WO2008023524A1 - support d'affichage électrophorétique, son processus de fabrication, et appareil d'affichage électrophorétique - Google Patents

support d'affichage électrophorétique, son processus de fabrication, et appareil d'affichage électrophorétique Download PDF

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Publication number
WO2008023524A1
WO2008023524A1 PCT/JP2007/064476 JP2007064476W WO2008023524A1 WO 2008023524 A1 WO2008023524 A1 WO 2008023524A1 JP 2007064476 W JP2007064476 W JP 2007064476W WO 2008023524 A1 WO2008023524 A1 WO 2008023524A1
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WO
WIPO (PCT)
Prior art keywords
substrate
electrophoretic display
display medium
partition
resist film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/064476
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English (en)
French (fr)
Japanese (ja)
Inventor
Kenichi Murakami
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Brother Industries Ltd
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Brother Industries Ltd
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Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Publication of WO2008023524A1 publication Critical patent/WO2008023524A1/ja
Anticipated expiration legal-status Critical
Priority to US12/390,998 priority Critical patent/US20090180172A1/en
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field
    • G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
    • G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field
    • G02F1/1675—Constructional details
    • G02F1/1679—Gaskets; Spacers; Sealing of cells; Filling or closing of cells
    • G02F1/1681—Gaskets; Spacers; Sealing of cells; Filling or closing of cells having two or more microcells partitioned by walls, e.g. of microcup type
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/12—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode
    • G02F2201/121—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode common or background

Definitions

  • Electrophoretic display medium method of manufacturing electrophoretic display medium, and electrophoretic display device
  • the present disclosure relates to an electrophoretic display medium, a method of manufacturing the electrophoretic display medium, and an electrophoretic display device, and more particularly, to a plurality of division cells in which a dispersion system including charged particles is partitioned by partition walls.
  • the present invention relates to an enclosed electrophoretic display medium, a method of manufacturing the electrophoretic display medium, and an electrophoretic display device.
  • electrophoretic display media are known as media for displaying images.
  • This electrophoretic display medium has a structure in which a dispersion medium containing charged particles is filled between a first substrate to be a transparent or translucent display surface and a pair of substrates to be paired with the first substrate. It has a composition.
  • the charged particles can be moved to the first substrate side or the second substrate side by the voltage applied to the electrodes provided opposite to each other with the dispersion medium interposed therebetween.
  • the color of the charged particles can be observed when the charged particles are moved to the display substrate side by voltage application.
  • the charged particles move to the second substrate side, the color of the dispersion medium can be observed.
  • partition walls are formed on a substrate to divide the space between the substrates into a plurality of cells, and charged particles are sealed in these cells to limit aggregation and lateral movement of the particles.
  • a method of forming the barrier ribs a method is used in which a photosensitive material is applied on a substrate and the barrier ribs are formed by photolithography.
  • the partition walls may be peeled off from the substrate, for which it is difficult to secure the adhesion between the substrate and the partition walls.
  • Patent Document 1 Japanese Patent Application Publication No. 2001-343672
  • the electrode provided on the substrate on which the partition wall is formed has the electrode formed on the surface opposite to the surface on which the partition wall is formed. In this case, since the distance between the facing electrodes becomes long, there is a problem that the voltage for moving the charged particles becomes high.
  • the present disclosure has been made to solve the above-described problems, and an electrophoretic display medium having a partition that is difficult to peel off from the substrate while suppressing the voltage applied to the electrode, and an electrophoretic display medium And a method of manufacturing the same.
  • a first substrate and a second substrate which are provided to face each other, and an opposing surface, which is a surface of the first substrate facing the second substrate, are erected,
  • a method of manufacturing an electrophoretic display medium comprising: a partition dividing a space sandwiched by a substrate and the second substrate into a plurality of cells; and charged particles contained in the cell and moved by the action of an electric field.
  • a molding die provided with a molding surface having a concavo-convex shape is pressed against the facing surface of the first substrate before processing in which at least the facing surface is formed of a synthetic resin, and the first substrate before processing is After the embossing step of forming in accordance with the concavo-convex shape of the forming surface, and after the embossing step, the forming die is separated from the first substrate, and the partition formed of the convex portion is formed on the opposing surface of the first substrate.
  • an electrode film forming step of forming an electrode film on a partition non-standing portion which is a portion on which the partition is not provided among the opposing surfaces of the first substrate formed by A method of manufacturing a display medium is provided.
  • a first substrate and a second substrate which are provided to face each other, and an opposing surface which is a surface of the first substrate that faces the second substrate are provided.
