WO2008038574A1 - Tableau de connexion pour élément émettant de la lumière de type à montage en surface et dispositif émettant de la lumière - Google Patents

Tableau de connexion pour élément émettant de la lumière de type à montage en surface et dispositif émettant de la lumière Download PDF

Info

Publication number
WO2008038574A1
WO2008038574A1 PCT/JP2007/068291 JP2007068291W WO2008038574A1 WO 2008038574 A1 WO2008038574 A1 WO 2008038574A1 JP 2007068291 W JP2007068291 W JP 2007068291W WO 2008038574 A1 WO2008038574 A1 WO 2008038574A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting element
light emitting
wiring board
metal body
light
Prior art date
Application number
PCT/JP2007/068291
Other languages
English (en)
Japanese (ja)
Inventor
Minako Izumi
Tomohide Hasegawa
Yasuhiro Sasaki
Original Assignee
Kyocera Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corporation filed Critical Kyocera Corporation
Publication of WO2008038574A1 publication Critical patent/WO2008038574A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a surface-mounting light emitting element wiring board and a light emitting device for mounting a light emitting element such as a light emitting diode.
  • a light emitting device using an LED element has been used for various applications because it has a very high luminous efficiency and has a small amount of heat generated by light emission compared to an incandescent bulb.
  • the amount of emitted light is smaller than that of incandescent bulbs and fluorescent lamps, it is used as a light source for display that is not used for lighting, and the energization amount is very small at about 30 mA (for example, (See JP 2002-134790).
  • a heat sink is provided on the upper side of the semiconductor element (see, for example, Japanese Patent Laid-Open No. 8-222668), or a heat sink is provided on the lower side of the semiconductor element (for example, Japanese Patent Laid-Open No. 7-254668).
  • Japanese Patent Laid-Open No. 8-222668 Japanese Patent Laid-Open No. 8-222668
  • a heat sink is provided on the lower side of the semiconductor element (for example, Japanese Patent Laid-Open No. 7-254668).
  • the LED element is very small, less than lmm square, so the wiring board for the light-emitting element on which the element is mounted is also small, and the high-brightness LED device is used in various devices such as mobile phones and backlights for liquid crystal displays.
  • a mounting method convenient surface mounting is used.
  • a heat radiating body is provided so as to pass through the wiring board for the light emitting element exclusively (for example, refer to Japanese Patent Laid-Open No. 2003-318448).
  • the method disclosed in Japanese Patent Application Laid-Open No. 2006-93565 has a problem that the degree of freedom in design is significantly reduced although the heat dissipation can be improved by providing a through metal body. That is, when the through metal body is not used as an electric circuit, a terminal cannot be provided at a portion where the through metal body is exposed. Therefore, it is necessary to prepare the terminal by avoiding the through metal body. There is no particular problem because the terminals on the light-emitting element side are small enough to function properly.However, on the side where the connection terminals to the external board are provided, it is necessary to dissipate heat from the connection parts of both, and the external electrode terminals There is a need to increase the area. For this reason, when a wiring board for a light emitting element having a through metal body and a large external electrode terminal is manufactured, there is a problem that the wiring board for the light emitting element is necessarily enlarged.
  • An object of the present invention is to provide a surface-mount type light-emitting element wiring board that has a high degree of design freedom and can be miniaturized and is excellent in heat dissipation, and a light-emitting device using the same.
  • a wiring board for a surface-mounted light-emitting element according to the present invention includes an insulating base made of ceramics having a bottomed hole having an opening on an upper surface, and a mounting portion for mounting the light-emitting element on an upper surface, and is disposed in the bottomed hole.
  • the external connection terminals are arranged so that at least a part overlaps the top and bottom.
  • the connection electrode and the external connection terminal are electrically connected by an external wiring formed on the side wall of the insulating base, which may be electrically connected by an internal wiring formed inside the insulating base.
  • the metal body since the metal body is disposed in the bottomed hole formed in the insulating base, the metal body serves as a heat sink and the heat generated by the light emitting element. Can be released to the external substrate through the metal body, the insulating base and the external connection terminal, and the light emitting element can be prevented from being heated excessively. For this reason, it is possible to prevent a decrease in luminance or to further increase the luminance.
  • the insulating base is interposed between the metal body and the external connection terminal, the metal body is not exposed on the lower surface of the surface mount type light emitting element wiring board, and the external connection terminal can be freely designed. Therefore, it contributes to the miniaturization of the surface mounting type light emitting element wiring board, and the wiring design considering the connection reliability and the mounting reliability can also be performed.
