WO2008078688A1 - ステージ装置、露光装置、及びデバイスの製造方法 - Google Patents

ステージ装置、露光装置、及びデバイスの製造方法 Download PDF

Info

Publication number
WO2008078688A1
WO2008078688A1 PCT/JP2007/074673 JP2007074673W WO2008078688A1 WO 2008078688 A1 WO2008078688 A1 WO 2008078688A1 JP 2007074673 W JP2007074673 W JP 2007074673W WO 2008078688 A1 WO2008078688 A1 WO 2008078688A1
Authority
WO
WIPO (PCT)
Prior art keywords
substages
moving surface
moving
device manufacturing
stage apparatus
Prior art date
Application number
PCT/JP2007/074673
Other languages
English (en)
French (fr)
Inventor
Kazuya Ono
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to KR1020097015661A priority Critical patent/KR20090106555A/ko
Priority to JP2008551084A priority patent/JP5146323B2/ja
Priority to KR20157004515A priority patent/KR20150036734A/ko
Priority to EP07859953A priority patent/EP2109133A4/en
Publication of WO2008078688A1 publication Critical patent/WO2008078688A1/ja
Priority to US12/457,914 priority patent/US20100066992A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

　所定の移動面（１６ａ）を備えた固定部（１６）と、移動面（１６ａ）に沿って第１方向を含む複数の方向に移動可能な第１移動体とを有する。第１移動体の移動と同期して、移動面（１６ａ）に対して第１方向に移動するサブステージ（６１Ａ、６１Ｂ）と、サブステージ（６１Ａ、６１Ｂ）に少なくとも一部が設けられ、サブステージ（６１Ａ、６１Ｂ）と移動面（１６ａ）との間の第１方向の相対位置に関する情報を検出する第１計測装置（６７）と、サブステージ（６１Ａ、６１Ｂ）に少なくとも一部が設けられ、サブステージと第１移動体との間の第１方向と略直交しかつ移動面（１６ａ）に沿う第２方向の相対位置に関する情報を検出する第２計測装置（７１、７２）とを有する。
PCT/JP2007/074673 2006-12-27 2007-12-21 ステージ装置、露光装置、及びデバイスの製造方法 WO2008078688A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020097015661A KR20090106555A (ko) 2006-12-27 2007-12-21 스테이지 장치, 노광 장치, 및 디바이스의 제조 방법
JP2008551084A JP5146323B2 (ja) 2006-12-27 2007-12-21 ステージ装置、露光装置、及びデバイスの製造方法
KR20157004515A KR20150036734A (ko) 2006-12-27 2007-12-21 스테이지 장치, 노광 장치, 및 디바이스의 제조 방법
EP07859953A EP2109133A4 (en) 2006-12-27 2007-12-21 PLATTER APPARATUS, EXPOSURE APPARATUS, AND METHOD FOR MANUFACTURING THE APPARATUS
US12/457,914 US20100066992A1 (en) 2006-12-27 2009-06-25 Stage apparatus, exposure apparatus, and device fabricating method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006351479 2006-12-27
JP2006-351479 2006-12-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/457,914 Continuation US20100066992A1 (en) 2006-12-27 2009-06-25 Stage apparatus, exposure apparatus, and device fabricating method

Publications (1)

Publication Number Publication Date
WO2008078688A1 true WO2008078688A1 (ja) 2008-07-03

Family

ID=39562477

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074673 WO2008078688A1 (ja) 2006-12-27 2007-12-21 ステージ装置、露光装置、及びデバイスの製造方法

Country Status (7)

