Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/2851—Testing of integrated circuits [IC]
  • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/04—Housings; Supporting members; Arrangements of terminals
  • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
  • G01R1/0433—Sockets for IC's or transistors
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/2851—Testing of integrated circuits [IC]
  • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
  • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Definitions

• the present invention relates to an electronic component testing apparatus for testing an electronic component such as a semiconductor integrated circuit element (hereinafter also typically referred to as an IC device).
• an electronic component such as a semiconductor integrated circuit element (hereinafter also typically referred to as an IC device).
• a handler In an electronic component testing apparatus referred to as a handler, a large number of IC devices housed in a tray are transported into a handle and each IC device is brought into electrical contact with a test head. Have the body (hereinafter referred to as the tester) perform the test. When the test is completed, each IC device is delivered from the test head and placed on the tray according to the test result, so that it is sorted into categories such as non-defective products and defective products.
• a tray (hereinafter referred to as a customer tray) that is carried into and out of the Nodler in a state in which a pre-tested or tested IC device is accommodated (hereinafter referred to as a customer tray) is circulated and conveyed in the handler. It is known that the IC device is transferred to the test tray, and the IC device is tested by bringing the IC device into electrical contact with the socket of the test head with the IC device mounted on the test tray.
• the customer tray tracker also replaces the IC device on the test tray before the test, and the test tray tracker and the customer tray also replace the IC device after the test. He spends a lot of time on pick and place work. For this reason, picking up and placing IC devices becomes a network process when the number that can be tested simultaneously in the test unit to improve throughput (hereinafter referred to as the number of simultaneous measurements) increases.
• this type of electronic component testing apparatus requires a transfer device for transferring the IC device between the customer tray and the test tray, and a dedicated test tray. Incurred an increase in costs.
• the present invention reduces the pick-and-place work of the electronic device under test and reduces the cost. It is an object of the present invention to provide an electronic component testing apparatus capable of achieving the above.
• an electronic component testing apparatus used for testing an electronic device under test, the customer having an accommodating portion for accommodating the electronic device under test.
• the electronic device under test In a state where the electronic device under test is accommodated or held in a tray or a force bar tray in which a holding portion for holding the electronic device under test is arranged in substantially the same arrangement as the accommodating portion of the customer tray.
• a test unit that presses the electronic device under test against a socket of a test head and electrically contacts an input / output terminal of the electronic device under test with a contact pin of the socket;
• An electronic component testing device is provided, characterized in that the electronic component testing apparatus includes: a holding means for holding and transferring the customer tray or the force bar tray to the test unit. Reference 1).
• the customer tray or force bar tray in which the electronic device under test is accommodated or held in the accommodating portion is transported to the test portion, and the electronic device under test is stored or held in the customer tray or force bar tray in the test portion. Test the electronic device under test by pressing the component against the socket.
• the test is performed in a state where the electronic device under test is accommodated or held in the customer tray or the force bar tray without using the test tray, the electronic device under test is placed between the customer tray and the test tray before and after the test. There is no need to replace parts, and the pick-and-place work can be reduced by IJ.
• the test unit may connect the input / output terminal of the electronic device under test to the contact pin of the socket with the input / output terminal of the electronic device under test facing upward. It is preferable that it is pressed against the surface (see claim 2)
• the force bar tray is configured to have a material strength higher than that of the material constituting the customer tray (see claim 3). ).
• the customer tray is also made of synthetic resin material and the like, the strength is insufficient for the pressing force when pressing the electronic device under test against the socket, or the electronic device under test is applied when thermal stress is applied. There are problems such as a force that cannot efficiently transfer the heat of the component, and that the electronic device under test is not accurately positioned with respect to the socket when the electronic device under test contacts the socket.
• the force bar tray is made of a material having higher strength than the material constituting the customer tray, such as a metal material or ceramic, so that the strength required at the time of pressing or when a thermal stress is applied. Efficient heat conduction can be ensured, and high-precision positioning at the time of contact is also possible.