  • An electrophoretic display medium comprising: a partition that divides a space sandwiched by one substrate and the second substrate into a plurality of cells; and charged particles encapsulated in the cells and moved by the action of an electric field.
  • a molding die provided with a molding surface having a concavo-convex shape is pressed against the facing surface of the first substrate before processing in which at least the opposing surface is formed of a synthetic resin, and the first substrate before processing is subjected to the molding
  • the molding die is separated from the first substrate, and the partition wall is formed of convex portions on the opposing surface of the first substrate.
  • An electrophoretic display medium is provided, which is manufactured by a manufacturing method including an electrode film forming step of forming an electrode film.
  • a first substrate and a second substrate which are provided to face each other, and an opposing surface which is a surface of the first substrate that faces the second substrate are provided.
  • An electrophoretic display medium comprising: a partition dividing a space sandwiched by one substrate and the second substrate into a plurality of cells; and charged particles encapsulated in the cells and moved by the action of an electric field
  • a molding die having a molding surface having a concavo-convex shape is pressed against the opposite surface of the first substrate before processing at least the opposite surface is formed of a synthetic resin.
  • the substrate is molded in conformity with the concavo-convex shape of the molding surface of the molding die, and after the embossing step, the molding die is separated from the first substrate, and a convex portion is formed on the opposite surface of the first substrate.
  • An electrophoretic display device comprising the electrophoretic display medium manufactured by the manufacturing method comprising:
  • FIG. 1 is a perspective view showing the appearance of an electrophoretic display medium 1 provided in an electrophoretic display device 100.
  • FIG. 2 is an exploded perspective view showing the main part of the electrophoretic display medium 1.
  • FIG. 3 is a partial cross-sectional view in the arrow direction of the Z-Z line of the electrophoretic display medium 1 shown in FIG.
  • FIG. 4 It is a fragmentary sectional view in the arrow direction in the W-W line of the electrophoretic display medium 1 shown in FIG.
  • FIG. 5 An explanatory view showing a state in which black is displayed in the entire display area of the display surface of the first substrate 11.
  • FIG. 6 An explanatory view showing a state in which white is displayed over the entire display area of the display surface of the first substrate 11.
  • Example 11 Of the partition forming process of Example 1, in the embossing step, it is an explanatory view for explaining a synthetic resin disposed in a pressing device with a heating mechanism.
  • Example 1 in the embossing step, it is an explanatory view for explaining a state of molding while pressing a synthetic resin containing a thermoplastic resin.
  • FIG. 15 An explanatory view showing a state in which a resist film 50 is formed on the facing surface 20 of the first substrate 11 so as to cover the partition walls 13 and the spacer 14 in the resist film forming step.
  • the resist film 50 formed in the resist film formation process is irradiated with light, and the outer periphery of the partition walls 13 and the spacers 14 which are the convex portions formed on the opposing surface 20 of the first substrate 11 in the mold release process. It is an explanatory view for explaining an exposure process for making a resist film of a part insoluble in a developing solution. 17) In the development process, remove the resist film except the resist film 52 made insoluble by the exposure process. It is explanatory drawing showing the state which was carried out. [FIG. 18] In the conductive film forming step, the resist film is removed in the developing step, and the resist film on the outer peripheral portion of the partition 13 which remains after passing through the developing step. FIG. 16 is an explanatory view showing a state in which a common electrode 26 and an electrode film 53 are formed on the surface of the substrate 52.
  • FIG. 19 An illustration showing a state in which the resist film 52 on the outer peripheral portion of the partition wall 13 remaining after the development process and the electrode film 53 formed on the resist film 52 are removed after the conductive film deposition process. It is.
  • FIG. 20 is a view corresponding to the partial cross-sectional view shown in FIG. 4 of a partition wall 113 according to modification 1;
  • FIG. 21 is a view corresponding to the partial cross-sectional view shown in FIG. 4 of a partition wall 213 according to modification 2;
  • FIG. 22 is a view corresponding to the partial cross-sectional view shown in FIG. 4 of a partition wall 313 according to modification 3;
  • FIG. 23 An explanatory view for explaining a sand blasting process of Example 2.
  • FIG. 24 is an explanatory view showing a state in which a resist film 252 is formed on the outer peripheral portion of the partition wall 13 in the resist application step according to Example 3.
  • the electrophoretic display medium 1 exemplified as the present embodiment is a small display panel that can be included in the electrophoretic display device 100 such as a portable electronic device.
  • the first substrate 11 and the second substrate 12 are opposed to each other with the spacer 14 interposed therebetween. It is held. Then, on an opposing surface that is a surface facing the second substrate 12 of the first substrate 11, a partition wall 13 for dividing a space sandwiched by the first substrate 11 and the second substrate 12 into a plurality of cells 17 stands. It is being done. Further, as shown in FIG. 3, a dispersion containing a dispersion medium 16 and a plurality of charged particles 15 is enclosed between the first substrate 11 and the second substrate 12.