  • the metal body and the external connection terminal are arranged so that at least part of the metal body and the external connection terminal are vertically stacked with an insulating base interposed in the thickness direction of the surface mounting type light emitting element wiring board, whereby the heat generated by the light emitting element A path from the body to the outside of the system can be formed short, and an excessive temperature rise of the light emitting element can be suppressed.
  • the wiring board for a surface-mounted light-emitting element includes an insulating base having a mounting portion on which the light-emitting element is mounted on the upper surface, a metal body embedded in the insulating base immediately below the mounting portion, A connection electrode formed on the upper surface of the insulating base; and an external connection terminal formed on the lower surface of the insulating base and electrically connected to the connection electrode.
  • the metal body and the external connection terminal It is preferable that at least a part of the layers overlap each other. In this case, it is desirable that an independent metal film is formed on the mounting portion, or that the connection electrode is extended.
  • the surface mount type light emitting device wiring board of the present invention can freely arrange the connection electrodes and mounting parts when the metal body is embedded in the insulating base and the metal body is not exposed on the top surface of the insulating base. Therefore, it can contribute to miniaturization of the wiring board for the surface mount type light emitting element.
  • connection electrodes formed on the upper surface of the insulating base have a pair of connection electrodes to which a potential difference is applied.
  • a flip-chip type (face-down structure) light-emitting element is mounted, and the electrode terminals of the light-emitting elements are respectively connected. If the metal body is exposed on the upper surface of the insulating substrate when connected to the connection electrode, the pair of connection electrodes to which this potential difference is applied are electrically connected. Will end up.
  • the metal body is not exposed on the upper surface of the insulating substrate, even if a flip chip type (face-down structure) light-emitting element is mounted, the metal body is not electrically connected to the pair of connection electrodes. The body can be placed and a sufficient heat dissipation effect can be obtained.
  • the light emitting element When an insulating base is interposed between the metal body and the connection electrode, and an independent metal film is formed on the mounting portion or the connection electrode extends, the light emitting element is mounted.
  • the light emitting element and the mounting portion can be joined using a material having high thermal conductivity.
  • a metal film plated with Au is formed on the mounting portion, a high heat dissipation effect can be obtained by mounting the light emitting element by AuSn bonding.
  • an independent metal film is formed on the mounting portion or the connection electrode is extended, the light is reflected by the mounting portion, so that the light extraction efficiency can be improved. For example, when Ag plating with high reflectivity is applied to the surface, the light extraction efficiency can be improved.
  • the wiring board for a surface-mounted light-emitting element according to the present invention has a thermal conductivity of the ceramic of 15 W / (m′K) or more, and the insulating substrate between the metal body and the external connection terminal. Desirably, the thickness is 50 to 200 111, and 30% or more of the lower surface of the metal body is disposed so as to overlap with the external connection terminals.
  • the surface mount type light emitting device wiring board of the present invention has a thermal conductivity of 15 W / (m * K) or more of the ceramic forming the insulating base, and the insulating substrate between the metal body and the external connection terminal.
  • the thickness of the body is 50 to 200 111, and 30% or more of the lower surface of the metal body is arranged so as to overlap with the external connection terminals. A heat dissipation effect can be realized.
  • the light-emitting device of the present invention is obtained by mounting a light-emitting element on the mounting portion of the wiring board for a surface-mounted light-emitting element described above.
  • the heat generated from the light emitting element can be quickly generated using the metal body and the external connection terminal. Since it can be discharged outside the device, it can suppress the decrease in brightness due to heat generation, and the design force of the external connection terminal is high, so it can be downsized. it can.
  • FIG. 1A is a cross-sectional view of a wiring board for a surface-mounted light-emitting element according to one embodiment of the present invention
  • FIG. 1B is a cross-sectional view of a wiring board for a surface-mounted light-emitting element according to another embodiment of the present invention. is there.
  • FIG. 2A is a cross-sectional view of a light-emitting device according to an embodiment of the present invention
  • FIG. 2B is a cross-sectional view of a light-emitting device according to another embodiment of the present invention.
  • FIG. 3A is a cross-sectional view of a wiring board for a surface-mounted light-emitting element according to still another embodiment of the present invention
  • FIG. 3B is a wiring board for a surface-mounted light-emitting element according to still another embodiment of the present invention. It is sectional drawing.
  • FIG. 4A is a cross-sectional view of a wiring board for a surface-mounted light-emitting element according to still another embodiment of the present invention