• the apparatus further comprises an attaching means for covering the force bar tray or the customer tray on the customer tray or the cover tray. (See Section 4).
• the test tray is provided with a latch mechanism for preventing the contained electronic device under test from popping out, but the customer tray is not provided with means for preventing popping out. Therefore, according to the present invention, when the customer tray is transported in the electronic component testing apparatus, the force bar tray is put on the customer tray containing the electronic components to be tested by the attaching means, so that the customer tray card Prevents electronic devices under test from popping out.
• the attachment means covers the force bar tray over the customer tray containing the electronic device to be tested before the test. It is preferable that the apparatus includes an attachment means and a second attachment means for accommodating the electronic device under test after the test and placing the customer tray on the force bar tray. (See claim 5).
• the apparatus further comprises a reversing means for reversing the customer tray covered with the force bar tray or the force bar tray covered with the customer tray. Is preferred (see claim 6).
• V is not particularly limited.
• the reversing means accommodates the electronic device to be tested before the test and reverses the customer tray on which the force bar tray is covered.
• a second reversing means for holding the electronic device under test after the test and reversing the force bar tray covered with the customer tray. (See claim 7).
• the apparatus further comprises a removing means for removing the customer tray or the force bar tray from above the force bar tray or the customer tray. (See claim 8).
• the removing means removes the customer tray from above the force bar tray holding the electronic device to be tested before the test. It is preferable that the power bar tray is removed from the top of the customer tray that houses the electronic device under test after the test, and a second removal unit. (See claim 9).
• the apparatus further includes a feeding means for feeding the force bar tray or the customer tray from the removing means or the attaching means to the attaching means or the removing means. It is preferable that this is characterized (see claim 10).
• the forwarding means includes a first forwarding means for forwarding the force bar tray from the second removing means to the first attaching means, and the force stagger tray. And U. (2) a second forwarding means for forwarding from the first removing means to the second mounting means (see claim 11).
• the test head includes guide means that is held by the force bar tray and guides the electronic component to be tested with respect to the socket. It is preferred (see claim 8).
• a guide means is provided on the test head side, and by this guide means, the electronic device under test itself, which is held on the force bar tray and guided to the socket, is miscontacted between the electronic device under test and the socket. Can be prevented.
• FIG. 1 is a schematic plan view showing an entire configuration of an electronic component testing apparatus according to an embodiment of the present invention.
• FIG. 2A is a plan view showing a customer tray used in the electronic device testing apparatus according to the embodiment of the present invention.
• FIG. 2B is a side view of the customer tray shown in FIG. 2A.
• FIG. 2C is an enlarged cross-sectional view showing the IIC portion of FIG. 2B.
• FIG. 3 is a plan view showing a mounting device for an electronic device test apparatus according to an embodiment of the present invention.
• FIG. 4A is a plan view showing a first reversing device of the electronic device test apparatus according to the embodiment of the present invention.
• FIG. 4B is a front view of the first inverting means shown in FIG. 4A.
• FIG. 5 is a plan view showing an attachment / detachment device for an electronic component test apparatus according to an embodiment of the present invention.
• FIG. 6A is a cross-sectional view showing a state in which the force bar tray is attached on the customer tray by the attaching device in the embodiment of the present invention.
• FIG. 6B is a cross-sectional view showing a state where the customer tray and the force bar tray are reversed by the first reversing device in the embodiment of the present invention.
• FIG. 6C is a cross-sectional view showing a state in which the customer tray on the force bar tray is removed by the attaching / detaching device in the embodiment of the present invention.
• FIG. 6D is a cross-sectional view showing a state in which the IC device force test head socket housed in the force bar tray is approaching in the embodiment of the present invention.
• FIG. 6E is a cross-sectional view showing a state where the input / output terminals of the IC device are in electrical contact with the contact pins of the socket in the embodiment of the present invention.
• FIG. 7A is a cross-sectional view showing a state in which the socket of the IC device force test head accommodated in the force bar tray is approaching in another embodiment of the present invention.
