WO2008032647A1 - Substrate for display panel, and display panel provided with the substrate - Google Patents
Substrate for display panel, and display panel provided with the substrate Download PDFInfo
- Publication number
- WO2008032647A1 WO2008032647A1 PCT/JP2007/067475 JP2007067475W WO2008032647A1 WO 2008032647 A1 WO2008032647 A1 WO 2008032647A1 JP 2007067475 W JP2007067475 W JP 2007067475W WO 2008032647 A1 WO2008032647 A1 WO 2008032647A1
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- WIPO (PCT)
- Prior art keywords
- strip
- display panel
- lead
- out wiring
- substrate
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/13606—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit having means for reducing parasitic capacitance
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
- G02F1/136263—Line defects
Definitions
- Substrate for display panel for display panel, display panel provided with this substrate, method for manufacturing substrate for display panel, and method for manufacturing display panel
- the present invention relates to a display panel substrate, a display panel including the substrate, and a method for correcting the display panel, and in particular, a conductor film having a predetermined pattern, such as a substrate for a liquid crystal display panel, and a semiconductor film
- the present invention relates to a display panel substrate having a laminated structure such as an insulating film, a display panel including the substrate, and a method for correcting the display panel.
- a general active matrix type liquid crystal panel has a configuration in which a TFT array substrate and a counter substrate are arranged to face each other with a predetermined minute gap therebetween, and the gap is filled with liquid crystal. Exclude.
- FIG. 18 is a plan view schematically showing a conventional example of the configuration of a TFT array substrate.
- An active region is provided on one surface of the TFT array substrate 9.
- a plurality of picture element electrodes (not shown) and switching elements (not shown) for driving each of the plurality of picture element electrodes are arranged in a matrix.
- the active region 91 is provided with a plurality of data signal lines 911, a plurality of gate signal lines 912, and a force S for driving these switching elements.
- each lead-out wiring 921 for transmitting a source signal to each data signal line 911 is provided outside the active region 91.
- One end of each lead-out wiring 921 is electrically connected to a predetermined data signal line 911 in the vicinity of the outer edge of the active region 91, and the other end is connected to a land provided in the vicinity of the outer edge of the TFT array substrate 9.
- these lead-out wirings are generally focused by a predetermined number in accordance with the outer edge force of the active region and toward the outer edge of the TFT array substrate.
- these lead-out wirings form a bundle of wires for each predetermined number, and each wire bundle has a tapered shape that converges according to the directional force toward the outer edge of the TFT array substrate.
- the lead wires included in each wire bundle are located at the center of each wire bundle, and the length becomes longer according to the urging force at both ends having the shortest length.
- the lengths of the lead wires included in each wire bundle are different from each other.
- each lead-out wiring may differ depending on their length. For this reason, the display state forces of the pixel groups that receive the transmission of the source signal through the lead wires (and the data signal lines connected thereto) having different lengths may be different from each other.
- the electrical resistance and the parasitic capacitance also vary from the center to both ends. It gradually changes toward. Therefore, from the pixel group that receives the transmission of the source signal through the lead wire (and the data signal line connected to the lead wire) located at the center of each wire bundle, the lead wire (and the data signal connected to them) located at both ends. There is a risk that the display state will change in gradation toward the picture element that receives the source signal through the line. Since a plurality of wiring bundles are provided, a plurality of gradation-like display changes appear continuously in the image displayed on the display panel as a whole, and as a result, vertical stripe-like display unevenness may appear.
- the configuration described in Japanese Patent Application Laid-Open No. 2006-106676 has the following problem S.
- the foreign matter adheres to the surface of the substrate, the foreign matter penetrates the insulating film formed between the lead-out wiring and the conductor film, and the lead-out wiring and the conductor film are electrically connected. May be short-circuited. If the lead wire and the conductor film are short-circuited, a predetermined source signal may not be transmitted to the data signal line connected to the lead wire. As a result, a streak-like display defect occurs along the data signal line.
- the configuration described in Japanese Patent Laid-Open No. 2006-106676 is difficult to correct such display defects.
- the problem to be solved by the present invention is a display capable of correcting a short-circuited portion when the data signal line and the conductor film are short-circuited in a configuration in which the data signal line is provided with a parasitic capacitance.
- Providing a panel substrate, a display panel including the substrate, a method for correcting the display panel, or affecting the parasitic capacitance of the lead wiring when the data signal line and the conductor film are short-circuited A substrate for a display panel that can correct the short-circuited portion while suppressing the influence or the influence, a display panel including the substrate, and the display panel Is to provide a correction method.
- the present invention superimposes a plurality of strip-shaped conductors through an insulating film on a lead-out wiring for transmitting a data signal to the data signal line.
- a plurality of strip-shaped conductors are electrically connected by a connecting portion.
- connection portion has a portion that does not overlap with the lead-out wiring so that the connection portion can be cut by irradiation with light energy (eg, laser) from the outside of the display panel.
- light energy eg, laser
- the lead-out wiring has a zigzag folded portion
- a strip-shaped conductor is superposed on the zigzag folded portion via an insulating film. Then, by connecting the connecting portion for connecting the strip-shaped conductors to the folded portion where the lead-out wiring is interlaced, a portion that does not overlap the lead-out wiring is provided in the connecting portion.
- connection configuration of the strip-shaped conductors include the following configurations. First, adjacent ones of a plurality of strip-shaped conductors that overlap each lead-out wiring through the insulating film are electrically connected by a connecting portion. Furthermore, a plurality of strip-shaped conductors that are superimposed on a certain lead-out line through the insulating film, and a plurality of strip-shaped conductors that are superimposed on another lead-out line adjacent to the certain lead-out line via the insulating film; Adjacent ones of them are electrically connected by a connecting part. As a result, the strip-shaped conductors are electrically connected in a matrix shape.
- the following configuration may also be used.
- adjacent ones of a plurality of strip-shaped conductors that overlap each lead-out wiring through the insulating film are electrically connected by a connecting portion.
- a connecting portion for connecting a plurality of strip conductors that are superimposed on a certain lead wiring through the insulating film, and a plurality of strips that are superimposed on the lead wiring adjacent to the certain lead wiring via the insulating film are connected to adjacent ones.
- adjacent ones are connected by another connecting part.
- the strip-shaped conductors are electrically connected in a matrix.
- Adjacent ones of the plurality of strip-shaped conductors that overlap each lead-out wiring through the insulating film are electrically connected by a connecting portion.
- a plurality of wirings overlapping each lead-out wiring through the insulating film are provided.
- Strip-shaped conductors are electrically connected in series.
- a light shielding film may be formed between the lead-out wirings.
- the connection portion is not overlapped with either the lead-out wiring or the light shielding film so that the connection portion can be cut by irradiating a laser from the outside of the substrate for the display panel. Les, preferably to have.
- a display panel is manufactured using such a display panel substrate and a counter substrate.
- the strip-shaped conductor provided on the display panel substrate is electrically connected to a common electrode or a common potential line provided on the counter substrate.
- the lead-out wiring for transmitting the data signal to the data signal line and the strip-shaped conductor superimposed on the data signal line via the insulating film are short-circuited, this short-circuited strip-shaped By cutting the connection portion connected to the other conductor, the short-circuited strip-shaped conductor can be electrically separated from the other strip-shaped conductors. As a result, display defects caused by the short circuit can be easily corrected.
- connection portion when the connection portion has a portion that does not overlap with the lead-out wiring, the connection portion can be cut by irradiating the connection portion with a laser from the outside. Further, when the light shielding film is formed between the bow I lead-out wirings, the connection portion has a portion that does not overlap with either the lead-out wiring or the light shielding film. The connecting portion can be cut by irradiating the connecting portion through this portion from the outside of the substrate. Therefore, correction is easy.
- FIG. 1 is an exploded perspective view schematically showing the entire configuration of a display panel substrate according to the first embodiment of the present invention.
- FIG. 2 is a plan view schematically showing a configuration of a bundle of data lead-out wires and a configuration of a conductor layer for providing each data signal line with a predetermined parasitic capacitance.
- a perspective view and a cross-sectional view schematically showing a process of forming a bundle of wires and a conductor layer (a) is a perspective view showing a process of forming a data lead-out line, and (b) is (a) (C) is a cross-sectional view showing a process for forming an insulating film, (d) is a perspective view showing a process for forming a conductor layer, and (e) is a process in the same process as (d). It is sectional drawing.
- FIG. 4 A plan view schematically showing the configuration of the data lead-out wiring, the conductor layer, and the light shielding film of the substrate for the display panel according to the second embodiment.
- B) is a cross-sectional view thereof
- (c) is a cross-sectional view showing a step of forming a first insulating film
- (d) is a perspective view showing a step of forming a light shielding film
- (e) is a cross-sectional view thereof.
- Sectional drawing, (f) is a sectional view showing a second insulating film forming step
- (g) is a perspective view showing a conductor layer forming step
- (g) is a perspective view thereof.