  • FIG. 4B is a flip-chip light-emitting element on the wiring board for the surface-mounted light-emitting element of the present invention. It is sectional drawing of the light-emitting device of further another embodiment of this invention which mounted
  • FIG. 5A is a cross-sectional view of a light-emitting device according to still another embodiment of the present invention
  • FIG. 5B is a cross-sectional view of a light-emitting device according to still another embodiment of the present invention.
  • FIGS. 6A and 6C are plan views of the surface mount type light emitting device wiring board of the comparative example as viewed from below. It is.
  • a wiring board 11 for a surface-mounted light-emitting element includes a flat insulating base 1 made of ceramics and a bottomed hole 3 formed in the insulating base 1. It has. A metal body 5 is disposed in the bottomed hole 3, and a mounting portion 7 for mounting a light emitting element is formed on the upper side of the metal body 5.
  • connection electrode 9 that is electrically connected to the electrode of the light emitting element mounted on the mounting portion 7 is disposed on the upper surface la of the insulating substrate 1, and the surface mounting of the present invention is performed on the lower surface lb of the insulating substrate 1.
  • An external connection terminal 13 for electrically connecting the wiring board 11 for type light emitting element to an external wiring board or the like is disposed.
  • an internal wiring 15 that electrically connects the connection electrode 9 and the external connection terminal 13 is disposed so as to penetrate the insulating substrate 1 inside the insulating substrate 1.
  • the metal body 5 and the external connection terminal 13 are arranged so as to overlap at least partially in the vertical direction.
  • the metal body 5 when the metal body 5 is embedded in the bottomed hole 3 under the mounting portion 7 of the insulating base 1, heat generated from the light emitting element mounted on the surface mount type light emitting element wiring substrate 11 of the present invention is generated.
  • the metal body 5 By promptly transmitting the light to the metal body 5, it is possible to prevent the temperature of the light emitting element from excessively rising, to suppress a decrease in luminance of the light emitting element, and to achieve higher luminance.
  • the metal body 5 since the metal body 5 is arranged in the bottomed hole 3, the metal body 5 is not exposed to the lower surface lb of the surface mount type light emitting device wiring board 11, so that the wiring design of the external connection terminal 13 can be reduced.
  • the degree of freedom is high, and the surface mount type light emitting element wiring board 11 can be miniaturized.
  • the metal body 5 and the external connection terminal 13 are arranged so as to overlap each other in the thickness direction of the surface mount type light emitting element wiring board 11, in other words, a part of the external connection terminal 13 is seen from above. Since it overlaps with the metal body 5, the heat generated from the light emitting element and transferred to the metal body 5 with high thermal conductivity is released outside the system through the external connection terminal 13 with high thermal conductivity. It is possible to prevent excessive heat generation of the light emitting element.
  • the ratio of the external connection terminals 13 to the lower surface lb of the insulating substrate 1 is 45% or more in terms of area ratio.
  • the external connection terminal 13 occupies a large area, so that the surface mount type light emitting device wiring board 11 can be realized with high heat dissipation and at the same time connection reliability and mounting reliability. It is also possible to perform wiring design considering the above.
  • the area ratio of the external connection terminals 13 is preferably 60% or more.
  • the wiring substrate for the surface mount light emitting element is further increased.
  • the heat dissipation effect of the plate 11 can be enhanced.
  • the thickness of the insulating base 1 between the metal body 5 and the external connection terminal 13 is 50 to 200 m! /.
  • the thickness of the insulating substrate 1 between the metal body 5 and the external connection terminal 13 is preferably ⁇ , ⁇ , more preferably 80 to 100111.
  • the insulating substrate 1 it is desirable to use a material having a thermal conductivity of 15 W / (m′K) or more. As a result, the power S for further enhancing the heat dissipation of the surface mount type light emitting element wiring substrate 11 can be obtained.
  • the surface mount type light emitting element wiring board 11 of the present invention has a comprehensively satisfying these requirements, that is, the thermal conductivity of the ceramic forming the insulating substrate 1 is 15 W / (m ′ K) Above, the thickness of the insulating base 1 between the metal body 5 and the external connection terminal 13 is 50 to 200 m, and 30% or more of the lower surface of the metal body 5 is arranged so as to overlap the external connection terminal 13 vertically. In particular, it exhibits an excellent heat dissipation effect.
  • Inexpensive raw materials can be used, and an inexpensive surface mount type light emitting element wiring substrate 11 can be obtained.
  • the Al 2 O-type sintered body having Al 2 O as the main crystal phase is, for example, A1 by X-ray diffraction.
  • the O peak is detected as the main peak.
  • such a sintered body has, for example, an A 1 O powder having an average particle size of 1.0 to 2.0 m and a purity of 99% or more, an average particle size of 1.0 to 2.0 am (Mn O, Group power of SiO, MgO, CaO, SrO,
  • the “average particle size” means the particle size d50 at which the cumulative curve is 50% when the cumulative curve is obtained with the total volume of the powder group as 100%.