• FIG. 7B is a cross-sectional view showing a state where the input / output terminals of the IC device are in electrical contact with the contact pins of the socket in another embodiment of the present invention.
• FIG. 1 is a schematic plan view showing the overall configuration of an electronic component testing apparatus according to an embodiment of the present invention.
• the handler 1 allows a tester (not shown) to input / output a test signal to / from the IC device via the test head 7 in a state where a high-temperature or low-temperature stress is applied to the IC device.
• This is a device for testing (inspecting) whether an IC device operates properly.
• the test of the IC device by the electronic component test apparatus is executed in a state where the IC device is held on the force bar tray 9 arranged in the same manner as the customer tray 8A without using the test tray.
• the handler 1 includes, as shown in FIG.
• a test unit 400 a test unit 400, a heat removal unit 500, and an unloading unit 600.
• the carry-in unit 200 carries one by one into the application unit 300 while covering the cover tray 9 on the customer tray 8A supplied to the noder 1 in a stacked state.
• the IC device is accommodated in the customer tray 8A, and after applying a high or low temperature thermal stress to the IC device, the customer tray 8A and the force bar tray 9 are reversed and overlapped, Carry it into the test unit 400.
• the upper force of the force bar tray 9 is also removed from the customer tray 8A, and the customer tray 9 is moved below the test head 7 to execute the IC device test. Put the customer tray 8A on top and carry it out to the heat removal unit 500.
• the force bar tray 9 and the customer tray 8A are reversed again in an overlapped state, and then the IC device force also removes thermal stress and is carried out to the carry-out unit 600.
• the customer tray 8A is unloaded on the existing unloading section 600! And stacked on the customer tray 8A. .
• the customer tray containing the IC device that has been tested in this way is transported to a dedicated classification machine different from Handler 1 by an operator in the test process or an automatic transport machine such as ADV.
• the test results from the electronic component testing device are given to each customer tray itself as an ID such as a barcode, or transferred as data from the handler 1 to the dedicated classification machine. Then, the IC device is classified into categories according to the test results by the dedicated classification machine.
• FIG. 2A is a plan view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention
• FIG. 2B is a side view of the customer tray shown in FIG. 2A
• FIG. 2C shows the IIC part of FIG. It is an expanded sectional view.
• the customer tray 8A has, for example, a concave housing for housing an IC device on the upper surface of a flat tray body 81 having a synthetic resin material force.
• a total of 126 storage portions 82 are formed in the tray body 81 in an array of 7 rows and 18 columns.
• a rib 83 that protrudes downward is provided on the lower surface side of each accommodating portion 82.
• the rib 83 is formed so as to substantially face the periphery of the accommodating portion 82 of the other customer tray 8A when the customer tray 8A is stacked on the other customer tray 8A. (See Figure 6A below).
• the force bar tray 9 in the present embodiment has the same shape as the customer tray 8A.
• the force bar tray 9 has a flat tray main body 91, a large number of storage portions 92 provided on the tray main body 91, and each storage. And a rib 93 provided on the lower surface side of the container 92.
• the tray main body 91 of the force bar tray 9 is made of a customer tray such as a metal material such as aluminum or stainless steel or ceramics such as alumina (A1 0).
• the material strength is higher than that of the synthetic resin material constituting 8A.
• the force bar tray 9 by configuring the force bar tray 9 with a metal material, it is possible to ensure the strength required to press the IC device against the socket 70 (see FIG. 6E) of the test head 7.
• the IC device when applying or removing thermal stress from the IC device in the application unit 300 or the heat removal unit 500, it is possible to efficiently apply thermal stress to the IC device.
• the IC device and the socket 70 are in contact, the IC device can be positioned with high accuracy with respect to the socket 70.
• the metal force bar tray 9 may be subjected to a slow leak treatment or the like as an ESD (electro-static discharge) countermeasure.
• the power bar tray 9 When the power bar tray 9 is put on the customer tray 8A in which the IC device is accommodated in the accommodating portion 82, the customer tray 8A and the force bar tray 9 are reversed, and the IC device is placed on the rib 93 of the force bar tray 9. Will be held (see Figure 6B). Accordingly, the rib 93 of the force bar tray 9 in this embodiment corresponds to an example of the holding portion of the force bar tray in the present invention. To do.
