a CCD camera for photographing the alignment mark provided on the electrical connection device 10 positioned above the stage 14.
- the semiconductor wafer 12 which is the object to be inspected, is arranged by well-known image processing.
- Relative position information between the chuck top 16 and the electrical connection device 10 which is a probe card is obtained, and based on this position information, the probe tips 24 of each probe 2 2 correspond to the semiconductor wafer 12 corresponding to the above.
- the XY 2 0 stage 1 4 is driven around the axis and the Y axis and the Z axis so that it can come into contact with the electrodes, so that the electrical connection device 10 is relative to the semiconductor wafer 1 2. The position is adjusted.
- the stage 14 is driven in the Z-axis direction so that the electrode of the semiconductor wafer 12 is connected to the needle tip 24 of the corresponding probe 22.
- the tester body is connected to each integrated circuit on the semiconductor wafer 12 by electrical connection between the needle tips 24 of these probes 22 and the corresponding electrodes, and a predetermined electrical inspection is performed. Is called.
- FIGS. 3 and 4 show a probe 22 provided with an alignment mark used for adjusting the position of the electrical connecting device 10 described above.
- the probe 2 2 is entirely composed of a plate-like conductive member.
- the probe 22 includes a base portion 3 2 whose one end is an attachment end 3 2 a to the wiring path 18, an arm portion 3 4 extending in a lateral direction connected to the other end of the base portion, and the arm portion A needle tip portion 36 formed integrally with the extended end portion of the needle tip portion 24, and a needle tip portion 24 is formed at the tip of the needle tip portion.
- the portions 3 2, 3 4 and 3 6 except for the needle tip 24 are preferably formed of a metal material having high toughness such as nickel, nickel alloy or phosphor bronze. Needle point
- the needle tip 24 is formed of a hard metal material such as cobalt, rhodium or an alloy thereof, and the needle tip 24 is embedded in the protruding end of the needle tip portion 36. It is preferable.
- the arm portion 3 4 has an arm portion in order to facilitate bending deformation.
- a long hole 3 8 that divides 3 4 into upper and lower arm parts 3 4 a and 3 4 b extends in the longitudinal direction of arm 3 4.
- the elongated hole 38 is formed through the arm portion 34 in the plate thickness direction.
- holes 40, 4 2, and 4 4 are formed in the needle tip portion 36 and the base portion 32 so as to penetrate each in the thickness direction.
- the hole 40 formed in the needle tip portion 36 will be described in detail later, but it is used for deformation of the arm portion 34 when the needle tip 24 of the needle tip portion 36 is pressed against the electrode. Accommodates the elastic deformation of the associated needle tip 3 6. Also, the holes 4 2 and 2 provided in the base 3 2 and
- the etching liquid is used to peel off the probe 22 from the base after the probe 22 is formed by depositing the metal material on the base (not shown).
- the etching solution penetrates between the base and the probe 22 to promote the etching action of the etching solution. But Therefore, these holes 40, 42, 44 can be unnecessary.
- the attachment end 3 2 a of the base 3 2 is formed in a wave shape so as to hold a gap for retaining the solder material 4 6 ′ with the wiring path 18.
- the mounting end 3 2 a can be a flat surface parallel to the wiring path 18, but for the strong connection between the base 3 2 and the wiring path 18, it should be a wavy end surface as shown. Is desirable.
- the arm portion 34 extends laterally from one side of the base portion 3 2 with a predetermined interval from the attachment end 3 2 a, that is, with a predetermined interval from the probe substrate 20.
- the arm portion 3 4 is divided into the upper and lower arm portions 3 4 a and 3 4 b by the elongated holes 3 8, and both arm portions 3 4 a, 3 4 b is integrally connected at both ends.
- the lower arm portion 4 6 of the lower arm portion 3 4 b located on the side away from the mounting end 3 2 a of the base portion 3 2 of both arm portions 3 4 a and 3 4 b is shown in FIG. 4 and FIG. As shown in the figure, it is formed of a flat surface substantially parallel to the horizontal plane along the probe substrate 20 and has an elongated rectangular planar shape along the extending direction of the arm portion 34.