Country Link
US (1) US20100066992A1 (ja)
EP (2) EP2998983B1 (ja)
JP (1) JP5146323B2 (ja)
KR (2) KR20090106555A (ja)
HK (1) HK1218185A1 (ja)
TW (1) TWI457978B (ja)
WO (1) WO2008078688A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010062209A (ja) * 2008-09-01 2010-03-18 Nikon Corp 露光装置、露光方法、及びデバイス製造方法
JP2011211180A (ja) * 2010-03-29 2011-10-20 Nikon Corp 露光方法及び露光装置、並びにデバイス製造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9140992B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
JP2017142523A (ja) * 2009-08-20 2017-08-17 株式会社ニコン 移動体装置、物体処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び搬送方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
NL2008696A (en) * 2011-05-25 2012-11-27 Asml Netherlands Bv A multi-stage system, a control method therefor, and a lithographic apparatus.
US9169895B2 (en) * 2011-11-29 2015-10-27 Hennessy Industries, Inc. Vehicle wheel balance weights
US8779635B2 (en) * 2012-04-10 2014-07-15 Kla-Tencor Corporation Arrangement of reticle positioning device for actinic inspection of EUV reticles
US10133194B2 (en) 2012-10-02 2018-11-20 Nikon Corporation Movable body apparatus, exposure apparatus, and device manufacturing method
WO2014060170A1 (en) * 2012-10-15 2014-04-24 Asml Netherlands B.V. Actuation mechanism, optical apparatus, lithography apparatus and method of manufacturing devices
CN105684108A (zh) 2013-09-04 2016-06-15 Ckd株式会社 电磁致动器用电枢线圈、电磁致动器、曝光装置及器件制造方法
CN113093484B (zh) 2014-12-24 2023-12-19 株式会社尼康 测量系统、测量方法及曝光装置
KR102284227B1 (ko) 2014-12-24 2021-07-30 가부시키가이샤 니콘 계측 장치 및 계측 방법, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
CN108168442B (zh) * 2018-03-28 2023-09-08 河北省同创交通工程配套产品产业技术研究院 一种止水带凹凸槽动态测量装置的动态测量方法
DE202019000816U1 (de) * 2019-02-20 2020-05-28 isel GmbH & Co. KG Planarläuferpositionsmesssystem

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2369299A (en) 1942-05-16 1945-02-13 Kafowi Jan Apparatus for working metals
JPH05326369A (ja) * 1992-05-26 1993-12-10 Sony Corp パターニング装置
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
US5677758A (en) 1995-02-09 1997-10-14 Mrs Technology, Inc. Lithography System using dual substrate stages
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JPH10303114A (ja) 1997-04-23 1998-11-13 Nikon Corp 液浸型露光装置
JPH11135400A (ja) 1997-10-31 1999-05-21 Nikon Corp 露光装置
JPH11164543A (ja) * 1997-09-25 1999-06-18 Nikon Corp 電磁力モータ、ステージ装置および露光装置
WO1999034255A1 (fr) 1997-12-25 1999-07-08 Nikon Corporation Procede et appareil de fabrication de photomasque et procede de fabrication de l'appareil
JPH11194479A (ja) 1997-12-26 1999-07-21 Nikon Corp フォトマスクの製造方法及び装置
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
WO1999050712A1 (fr) 1998-03-26 1999-10-07 Nikon Corporation Procede et systeme d'exposition, photomasque et son procede de fabrication, micro-composant et son procede de fabrication
WO1999066370A1 (fr) 1998-06-17 1999-12-23 Nikon Corporation Procede relatif a l'elaboration d'un masque
JP2000012453A (ja) 1998-06-18 2000-01-14 Nikon Corp 露光装置及びその使用方法、露光方法、並びにマスクの製造方法
JP2000029202A (ja) 1998-07-15 2000-01-28 Nikon Corp マスクの製造方法
JP2000164504A (ja) 1998-11-30 2000-06-16 Nikon Corp ステージ装置、露光装置、及び前記ステージ装置を用いた位置決め方法
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
JP2003224961A (ja) 2002-01-28 2003-08-08 Canon Inc リニアモータ、ステージ装置、露光装置及びデバイス製造方法
US6611316B2 (en) 2001-02-27 2003-08-26 Asml Holding N.V. Method and system for dual reticle image exposure
US6778257B2 (en) 2001-07-24 2004-08-17 Asml Netherlands B.V. Imaging apparatus
JP2005046941A (ja) * 2003-07-31 2005-02-24 Canon Inc ケーブル微動ユニット付きステージ装置
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
JP2006351479A (ja) 2005-06-20 2006-12-28 Sumitomo Wiring Syst Ltd コネクタ