  • X-100 manufactured by Nikkiso Co., Ltd.
  • Al O is the main component.
  • the amount of composition other than Al 2 O, such as sintering aids is desirably 15% by mass or less, and more desirably 10% by mass or less.
  • the amount of composition other than Al 2 O, such as sintering aids is desirably 15% by mass or less, and more desirably 10% by mass or less.
  • most of the obtained insulating substrate 1 is formed of Al 2 O crystals.
  • These sintering aids are preferably added in an amount of 5% by mass or more, and more preferably 7% by mass or more in order to lower the firing temperature.
  • a sintered body mainly composed of glass ceramics, magnesium oxide, zirconium oxide, aluminum nitride, silicon nitride, mullite, cordierite, or the like may be used.
  • the thermal conductivity of the metal body 5 is particularly preferably 150 W / (m′K) or more.
  • the effect of the metal body 5 as a heat sink can be further enhanced, and high heat dissipation can be obtained.
  • Cu, Cu—W, Ag, Al, W, Mo, or the like can be used.
  • the metal body 5 may have a rectangular parallelepiped shape, a cylindrical shape, or a multistage shape.
  • the volume of the metal body 5 can be maximized and high heat dissipation can be realized.
  • a cylindrical shape it is possible to prevent stress concentration and provide high reliability.
  • a multi-stage shape since the contact area with the insulating base 1 is large, the bonding reliability with the insulating base 1 can be increased.
  • the surface mount type light emitting element wiring board 11A is provided with a light emitting element for guiding light from the light emitting element mounted on the mounting portion 7 or a light emitting element.
  • a frame 17 may be provided on the upper surface la of the insulating substrate 1.
  • the frame 17 can protect the light emitting element and can easily arrange a phosphor or the like around the light emitting element.
  • the light emitted from the light emitting element can be reflected by the frame body 17 and guided in a predetermined direction.
  • the inner wall surface 17a of the frame body 17 may be perpendicular to the upper surface la of the insulating substrate 1 or may be inclined. When the inner wall surface 17a of the frame 17 is inclined outward, the light extraction efficiency is further increased.
  • the frame 17 may be ceramic or metal, and when the same material as the insulating base 1 is used, High heat and reliability with the insulating substrate 1 can be obtained, and higher heat dissipation and light extraction efficiency can be obtained by using ceramics or metal of high heat transfer material or high reflectivity material.
  • a method for manufacturing the surface mount type light emitting element wiring boards 11 and 11A in the present invention will be specifically described. First, as described below, a ceramic green sheet, a metal sheet, and a conductor paste are prepared.
  • the ceramic green sheet is formed on a sheet from a ceramic slurry prepared by mixing ceramic powder, a resin, and a solvent at a predetermined ratio, by a conventionally known doctor blade method or the like.
  • the metal sheet is also formed into a sheet shape by a doctor blade method or the like from a metal slurry formed from a metal powder, a resin and a solvent.
  • the metal slurry may contain ceramic powder as necessary. Ceramic powders and metal powders used for ceramic green sheets and metal sheets preferably have an average particle size of 0.01 to about 10 to 10 m, especially powders in the range of 1 to 5 m. Is excellent in handling and sinterability.
  • a conductor paste containing at least one of Cu, Ag, W, and Mo as a main component is prepared.
  • the conductive paste is produced by mixing metal powder, resin and solvent in a predetermined ratio and removing the solvent by heating under reduced pressure. Ceramic powder may be included as necessary.
  • the average particle size of the metal powder and ceramic powder used in the conductive paste is 0.01 to 10 m, and the powder is preferably used in the range of 1 to 5 m. Excellent sinterability!
  • a via hole is formed in the ceramic green sheet with a micro drill or laser, and the via hole is filled with a conductor paste by a method such as printing, and the conductor paste is printed on the surface of the ceramic green sheet to form a wiring. Then, after forming a through hole at a predetermined location of the ceramic green sheet, a metal sheet is laminated on the ceramic green sheet in which the through hole is formed, and a through hole forming portion in the ceramic green sheet is pressed from the metal sheet side, Part of the metal sheet is embedded in the through hole, and the ceramic liner sheet and the metal sheet are integrated. At this time, the ceramic green sheet and metal sheet It is desirable that the thickness is almost the same thickness.
  • connection electrode 9, the external connection terminal 13, the internal wiring 15, and the metal 5 were formed on the surface and inside.
  • the surface mount type light emitting element wiring substrate 11 can be manufactured.
  • connection body 9 and the external connection terminal 13 may be formed on the surface of the insulating substrate 1 by a thin film method, or may be formed by transferring a metal foil onto the surface of the molded body.
  • a pure metal block may be bonded to the baked insulating substrate 1 using solder, silver solder or active solder.
  • a frame 17 as shown in FIG. 1B can be formed by punching a ceramic green sheet, laminating it on the ceramic green sheet of the insulating substrate 1, and performing simultaneous firing. It is also possible to form a metal such as A1 or Fe—Ni—Co alloy in the shape of a frame by cutting or etching and adhere it to the sintered insulating substrate 1 using a brazing agent or resin. When bonding using a brazing agent, it is necessary to form a metal layer (not shown) using a metal paste on the bonding surface between the insulating substrate 1 and the frame 17.