- the needle tip portion 36 is formed so as to protrude from the lower surface 46, which is a flat surface region of the arm portion 34b, at a right angle so as to be spaced from the tip of the arm portion 34. ing. Therefore, the lower surface 46 is a lower surface portion 46a that is a first flat surface region portion corresponding to the interval W and a second flat surface region portion constituted by the remaining portion by the needle tip portion 36.
- the lower surface portion 4 6 b is divided in the extending direction of the arm portion 3 4.
- the above-described needle tip 24 is formed at the protruding end of the needle tip portion 36 that divides the lower surface 46. Therefore, the protruding direction of the needle tip portion 36 and the protruding direction of the needle tip 24 are the normal line of the lower surface 46 consisting of the first lower surface portion 46a and the second lower surface portion 46b. It matches the direction.
- FIG. 6 shows a captured image of the probe 22 captured by the imaging device 30.
- image portions corresponding to the first lower surface portion 46 a, the needle tip 24 and the second lower surface portion 46 b are shown with the same reference numerals for convenience.
- the image portion corresponding to the lower surface portion 4 6 a is shown as a substantially square image portion adjacent to the image portion of the needle tip 24.
- the first flat surface region portion the lower surface portion 46a
- a curved surface portion 48a connected to the lower surface portion 46a is formed on one side wall 48 of the needle tip portion 36 rising from the lower surface portion. Due to this curved surface portion 48 a, an M portion that opens to the side is formed on the side wall 48.
- both arm portions 3 4 a and 3 4 b of the probe 2 2 Arc-shaped elastic deformation occurs that displaces the tip of the arm part 34 upward.
- the needle tip 24 slides in the direction indicated by the arrow 50 on the electrode.
- This slip of the needle tip 24 breaks the oxide film on the electrode, and ensures electrical connection between the needle tip 24 and the electrode.
- a compressive force acts on the side wall 48 of the needle tip portion 3 6 as the needle tip 24 slides.
- the curved surface portion 48a formed on the side wall 48 disperses this compressive force and prevents an increase in stress due to the partial concentration, thereby increasing the mechanical strength at the side wall 48 of the needle tip portion 36. It works to increase.
- the hole 40 of the needle tip portion 36 promotes elastic deformation of the needle tip portion 36 accompanying the sliding of the needle tip 24, thereby electrically connecting the needle tip 24 and the electrode. Make the connection more secure.
- the first lower surface portion 46 a which is the first flat surface portion formed on the lower surface 46 of the arm portion 3 4 of the probe 22 is used as the alignment mark. Used. Therefore, as shown in FIG. 6, when the image portion corresponding to the lower surface portion 46a provided on the predetermined probe 22 of the probe substrate 20 is captured by the imaging device 30, as in the conventional case, The position information of the lower surface portion 46 a relative to the semiconductor wafer 12 on the XYZ 0 stage 14 is obtained from the previously known position information of the probe 22 on the probe substrate 20. Based on the positional information, the electrical connection device 10 and the semiconductor wafer 1 are connected so that each probe 22 of the electrical connection device 10 is properly connected to the corresponding electrode on the semiconductor wafer 12. The relative position to 2 is adjusted by driving the XYZ 0 stage 1 4.
- the lower surface portion 46 6 a used as the alignment mark is formed with a level difference from the needle tip 24 to the needle tip portion 36. Therefore, said Even if the electrode of the semiconductor wafer 12 is scraped due to the sliding of the needle tip 2 4 as described above, it is possible to reliably prevent the shavings from adhering to the lower surface portion 4 6 a. The above-mentioned shavings are not reflected.
- the image of the shavings described above is not mixed with the outline of the alignment mark image (4 6 a) obtained by the imaging device 30, and a clear mark alignment mark image (4 6 a) is obtained. . Therefore, accurate alignment can be performed quickly.
- the second lower surface portion 46b is used as the alignment mark, and the photographed image portion (46b) can be used as the alignment mark image.
- the first lower surface portion 4 6a is closer to the needle tip 24 than the second lower surface portion 4 6b. It is desirable to use the lower surface portion 46 as a alignment mark in order to improve the accuracy of the alignment.