• FIG. 3 is a plan view showing a mounting apparatus for an electronic component testing apparatus according to this embodiment.
• the carry-in unit 200 includes a first transfer device that transfers the customer trays 8A supplied to the nodler 1 in a stacked state one by one to the first transfer device 230. 210, a first attachment device 220 for covering the customer tray 8A with the force bar tray 9, and a first transfer device 230 for transferring the customer tray 8A to the application unit 300.
• the first transfer device 210 includes a Y-axis direction rail 211 installed along the Y-axis direction on the device substrate of the handler 1, and the Y-axis direction rail 211.
• a movable arm 212 that can reciprocate along the Y-axis direction, and a holding head 213 that is provided at the tip of the movable arm 212 and that can be moved up and down by an actuator (not shown) are provided.
• the holding head 213 has an openable / closable gripping claw 214 for gripping the customer tray 8A downward.
• the Y-axis direction rail 211 is provided so as to straddle the first transport device 230.
• the gripping head 213 grips the customer tray 8A, which is positioned at the uppermost stage of the laminate including the customer tray 8A supplied with the pre-process force to the handler 1, by the gripping claws 214. Then, after the holding head 213 is lifted by an actuator (not shown), the movable arm 212 moves on the Y-axis direction rail 211 and hands over the customer tray 8A to the first transport device 230.
• the first mounting device 220 has an X-axis rail 221 installed on the device board of the handler 1 along the X-axis direction, and an X-axis rail 221 on the X-axis rail 221.
• a movable arm 222 that can reciprocate along the axial direction and a gripping head 223 that is provided at the tip of the movable arm 222 and that can be moved up and down by an actuator (not shown) are provided.
• the gripping head 223 has an open / close-type gripping claw 224 for gripping the force bar tray 9 on the lower side.
• the cover tray 9 positioned at the end point of the first forwarding device 101 is gripped by the gripping head 223 by the gripping claws 224 and held by an actuator (not shown). After the holding head 223 rises, the movable arm 222 moves on the X-axis rail 221 and is gripped on the customer tray 8A located on the first transport device 230! Cover tray 9 can now be covered.
• the first forwarding device 101 is also configured with, for example, a belt conveyor force provided on the device substrate of the handler 1, and is removed from the customer tray 8A by the second removal device 620 in the carry-out portion 600.
• the force bar tray 9 is returned to the first mounting device 220 of the carry-in section 200.
• the first transport device 230 is configured, for example, by arranging a large number of rotating rollers that can be driven by a motor or the like (not shown) in substantially two rows.
• the customer tray 8A can be moved along the axial direction.
• the first transport device 230 is moved by the first transfer device 210 so that the customer tray 8A covered with the force bar tray 9 by the first mounting device 220 is transferred to the application unit 300. It has become.
• FIG. 4A is a plan view showing a first reversing device of the electronic component testing apparatus according to the present embodiment
• FIG. 4B is a front view of the first reversing device shown in FIG. 4A.
• the application unit 300 has a thermostatic chamber that applies a target high or low temperature stress to the IC device accommodated in the customer tray 8A.
• the vertical conveying device conceptually shown in FIG. 1, the second conveying device 310 that conveys the force bar tray 9 and the customer tray 8A to the test unit 400, and the customer tray 8A and the force bar tray 9 are stacked.
• a first reversing device 320 for reversing in the combined state.
• the vertical transfer device can hold a plurality of sets of customer trays 8A and force bar trays 9, and sequentially move these customer trays 8A and force bar trays 9 in the Z-axis direction. It is possible to make it.
• the customer tray 8A waits in the application unit 300 while being held by the vertical transfer device until the test unit 400 becomes empty, so that a high or low temperature stress of about 55 to + 150 ° C is applied to the IC device. To be applied.