- FIG. 6 is a plan view schematically showing the configuration of the data lead-out wiring, strip-shaped conductor, strip-shaped conductor, and connecting portion of the display panel substrate, which is the power of the third embodiment.
- FIG. 7 is a plan view schematically showing the configuration of the data lead-out wiring, the conductor layer, and the light-shielding film of the display panel substrate according to the fourth embodiment.
- FIG. 8 is a plan view schematically showing the data lead-out wiring and strip-shaped conductors, strip-shaped conductors and connecting portions of the display panel substrate according to the fifth embodiment.
- FIG. 9 A plan view schematically showing the configuration of the data lead-out wiring, the conductor layer, and the light shielding film of the display panel substrate according to the sixth embodiment.
- FIG. 10 A cross-sectional view schematically showing a cross-sectional structure of a display panel including a display panel substrate according to any of the embodiments of the present invention, and particularly showing a cross-sectional structure of a panel frame region.
- FIG. 12 is an enlarged view of part A in FIG.
- FIG. 5 is a plan view schematically showing a state in which a specific data lead-out wiring and a specific strip-shaped conductor superimposed thereon are short-circuited and a method for correcting a display defect caused by the short-circuit.
- FIG. 14 In a display panel including a display panel substrate according to the sixth embodiment, a state in which a specific data lead-out wiring and a specific strip-shaped conductor are short-circuited by a conductive foreign substance, and the short circuit. It is the top view which showed typically the correction method of the display defect to perform.
- FIG. 15 is a cross sectional view schematically showing each step of a method for manufacturing a substrate for a display panel, according to any embodiment of the present invention.
- FIG. 16 is a perspective view schematically showing the configuration of a display panel in which a display panel substrate is applied to any embodiment of the present invention.
- FIG. 17 is a diagram schematically showing the configuration of a color filter (counter substrate), (a) is a perspective view schematically showing the overall structure of the color filter, and (b) is formed on the color filter. A plan view showing the configuration of one picture element, (c) is a cross-sectional view taken along the line BB of (b), showing the cross-sectional structure of the picture element.
- FIG. 18 is a plan view schematically showing a conventional example of the configuration of a TFT array substrate.
- FIG. 1 is an exploded perspective view schematically showing the entire configuration of a display panel substrate, which focuses on the first embodiment of the present invention.
- the overall configuration of the display panel substrate la according to the first embodiment of the present invention will be briefly described.
- an active region 11 is provided on a substrate la for a display panel that is effective in the first embodiment of the present invention.
- a plurality of pixel electrodes (not shown) and switching elements (not shown. Specifically, for example, thin film transistors) for driving each of the plurality of pixel electrodes are arranged in a matrix.
- the active region 11 is provided with a plurality of data signal lines 111 (also referred to as “source signal lines”, “source bus lines”, etc.) that transmit data signals to the source electrodes of the respective switching elements.
- a plurality of scanning signal lines 112 (also referred to as “gate signal lines”, “gate bus lines”, etc.) for transmitting scanning signals to the gate electrodes of the switching elements are substantially parallel to each other and substantially orthogonal to the data signal lines 111.
- wiring hereinafter also referred to as "data leading wiring” 121 drawn from each data signal line 111 and 121
- a wiring 122 drawn from each scanning signal line 112 is provided.
- each data lead-out wiring 121 is located in a contact portion 124 provided near the outer edge of the active region 11, and is electrically connected to a predetermined data signal line 111 at this contact portion 124.
- the other end is located at the terminal 125 near the outer edge of the substrate la for the display panel.
- a TAB Tepe Automated Bonding
- It is electrically connected to the land to be used (for example, the other end forms a land).
- Each data lead-out line 121 serves as a path for transmitting a data signal generated by the source driver to a predetermined data signal line 111.
- the data lead-out wiring 121 forms a bundle of wirings 123 for each predetermined number.
- each data lead-out wiring bundle 123 has a tapered shape from the contact portion 124 toward the terminal portion 125.
- an insulating film is formed on the surface of each data lead-out wiring 121.
- each data lead-out wiring 121 has a portion overlapping with the conductor layer 126 via an insulating film. Therefore, a capacitance is generated between each data lead-out wiring 121 and the conductor layer 126. As a result, each data lead-out wiring 121 has a predetermined parasitic capacitance.
- One end of the wiring 122 drawn from each scanning signal line 112 is electrically connected to a predetermined scanning signal line 112 at the outer edge of the active region 11.
- the other end is located at a terminal portion 127 provided in the vicinity of the outer edge of the substrate la for the display panel, and the terminal portion 127 is electrically connected to a land for connecting a TAB (not shown) on which the gate driver is mounted. Connect the network.
- the wiring 122 drawn from each scanning signal line 112 is generated by the gate driver. This is a path for transmitting the scanning signal to be transmitted to the predetermined scanning signal line 112.
- the wiring 122 drawn from each scanning signal line 112 is integrally formed of the same material as the scanning signal line 112 and the land of the terminal portion 127, for example.
- the wirings 122 drawn from each scanning signal line 112 also form a bundle of wirings 128 for each predetermined number.
- a bundle 128 of wiring drawn from these scanning signal lines is arranged at a predetermined interval along the outer edge of the substrate la for display panel.
- the wiring 122 drawn from the scanning signal line included in each wiring bundle 128 converges from the outer edge of the active region 11 to the terminal portion 127 according to the directional force. Therefore, the bundle of wires 128 drawn from each scanning signal line has a tapered shape from the outer edge of the active region 11 toward the terminal portion 127.
- FIG. 2 is a plan view schematically showing the configuration of the bundle of data lead-out wires 123 and the configuration of the conductor layer 126 for providing each data lead-out wire 121 with a predetermined parasitic capacitance. .
- This FIG. 2 is a schematic diagram for explanation, and there are cases where the actual dimensions and shapes of the actual data lead-out wiring bundle 123 and the conductor layer 126 are not shown.
- the “bundle of wiring” means “bundle of data lead-out wiring”.
- a bundle of wirings 123 includes a predetermined number of data lead-out wirings 121.
- One end of each data lead-out wiring 121 is provided in a contact portion 124, and the contact portion 124 is electrically connected to a predetermined data signal line 111 through a through hole or the like.
- the other end of each data lead-out wiring 121 is provided in the terminal portion 125, and a land 1211 for connecting a TAB (not shown) on which the source driver is mounted to the terminal portion 125 is formed. . That is, each lead wire 121 and land 1211 are integrally formed of the same conductor film.
- each bundle of wires 123 has a tapered shape from the contact portion 124 toward the terminal portion 125 as a whole.
- the data lead-out wiring 121 included in one wiring bundle 123 has substantially the same length.
- Data bow I included in each wire bundle 123 The linear distance from one end to the other end of the lead wire 121 is shorter as it is located at the center of each wire bundle 123 and is longer as it is located at both ends. . Therefore, in order to eliminate the variation in electrical resistance due to the difference in the length of each data bow I lead-out wiring 121, the predetermined data lead-out wiring 121 has a folded portion 1212 in a predetermined range in the middle. Is provided.
- the length of the folded portion 1212 is lengthened, and the outwardly directed force is increased. Reduce the length of.
- the data lead-out wiring 121 located on the outermost side does not have to be formed with a folded portion. As a result, the overall length of each data lead-out wiring 121 can be made uniform, and the electrical resistance can be made uniform.
- an insulating film (not shown) is formed on the surface of the bundle of wires 123.
- a conductor layer 126 for forming each data lead-out wiring 121 with a predetermined parasitic capacitance is formed on the surface of the insulating film. That is, the conductor layer 126 is superimposed on the surface of each data lead-out wiring 121 with an insulating film interposed therebetween. As a result, a capacitance is generated between each data lead-out wiring 121 and the conductor layer 126 according to the dielectric constant of the insulating film and the area where each data lead-out wiring 121 and the conductor layer 126 overlap.
- the conductor layer 126 includes a strip-shaped portion 1261 (in the present specification, a force S referred to as "band-shaped conductor") and a strip-shaped portion 1262 (in this specification! / And a connection apportionment 1263, 1264, 1265 for connecting the respective strip-shaped portions 1262 or the strip-shaped portion 1261 and the strip-shaped portion 1262.
- one or a plurality of strip-shaped conductors 1262 are provided so as to overlap with each other in the serpentine folded portion 1212 of each data lead-out wiring 121 via an insulating layer.
- the number of strip-shaped conductors 1262 provided so as to overlap with one data lead-out wiring 121 increases toward the outer sides as the number of the conductors located in the central part of the wiring bundle 123 increases. Set to be less.
- FIG. 2 shows a configuration in which the strip-shaped conductor 1262 is not superimposed on the outermost data lead-out wiring 121.
- the parasitic capacitance of each data lead-out wiring 121 is reduced. Uniformity can be achieved. In other words, the capacitance generated between the data lead-out wires 121 and the capacity generated between the data lead-out wires 121 and other conductors in the vicinity tend to increase as the length of the data lead-out wires 121 increases. . Therefore, the parasitic capacitance of each data bow I lead-out wiring 121 increases as it is located on both outer sides of the wiring bundle 123.