- the crossing angle a between the side surface and the flat surface of the needle tip 24 is, for example, an angle exceeding 20 degrees. It is desirable to form the side shape of the needle tip portion 36. Thereby, it is possible to surely prevent the reflected light from the portion excluding the needle tip 24 of the needle tip portion 36 from being captured by the imaging device 30.
- the side surface shape of the needle tip portion 36 so that the crossing angle ⁇ between the side surface of the needle tip portion 36 and the flat surface of the needle tip 24 exceeds 20 degrees, for example, Since it is possible to prevent the portion excluding the needle tip 24 of the needle tip portion 36 from acting as a reflecting surface, the discrimination between the image portion of the needle tip portion 36 and the alignment mark image can be improved.
- the probes 22 having the lower surface portion 46a can be used for all the probes 22 provided on the probe substrate 20. However, it is desirable to dispose at least three probes 22 provided with alignment marks 46 a on the probe substrate 20 so as to be spaced apart from each other.
- the other probe 22 for example, the above-mentioned alignment mark 4 6 a is provided by the needle tip portion 3 6 rising from the lower surface 4 6 without leaving the interval W from the tip of the arm portion 3 4 b. Probes that are not used can be used. As a result, the target probe 22 with the alignment mark 4 6 a used for alignment can be identified from the other probes 22. Easy to do.
- the probe 22 described above can be formed, for example, as follows. First, the photolithography technique used in the semiconductor manufacturing process is used to make the planar shape of the probe 22 2 with the photoresist (the planar shape of the other parts 3 2, 3 4, and 3 6 except the needle tip 2 4 may be used). ) Is formed on the base. Next, a metal material for the probe 22 is sequentially deposited in the thickness direction by a deposition method such as electroforming or sputtering on the concave portion formed by the resist pattern. Thereafter, the resist pattern is removed, and the probe 22 is partially peeled off from the base by etching, and then the probe 22 is peeled off from the base.
- a deposition method such as electroforming or sputtering
- the etching solution passes through the holes 4 2 and 4 4 provided in the base 3 2 of the probe 22 and passes between the probe 22 and the base.
- the etching process for peeling the probe 22 from the base can be effectively performed.
- the long hole 38 and the hole 40 also have the same effect.
- the concave curved surface portion 48 8 a is formed on the side wall 48 of the needle tip portion 36 is shown.
- the side wall 48 can be an upright side wall perpendicular to the lower surface portion 46 a.
- the side wall 48 is a convex curved side wall that bulges outward unless the lower surface portion 46a is substantially hindered by the imaging device 30. be able to.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/064,620 US7924038B2 (en) | 2007-01-22 | 2007-04-26 | Probe and electrical connecting apparatus using it |
DE112007000415.0T DE112007000415B4 (de) | 2007-01-22 | 2007-04-26 | Sonde und elektrische Verbindungsvorrichtung, die sie verwendet |
CN2007800013283A CN101356443B (zh) | 2007-01-22 | 2007-04-26 | 探针以及采用该探针的电气连接装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-011279 | 2007-01-22 | ||