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01164543A (ja) 1987-12-21 1989-06-28 Okuma Mach Works Ltd ワーク判別方法
JPH01194479A (ja) 1988-01-29 1989-08-04 Murata Mfg Co Ltd 積層熱電素子およびその製造方法
US6222614B1 (en) * 1996-12-06 2001-04-24 Nikon Corporation Exposure elements with a cable-relaying support
JPH10293611A (ja) * 1997-04-21 1998-11-04 Canon Inc 位置決め装置
WO2001045145A1 (fr) * 1999-12-16 2001-06-21 Nikon Corporation Procede et dispositif d'exposition
US6437463B1 (en) * 2000-04-24 2002-08-20 Nikon Corporation Wafer positioner with planar motor and mag-lev fine stage
JP2002043213A (ja) * 2000-07-25 2002-02-08 Nikon Corp ステージ装置および露光装置
US6842248B1 (en) * 2000-11-28 2005-01-11 Nikon Corporation System and method for calibrating mirrors of a stage assembly
JP2002305140A (ja) * 2001-04-06 2002-10-18 Nikon Corp 露光装置及び基板処理システム
JP4814438B2 (ja) * 2001-05-02 2011-11-16 日本トムソン株式会社 リニアモータを内蔵したステージ装置
EP2017675A1 (en) * 2001-07-09 2009-01-21 Canon Kabushiki Kaisha Exposure apparatus
SG103893A1 (en) * 2001-11-30 2004-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US6937911B2 (en) * 2002-03-18 2005-08-30 Nikon Corporation Compensating for cable drag forces in high precision stages
JP3955555B2 (ja) * 2002-06-13 2007-08-08 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置およびデバイス製造方法
JP2004260116A (ja) * 2003-02-27 2004-09-16 Nikon Corp ステージ装置、露光装置、及びデバイス製造方法
JP2005159322A (ja) * 2003-10-31 2005-06-16 Nikon Corp 定盤、ステージ装置及び露光装置並びに露光方法
JP4586367B2 (ja) * 2004-01-14 2010-11-24 株式会社ニコン ステージ装置及び露光装置
JP2005285881A (ja) * 2004-03-29 2005-10-13 Nikon Corp ステージ装置及び露光装置
JP2005317916A (ja) * 2004-03-30 2005-11-10 Canon Inc 露光装置及びデバイス製造方法
JP4677267B2 (ja) * 2005-04-04 2011-04-27 キヤノン株式会社 平面ステージ装置及び露光装置

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2369299A (en) 1942-05-16 1945-02-13 Kafowi Jan Apparatus for working metals
JPH05326369A (ja) * 1992-05-26 1993-12-10 Sony Corp パターニング装置
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
US5677758A (en) 1995-02-09 1997-10-14 Mrs Technology, Inc. Lithography System using dual substrate stages
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JPH10303114A (ja) 1997-04-23 1998-11-13 Nikon Corp 液浸型露光装置
JPH11164543A (ja) * 1997-09-25 1999-06-18 Nikon Corp 電磁力モータ、ステージ装置および露光装置
JPH11135400A (ja) 1997-10-31 1999-05-21 Nikon Corp 露光装置
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
WO1999034255A1 (fr) 1997-12-25 1999-07-08 Nikon Corporation Procede et appareil de fabrication de photomasque et procede de fabrication de l'appareil
JPH11194479A (ja) 1997-12-26 1999-07-21 Nikon Corp フォトマスクの製造方法及び装置
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
WO1999050712A1 (fr) 1998-03-26 1999-10-07 Nikon Corporation Procede et systeme d'exposition, photomasque et son procede de fabrication, micro-composant et son procede de fabrication
WO1999066370A1 (fr) 1998-06-17 1999-12-23 Nikon Corporation Procede relatif a l'elaboration d'un masque
JP2000012453A (ja) 1998-06-18 2000-01-14 Nikon Corp 露光装置及びその使用方法、露光方法、並びにマスクの製造方法
JP2000029202A (ja) 1998-07-15 2000-01-28 Nikon Corp マスクの製造方法
JP2000164504A (ja) 1998-11-30 2000-06-16 Nikon Corp ステージ装置、露光装置、及び前記ステージ装置を用いた位置決め方法
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
US6611316B2 (en) 2001-02-27 2003-08-26 Asml Holding N.V. Method and system for dual reticle image exposure
JP2004519850A (ja) 2001-02-27 2004-07-02 エイエスエムエル ユーエス， インコーポレイテッド デュアルレチクルイメージを露光する方法および装置
US6778257B2 (en) 2001-07-24 2004-08-17 Asml Netherlands B.V. Imaging apparatus
JP2003224961A (ja) 2002-01-28 2003-08-08 Canon Inc リニアモータ、ステージ装置、露光装置及びデバイス製造方法
JP2005046941A (ja) * 2003-07-31 2005-02-24 Canon Inc ケーブル微動ユニット付きステージ装置
JP2006351479A (ja) 2005-06-20 2006-12-28 Sumitomo Wiring Syst Ltd コネクタ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2109133A4