• the second transport device 310 is configured by, for example, a plurality of rotating rollers that can be driven by a driving source (not shown) such as a motor arranged in two rows substantially in parallel, and in the X-axis direction.
• a driving source such as a motor arranged in two rows substantially in parallel, and in the X-axis direction.
• the customer tray 8A and the force bar tray 9 can be moved along.
• the first reversing device 320 is provided in each rotating unit 321 so as to face a pair of rotating units 321 provided on the apparatus substrate of the handler 1.
• Each of the extending portions 322 is provided with an extending portion 322 and a chuck 323 provided at the tip of each extending portion 322.
• Each rotating unit 321 is composed of, for example, a rotating motor and a gear mechanism (none of which is shown) connected to the driving shaft thereof, and can rotate the extending unit 322 around the Y-axis direction. It has become.
• Each extending portion 322 is also configured with, for example, an air cylinder force, and the rod 322a can be extended along the Y-axis direction.
• the two extending portions 322 are arranged so that the tips of the rods 322a face each other. For this reason, the distance between the tips of the rods 322a is reduced when each extension 322 is extended, while the distance between the tips of the rods 322a is increased when each extension 322 is shortened.
• a chuck 323 is provided at the tip of the rod 322a of each extension 322.
• Each chuck 323 can be gripped by the overlapping customer tray 8A and cover tray 9 by being opened and closed by air pressure or the like.
• the first reversing device 320 is configured such that the second transport device 310 also transfers the customer tray 8A and the cover tray 9 to the customer while the vertical transport device force is transporting the customer tray 8A and the force bar tray 9 to the test unit 400. From the state where the force bar tray 9 is covered on the tray 8A to the state where the customer tray 8A is covered on the cover tray 9, it is rotated substantially 180 degrees.
• a part of the second transport device 310 is used when the first reversing device 320 is reversed to avoid interference with the customer tray 8A and the force bar tray 9. It is possible to descend.
• FIG. 5 is a plan view showing an attachment / detachment device for the electronic component testing apparatus according to the present embodiment.
• the test unit 400 presses the IC device held by the cover tray 9 against the socket 71 of the test head 7 while maintaining the thermal stress applied to the IC device, and inputs / outputs the IC device. And a contact pin 71 of the socket 70 are electrically contacted to have a test chamber for executing a test of the IC device.
• the upper portion of the test head 7 is inserted into the inside of the test chamber through an opening (not shown) formed in the apparatus substrate, and the socket 70 is located inside the test chamber.
• the customer tray 8A is removed from the top of the force bar tray 9 in which the IC device immediately before the test is accommodated inside the test chamber.
• An attachment / detachment device 410 for re-covering the customer tray 8A is provided.
• the attaching / detaching device 410 removes the customer tray 8A from above the force bar tray 9, and moves the customer tray 8A to the second forwarding device 430.
• the second forwarding device 430 that transports the customer tray 8A moved by the first removal device 420 to the second mounting device 440, and the customer tray 8A transported by the second forwarding device 430.
• a second mounting device 440 for re-covering the bar tray 9 and the force is also configured.
• the first removal device 420 includes a Y-axis direction rail 421 installed on the device board of the handler 1 along the Y-axis direction, and the Y-axis direction rail 421.
• a movable arm 422 that can reciprocate along the Y-axis direction and a gripping head 423 that is provided at the tip of the movable arm 422 and can be moved up and down by an actuator (not shown) are provided.
• the gripping head 423 has an openable / closable gripping claw 424 for gripping the customer tray 8A downward.
• the Y-axis direction rail 421 is provided so as to straddle the second transport device 310 and the second forwarding device 430.
• the second forwarding device 430 is composed of, for example, a belt conveyor or the like, and moves the customer tray 8A to the operation region of the second mounting device 440. Is possible.
• the second mounting device 440 includes a Y-axis direction rail 441 installed on the device board of the handler 1 along the Y-axis direction, and the Y-axis direction rail 421 on the Y-axis direction rail 421.
• a movable arm 442 that can reciprocate along the axial direction, and provided at the tip of the movable arm 442.