- the data lead-out wiring 121 located at the center of the bundle of wirings 123 is obtained by increasing the area in which the conductor layers are overlapped, that is, by increasing the number of strip-shaped conductors 1262 to be overlapped.
- the capacitance generated between the lead-out wiring 121 and the conductor layer 126 is increased.
- the parasitic capacitance of each data lead-out wiring 121 that is, the capacitance generated between the data lead-out wirings 121, the connection between each data lead-out wiring 121 and the strip-like conductor 1262 and other conductors. It is possible to make the total amount of the capacity generated in the meantime uniform.
- the strip-shaped conductors 126 2 are electrically connected to each other by the connection portions 1263, 1264, 1265 of the conductor layer 126, and the strip-shaped conductor 1261 and each strip-shaped conductor 1262 are electrically connected to each other. Connected.
- connection portion 1263 the strip-shaped conductor 1261 and each strip-shaped conductor 1262 provided in the vicinity thereof are electrically connected by the connection portion 1263.
- connection portion 1263 such a connection portion 1263 will be referred to as a “first connection portion” for convenience of explanation.
- connection portion 1264 is referred to as a “second connection portion” for convenience of explanation. That is, the plurality of strip-shaped conductors 1262 provided so as to overlap with one data lead-out wiring 121 are electrically connected in series by the second connection portion 1264.
- a strip-shaped conductor 1262 provided so as to overlap with a data lead-out wiring 121 and another data bow I lead-out wiring 121 adjacent to this data bow I lead-out wiring 121 are provided. Adjacent ones of the strip-shaped conductors 1262 are electrically connected to each other by a connection portion 1265.
- a connection portion 1265 is referred to as a “third connection portion”. Accordingly, as a whole, each strip-shaped conductor 1262 is electrically connected in a matrix and is also electrically connected to the strip-shaped conductor 1261. Therefore, each strip-shaped conductor 1 262 has the same potential or substantially the same potential, and each strip-shaped conductor 1262 and the strip-shaped conductor 1261 have the same potential or substantially the same potential.
- the first to third connection portions 1263, 1264, 1265 are formed in a thin strip shape.
- the first to third connection portions 1263, 1264, and 1265 each have at least a portion of the data bow I lead-out wiring 121 and a portion that does not overlap with the displacement! /.
- the second connection portion 1264 that connects the strip-shaped conductors 12 62 provided to overlap with the same data lead-out wiring 121 is the data in the zigzag-shaped portion 1212 of the data lead-out wiring 121. A fire is formed so as to cross the lead-out wiring 121 several times). Therefore, in these second connection portions 1264, portions overlapping with each data bow I lead-out wiring 121 and portions not overlapping! /, Appear alternately.
- the first connection portion 1263 that connects the strip-shaped conductor 1261 and the strip-shaped conductor 1262 has the same configuration as the second connection portion 1264.
- a third connection portion 1265 (a strip-shaped conductor 1262 provided so as to overlap with a certain data lead-out wiring 121 and another data lead-out wiring 121 adjacent to this data lead-out wiring 121 is provided. As shown in Fig. 2, the connecting part that electrically connects the strip-shaped conductors 1262 does not overlap with the misaligned data bow.
- FIG. 3 is a perspective view and a cross-sectional view schematically showing the process of forming the wiring bundle 123 and the conductor layer 126.
- 3 (a) is a perspective view showing the process of forming the data lead-out wiring 121
- FIG. 3 (b) is a cross-sectional view in the same process as FIG. 3 (a)
- FIG. 3 (c) is the process of forming the insulating film.
- FIG. 3 (d) is a perspective view showing a conductor layer forming step
- FIG. 3 (e) is a sectional view in the same step as FIG. 3 (d).
- the data lead-out wiring 121 is provided on the surface of the transparent substrate 13.
- a conductive material layer is formed on the surface of the transparent substrate 13, and the formed conductive material layer is notched into the pattern of the data lead-out wiring 121 using a photolithography method or the like.
- an insulating film 131 is formed so as to cover the formed data lead-out wiring 121.
- a conductor layer 126 (that is, each strip-shaped conductor 1262, strip-shaped conductor 1261, and first to third connection portions 1263, 1264, 1265) is formed.
- a conductive material layer is formed on the surface of the insulating film 131, and the formed conductive material layer is formed into each strip-shaped conductor 1262, strip-shaped conductor 1261, and first to third layers using a photolithography method or the like. Pattern the connection part 1263, 1264, 1265.
- each data lead-out wiring 121 and conductor layer 126 overlaps.
- the capacitance generated between each data lead-out wiring 121 and the conductor layer 126 is determined according to the dielectric constant of the insulating film 131 and the overlapping area between each data lead-out wiring 121 and the conductor layer 126. Therefore, the number and the area of the strip-shaped conductors 1262 to be superimposed on each data lead-out wiring 121 are set so that the parasitic capacitance of all the data lead-out wirings 121 included in the display panel substrate la is uniform or almost uniform. Set to.
- a film made of a light shielding material is formed in the panel frame region 12 in order to prevent light leakage in the panel frame region 12 of the display panel.
- a film made of a light-shielding material (hereinafter referred to as “light-shielding film”) may be formed on the panel frame region 12 in some cases.
- FIG. 4 shows a data bow I lead-out wiring and a conductor layer in a display panel substrate lb according to the second embodiment, that is, a display panel substrate lb in which a light shielding film is formed in the panel frame region 12. It is the top view which showed typically the structure with a light shielding film.
- a light shielding film 134 is formed between the data bows I of the panel frame region 12 of the panel frame region 12 of the display panel substrate 12 and the lead-out wiring 121.
- the force S for forming a light-shielding film on the outside of the bundle of wires 123 is omitted in FIG. 4.
- the third connection portion 1265 (a strip-shaped conductor 1262 provided so as to be superimposed on one data lead-out wiring 121 and another data lead-out wiring 121 adjacent to the data lead-out wiring 121)
- the light shielding film 134 is not provided at a position overlapping the connecting portion 1265) connecting the provided strip-shaped conductor 1262.
- the light shielding film 134 is not provided at a position overlapping the first connection portion 1263 and the second connection portion 1264. That is, the first to third connection portions 1263, 1264, and 1265 have a portion that does not overlap the data lead-out wiring 121 and the light shielding film 134.
- the light shielding film 134 is formed of a conductor film that constitutes a predetermined wiring different from the data bow I lead-out wiring 121, for example.
- the data bow I lead-out wiring 121 is formed of the same conductor as the scanning signal line 112 formed in the active region 11, the light shielding film 134 is formed of the same conductor as the data signal line 111.
- FIG. 5 is a perspective view and a cross-sectional view schematically showing a process of forming the wiring bundle 123, the conductor layer 126, and the like.
- (a) and (b), (d) and (e), (g) and (h) are a perspective view and a sectional view of the same process, respectively.
- a data lead-out wiring 121 is formed on the surface of the transparent substrate 13.
- a conductive material layer is formed on the surface of the transparent substrate 13, and the formed conductive material layer is notched into the pattern of the data lead-out wiring 121 using a photolithography method or the like.
- a first insulating film 132 is formed so as to cover the formed data lead-out wiring 121.
- a light shielding film 134 is formed on the surface of the first insulating film 132.
- a light-shielding material layer is formed on the surface of the first insulating film 132, and the formed light-shielding material layer is patterned on the pattern of the light-shielding film 134 using a photolithography method or the like.
- a second insulating film 133 is formed on the surface of the transparent substrate 13 that has undergone the above steps. After this step, the light shielding film 134 is covered with the second insulating film 133. As shown in FIGS. 5 (g) and (h), a strip-shaped lead is formed on the surface of the second insulating film 133.
- the body 1262, the strip-shaped conductor 1261 and the first to third connecting apportionments 1263, 1264, 1265 are formed.
- a layer of a conductive material is formed on the surface of the second insulating film 133, and the formed conductive material layer is formed into each strip-shaped conductor 1262, strip-shaped conductor 1261, and first to Pattern the third connection part 1263, 1264, 1265.
- each data lead-out wiring 121 can be provided with a predetermined parasitic capacitance while preventing or suppressing light leakage in the panel frame region 12. Except for the configuration having the light shielding film 134 and the second insulating film 133 that covers the light shielding film 134, the same configuration as that of the display panel substrate la can be applied to the first embodiment.
- connection between the strip-shaped conductors 1262 is not limited to the configuration of the display panel substrates la and lb which are the same as those of the first embodiment or the second embodiment. Therefore, other configurations will be described below.
- the same reference numerals as those in the first embodiment or the second embodiment are assigned to the same components as those in the first or second embodiment, and the description thereof may be omitted.
- FIG. 6 schematically shows the configuration of the data lead-out wiring 121 of the display panel substrate lc, the strip-shaped conductor 1262, the strip-shaped conductor 1261, and the connection portions 1263, 1264, and 1266, which is the power of the third embodiment.