Cited By (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9146474B2 (en) 2003-04-09 2015-09-29 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger and different linear polarization states in an on-axis area and a plurality of off-axis areas
US9164393B2 (en) 2003-04-09 2015-10-20 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in four areas
US9885959B2 (en) 2003-04-09 2018-02-06 Nikon Corporation Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator
US9146476B2 (en) 2003-10-28 2015-09-29 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9244359B2 (en) 2003-10-28 2016-01-26 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9140992B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9423697B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9760014B2 (en) 2003-10-28 2017-09-12 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US10281632B2 (en) 2003-11-20 2019-05-07 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power to rotate linear polarization direction
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US9429848B2 (en) 2004-02-06 2016-08-30 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10241417B2 (en) 2004-02-06 2019-03-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9140990B2 (en) 2004-02-06 2015-09-22 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9423694B2 (en) 2004-02-06 2016-08-23 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10234770B2 (en) 2004-02-06 2019-03-19 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US9310696B2 (en) 2005-05-12 2016-04-12 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9360763B2 (en) 2005-05-12 2016-06-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9429851B2 (en) 2005-05-12 2016-08-30 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9057963B2 (en) 2007-09-14 2015-06-16 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US9366970B2 (en) 2007-09-14 2016-06-14 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8508717B2 (en) 2007-10-16 2013-08-13 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US9057877B2 (en) 2007-10-24 2015-06-16 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9857599B2 (en) 2007-10-24 2018-01-02 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US8456624B2 (en) 2008-05-28 2013-06-04 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
JP2010062209A (ja) * 2008-09-01 2010-03-18 Nikon Corp 露光装置、露光方法、及びデバイス製造方法
JP2017142522A (ja) * 2009-08-20 2017-08-17 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
JP2017142523A (ja) * 2009-08-20 2017-08-17 株式会社ニコン 移動体装置、物体処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び搬送方法
KR20190131146A (ko) * 2009-08-20 2019-11-25 가부시키가이샤 니콘 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
KR102184248B1 (ko) 2009-08-20 2020-11-30 가부시키가이샤 니콘 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
JP2011211180A (ja) * 2010-03-29 2011-10-20 Nikon Corp 露光方法及び露光装置、並びにデバイス製造方法

Also Published As

Publication number Publication date
TW200845118A (en) 2008-11-16
HK1218185A1 (zh) 2017-02-03
EP2109133A4 (en) 2011-12-28
EP2998983A3 (en) 2016-06-08
EP2998983A2 (en) 2016-03-23
EP2109133A1 (en) 2009-10-14
KR20090106555A (ko) 2009-10-09
JP5146323B2 (ja) 2013-02-20
TWI457978B (zh) 2014-10-21
KR20150036734A (ko) 2015-04-07
US20100066992A1 (en) 2010-03-18
EP2998983B1 (en) 2018-03-21
JPWO2008078688A1 (ja) 2010-04-22

Similar Documents

Publication Publication Date Title
WO2008078688A1 (ja) ステージ装置、露光装置、及びデバイスの製造方法
EP1816518A3 (en) Mold for imprint, process for producing minute structure using the mold, and process for producing the mold
DK1882652T3 (da) Gribeindretning
WO2009065831A3 (de) Roboter, medizinischer arbeitsplatz und verfahren zum projizieren eines bildes auf die oberfläche eines objekts
TW200519445A (en) Apparatus for manipulation of an optical element
WO2009038838A3 (en) Methods and systems for determining a position of inspection data in design data space
TW200745770A (en) Lithographic apparatus and device manufacturing method
WO2008003416A8 (en) Active gripper for haptic devices
WO2008016651A3 (en) Method of performing lithography and lithography system
WO2009014251A3 (en) Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method
WO2007120280A3 (en) Methods and systems for utilizing design data in combination with inspection data
EP1657612A3 (en) Moving distance sensing apparatus for robot cleaner and method therefor
EP1705695A4 (en) EXPOSURE DEVICE AND METHOD FOR MANUFACTURING THE SAME
WO2007098935A3 (en) Platforms, apparatuses, systems and methods for processing and analyzing substrates
MY147938A (en) Gantry positioning system
WO2008105531A1 (ja) ペリクルフレーム装置、マスク、露光方法及び露光装置並びにデバイスの製造方法
EP1783555A3 (en) Lithographic apparatus and device manufacturing method
WO2006108380A3 (de) Verfahren und vorrichtung zur positionierung eines bauelements
WO2008033601A3 (en) Method and system tracking work done by human workers
ITRM20030169A1 (it) Attuatore a ricircolo di sfere per superfici di governo di aermobili.
WO2007010066A3 (es) Conjunto flexible para trabajos sobre grandes superficies
TWI339875B (en) An interconnect structure, a method for fabricating the same and a wafer
WO2009079565A3 (en) Multiple chuck scanning stage
EP1757978A3 (en) Mask for laser induced thermal imaging (LITI) and LITI method using the same
WO2006081498A3 (en) Apparatus having a photonic crystal

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07859953

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2008551084

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020097015661

Country of ref document: KR

Ref document number: 2007859953

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020157004515

Country of ref document: KR