• a gripping head 443 that can be moved up and down by an actuator (not shown).
• the gripping head 443 has an openable / closable gripping claw 444 for gripping the customer tray 8A downward.
• the Y-axis direction rail 441 is provided so as to straddle the second forwarding device 430 and the third transport device 510.
• the first removal device 420 of the attachment / detachment device 410 removes the customer tray 8A from the force bar tray 9 positioned on the second transfer device 310 on the application unit 300 side.
• the customer tray 8A is moved to the second forwarding device 430.
• the force bar tray 9 from which the customer tray 8A has been removed is moved onto the test head 7, and the pusher (not shown) is held by the Z-axis drive mechanism (not shown) while being held on the force bar tray 9.
• the IC device is pressed against the socket 70 of the test head 7 through the IC, and the input / output terminals of the IC device are in electrical contact with the contact pin 71 of the socket.
• a device test is run.
• the test result of the IC device is given to the customer tray 8A itself as an ID such as a barcode, or transferred as data from the handler 1 to the dedicated classification machine.
• the force bar tray is ejected from the test head 7 to the third transfer device 510 on the heat removal unit 500 side while holding the tested IC device.
• the second forwarding device 430 moves the customer tray 8A along the X-axis direction.
• the second mounting device 440 receives the customer tray 8A from the second forwarding device 430 and puts it on the force bar tray 9. Put customer tray 8A back on.
• the force bar tray 9 and the customer tray 8A are transported to the heat removal unit 500 by the third transport device 510 in an overlapping state.
• the heat removal unit 500 has a heat removal tank for removing applied thermal stress from a tested IC device, and as shown in FIG.
• the third transfer device 510 that transfers the force bar tray 9 from the test unit 400 to the heat removal unit 500 in a state where the force bar tray 9 is overlapped, and the second reversing device 520 that reverses the force bar tray 9 and the customer tray 8A in an overlap state
• a vertical transfer device conceptually shown in FIG. It has.
• the third transport device 510 is configured, for example, by arranging a plurality of rotating rollers that can be driven by a driving source (not shown) such as a motor in substantially parallel two rows along the X-axis direction.
• a driving source such as a motor
• the customer train 8A and the force bar tray 9 can be moved.
• the second reversing device 520 is not particularly shown, but in the same manner as the first reversing device 320 described above, each time the second reversing device 520 is opposed to a pair of rotating portions provided on the device substrate of the handler 1. An extending portion provided at the rolling portion, and a chuck provided at the tip of each extending portion.
• the third transport device 510 moves the customer tray 8A and the cover tray 9 to the force while the third transport device 510 transports the customer tray 8A and the force bar tray 9 from the test unit 400 to the vertical transport device. From the state in which the customer tray 8A is covered on the bar tray 9 to the state in which the force bar tray 9 is covered on the customer tray 8A, it is rotated by 180 degrees.
• a part of the third transport device 510 is lowered by the second reversing device 520 during reversal in order to avoid interference with the customer tray 8A and the force bar tray 9. It is possible.
• the vertical transfer device can hold a plurality of sets of customer trays 8A and force bar trays 9, and can sequentially move these customer trays 8A and force bar trays 9 in the Z-axis direction.
• this heat removal unit 500 when a high temperature is applied to the IC device by the application unit 300, the IC device is cooled to the room temperature by blowing air and then carried out to the carry-out unit 600. On the other hand, when a low temperature is applied to the IC device by the applying unit 300, the IC device is heated to hot air or a heater or the like to return to a temperature at which dew condensation does not occur and then transported to the transporting unit 600.
• the unloading unit 600 includes a fourth transfer device 610 for unloading the customer tray 8A from the heat removal unit 500, and a second exterior device 620 for removing the upper force bar tray 9 of the customer tray 8A. And a second transfer device 630 for moving the customer tray 8A one by one from the fourth transfer device 610 onto the laminate made up of the customer train 8A unloaded from the handler 1.
• the fourth transport device 610 has a configuration similar to that of the first transport device 210 of the carry-in section 200.