  • the first base plate 11, the partition wall 13 and the spacer 14 are integrally formed.
  • the first substrate 11 is a plate-like substrate having a display surface for displaying an image formed in pixel units and having a predetermined thickness.
  • the thickness of the first substrate 11 can be appropriately set according to the material of the electrophoretic display medium 1, the application, and the like, and has a thickness of, for example, SOO m.
  • the facing surface 20 which is a surface facing the second substrate 12 of the first substrate 11, a region where the partition wall 13 is not provided is a partition non-standing portion 21.
  • the partition wall non-standing portion 21 is a partition wall 13 for securing the electrical connectivity between the cell portion 31 partitioned by the partition wall 13 and the electrode film 56 provided in the cell portion 31. Is set up! /, !, with the connection 32! / ,.
  • the first substrate 11 is integrally formed with the partition walls 13 and the spacer 14 by a synthetic resin, preferably, a stimulus curing resin which is cured by a stimulus from the outside.
  • a synthetic resin preferably, a stimulus curing resin which is cured by a stimulus from the outside.
  • the external stimulus which is a condition under which the stimulus-curable resin cures include heat, light such as ultraviolet light, oxygen, and mixing (stirring).
  • the stimulus curable resin for example, a thermosetting resin which cures by heating, a thermoplastic resin which cures by cooling, an ultraviolet curable resin which cures by irradiation of ultraviolet rays and the like are used.
  • the stimulable resin a resin that cures when exposed to oxygen, a resin that cures by mixing (stirring) a resin material, and the like are used.
  • thermosetting resin for example, an epoxy resin, a phenol resin, a melamine resin, an unsaturated ester resin and the like are used.
  • thermoplastic resin a resin which is cured by cooling is used. Specifically, for example, polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), cycloolefin polymer (COP), polyethylene (PE), polypropylene (PP), polyether monkey Phone (PES) etc. are used.
  • PMMA polymethyl methacrylate
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • COP cycloolefin polymer
  • PE polyethylene
  • PP polypropylene
  • PES polyether monkey Phone
  • the first substrate 11 is formed of a synthetic resin such as this stimulable curing resin as in the present embodiment
  • a part of the first substrate 11 is made of a synthetic resin.
  • at least the opposite surface facing the second substrate 12 may be provided with a synthetic resin such as a stimulus curable resin.
  • the second substrate 12 is not a substrate on the display surface side, it does not have to be transparent.
  • the first substrate 11 may be formed of a transparent material, for example, a non-transparent material such as stainless steel or aluminum provided with an insulating layer on the surface.
  • a transparent material for example, a non-transparent material such as stainless steel or aluminum provided with an insulating layer on the surface.
  • the electric swimming shown in Figure 3 In the dynamic display medium 1, the second substrate 12 is not limited to the force shown in the case where it is formed of a resin material such as polyimide resin, polypropylene resin, polyethylene resin and the like.
  • the spacer 14 is formed in a rectangular shape so as to surround the partition wall 13 and holds the first substrate 11 and the second substrate 12 at a predetermined interval, and the dispersion medium 16 and the charged particles 15 described later are external. It plays a role of sealing so as not to leak out.
  • the distance between the first substrate 11 and the second substrate 12 is held by the spacer 14 so as to be 25 m.
  • the width of the spacer 14 can be appropriately set depending on the material, application and the like of the electrophoretic display medium 1, and has a width of, for example, 1 mm.
  • the spacer 14 is integrally formed with the first substrate 11 and the partition wall 13 with the above-described stimulus curable resin.
  • the spacer 14 may not be integrally formed with the first substrate 11 and the partition wall 13. In that case, for example, an epoxy resin, an acrylic resin, or the like may be used to form the opposing surface 20 of the first substrate 11. Therefore, although FIG. 3 shows the case where the spacer 14 is formed of a resin material, it is possible to adopt various materials which are not limited to this.
  • the dispersion medium 16 is a solvent for dispersing the charged particles 15, and a highly transparent liquid having high electric resistance is used.
  • aromatic hydrocarbon solvents such as benzene, toluene and xylene, aliphatic hydrocarbon solvents such as hexane and cyclohexane, and insulating organic solvents such as polysiloxane and high purity petroleum are used.
  • the electrophoretic display medium 1 may be used alone or as a mixture of two or more of the dispersion media as described above.
  • the dispersion medium 16 can contain other components as needed. Examples of other components include dispersants, charge control agents, viscosity modifiers and the like.