- the strip-shaped conductor 1261 and each strip-shaped conductor 1262 are electrically connected by the first connection portion 1263, and the strip-shaped conductors 1262 are connected to each other by the connection portion 1 264, 1266 ⁇ ⁇ J: Connected to an electric white paper.
- the strip-shaped conductor 1261 and each strip-shaped conductor 1262 provided in the vicinity thereof are electrically connected by the first connection portion 1263.
- This configuration is the same as that of the display panel substrate, which is the same as in the first embodiment or the second embodiment.
- those adjacent to each other are electrically connected by the second connection portion 1264.
- This configuration is the same as that of the display panel substrate, which is the same as that of the first embodiment or the second embodiment.
- a strip-shaped conductor 1 provided so as to overlap with one data lead-out wiring 121 262 Electrically connect the second connection portion 1264 that electrically connects the two strip-like conductors 1264 that overlap with the other data lead-out wiring 121 adjacent to the data lead-out wiring 12 1 126 2 Of the second connection portion 1264, adjacent ones are further electrically connected by the connection portion 1266.
- Such a connection portion 1266 for electrically connecting the second connection portions 1264 is referred to as a “fourth connection portion” for convenience of explanation.
- the fourth connection portion 1266 has a portion that does not overlap with each data lead-out wiring 121.
- the strip-shaped conductor 1262 provided so as to overlap with a certain data lead-out wiring 121 and the strip-shaped conductor 1262 provided so as to overlap with another data lead-out wiring 121 adjacent to the data lead-out wiring 121 are: It is not directly electrically connected.
- each strip-shaped conductor 1262 has the same potential or substantially the same potential, and each strip-shaped conductor 1262 and the strip-shaped conductor 1261 have the same potential or substantially the same potential.
- the first, second, and fourth connection portions 1263, 1264, and 1266 are formed in a thin strip shape.
- the first, second, and fourth connection portions 1263, 1264, and 1266 each have at least a portion that does not overlap the V and the misaligned data bow I lead-out wiring 121! /.
- first connection portion 1263 that connects the strip-shaped conductor 1261 and the strip-shaped conductor 1262 and the strip-shaped conductor 1262 that is provided so as to overlap the one lead-out wiring 121 are connected to each other.
- the two connection portions 1264 are formed so as to intersect with the data lead-out wiring 121 at the folded portions of the data lead-out wiring 121, respectively. Therefore, in these first and second connection portions 1263 and 1264, the portions that overlap each data lead-out wiring 121 and the portions that do not overlap are alternately repeated. For this reason, each one Data bow over part I I Do not overlap with lead wire 121!
- connection portion 1266 connecting the second connection portions 1264 also has a portion that does not overlap the data bow I lead-out wiring 121 as shown in FIG.
- the second connection portion 1264 has a portion that does not overlap the data lead-out wiring 121 at a position close to at least one strip-shaped conductor 1262 from a position where the fourth connection portion 1266 branches or intersects. Have at least one location.
- the fourth connection portion 1266 has a portion that does not overlap with the data bow I lead-out wiring 121 at a position close to the strip-shaped conductors 1262 on both the front and rear sides from the position where the second connection portion 1266 branches or intersects. Indicates.
- the method of forming the display panel substrate lc, the data lead-out wiring 121, the conductor layer, etc. is the same as that of the display panel substrate la.
- the law is applicable. Therefore, explanation is omitted.
- the pattern of the conductor layer 126 to be formed is different from the substrate la for display panel according to the first embodiment in the process of forming the conductor layer 126.
- FIG. 7 is a plan view schematically showing the configuration of the data lead-out wiring 121, the conductor layer 126, and the light-shielding film 134 of the display panel substrate Id, which focuses on the fourth embodiment.
- the display panel substrate Id according to the fourth embodiment has a configuration in which a light-shielding film is formed in the panel frame region 12 of the display panel substrate lc, which is the same as the third embodiment.
- a light shielding film 134 is formed between the data extraction wirings 121.
- a light-shielding film is also formed outside the bundle of wires 123, but is omitted in FIG. 7). However, the light shielding film 134 is not formed at a position overlapping the fourth connection portion 1266. In other words, the fourth connection portion 1266 has a portion that does not overlap with either the data lead-out wiring 121 or the light shielding film 134.
- the structure of the display panel substrate Id which is the power of the fourth embodiment, is the same as that of the third embodiment except that the light shielding film 134 and the second insulating film covering the light shielding film 134 are formed.
- the same configuration as that of the display panel substrate lc according to the embodiment can be applied.
- the method of forming the wiring bundle 123 and the conductor layer 126 of the display panel substrate Id which is the same as in the fourth embodiment, is almost the same method as the display panel substrate lb as in the second embodiment. Is applicable. That is, In each of the step of forming the conductor layer 126 and the step of forming the light shielding film 134, only the pattern of the conductor layer 126 to be formed and the pattern of the light shielding film 134 are different.
- FIG. 8 schematically shows the display panel substrate 1 e data bow I stripped wiring 121, strip-shaped conductor 1262, strip-shaped conductor 1261, and connection portions 1263 and 1264 in the fifth embodiment. It is a plan view.
- the configuration other than the connection portions 1263 and 1264 of the conductor layer 126 can be applied to the same configuration as that of the display panel substrate la.
- the strip-shaped conductor 1261 and the strip-shaped conductor 1262 adjacent thereto are electrically connected by the first connection portion 1263 and the strip-shaped conductors 1262 are connected to each other. Electrically connected by a connecting part 1264.
- a strip-shaped conductor 1262 provided to be overlapped with a certain data lead-out wiring 121 and other data lead-out wiring adjacent to the data lead-out wiring 121 The third connection portion 1265 that connects the strip-shaped conductor 1262 provided to overlap with 121 is not provided. Further, the fourth connection portion 1266 for connecting the second connection portions 1264 to each other is not provided.
- each strip-shaped conductor 1262 superimposed on one data lead-out wiring 121 and the strip-shaped conductor 1262 superimposed on another data lead-out wiring 121 are electrically connected only through a strip-shaped conductor. Is done. With such a configuration, the strip-shaped conductor 1262 provided so as to be superimposed on one data lead-out wiring 121 has the same potential or substantially the same potential, and the strip-shaped conductors superimposed on all the data lead-out wirings 121 have the same potential. Conductor 1262 has the same potential or almost the same potential.
- first connection portion 1263 that electrically connects the strip-shaped conductor 1261 and the strip-shaped conductor 1262
- second connection portion 1264 that electrically connects the strip-shaped conductors 1262
- FIG. 9 is a plan view schematically showing configurations of the data bow I lead-out wiring 121, the conductor layer 126, and the light shielding film 134 of the display panel substrate If according to the sixth embodiment.
- the display panel substrate If according to the sixth embodiment has a configuration in which a light shielding film 134 is formed in the panel frame region 12 of the display panel substrate le, which is the same as in the fifth embodiment.
- a light shielding film 134 is formed in the panel frame region 12 (force S for forming the light shielding film 134 on the outside of the bundle 123 of wirings, omitted in FIG. 9).
- the first connection portion 1263 and the second connection portion 1264 each have a portion that does not overlap with the data lead-out wiring 121 and the light shielding film 134.
- the light shielding film 134 is not provided in the gap between the data extraction wirings 121 formed in the zigzag-folded portion 1212 of each data extraction wiring 121! /. It is not necessary to make the pattern in such a way as to avoid the overlapping of the first connection portion 1263 and the second connection portion 1264.
- the structure of the display panel substrate If, which is the force of the sixth embodiment, is the same as that of the fifth embodiment except that a light shielding film 134 and a second insulating film 133 covering the light shielding film 134 are formed.
- the same configuration as that of the display panel substrate le can be applied.
- the method of forming the wiring bundle 123 and the conductor layer 126 of the display panel substrate If, which is the same as in the sixth embodiment, is almost the same as the method lb of the display panel substrate lb. Applicable. That is, only the pattern of the conductor layer 126 to be formed and the pattern of the light shielding film 134 are different in each of the step of forming the conductor layer 126 and the step of forming the light shielding film 134.
- FIG. 10 shows a display panel substrate la, lb, lc, Id, le, If (hereinafter represented by reference numeral “1”) according to any force of the first embodiment to the sixth embodiment.
- FIG. 4 is a cross-sectional view schematically showing a cross-sectional structure in the vicinity of the outer edge portion of the display panel 2 provided (a part of the active region 11 and the panel frame region 12). As shown in FIG. 10, any one of the display panel substrates 1 and the counter substrate 21 are arranged to face each other with a predetermined minute interval. And active The display panel substrate 1 and the counter substrate 21 are bonded together by the sealing material 22 provided so as to surround the region 11, and the region surrounded by the sealing material 22 is filled with the liquid crystal 23.