• the fourth transport device 610 has a number of rotations that can be driven by a motor or the like. The rollers are arranged in two rows substantially in parallel, and the customer tray 8A can be moved along the Y-axis direction.
• This fourth transfer device 610 carries the customer tray 8A located at the uppermost stage of the vertical transfer device of the heat removal unit 500 to the carry-out unit 600.
• the second removal device 620 has the same configuration as the first attachment device 220 of the carry-in unit 200, and includes an X-axis rail, a movable arm, and a gripping head. And gripping claws.
• the second removal device 620 covers the customer tray 8A located at the end point of the fourth transport device 610! /, And removes the force bar tray 9 from the customer tray 8A.
• the first forwarding device 101 is moved to the starting point.
• the second transfer device 630 has the same configuration as the first transfer device 210 of the carry-in unit 200, and includes a Y-axis direction rail, a movable arm, and a grip A head and gripping claws are provided.
• This second transfer device 630 is located at the end point of the fourth transfer device 610, and the customer tray 8 A from which the force bar tray 9 has been removed by the second removal device 620 is transferred from the handler 1. It will be transferred to the top level of the stack that is the customer tray that will be transported to the subsequent process!
• 6A to 6E are cross-sectional views showing the state of the customer tray and the force bar tray in each step of the electronic component testing apparatus according to this embodiment.
• a stacked body configured by stacking a plurality of customer trays 8A containing IC devices before testing is loaded into the loading section 200 of the handler 1, it is positioned at the top of the stacked body.
• the first transfer device 210 moves the customer tray 8A on the first transfer device 230.
• the customer tray 8A is loaded into the loading section 200 of the handler 1 with the input / output terminal HB of the IC device facing downward.
• the force bar tray 9 positioned at the end point of the first forwarding device 101 is put on the customer tray 8A.
• the force bar tray 9 is put on the customer tray 8A, as shown in FIG. 6A, the lower portion of the force bar tray 9 enters the upper portion of the customer tray 8A and is received in the receiving portion 82 of the customer tray 8A.
• the rib 93 of the force bar tray 9 is pressed against the upper surface of the device.
• the first transport device 230 carries the customer tray 8A and the force bar tray 9 into the application unit 300, and the vertical transport device sequentially raises the customer tray 8A in the application unit 300 while the IC device A high or low temperature thermal stress is applied.
• the customer tray 8 A that has been raised to the top of the vertical transport device is transported to the test unit 400 by the second transport device 310.
• the first reversing device 320 rotates the customer tray 8A and the force bar tray 9 that overlap each other substantially 180 degrees.
• the customer tray 8A and the force bar tray 9 are reversed by the first reversing device 320, the customer tray 8A is put on the force bar tray 9 as shown in FIG. 6B.
• the terminal HB is held on the force bar tray 9 with the posture facing upward.
• the first removing device 420 of the attachment / detachment device 410 also removes the customer tray 8A from the upper force of the force bar tray 9.
• the force bar tray 9 is conveyed below the test head 7 and the customer tray 8 A is transferred to the second forwarding device 430.
• the test head 7 in the present embodiment includes four guide posts 72 protruding downward. These guide posts 72 are provided around the socket 70 so as to surround the four corners of the IC device held by the ribs 93 of the force bar tray 9 when the IC device is pressed against the socket 71. Inclined tapered surfaces 73 are formed at the tip portions of the side surfaces of the guide posts 72 facing each other.
• the Z-axis drive mechanism (not shown) is held by the force bar tray 9 via a pusher (not shown). Press the IC device against the socket 70, and connect the I / O terminal HB of the IC device to the socket. Electrical contact is made with the 70 contact pins 71 and the tester (not shown) force C is tested through the test head 7.
• a socket 70 is provided on the test head 7 so that a plurality of IC devices can be tested simultaneously.
• a large number of sockets 70 on the test head 7 are arranged at the same pitch as the pitch between the accommodating portions 82 of the customer tray 8A or an integer multiple of the pitch.