  • a plating layer made of Ni, Au, A1, Ag, or the like is formed on the surface of the connection electrode 9, the external connection terminal 13, the metal body 5, and the frame body 17 to increase reflectivity and emit light.
  • the extraction efficiency of light generated from the element may be improved.
  • the light emitting element 21 is provided with a connection layer 23 made of metal or resin on the mounting portion 7 of the surface mount type light emitting element wiring board 11 or 11A of the present invention described above.
  • the terminal (not shown) of the light emitting element 21 and the connection electrode 9 are connected by a bonding wire 25, and the light emitting element 21, the connection layer 23, and the bonding wire 25 are made of a molding material or the like.
  • a translucent sealing resin 27 or the like By covering with a translucent sealing resin 27 or the like, a light emitting device 29 according to an embodiment of the present invention and a light emitting device 29A according to another embodiment of the present invention are obtained.
  • the light emitting element 21 is covered with the sealing resin 27, the light emitting element 21 may be sealed using a lid (not shown) without using the sealing resin 27. And a lid may be used in combination. As the lid used in this case, it is desirable to use a light-transmitting material such as glass.
  • the wavelength of the light emitted from the light emitting element 21 is converted into this sealing resin 27. You can also add a phosphor (not shown).
  • connection layer 23 it is desirable to use a metal such as solder, indium, or AuSn alloy as the connection layer 23.
  • the heat dissipation is further improved by providing a heat sink.
  • a heat sink For example, it is not excluded to provide a cooling device.
  • the light-emitting device 29, 29A of the present invention in which the light-emitting element 21 is mounted on the surface mount type light-emitting element wiring board 11, 11A of the present invention described above, light is emitted through the metal body 5 and the external connection terminal 13. Since the heat generated from the element 21 can be quickly released outside the device, it is possible to suppress a decrease in luminance due to the generated heat, and the external connection terminal 13 has a high degree of freedom in design, and thus can be downsized. .
  • connection electrode 9 and the external connection terminal 13 in the surface mount type light emitting element wiring board of the present invention is not limited to the connection by the internal wiring 15, but is still another embodiment of the present invention shown in FIG. 3A.
  • the connection by the external wiring 16 may be used like the surface mount type light emitting element wiring board 11B of the embodiment.
  • the surface mount type light emitting element wiring board 11C includes an upper surface la of the insulating substrate 1 so as to cover the lower surface of the metal body 5 from below.
  • a cover land 31 may be provided in parallel.
  • the metal body 5 may be embedded in the insulating base 1 immediately below the mounting portion 7 so that the insulating base 1 is interposed between the metal body 5 and the connection electrode 9.
  • the mounting portion 7 is within the cross section of the metal body 5 when viewed from above, in other words, when viewed from above the metal body 5. It is preferable that the outer periphery of the cross section is located outside the mounting portion 7.
  • the mounting portion 7 means a region where the light emitting element 21 on the upper surface la of the insulating substrate 1 is mounted, in other words, an upper surface region of the insulating substrate 1 overlapping the light emitting element 21 when viewed from above.
  • a flip chip type (face-down structure) light emitting element is mounted by embedding a metal body 5 inside the insulating substrate 1. Even in such a case, the metal body can be disposed without electrically connecting the pair of connection electrodes, so that a sufficient heat radiation effect can be obtained. That is, as the connection electrodes formed on the upper surface of the insulating substrate, there are a pair of connection electrodes to which a potential difference is applied, and a flip-chip (face-down structure) light-emitting element is mounted, and the electrode terminals of the light-emitting elements are respectively connected.
  • the metal body If the metal body is exposed on the upper surface of the insulating substrate when connected to the connection electrode, the pair of connection electrodes to which this potential difference is applied are electrically connected. On the other hand, if the metal body is not exposed on the upper surface of the insulating substrate, the metal body can be connected without electrically connecting the pair of connection electrodes even if a flip-chip (face-down structure) light-emitting element is mounted. It can arrange
  • the thickness of the insulating substrate 1 between the metal body 5 and the connection electrode 9 (the distance from the upper surface of the metal body 5 to the upper surface la of the insulating substrate 1) is between the metal body 5 and the external connection terminal 13. Similarly to the thickness of the insulating substrate 1, it is desirable that the thickness is 50 to 200 ⁇ m, particularly 60 to 150 ⁇ m, more preferably 80 to 100 m from the viewpoint of insulation and heat dissipation.
  • the light emitting element 21 and the mounting portion 7 can be joined using a material having high thermal conductivity.