- a plurality of pixel electrodes 113 and switching for driving each of the plurality of pixel electrodes 113 are provided in the active region 11 of the display panel substrate 1. Elements (not shown, specifically, for example, thin film transistors) are arranged in a matrix. Further, in the active region 11, a plurality of data signal lines 111 for transmitting data signals to the source electrode of each switching element are provided substantially parallel to each other, and a plurality of data signal lines for transmitting a scanning signal to the gate electrode of the switching element are provided. The scanning signal lines 112 are provided so as to be substantially parallel to each other and substantially orthogonal to the data signal line 111. In addition, an alignment film 114 is formed on the surface of the substrate 1 for a display panel, which is suitable for any embodiment of the present invention.
- each data lead-out wiring 121 is located in a contact portion 124 provided in the vicinity of the outer edge of the active region 11, and is electrically connected to a predetermined data signal line 111 at this contact portion 124.
- the configuration of the counter substrate 21 will be briefly described.
- the counter substrate 21 is made of glass or the like.
- a black matrix 211 is formed on the surface of a transparent substrate 217. Inside each lattice of the black matrix 211, a colored layer made of colored light-sensitive materials of red, green, and blue. 212 is formed. The grid layers 212 of each color are formed in a predetermined order.
- a protective film 213 is formed on the surface of the black matrix 211 and the colored layer 212 of each color, and a transparent electrode (common electrode) 214 is formed on the surface of the protective film 213.
- an alignment regulating structure 215 for controlling the alignment of the liquid crystal is formed.
- an alignment film 216 is formed on the surface.
- the transparent electrode (common electrode) 214 is electrically connected to a common potential line (not shown).
- the sealing material 22 is mixed with fine particles (for example, gold beads) made of a conductive material, and has a conductive property.
- the sealing material 22 is in contact with both the exposed portion of the strip-like conductor 1261 provided on the display panel substrate 1 and the common electrode 214 of the counter substrate 21. For this reason, the strip-shaped conductor 1262 and the strip-shaped conductor The body 1261 is electrically connected to the common electrode 214 of the counter substrate 21, and has the same potential or substantially the same potential as the common electrode 214.
- this foreign substance is the insulating film between the data bow I lead-out wiring 121 and the strip-shaped conductor 1262 (in FIG. 10 !, the first insulating film 132 and the first insulating film 132).
- a specific data lead-out line 121 and a strip-shaped conductor 1262 may be electrically connected through the second insulating film 133).
- the conductor layer 126 is electrically connected to the common electrode 214 of the counter substrate 21 by the sealing material 22. Therefore, the specific data lead-out wiring 121 and the common electrode 214 of the counter substrate 21 are the same. Potential or almost the same potential. For this reason, since the pixel electrode 113 that receives the data signal transmission through the specific data lead-out wiring 121 and the common electrode 214 of the counter substrate 21 have the same potential, for example, if the display panel 2 is a normally black type, These picture elements always display the lowest brightness. Therefore, a streak-like display defect along the data signal line 111 (black display defect in the case of a normally black display panel) appears on the display panel 2.
- FIG. 11 shows a case where a specific data lead-out wiring 121a and a specific strip-shaped conductor 1262c are short-circuited in a display panel including the display panel substrate lb, which is the power of the second embodiment. It is the top view which showed the state typically.
- a specific data lead-out wiring 121a and a specific strip-shaped conductor 1262c provided so as to overlap therewith are electrically short-circuited by a foreign object 801, and as a result, the display panel 2
- a streak-like display appears.
- a lighting inspection of the manufactured display panel 2 is performed.
- a specific data lead-out wiring 121a and a specific strip-shaped conductor 1262c provided overlapping therewith are electrically short-circuited, streaky display defects may appear in the image displayed on the display panel 2. is there. Therefore, a streak-like display defect is confirmed in the lighting inspection of the display panel 2, and the cause of the parenthesis display defect is the specific data lead-out wiring 121a and any strip-like conductor provided so as to overlap therewith. If this is considered to be due to a short circuit with 1262, observe the data lead-out wiring 121a that transmits the data signal to the picture element where the display defect has occurred, using a magnifying glass, etc., and identify the short-circuit location .
- FIG. 12 is an enlarged plan view showing a part A of FIG. If the strip-shaped conductor 1262c that is short-circuited with the data lead-out wiring 121a is identified, connect this strip-shaped conductor 1262c to the other strip-shaped conductors 1262d, 1262b, 1262g, 1262i adjacent to this Do Cut the two second connection portions 1264b and 1264f and the two third connection portions 1265c and 1265e. When the strip-shaped conductor force first connection portion 1263 that is short-circuited with the data lead-out wiring 121 is connected to the strip-shaped conductor, the first connection portion is also cut off.
- connection portions 1264b, 1264c, 1265c, and 1265e are cut by the energy of the laser.
- each of the connection portions 1264b, 1264c, 1265c, and 1265e of the display panel substrate lb has a portion that does not overlap with any of the data lead-out wiring 121 and the light shielding film 134, as is the case with the second embodiment. Therefore, the connection portions 1264b, 1264c, 1265c, and 1265e can be cut from the outside by irradiating the laser through this portion. That is, the positions of the broken line e, the broken line f, and the broken line h can be cut.
- the light shielding film 134 Since the light shielding film 134 is not formed on the display panel substrate la according to the first embodiment, the light shielding film 134 does not become an obstacle when the third connection portions 1265c and 1265e are cut. When the connection portions 1264b, 1264c, 1265c, and 1265e are cut in this manner, the electrical connection between the data extraction wiring 121a and the common electrode of the counter substrate 21 is lost. Therefore, the data lead-out wiring 121a can transmit a predetermined data signal to the data signal line, and display defects are eliminated. In addition, among the strip-shaped conductors that are superimposed on the data lead-out wiring 121a, except for the strip-shaped conductor 1262c that is electrically separated from the surroundings, it functions as a parasitic capacitance as before. To do. Therefore, it is possible to reduce the influence on the transmission of the data signal that the parasitic capacitance included in the data lead-out wiring 121a greatly changes by the modification.
- the position of the broken line d of the second connection portion 1264a and the position of the broken line a of the third connection portion 1265a are cut, and the strip-shaped conductor 1262a is electrically connected to the other strip-shaped conductors 1262e and 1262b. Disconnect.
- the strip-shaped conductor 1262b located second from the end is electrically connected to the other strip-shaped conductors 1262f, 1262h, 1262c adjacent to the strip-shaped conductor 1262b.
- the position of the broken line e of one second connection portion 1264b and the positions of the broken lines b and g of two third connection portions 1265b and 1265d are cut by a laser. To do.
- the strip-shaped conductor 1262b is electrically separated from the other three strip-shaped conductors 1262c, 1262f, and 1262h adjacent to the strip-shaped conductor 1262b.
- the lighting inspection is performed again.
- the data signal is transmitted to the pixel group where the display defect appears.
- the process of electrically separating the strip-shaped conductor provided to overlap the data lead-out wiring 121a to be separated from other strip-shaped conductors adjacent to this, and whether the streak display defect has been eliminated by performing a lighting inspection Repeat the process of checking.
- the strip-shaped conductor 1262c located third from the end is electrically separated from the other three adjacent strip-shaped conductors 1262g, 1262c, 1262d, If there is no abnormality, the display defect will be resolved.
- any strip-shaped conductor is adjacent to the other strip-shaped conductor (and connected to the strip-shaped conductor! It is not limited to the above-mentioned order whether or not it is electrically separated from the above. That is, as described above, it may be separated in order from the terminal located at the end, or may be separated in order from those suspected of being short-circuited. Even with such a method, the force S exerts the same effect as described above.
- a strip-shaped conductor that is not short-circuited with the data lead-out wiring may be electrically disconnected from other adjacent strip-shaped conductors.
- the effect on the display quality of the display panel is considered to be small.
- a strip-shaped conductor that is electrically separated from other adjacent strip-shaped conductors or strip-shaped conductors does not function as normal parasitic capacitance.
- the parasitic capacitance included in this data extraction wiring is the parasitic capacitance included in other data extraction wiring. And different. For this reason, the state of the transmitted data signal (for example, signal delay) may be different.
- the state of the data signal to be transmitted is somewhat different when the parasitic capacitance is different, the data signal can be transmitted to the data signal line. Groups can display based on the transmitted data signal. And since the data lead-out wiring included in the bundle of wirings has a uniform parasitic capacitance, even if the parasitic capacitance of a specific one of them is slightly different from the others, the display state is different. Is inconspicuous. Therefore, display products for display panels The influence on the place is small!
- the method for correcting the display panel provided with the display panel substrate lc, which is strong in the third embodiment, and the method for correcting the display panel provided with the display panel substrate Id in the fourth embodiment are almost the same. The same. Therefore, a display panel including the display panel substrate Id according to the fourth embodiment will be described as an example.
- FIG. 13 is a plan view schematically showing a state in which a specific data lead-out wiring 121a and a specific strip-shaped conductor 1 262c superimposed thereon are short-circuited and a method for correcting a display defect caused by the short-circuit.
- FIG. FIG. 13 is an enlarged plan view showing a region corresponding to part A in FIG.