  • the dispersant is used to assist the dispersion of the charged particles 15, and examples thereof include surfactants.
  • the charge control agent is used to adjust the electrophoretic property of the charged particles in the dispersion medium, and examples thereof include alcohols.
  • the viscosity modifier is used to prevent sedimentation of the charged particles in the dispersion medium, and examples thereof include viscosity modifiers such as polymer resins.
  • the charged particles 15 are particles that migrate to the side of the first substrate 11 or the second substrate 12 according to the electric field applied to each pixel, and form a display image on the display surface.
  • the charged particles 15 may be, for example, white charged particles, titanium oxide-containing PMMA particles, black charged particles, or the like. Black-containing PMMA particles are used.
  • inorganic pigments such as titanium oxide and zinc oxide
  • organic pigments such as carbon black, azo-based pigments and phthalocyanine-based pigments are used.
  • the charged particles 15 may be, for example, polymer particles made of a polymer material obtained by a known method such as a suspension polymerization method, a dispersion polymerization method, a seed polymerization method, or a composite of an inorganic material and a polymer material. Composite particles etc. are used. Of course, the polymer particles and the composite particles may be colored in any color with pigments or dyes.
  • the charged particles 15 may be used alone or as a mixture of two or more of the above-described charged particles.
  • the partition wall 13 is integrally formed with the first substrate 11 so as to protrude to the second substrate 12 on the facing surface 20 of the first substrate 11 as shown in FIG.
  • the sandwiched space is divided into a plurality of cells 17.
  • partition walls 13 having a cruciform or rod-like planar shape are regularly arranged in a row, and as a whole, it has a lattice-like planar shape.
  • the partition wall 13 has, for example, a thickness of 20 am (indicated by dimension X in FIGS. 4 and 19), and two 20 m ⁇ 500 m (indicated by!
  • the rectangles have a cross-like planar shape formed to intersect at right angles at each center.
  • the partition wall 13 projects from the opposing surface 20 of the first substrate 11 toward the second substrate 12 by 20 inches (shown by a dimension W in FIG. 19).
  • a 5 m gap exists between the second substrate 12 and the surface of the partition 13 facing the second substrate 12.
  • a space sandwiched between the first substrate 11 and the second substrate 12 is divided into a plurality of cells 17 having a substantially square planar shape having a side length of 250 m by the partition wall 13 having such a structure. ing.
  • the charged particles 15 are limited to the inside of the area force cell 17 where they can migrate. For this reason, it is possible to prevent the concentration of particles in the dispersion medium 16 from being uneven and to prevent the occurrence of display unevenness.
  • the partition 13 of the electrophoretic display medium 1 shown in FIG. 3 is not in contact with the second substrate 12, the partition 13 and the second substrate 12 have the same height. It may be in contact with the The partition wall 13 and the spacer 14 may have the same thickness.
  • the medium force of the plurality of partition walls 13 also arbitrarily focuses on any of the partition walls 13.
  • a space divided by two cross-shaped partition walls 13 forms one cell 17.
  • the upper right direction (diagonal 45 ° direction), the lower right direction, and the center point of the partition 13 of interest (the intersection of the crosses of the partitions 13 having a cross-shaped planar shape).
  • Four partitions 13 having center points are arranged in the upper left direction and the lower left direction.
  • the partition 13 of interest and the partition 13 having a central point in the upper right, lower right, upper left or lower left direction are the length obtained by adding the thickness 20 ⁇ m of the partition 13 to the length of one side of the cell 17 Only away.
  • the length of one side of the cell 17 is 250 ⁇ m and the thickness of the partition 13 is 20 m
  • the length of the diagonal of a square with 270 m as one side ie, 270 X ⁇ 2 m (Fig. 4).
  • the partition 13 is moved at a position indicated by the dimension Z, and the partition 13 having a center point in the upper right direction, lower right direction, upper left direction, lower left direction of the partition 13 of interest is arranged.
  • each of the cells 17 having a square planar shape two of the diagonally opposite corners are surrounded by four partitions 13 and one of the opposing surfaces 20 is not set up.
  • the partition wall 13 is illustrated with dimensions different from those of the above-described example.
  • the connecting portion 32 is a portion where the partition wall 13 is not provided. Therefore, when the distance between the concave portions, which is the shortest distance between the adjacent partition walls 13 surrounding the connection portion 32, is sufficiently larger than the average particle diameter of the charged particles 15, the charged particles 15 are uniformly dispersed in the dispersion injection step. It has the advantage of being easy to The dispersion injection step will be described later with reference to FIG.