JP2007011279A JP5113392B2 (ja) | 2007-01-22 | 2007-01-22 | プローブおよびそれを用いた電気的接続装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008090635A1 true WO2008090635A1 (ja) | 2008-07-31 |
Family
ID=39644215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/059424 WO2008090635A1 (ja) | 2007-01-22 | 2007-04-26 | プローブおよびそれを用いた電気的接続装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7924038B2 (ja) |
JP (1) | JP5113392B2 (ja) |
KR (1) | KR101000005B1 (ja) |
CN (1) | CN101356443B (ja) |
DE (1) | DE112007000415B4 (ja) |
TW (1) | TW200835916A (ja) |
WO (1) | WO2008090635A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8671567B2 (en) | 2009-11-19 | 2014-03-18 | Kabushiki Kaisha Nihon Micronics | Method for manufacturing a probe for an electrical test |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101688886A (zh) * | 2007-07-24 | 2010-03-31 | 株式会社爱德万测试 | 接触器、探针卡及接触器的安装方法 |
KR101019554B1 (ko) * | 2008-11-18 | 2011-03-08 | 주식회사 코디에스 | 프로브 및 그의 제조방법 |
JP5416986B2 (ja) | 2009-02-19 | 2014-02-12 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP5308948B2 (ja) * | 2009-07-23 | 2013-10-09 | ルネサスエレクトロニクス株式会社 | 半導体デバイスの検査装置及び方法 |
JP2014016204A (ja) * | 2012-07-06 | 2014-01-30 | Micronics Japan Co Ltd | 電気的接触子及び電気的接触子の接触方法 |
JP5968158B2 (ja) * | 2012-08-10 | 2016-08-10 | 株式会社日本マイクロニクス | コンタクトプローブ及びプローブカード |
US9804196B2 (en) * | 2016-01-15 | 2017-10-31 | Cascade Microtech, Inc. | Probes with fiducial marks, probe systems including the same, and associated methods |
JP6988954B2 (ja) * | 2016-06-17 | 2022-01-05 | オムロン株式会社 | プローブピン |
JP6737002B2 (ja) * | 2016-06-17 | 2020-08-05 | オムロン株式会社 | プローブピン |
CN109477867B (zh) * | 2016-06-28 | 2021-07-13 | 日本麦可罗尼克斯股份有限公司 | 电性连接装置及触头 |
IT201800001170A1 (it) * | 2018-01-17 | 2019-07-17 | Technoprobe Spa | Testa di misura di tipo cantilever e relativa sonda di contatto |
IT201800001173A1 (it) | 2018-01-17 | 2019-07-17 | Technoprobe Spa | Sonda di contatto di tipo cantilever e relativa testa di misura |
JP7292921B2 (ja) * | 2019-03-29 | 2023-06-19 | 株式会社日本マイクロニクス | 多ピン構造プローブ体及びプローブカード |
JP7471778B2 (ja) * | 2019-03-29 | 2024-04-22 | 株式会社日本マイクロニクス | プローブカード |
JP7393873B2 (ja) * | 2019-03-29 | 2023-12-07 | 株式会社日本マイクロニクス | 電気的接触子及びプローブカード |
JP1646397S (ja) * | 2019-05-21 | 2019-11-25 | ||
JP2021028603A (ja) * | 2019-08-09 | 2021-02-25 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
JP7353859B2 (ja) * | 2019-08-09 | 2023-10-02 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
KR102088205B1 (ko) * | 2019-08-30 | 2020-03-16 | 주식회사 프로이천 | 디스플레이 패널 검사용 프로브 핀 |
TW202206824A (zh) * | 2020-08-04 | 2022-02-16 | 義大利商探針科技公司 | 電子裝置的探針頭的接觸探針 |
KR102386462B1 (ko) * | 2020-09-02 | 2022-04-15 | (주)티에스이 | 프로브 카드 및 이의 얼라이닝 장치 |
TWI792995B (zh) * | 2022-04-29 | 2023-02-11 | 中華精測科技股份有限公司 | 懸臂式探針卡裝置及其對焦型探針 |
WO2024062562A1 (ja) * | 2022-09-21 | 2024-03-28 | 日本電子材料株式会社 | プローブカード用カンチレバー型プローブおよびプローブカード |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001349929A (ja) * | 2000-06-07 | 2001-12-21 | Kobe Steel Ltd | プローブ針の針先位置の検出方法及び検出装置 |
WO2004102207A1 (ja) * | 2003-05-13 | 2004-11-25 | Kabushiki Kaisha Nihon Micronics | 通電試験用プローブ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2465191Y (zh) * | 2001-02-12 | 2001-12-12 | 华硕电脑股份有限公司 | 横杆式探针测试装置 |
US6933738B2 (en) | 2001-07-16 | 2005-08-23 | Formfactor, Inc. | Fiducial alignment marks on microelectronic spring contacts |
KR100880088B1 (ko) | 2002-07-15 | 2009-01-23 | 폼팩터, 인크. | 마이크로 전자 스프링 접촉부 상의 기준 정렬 마크 |