  • connection electrode 9 is extended to the mounting portion 7 as in the light emitting device 29C according to still another embodiment of the present invention shown in FIG. 5A, of the pair of connection electrodes 9 shown in FIG. 2A.
  • One of them extends in a direction parallel to the upper surface la of the insulating substrate 1, meaning that the connection electrode 9 is formed in the entire region of the mounting portion 7.
  • the fact that the independent metal film 8 is formed on the mounting portion 7 means that it is electrically connected to the connection electrode 9 as in the light emitting device 29D of still another embodiment of the present invention shown in FIG. 5B. This means that no metal film 8 was formed in the entire area of the mounting part 7. Taste.
  • the mounting part 7 has the metal film 8 plated with Au
  • a high heat dissipation effect can be obtained by mounting the light emitting element 21 by bonding using AuSn alloy.
  • the force that the independent metal film 8 is formed on the mounting portion 7 or the extension of the connection electrode causes the light to be reflected by the mounting portion 7, leading to an improvement in light extraction efficiency.
  • the light extraction efficiency can be improved when Ag plating with high reflectivity is applied to the surface.
  • the purity is 99% or more, the average particle size is 1.5 111 8 1 O powder, the purity is 99% or more, the average particle size is 1.0 111, 310 powder ,
  • a powder 11 with an average particle size of 2.0 111 is used, and 30% by mass of Cu powder and 70% by mass of W powder are mixed together to form an organic resin (binder) for molding.
  • an organic resin (binder) for molding After adding an talyl-based binder and toluene as a solvent and preparing a slurry to be a metal sheet in the same manner as the ceramic green sheet, a metal sheet having substantially the same thickness as the ceramic green sheet was prepared by the doctor blade method.
  • the average particle size of 2 111 of Cu powder 30 mass 0/0, W powder having an average grain size of 2 m, an acrylic-by Sunda and acetone were mixed as a solvent, the conductor pair one by removing the solvent by vacuum heating or the like A strike was prepared.
  • the ceramic green sheet as the insulating base is punched to form a via hole having a diameter of 100 m.
  • the via hole is filled with a conductive paste by a screen printing method, and a wiring pattern is formed. Was printed and applied.
  • a through hole is formed at a predetermined position of the ceramic green sheet, and a part of the metal sheet is embedded in the through hole by pressing a through hole forming portion of the ceramic green sheet from the metal sheet.
  • the composite of the ceramic green sheet and metal sheet thus produced, and the ceramic green sheet were combined, aligned, and laminated and pressed to produce a laminate.
  • a substrate was produced.
  • the thickness of the connection electrode and the external connection terminal was 20 ⁇ .
  • Ni, Au, and Ag plating were sequentially performed on the surface of the metal body exposed on the upper surface of the connection electrode, the external connection terminal, and the insulating base.
  • FIG. 6A to 6C are plan views of the fabricated surface-mount light-emitting element wiring board as viewed from below, and FIG. 6A is the surface-mount light-emitting element wiring board of the present invention.
  • Figure 6C shows a sample prepared as a comparative example. That is, FIG. 6B is a diagram showing a sample in which the metal body and the external connection terminal do not overlap in the thickness direction of the surface mount type light emitting device wiring board, and FIG. 6C is a diagram of the sample in which the through metal body is provided. .
  • a circle indicated by a broken line indicates the position of the metal body provided on the surface mount type light emitting element wiring board.
  • two external connection terminals 13 are formed in parallel so as to run vertically from one side of the insulating base to the opposite side, and the width W of the external connection terminal 13 is expressed. Changed as shown in 1. The distance G between the two external connection terminals 13 was also changed as shown in Table 1.
  • Table 1 shows the ratio of the area occupied by the external connection terminals to the bottom surface of the insulating substrate as S1, and the area where the metal body and the external connection terminals overlap is the cross-sectional area of the metal body viewed from above. Overlapping! / Injuring harm IJ combined is shown as S2.
  • the surface mount type light emitting device wiring board produced was a metal body of the same size placed in a bottomed hole with a diameter of 1.8 mm and a thickness of 0.4 mm placed on a 4 mm x 4 mm plate-shaped insulating substrate.
  • the thickness is 0.4 mm plus the thickness of the insulating substrate between the metal body and the external connection terminals listed in Table 1.
  • the thermal conductivity of the insulating substrate was 16 W / (m′K).
  • the tower A frame body having a width of 0.4 mm and a thickness of 0.3 mm was disposed along the end of the insulating base on the mounting portion side.
  • An epoxy resin is used as an adhesive on the mounting part of the wiring board for these surface-mounted light-emitting elements.
  • An LED chip which is a 5 W light-emitting element, is mounted, and the LED chip and connection terminals are connected by bonding wires to emit light. A device was made.
  • the obtained light-emitting device was mounted on an organic substrate with solder, a current of 0.4 A was passed through the light-emitting device, and the element temperature was measured after 1 minute. The results are shown in Table 1.
  • a light emitting device can be provided.