• the socket 70 is arranged at an integral multiple of the pitch of the accommodating portion 82 of the customer tray 8A, the IC device is tested by skipping one or more holding portions 92 of the force bar tray 9 and As a result, the IC device is tested multiple times.
• the IC device is guided to the socket 70 along the tapered surface 73 formed at the tip of each guide post 72.
• the input / output terminals HB of the IC device Immediately before the contact pins 71 of the socket 70 come into contact with each other, the IC post is accurately positioned with respect to the socket 70 by the guide post 72.
• the force bar tray 9 has the rib 93 around the rib 93. It is formed in a concave shape.
• the IC device when the test is executed, the IC device is in such a posture that the input / output terminal HB faces upward. For this reason, the length L (see FIG. 6D) of the contact bin 71 of the socket 70 is shortened as compared with the case where the IC device test is executed with the input / output terminal HB facing downward (see FIG. 7B). be able to. Therefore, it is effective when testing IC devices using high-frequency signals.
• the second reversing device 520 overlaps with each other, reverses the customer tray 8A and the force bar tray 9, and then heats the IC device while removing heat.
• Dress The apparatus lowers the customer tray 8A and the force bar tray 9 in order, and delivers them to the fourth transfer device 610.
• the second removal device 620 removes the upper force bar tray 9 of the customer tray 8A, and The customer tray 8A is transferred by the second transfer device 630 to the uppermost stage of the stack including the customer trays that are carried out from the handler 1 to the subsequent process.
• FIG. 7A is a sectional view showing a state in which the IC device housed in the force bar tray is approaching the socket in another embodiment of the present invention
• FIG. 7B is a cross-sectional view of the IC device in another embodiment of the present invention
• FIG. 4 is a cross-sectional view showing a state where input / output terminals are in electrical contact with contact pins of a socket.
• the IC device is tested in a state where it is accommodated in the customer tray 8B rather than being tested in the state where it is held on the force bar tray 9.
• a customer tray 8B has a recess 84 4 into which the upper part of the socket 70 can enter under the accommodating portion 82 that accommodates the IC device. have.
• the recess 84 communicates with the upper accommodating portion 82 via the opening 85.
• the opening 85 has a size such that all the input / output terminals HB of the IC device accommodated in the accommodation part 82 face the recess 84.
• the first reversing device 320 of the application unit 300 and the second of the heat removal unit 500 The reversing device 520 becomes unnecessary.
• the first removing device 420 of the attaching / detaching device 410 removes the force bar tray 9 from above the customer tray 8B, and the IC device is inserted into the socket 70 of the test head 7 while being accommodated in the customer tray 8B.
• the second forwarding device 430 forwards the force bar tray 9, and the second mounting device 440 covers the force bar tray 9 on the customer tray 8B.
• a customer can replace the metal force bar tray 9 with the customer.
• the tray 8A may be used to accommodate the IC device! /, And an empty customer tray 8A may be placed on the customer tray 8A to prevent the IC device from being dispersed.
• the customer tray 8A and the cover tray 9 are described to be reversed immediately before and after the test.
• the present invention is not particularly limited thereto.
• the cover tray 9 is reversed immediately after the cover tray 9 is put on the customer tray 8A, and at the unloading section 600, immediately before the upper tray bar 9 of the customer tray 8A is removed by the second removal device 620. It may be configured to be reversed.
• the guide post 72 is not provided around the socket 70, or the guide head 72 is provided and a guide pin is provided in the test head 7 and a guide hole is formed in the force bar tray 9.
• the force bar tray 9 may be positioned with respect to 7.

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• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Power Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Testing Of Individual Semiconductor Devices (AREA)

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• 2006
  • 2006-10-27 WO PCT/JP2006/321490 patent/WO2008050442A1/ja active Application Filing
  • 2006-10-27 JP JP2007540853A patent/JP5243037B2/ja active Active
  • 2006-10-27 KR KR1020077024030A patent/KR101106972B1/ko active IP Right Grant
• 2007
  • 2007-09-17 TW TW096134690A patent/TWI407118B/zh not_active IP Right Cessation

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