- a specific data lead-out wiring 121a and a specific strip-shaped conductor 1262c provided overlapping therewith are short-circuited by a conductive foreign material 801, and as a result, a display panel is displayed.
- An example will be described in which a streak-like display appears in the image.
- a lighting inspection of the manufactured display panel 2 is performed, and it is inspected whether or not streaky display defects appear in an image displayed on the display panel 2.
- the occurrence of a streak-like display defect can be confirmed, and the parenthesis display defect is short-circuited between the specific data lead-out wiring 121a and the strip-shaped conductor provided so as to overlap therewith. If this is considered to be caused by the data, transmit the data signal to the picture element where the display defect has occurred. To do.
- the laser cuts the position of the second connecting portion 1264b connected to the strip-shaped conductor 1262c at the position of the broken line 1 and the position of the broken line m of the second connecting portion 1 264c by the laser. Since the position of m does not overlap with either the data lead-out wiring 121 or the light shielding film 134, the laser can be irradiated to the external force of the display panel 2 and the like.
- a display panel provided with a substrate lc for display panel which is a force according to the third embodiment, or According to the display panel having the display panel substrate Id which is effective in the fourth embodiment, in order to electrically cut one strip-shaped conductor from another strip-shaped conductor adjacent thereto.
- Laser the two second connection parts if the strip-shaped conductor is adjacent to the strip-shaped conductor, one first connection part and one second connection part in total
- Just cut it off! / Therefore, it is possible to reduce the number of times of laser irradiation during correction.
- the strip-shaped conductor short-circuited to the data lead-out wiring 121a is electrically disconnected from the other strip-shaped conductor adjacent to it (and the strip-shaped conductor when adjacent to the strip-shaped conductor).
- the data lead-out wiring 121a can transmit a predetermined data signal to the data signal line, and display defects are eliminated.
- the parasitic capacitance included in the data lead-out wiring 121a can be less affected by the data signal transmission without being greatly changed by the correction.
- the strip-shaped conductors superimposed on the data lead-out wiring 121a that transmits the data signal to the pixel group in which the display defect appears the one that is farthest from the strip-shaped conductor (in other words, connected in series) Cut the strip-shaped conductor from the surroundings that is located at the end when viewed from the strip-shaped conductor. Specifically, the connecting portion is cut by a laser. As a result, the strip-shaped conductor is electrically disconnected from other adjacent strip-shaped conductors.
- the strip-shaped conductor 1262a located at the end of the second connection portion 1264a is cut at one position indicated by the broken line i. 62b, 1262e force, etc. are separated into electric egrets. [0124] Then, the lighting inspection is performed again. If a streak-like display defect also appears in this lighting inspection, the strip-shaped conductor located second from the end is electrically separated from other strip-shaped conductors adjacent to it.
- the positions of broken lines j and k of the two second connection portions 1264a and 1264b connected to the strip-shaped conductor 1262b located second from the end are cut by a laser. As a result, the strip-shaped conductor 1262b is electrically separated from the other strip-shaped conductors 1262c, 1262f, and 1262h adjacent thereto.
- the lighting inspection is performed again. Furthermore, when a streak-like display defect is observed also in this lighting inspection, the strip-shaped conductor located third from the end is electrically separated from other adjacent strip-shaped conductors.
- the positions of the two second connection portions 1264b and 1264c connected to the strip-shaped conductor 1262c located third from the end are cut by a laser, respectively. To do.
- the strip-shaped conductor 1262ci and other strip-shaped conductors 1262d, 1262g, and 1262i adjacent to the strip-shaped conductor 1262ci are separated into electric white collars.
- the process of confirming the power to eliminate the streak-like display defect by performing a lighting inspection is repeated.
- the strip-shaped conductor 1262c located third from the end is separated from the other adjacent strip-shaped conductors 1262d, 1262g, 1262i, the display defect is not abnormal unless otherwise abnormal. Eliminate.
- the display panel including the display panel substrate which is the same as the third embodiment or the fourth embodiment also includes the display panel substrate according to the first embodiment or the second embodiment.
- the display defect can be corrected in the same way as the display panel, and the same effect can be obtained with the force S.
- a method for correcting a display panel including the display panel substrate le according to the fifth embodiment, and a method for correcting a display panel including the display panel substrate ⁇ according to the sixth embodiment Will be described. It is to be noted that a display panel correcting method including the display panel substrate le according to the fifth embodiment and a display panel substrate If according to the sixth embodiment are provided. Since the same method can be applied to the display panel correction method, the display panel including the display panel substrate if which is the same as in the sixth embodiment will be described as an example.
- FIG. 14 schematically shows a state in which a specific data lead-out wiring 121a and a specific strip-shaped conductor 1262c are short-circuited by a conductive foreign material 801, and a method for correcting a display defect caused by the short-circuit. It is a top view.
- a specific data lead-out wiring 121a and a specific strip-shaped conductor 1262c provided so as to overlap therewith are short-circuited, and as a result, a streak-like display appears on the display panel 2. Will be described as an example.
- a lighting inspection of the display panel is performed in the same manner as the method for correcting the display panel including the display panel substrate according to the first embodiment or the second embodiment. If the occurrence of a streak-like display defect that can be attributed to a short-circuit between the data lead-out wiring and the conductor layer strip-like conductor provided in an overlapping manner is identified, the short-circuit location is identified.
- the strip-shaped conductor 1262c short-circuited with the data lead-out wiring 121a is identified, the strip-shaped conductor 1262c and the other strip-shaped conductors 1262b and 1262d adjacent to the strip-shaped conductor 1262c are electrically connected.
- the two second connection portions 1264b and 1264c connected to are cut by a laser. Specifically, a position that does not overlap with the data lead-out wiring 121a is cut as shown by a broken line p and a broken line r. Of the two second connection portions 1264b and 1264c, only the second connection portion 1264c on the belt-like conductor 1261 side may be cut.
- the same method as the method for correcting a display panel provided for the display panel can be applied to the first embodiment or the second embodiment.
- each strip-shaped conductor is only electrically connected in series, the second connection portion near the strip-shaped conductor 1261 of the strip-shaped conductor 1262c that is short-circuited is the first Is disconnected, the electrical connection between the data lead-out wiring 121a and the common electrode of the counter substrate 21 is lost. Therefore, the data lead-out wiring 121a can transmit a predetermined data signal to the data signal line, and display defects are eliminated. Further, with such a configuration, the number of times of laser irradiation at the time of correction can be reduced.
- the lighting inspection is performed again. If a streak-like display defect appears in this lighting inspection, the strip-shaped conductor 1261 out of the two second connection portions 1264a and 1264b connected to the strip-shaped conductor 1262b located second from the end The second connecting portion 1264b near the side is cut, and the strip-shaped conductor 1262b is electrically disconnected from the other strip-shaped conductor 1262c connected thereto. When this one place is cut, the strip-like conductor 1262b is not electrically connected to the counter electrode of the counter substrate 2.
- the lighting inspection is performed again. Further, when a streak-like display defect is observed in this lighting inspection, the strip-shaped conductor 1262c located third from the end is electrically separated from other adjacent strip-shaped conductors. In this case as well, if the second connection portion near the strip-shaped conductor of the strip-shaped conductor is cut, electrical continuity between the strip-shaped conductor 1262c and the counter electrode of the counter substrate is lost.
- the display panel including the display panel substrate which is the same as the fifth embodiment or the sixth embodiment is also the display panel substrate according to the first embodiment or the second embodiment.
- the display defect can be corrected in the same way as a display panel equipped with the same function and effect.
- a display panel including a display panel substrate according to any of the first to third embodiments (hereinafter referred to as “display panel substrate according to an embodiment of the present invention”).
- the overall flow of the manufacturing method will be described.
- FIG. 15 is a cross-sectional view schematically showing each step of the method for manufacturing the display panel substrate 1 according to any embodiment of the present invention.
- FIGS. 15 (a) to 15 (f) show the process of forming the picture element in the active area
- FIGS. 15 (g) to 15 (l) show the process of forming the bundle of lead wires in the panel frame area. Show.
- FIG. 15 (a) and (g), (b) and (h), (c) and (i), (d) and, (e) and (k), (f) and (1) These show the same steps.
- FIG. 15 is a schematic diagram for explanation, and in any embodiment of the present invention, it does not show a cross-sectional structure along a specific cutting line of the display panel substrate. Absent.
- the display panel substrate 1 which is particularly effective in the embodiment of the present invention, has a conductor film, a semiconductor film, an insulating film, and the like of a predetermined shape laminated in a predetermined order on one surface of a transparent substrate 13 such as glass. It is formed like this.
- a scanning signal line 112 an auxiliary capacitance line (not shown), and a gate electrode 151 of a switching element (ie, a thin film transistor) are formed in the active region 11.
- a data lead-out wiring 121 is formed in the panel frame region 12.
- a single-layer or multilayer first conductor film made of chromium, tungsten, molybdenum, aluminum or the like is formed on the surface of the transparent substrate 13.