Abstract

L'invention concerne un tableau de connexion pour un élément émettant de la lumière de type à montage en surface, ayant un degré de liberté élevé dans la conception, ayant de petites dimensions et d'excellentes caractéristiques de dissipation de chaleur. Un dispositif émettant de la lumière utilisant un tel élément émettant de la lumière de type à montage en surface est également proposé. Le tableau de connexion (11) pour l'élément émettant de la lumière de type à montage en surface est configuré par arrangement d'un corps métallique (5) dans un trou de fond (3) disposé sur un substrat isolant de type panneau plat (1) composé de céramique. Une borne de connexion externe (13), pour un montage du tableau de connexion (11) sur un tableau de connexion externe, et le corps métallique (5) sont disposés verticalement l'un sur l'autre dans la direction de l'épaisseur au moins au niveau d'une partie. Ainsi, le tableau de connexion (11) ayant un haut degré de liberté dans la conception, ayant de petites dimensions et d'excellentes caractéristiques de dissipation de chaleur, et le dispositif émettant de la lumière (29) utilisant un tel tableau de connexion sont proposés.
PCT/JP2007/068291 2006-09-26 2007-09-20 Tableau de connexion pour élément émettant de la lumière de type à montage en surface et dispositif émettant de la lumière WO2008038574A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006260715 2006-09-26
JP2006-260715 2006-09-26
JP2007-141782 2007-05-29
JP2007141782A JP2008109079A (ja) 2006-09-26 2007-05-29 表面実装型発光素子用配線基板および発光装置

Publications (1)

Publication Number Publication Date
WO2008038574A1 true WO2008038574A1 (fr) 2008-04-03

Family

ID=39230008

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/068291 WO2008038574A1 (fr) 2006-09-26 2007-09-20 Tableau de connexion pour élément émettant de la lumière de type à montage en surface et dispositif émettant de la lumière

Country Status (2)

Country Link
JP (1) JP2008109079A (fr)
WO (1) WO2008038574A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010250943A (ja) * 2009-04-10 2010-11-04 Rohm Co Ltd 有機ｅｌ装置
EP2369903A1 (fr) * 2010-03-24 2011-09-28 Asahi Glass Company, Limited Substrat pour élément électroluminescent et dispositif électroluminescent
EP2398072A1 (fr) * 2009-02-10 2011-12-21 Nichia Corporation Dispositif électroluminescent à semi-conducteurs
CN102779932A (zh) * 2011-05-13 2012-11-14 Lg伊诺特有限公司 发光器件封装及具有该发光器件封装的紫外灯
WO2013124420A1 (fr) * 2012-02-23 2013-08-29 Osram Opto Semiconductors Gmbh Procédé de fabrication d'un composant optoélectronique et composant optoélectronique fabriqué par ledit procédé
JP2016213509A (ja) * 2011-08-22 2016-12-15 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを含むライトユニット
DE112013000768B4 (de) 2012-01-31 2023-11-16 Seoul Semiconductor Co., Ltd. Leuchtdiodeneinheit

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5345363B2 (ja) 2008-06-24 2013-11-20 シャープ株式会社 発光装置
CN103325778B (zh) * 2009-10-21 2016-08-10 东芝照明技术株式会社 发光装置以及照明器具
JP5679405B2 (ja) * 2010-03-05 2015-03-04 セイコーインスツル株式会社 電子デバイス及びその製造方法
JP2016086191A (ja) * 2010-11-05 2016-05-19 ローム株式会社 半導体発光装置
JP5862574B2 (ja) * 2010-11-19 2016-02-16 旭硝子株式会社 発光素子用基板および発光装置
KR101869552B1 (ko) * 2011-05-13 2018-06-21 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 자외선 램프
KR101933022B1 (ko) * 2011-05-13 2018-12-27 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 자외선 램프
KR101853067B1 (ko) 2011-08-26 2018-04-27 엘지이노텍 주식회사 발광 소자 패키지
JP6038482B2 (ja) * 2012-04-27 2016-12-07 日本特殊陶業株式会社 発光素子搭載用配線基板
JP6145945B2 (ja) * 2012-05-31 2017-06-14 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール
KR101973395B1 (ko) * 2012-08-09 2019-04-29 엘지이노텍 주식회사 발광 모듈
KR20140039740A (ko) * 2012-09-25 2014-04-02 엘지이노텍 주식회사 발광소자 패키지
JP6125528B2 (ja) * 2012-11-06 2017-05-10 日本碍子株式会社 発光ダイオード用基板および発光ダイオード用基板の製造方法
JP6125527B2 (ja) * 2012-11-06 2017-05-10 日本碍子株式会社 発光ダイオード用基板および発光ダイオード用基板の製造方法
DE102014115375A1 (de) * 2014-08-08 2016-02-11 Epcos Ag Träger für eine LED