JP2004340654A (ja) | 2003-05-14 | 2004-12-02 | Micronics Japan Co Ltd | 通電試験用プローブ |
-
2007
- 2007-01-22 JP JP2007011279A patent/JP5113392B2/ja active Active
- 2007-04-26 KR KR1020087006797A patent/KR101000005B1/ko active IP Right Grant
- 2007-04-26 DE DE112007000415.0T patent/DE112007000415B4/de active Active
- 2007-04-26 US US12/064,620 patent/US7924038B2/en active Active
- 2007-04-26 WO PCT/JP2007/059424 patent/WO2008090635A1/ja active Application Filing
- 2007-04-26 CN CN2007800013283A patent/CN101356443B/zh active Active
- 2007-12-05 TW TW096146248A patent/TW200835916A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001349929A (ja) * | 2000-06-07 | 2001-12-21 | Kobe Steel Ltd | プローブ針の針先位置の検出方法及び検出装置 |
WO2004102207A1 (ja) * | 2003-05-13 | 2004-11-25 | Kabushiki Kaisha Nihon Micronics | 通電試験用プローブ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8671567B2 (en) | 2009-11-19 | 2014-03-18 | Kabushiki Kaisha Nihon Micronics | Method for manufacturing a probe for an electrical test |
Also Published As
Publication number | Publication date |
---|---|
CN101356443A (zh) | 2009-01-28 |
DE112007000415T5 (de) | 2008-12-11 |
DE112007000415B4 (de) | 2019-01-17 |
JP5113392B2 (ja) | 2013-01-09 |
KR20080085132A (ko) | 2008-09-23 |
KR101000005B1 (ko) | 2010-12-09 |
CN101356443B (zh) | 2011-08-31 |
US7924038B2 (en) | 2011-04-12 |
US20100219854A1 (en) | 2010-09-02 |
TW200835916A (en) | 2008-09-01 |
TWI349106B (ja) | 2011-09-21 |
JP2008175762A (ja) | 2008-07-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5113392B2 (ja) | プローブおよびそれを用いた電気的接続装置 | |
US7449906B2 (en) | Probe for testing an electrical device | |
US7548082B2 (en) | Inspection probe | |
US20090058441A1 (en) | Electrical test probe | |
JP4841620B2 (ja) | 通電試験用プローブおよびプローブ組立体 | |
KR101042513B1 (ko) | 전기 시험용 접촉자, 이를 이용한 전기적 접속 장치, 및 접촉자의 제조 방법 | |
KR20070120430A (ko) | 프로브 카드 | |
WO2007119636A1 (ja) | プローブシートの製造方法 | |
JP4917017B2 (ja) | 通電試験用プローブ及びこれを用いた電気的接続装置 | |
JP5631131B2 (ja) | 通電試験用プローブ及びプローブ組立体 | |
US20080143369A1 (en) | Electrical connecting apparatus and method for use thereof | |
KR100988814B1 (ko) | 프로브 카드용 프로브 및 그 제조 방법 | |
JP2007113946A (ja) | 通電試験用プローブ | |
JP5053542B2 (ja) | プローブピンとプローブピンの製造方法 | |
KR20110084098A (ko) | 전기적 시험용 프로브 및 그 제조방법, 및 전기적 접속장치 및 그 제조방법 | |
JP2001124799A (ja) | プローブシート及びその製造方法並びにプローブカード | |
KR20090018242A (ko) | 프로브유닛과 이의 니들의 제조방법 및 프로브유닛 | |
JP3219008B2 (ja) | コンタクトプローブおよびその製造方法と前記コンタクトプローブを備えたプローブ装置 | |
JPWO2008136395A1 (ja) | プローブカード | |
JPH10288629A (ja) | コンタクトプローブおよびこれを備えたプローブ装置 | |
JP2001330625A5 (ja) | ||
JP2009300079A (ja) | コンタクトプローブ及びプローブカード | |
JP2008196914A (ja) | プローブおよびプローブ組立体 | |
JPH10142260A (ja) | コンタクトプローブおよびそれを備えたプローブ装置 | |
JPH11248751A (ja) | コンタクトプローブおよびプローブ装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780001328.3 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12064620 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020087006797 Country of ref document: KR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07742859 Country of ref document: EP Kind code of ref document: A1 |
|
RET | De translation (de og part 6b) |
Ref document number: 112007000415 Country of ref document: DE Date of ref document: 20081211 Kind code of ref document: P |
|
WWE | Wipo information: entry into national phase |
Ref document number: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 07742859 Country of ref document: EP Kind code of ref document: A1 |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8607 |