- Various known sputtering methods can be applied to the formation of the first conductor film.
- the thickness of the first conductor film is not particularly limited, but for example, a film thickness of about lOOnm can be applied.
- the formed first conductor film is patterned into each pattern of the scanning signal line 112, the auxiliary capacitance line (not shown), the gate electrode 151 of the switching element, and the data lead-out wiring 121.
- Wet etching can be applied to the patterning of the first conductor film. For example, if the first conductor film is made of chromium, (NH) [Ce (NH)] + HN
- FIG. 15 (a) in the active region 11, the scanning signal line 112 having a predetermined pattern, the auxiliary capacitance line (not shown), and the gate electrode 15 of the switching element are provided. 1 is formed.
- FIG. 15 (g) a data lead-out wiring 121 is formed in the panel frame region 12.
- the shape of the data lead-out wiring 121 the same shape can be applied to any of the display panel substrates that are the same as those in the first embodiment to the sixth embodiment.
- a first insulating film 132 (that is, a gate insulating film) is formed on the surface of the transparent substrate that has undergone the above-described steps.
- SiNx silicon nitride
- it can be formed by a method of depositing the material of the first insulating film 132 using a plasma CVD method.
- the scanning signal line 112, the auxiliary capacitance line (not shown), and the gate electrode 151 of the switching element are formed in the active region 11. Covered by the first insulating film 132.
- the data lead-out wiring 121 is covered with the first insulating film 132.
- the semiconductor film 155 and the ohmic contact film are formed at predetermined positions on the surface of the first insulating film 132 (specifically, positions overlapping the gate electrode 151). Overlapping and forming 156.
- the semiconductor film 155 amorphous silicon having a thickness of about lOOnm can be used.
- n + type amorphous silicon having a thickness of about 20 nm can be applied.
- the ohmic contact film 156 is used to improve the ohmic contact with the source electrode 152 and the drain electrode 153 to be formed in a later step.
- the semiconductor film 155 and the ohmic contact film 156 can be formed by a plasma CVD method and a photolithography method, respectively. That is, the film material is first deposited using the plasma CVD method. Then, the material of the formed semiconductor film and the material of the ohmic contact film are patterned into a predetermined shape using a photolithography method or the like. For example, wet etching using an HF + HNO solution can be applied to this patterning.
- the data signal line 111, the drain wiring 154, the source electrode 152 and the drain electrode 153 of the switching element are formed in the active region 11.
- the panel frame region 12 is also shielded in this process.
- An optical film 134 is formed.
- a second conductor film is formed on the surface of the transparent substrate that has undergone the above steps.
- a single-layer or multilayer conductor film made of titanium, aluminum, chromium, molybdenum, or the like can be applied.
- a plasma CVD method or the like can be applied as a method for forming the second conductor film.
- the formed second conductor film is patterned.
- a data signal line 111 having a predetermined shape having a second conductor film force, a source electrode 152 and a drain electrode 153 of the switching element, and a drain wiring 154 are formed in the active region.
- a light shielding film 134 made of a second conductor film is formed in the panel frame region 12.
- the semiconductor film 155 and the ohmic contact film 156 formed so as to overlap with the gate electrode 151 of the switching element are etched to a predetermined depth.
- the shape of the light shielding film 134 is different in each of the display panel substrates according to the second embodiment, the fourth embodiment, and the sixth embodiment, but the material and the molding method are the same.
- the switching elements gate electrode 151, source electrode 152 and drain electrode 153
- scanning signal line 112 auxiliary capacitance line (Not shown)
- the drain wiring 154 and the data signal line 111 are formed.
- a data lead-out wiring 121, a first insulating film 132, and a light shielding film 134 are formed.
- a second insulating film 133 (that is, a passivation film) is formed.
- a second insulating film is formed on the surface of the transparent substrate 13 that has undergone the above-described process, and the formed second insulating film is patterned.
- a second insulating film 133 having a predetermined shape is obtained.
- silicon nitride (SiNx) having a thickness of about 400 nm can be applied.
- a plasma CVD method can be applied, and as a patterning method, for example, dry etching using SF + 0 is used.
- Tuching can be applied.
- the first insulating film 132 formed in the previous step is also patterned in a predetermined pattern. And by patterning in this process, As shown in FIG. 15 (e), a pixel contact portion for electrically connecting the drain wiring 154 and the pixel electrode (see FIG. 15 (f)) is formed in the region 11. Although not shown, in the contact portion of the panel frame region 12, an opening is formed in the first insulating film 132 that covers the data lead-out wiring 121 and the second insulating film 133 that covers the data signal line 111. . Then, the end of the data lead-out wiring 121 and the end of the data signal line 111 are exposed.
- a pixel electrode 113 is formed in the active region 11.
- a conductor layer 126 is provided in the panel frame region 12 for providing each data lead-out wiring 121 with a parasitic capacitance.
- a conductor layer for electrically connecting the exposed end portion of the data lead-out wiring 121 and the end portion of the data signal line 111 is formed in the contact portion of the panel frame region 12.
- the conductor layer that electrically connects the end of the signal line 111 is formed of the same conductor.
- ITO Indium Tin Oxide
- ITO Indium Tin Oxide
- the pixel electrode 113, the conductor layer 126 for providing each data lead-out wiring 121 with parasitic capacitance, and the data bow I are extracted.
- a third conductor film serving as a material for the conductor layer that electrically connects the end of the wiring 121 and the end of the data signal line 111 is formed.
- a plasma CVD method can be applied to the method for forming the third conductor film.
- the formed third conductive film is connected to the pixel electrode 113, the conductor layer 126 for providing each data lead-out wiring 121 with parasitic capacitance, and the end of the data lead-out wiring 121 and the end of the data signal line 111.
- This third conductor film patterning is HC1 + HNO + H
- a pixel electrode 113 having a predetermined shape is formed in the active region 11 as shown in FIG. 15 (f).
- Each pixel electrode 113 is formed on the second insulating film 133. It is electrically connected to the drain wiring 154 at the pixel contact portion.
- a conductor layer 126 is formed so as to overlap each data lead-out wiring 121.
- the shape of the conductor layer 126 may be different for each embodiment.
- the force material and the formation method are the same.
- each data lead-out wiring has a parasitic capacitance due to a conductor layer provided so as to overlap therewith.
- FIG. 16 is a perspective view schematically showing the configuration of the display panel 2 in which the display panel substrate 1 is applied to any of the embodiments of the present invention.
- the present display panel 2 includes a TFT array substrate (that is, a display panel substrate 1 that is effective in any embodiment of the present invention) and a color filter (that is, a counter substrate 21). . Between these, liquid crystal is filled. Since a general liquid crystal display panel configuration can be applied to the configuration of this display panel, a detailed description is omitted.
- the display panel manufacturing method includes a TFT array substrate manufacturing process, a color filter manufacturing process, and a panel (cell) manufacturing process.
- the TFT array substrate manufacturing process is as described above.
- FIG. 17 is a diagram schematically showing the configuration of the counter substrate (color filter) 21. Specifically, FIG. 17 (a) schematically shows the entire structure of the counter substrate (color filter) 21. As shown in FIG. Fig. 17 (b) is a perspective view, Fig. 17 (b) is a plan view showing the configuration of one picture element formed on the counter substrate (color filter) 21, and Fig. 17 (c) is a cross-sectional view taken along line BB in Fig. 17 (b). It is a figure, Comprising: It is the figure which showed the cross-section of the pixel.
- a black matrix 211 is formed on the surface of a transparent substrate 217 made of glass or the like, and a red matrix is placed inside each grade of the black matrix 211.
- a colored layer 212 made of colored sensitizing materials of green, blue and blue It is formed. The grids on which the colored layers 212 of these colors are formed are arranged in a predetermined order.
- a protective film 213 is formed on the surface of the black matrix 211 and the colored layer 212 of each color, and a transparent electrode (common electrode) 214 is formed on the surface of the protective film 213.
- an alignment regulating structure 215 for controlling the alignment of the liquid crystal is formed.
- the color filter manufacturing process includes a black matrix forming process, a colored layer forming process, a protective film forming process, and a transparent electrode (common electrode) forming process.
- the contents of the black matrix forming step are as follows for the resin BM method, for example.
- a BM resist photosensitive resin composition containing a black colorant
- the BM resist applied in the above / is formed into a predetermined pattern using photolithography.
- a black matrix having a predetermined pattern is obtained.
- a light shielding layer may be formed simultaneously with the BM resist.
- the light shielding layer is an element that prevents unnecessary light from being transmitted, and is provided in the panel frame region of the counter substrate (color filter) 21.
- the colored layers 212 of red, green, and blue for color display are formed.
- the color sensitive material method is as follows. First, a colored photosensitive material (referred to as a solution in which a pigment of a predetermined color is dispersed in a photosensitive material) is applied to the surface of the transparent substrate 217 on which the black matrix 211 is formed. Next, the applied colored photosensitive material is formed into a predetermined pattern using a photolithography method or the like. This process is performed for each color of red, green, and blue. Thereby, the colored layer 212 of each color is obtained.