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04246876A (ja) * 1991-02-01 1992-09-02 Nec Corp 半導体レーザ素子
JPH06283805A (ja) * 1993-03-26 1994-10-07 Sharp Corp 半導体レーザ装置
JPH09148691A (ja) * 1995-09-19 1997-06-06 Denso Corp プリント配線基板
JP2003168829A (ja) * 2001-09-19 2003-06-13 Matsushita Electric Works Ltd 発光装置
JP2003243717A (ja) * 2002-02-14 2003-08-29 Matsushita Electric Works Ltd 発光装置
JP2006093565A (ja) * 2004-09-27 2006-04-06 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
JP2006140360A (ja) * 2004-11-12 2006-06-01 Ngk Spark Plug Co Ltd 配線基板
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04246876A (ja) * 1991-02-01 1992-09-02 Nec Corp 半導体レーザ素子
JPH06283805A (ja) * 1993-03-26 1994-10-07 Sharp Corp 半導体レーザ装置
JPH09148691A (ja) * 1995-09-19 1997-06-06 Denso Corp プリント配線基板
JP2003168829A (ja) * 2001-09-19 2003-06-13 Matsushita Electric Works Ltd 発光装置
JP2003243717A (ja) * 2002-02-14 2003-08-29 Matsushita Electric Works Ltd 発光装置
JP2006093565A (ja) * 2004-09-27 2006-04-06 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
JP2006140360A (ja) * 2004-11-12 2006-06-01 Ngk Spark Plug Co Ltd 配線基板
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2398072A4 (fr) * 2009-02-10 2014-10-29 Nichia Corp Dispositif électroluminescent à semi-conducteurs
EP2398072A1 (fr) * 2009-02-10 2011-12-21 Nichia Corporation Dispositif électroluminescent à semi-conducteurs
JP2010250943A (ja) * 2009-04-10 2010-11-04 Rohm Co Ltd 有機ｅｌ装置
EP2369903A1 (fr) * 2010-03-24 2011-09-28 Asahi Glass Company, Limited Substrat pour élément électroluminescent et dispositif électroluminescent
EP2523230A3 (fr) * 2011-05-13 2015-12-02 LG Innotek Co., Ltd. Paquet de dispositif électroluminescent et lampe à rayonnement ultraviolet le possédant
CN102779932A (zh) * 2011-05-13 2012-11-14 Lg伊诺特有限公司 发光器件封装及具有该发光器件封装的紫外灯
US10270021B2 (en) 2011-05-13 2019-04-23 Lg Innotek Co., Ltd. Light emitting device package and ultraviolet lamp having the same
US10811583B2 (en) 2011-05-13 2020-10-20 Lg Innotek Co., Ltd. Light emitting device package and ultraviolet lamp having the same
JP2016213509A (ja) * 2011-08-22 2016-12-15 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを含むライトユニット
USRE48858E1 (en) 2011-08-22 2021-12-21 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device package and light unit
DE112013000768B4 (de) 2012-01-31 2023-11-16 Seoul Semiconductor Co., Ltd. Leuchtdiodeneinheit
WO2013124420A1 (fr) * 2012-02-23 2013-08-29 Osram Opto Semiconductors Gmbh Procédé de fabrication d'un composant optoélectronique et composant optoélectronique fabriqué par ledit procédé
US9543479B2 (en) 2012-02-23 2017-01-10 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component and optoelectronic component produced in such a way

Also Published As

Publication number Publication date
JP2008109079A (ja) 2008-05-08

Similar Documents

Publication Publication Date Title
WO2008038574A1 (fr) Tableau de connexion pour élément émettant de la lumière de type à montage en surface et dispositif émettant de la lumière
JP4789671B2 (ja) 発光素子用配線基板ならびに発光装置
US8314346B2 (en) Wiring board for light-emitting element
US9596747B2 (en) Wiring substrate and electronic device
JP2006093565A (ja) 発光素子用配線基板ならびに発光装置およびその製造方法
JP2007273602A (ja) 発光素子用配線基板および発光装置
JP4841284B2 (ja) 発光素子用配線基板ならびに発光装置
JP2006066519A (ja) 発光素子用配線基板ならびに発光装置
JP2007273603A (ja) 発光素子用配線基板および発光装置
JP4780939B2 (ja) 発光装置
JP2007273592A (ja) 発光素子用配線基板および発光装置
JP5046507B2 (ja) 発光素子用配線基板および発光装置
JP6010333B2 (ja) 配線基板および電子装置
JP2011205009A (ja) 表面実装型発光素子用配線基板および発光装置
JP2006156447A (ja) 発光素子用配線基板ならびに発光装置およびその製造方法
JP4699042B2 (ja) 発光素子用配線基板ならびに発光装置
JP2007149810A (ja) 発光素子用配線基板および発光装置
JP2007227738A (ja) 発光素子用配線基板ならびに発光装置
JP4895777B2 (ja) 発光素子用配線基板ならびに発光装置
JP2006128265A (ja) 発光素子用配線基板ならびに発光装置
JP2007123481A (ja) 発光素子用配線基板ならびに発光装置
JP2006066409A (ja) 発光素子用配線基板および発光装置ならびに発光素子用配線基板の製造方法
JP2011176060A (ja) 発光装置
JP6046421B2 (ja) 配線基板および電子装置
JP2011071554A (ja) 発光素子用配線基板ならびに発光装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07828286

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07828286

Country of ref document: EP

Kind code of ref document: A1