- a colored photosensitive material referred to as a solution in which a pigment of a predetermined color is dispersed in a photosensitive material
- the method used in the black matrix forming step is not limited to the resin BM method, and various known methods such as a chromium BM method and a superposition method can be applied.
- the method used in the colored layer forming step is not limited to the color sensitive material method, and various known methods such as a printing method, a dyeing method, an electrodeposition method, a transfer method, and an etching method can be applied. Further, a back exposure method in which the colored layer 212 is formed first and then the black matrix 211 is formed may be used.
- the protective film 213 is formed on the surfaces of the black matrix 211 and the colored layer 212.
- the surface of the transparent substrate 217 that has been subjected to the above process using a spin coater For example, the surface of the transparent substrate 217 that has been subjected to the above process using a spin coater.
- a method of applying a protective film material to the surface (entire coating method), a method of forming a protective film having a predetermined pattern using printing or photolithography (patterning method), and the like can be applied.
- the protective film material for example, an acrylic resin or an epoxy resin can be applied.
- a transparent electrode (common electrode) 214 is formed on the surface of the protective film 213.
- a transparent electrode (common electrode) is formed by disposing a mask on the surface of the transparent substrate 217 that has undergone the above steps and depositing ITO (Indium Tin Oxide) or the like by sputtering or the like.
- This alignment regulating structure 215 is formed using, for example, a photolithography method. A photosensitive material is applied to the surface of the transparent substrate 217 that has undergone the above-described steps, and exposed to a predetermined pattern through a photomask. Then, unnecessary portions are removed in the subsequent development step, and an alignment regulating structure 215 having a predetermined pattern is obtained.
- the counter substrate (color filter) 21 is obtained through such steps.
- an alignment film is formed on each surface of the TFT array substrate obtained through the above-described process (that is, the display panel substrate 1 which is effective in any embodiment of the present invention) and the counter substrate (color filter) 21. Form. Then, alignment treatment is performed on the formed alignment film. Thereafter, the display panel substrate 1 and the counter substrate (color filter) 21 according to any of the embodiments of the present invention are bonded together, and liquid crystal is filled between them.
- a method for forming alignment films on the surfaces of the display panel substrate 1 and the counter substrate (color filter) 21 according to any embodiment of the present invention is as follows. First, an alignment material is applied to the surface of each of the display panel substrate 1 and the counter substrate (color filter) 21 using an alignment material application apparatus or the like, which is effective in any of the embodiments of the present invention.
- the alignment material refers to a solution containing a material that is a raw material for the alignment film.
- a conventional general method such as a circular pressure printing apparatus or an inkjet printing apparatus can be applied.
- the applied alignment material is heated and baked using an alignment film baking apparatus or the like.
- the fired alignment film is subjected to an alignment treatment.
- a rubbing roll or the like is used to scratch the surface of the alignment film, or ultraviolet light is applied to the alignment film surface.
- Various known processing methods such as a photo-alignment process that adjusts the surface properties of the alignment film by irradiating light energy such as the above can be applied.
- a sealing material is applied to one surface of the display panel substrate 1 and the counter substrate (color filter) 21 according to the embodiment of the present invention using a seal patterning device or the like.
- a strip-shaped conductor for providing parasitic capacitance to each data lead-out wiring is exposed.
- the display panel substrate 1 and the counter substrate (color filter) 21 according to any one of the embodiments of the present invention are bonded together under a reduced-pressure atmosphere.
- the force applied to any of the embodiments of the present invention is brought into contact with the common electrode provided on the sealing material counter substrate (force filter) 21 applied to the display panel substrate 1.
- the sealing material is mixed with conductive fine particles (for example, gold beads) as described above. Therefore, when the display panel substrate 1 and the counter substrate (color filter) 21 are bonded to each other according to any embodiment of the present invention, the display panel substrate according to any embodiment of the present invention is attached.
- the conductive layer 126 provided on the substrate 1 and the common electrode provided on the counter substrate (color filter) 21 are electrically connected. Therefore, the conductor layer 126 and the counter electrode for providing each data lead-out wiring 121 with a parasitic capacitance have the same potential or substantially the same potential.
- the liquid crystal is injected between the display panel substrate 1 and the counter substrate (color filter) 21 according to any of the embodiments of the present invention. Good.
- a display panel that is effective in the present invention can be obtained. After that, the lighting display of the obtained display panel is inspected. Then, the occurrence of streak-like display defects was confirmed in the lighting inspection, and the parenthesis display defects were caused by a short circuit between the data lead-out wiring and the conductor layer. If so, make corrections.
- the correction method is as described above.
- the number of data lead-out wires included in one wire bundle is not limited.
- the number of data lead-out wirings included in one wiring bundle is appropriately set according to the resolution of the display panel and the number of wiring bundles provided outside the active area.
- the configuration and manufacturing method of the display panel substrate and the color filter which are particularly useful for the embodiment of the present invention are merely examples, and the present invention is not limited to the above configuration or manufacturing method.
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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EP07806916.8A EP2065873B1 (en) | 2006-09-16 | 2007-09-07 | Substrate for display panel, and display panel provided with the substrate |
US12/441,469 US8159645B2 (en) | 2006-09-16 | 2007-09-07 | Display panel substrate, a display panel having the substrate, a method of producing the substrate, and a method of producing the display panel |
JP2008534313A JP4606495B2 (ja) | 2006-09-16 | 2007-09-07 | 表示パネル用の基板およびこの基板を備える表示パネル |
CN2007800342666A CN101523468B (zh) | 2006-09-16 | 2007-09-07 | 显示面板用基板和具有该基板的显示面板 |
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JP2006251960 | 2006-09-16 | ||
JP2006-251960 | 2006-09-16 |
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WO2008032647A1 true WO2008032647A1 (en) | 2008-03-20 |
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PCT/JP2007/067475 WO2008032647A1 (en) | 2006-09-16 | 2007-09-07 | Substrate for display panel, and display panel provided with the substrate |
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US (1) | US8159645B2 (ja) |
EP (1) | EP2065873B1 (ja) |
JP (1) | JP4606495B2 (ja) |
CN (1) | CN101523468B (ja) |
WO (1) | WO2008032647A1 (ja) |
Cited By (2)
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WO2019159325A1 (ja) * | 2018-02-16 | 2019-08-22 | 堺ディスプレイプロダクト株式会社 | 液晶表示パネル |
WO2021131265A1 (ja) * | 2019-12-26 | 2021-07-01 | 株式会社ジャパンディスプレイ | フレキシブル基板及び電子機器 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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BRPI0822529A2 (pt) * | 2008-04-28 | 2019-09-24 | Sharp Kk | substrato de matriz ativa, painel de visor de cristal líquido equipado com o mesmo, e método para fabricar o substrato de matriz ativa |
TWI403937B (zh) * | 2010-06-03 | 2013-08-01 | Au Optronics Corp | 觸控顯示器及其觸控顯示基板 |
CN103135265B (zh) * | 2011-12-05 | 2015-09-16 | 上海中航光电子有限公司 | 液晶显示装置的修复线及其修复方法 |
JP6502012B2 (ja) * | 2013-11-22 | 2019-04-17 | 株式会社Vtsタッチセンサー | 透明導電性積層体、タッチパネル、および、表示装置 |
KR102438782B1 (ko) | 2015-11-26 | 2022-09-01 | 엘지디스플레이 주식회사 | 표시장치와 이의 제조방법 |
CN107578736A (zh) * | 2016-07-05 | 2018-01-12 | 上海和辉光电有限公司 | 一种显示装置 |
KR102387554B1 (ko) * | 2017-10-27 | 2022-04-15 | 엘지디스플레이 주식회사 | 표시 장치 |
CN114335024A (zh) * | 2021-12-30 | 2022-04-12 | 武汉天马微电子有限公司 | 显示面板及显示装置 |
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JPH0660980B2 (ja) | 1985-08-13 | 1994-08-10 | セイコー電子工業株式会社 | マトリクス表示装置 |
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- 2007-09-07 JP JP2008534313A patent/JP4606495B2/ja active Active
- 2007-09-07 US US12/441,469 patent/US8159645B2/en active Active
- 2007-09-07 CN CN2007800342666A patent/CN101523468B/zh active Active
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WO2021131265A1 (ja) * | 2019-12-26 | 2021-07-01 | 株式会社ジャパンディスプレイ | フレキシブル基板及び電子機器 |
Also Published As
Publication number | Publication date |
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CN101523468B (zh) | 2011-12-21 |
CN101523468A (zh) | 2009-09-02 |
US8159645B2 (en) | 2012-04-17 |
EP2065873A1 (en) | 2009-06-03 |
EP2065873B1 (en) | 2016-03-09 |
JP4606495B2 (ja) | 2011-01-05 |
US20100033666A1 (en) | 2010-02-11 |
EP2065873A4 (en) | 2010-05-26 |
JPWO2008032647A1 (ja) | 2010-01-21 |
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