  • the electrophoretic display medium 1 when used, the charged particles 15 may move between the cells 17 through the gap, and the charged particles 15 may be biased. In general, the charged particles 15 are likely to move in the direction in which the user tilts, that is, the longitudinal direction of the electrophoretic display medium 1 indicated by the arrow 81 or the lateral direction of the electrophoretic display medium 1 indicated by the arrow 82.
  • each connection portion 32 sandwiches the partition wall 13. It is arranged in a row. That is, the connecting portion 32 in which the shortest distance between the adjacent partition walls 13 surrounding the connecting portion 32 is equal to or larger than the average particle diameter of the charged particles 15 is either the longitudinal direction or the lateral direction of the electrophoretic display medium 1 It arranges so that it may be arranged in a row with the partition wall 13 in between.
  • the average particle size of the charged particles 15 refers to the volume average particle size, for example, a laser diffraction scattering method It is determined by Microtrack 3100 (manufactured by Nikkiso Co., Ltd.) using the (Microtrack method).
  • a laser diffraction scattering method It is determined by Microtrack 3100 (manufactured by Nikkiso Co., Ltd.) using the (Microtrack method).
  • Such a configuration limits the linear movement of the charged particles 15 in the longitudinal direction and the lateral direction of the electrophoretic display medium 1. Then, for example, in the direction of 45 ° oblique to the longitudinal direction of the electrophoretic display medium 1 as compared with the distance on the plane between the connection portions 32 arranged in a row in the longitudinal direction of the electrophoretic display medium 1 indicated by the arrow 81.
  • the planar distance between the connection portions 32 arranged in a row is shortened.
  • the width of the gap surrounded by the partition wall 13 of the connection portion 32 may be equal to or larger than the average particle diameter of the charged particles 15.
  • the charged particles 15 of the electrophoretic display medium 1 of the present embodiment are less likely to move in the longitudinal direction and the short direction of the electrophoretic display medium 1 in the electrophoretic display medium 1 of the present embodiment than in the case where the connection portions 32 are not arranged in a row .
  • the direction corresponding to the predetermined direction of the present disclosure which is the direction in which the connection portions are arranged in a row across the partition walls, can be arbitrarily determined according to the shape and use of the electrophoretic display medium, and the use mode of the user. . Therefore, as in the above-described example, the direction corresponding to the predetermined direction of the present disclosure may be the long direction and the short direction of the electrophoretic display medium 1.
  • connection portions 32 may be arranged so as to regulate the movement of the charged particles 15 in the oblique direction.
  • the connection portion satisfying the condition that the shortest distance between adjacent partition walls surrounding the connection portion is less than the average particle diameter of the charged particles. It is arranged in a row across!
  • the partition wall 13 integrally formed with the first substrate 11 is formed as a separate body from different materials of the partition wall and the first substrate, compared to the conventional electrophoretic display medium.
  • the partition wall is the first at the connection portion between the partition wall and the first substrate. There was a risk of peeling off from one substrate.
  • the partition wall 13 and the first substrate 11 are integrally formed. Therefore, there is no possibility that the partition wall 13 may come off from the first substrate 11 due to temperature change. Therefore, it can be suitably used even in an environment where the temperature environment is easily changed.
  • the partition wall 13 is integrally formed with the first substrate 11 in the electrophoretic display medium 1 of the present embodiment, the partition wall 13 is less likely to be peeled off than in the related art even when it is used by bending. Therefore, it can be suitably used also for the flexible electrophoretic display medium proposed in recent years.
  • the height, shape, spacing and the like of the partition 13 can be changed as appropriate depending on the material, application and the like, and is not limited to the above-mentioned dimensions.
  • the common electrode 26 included in the first substrate 11 and the drive electrode 27 included in the second substrate 12 have polarity for applying an electric field to the electrophoretic display medium 1.
  • the driving electrode 27 is preferably covered with a protective film (not shown) using a coating agent or the like having a fluorine compound.
  • the common electrode 26 provided on the first substrate 11 is made of a light-transmitting conductive material such as indium 'tin oxide (ITO), zinc oxide doped with metal, or a conductive polymer such as pentacene. Composed of thin film.
  • the common electrode 26 is composed of an electrode film 56 which controls the electric field applied to the charged particles 15 of negative polarity, and an electrode film 57 for electrically connecting the electrode film 56. .
  • the electrode film 56 is provided in the cell section 31, and the electrode film 57 is provided in the connection section 32.
  • the electrode film 56 provided in the cell portion 31 extends inward 1 m of the cell 17 having a square planar shape of 250 m on one side surrounded by the partition wall 13 and has a square planar shape of 248 m on one side. Have.
  • the electrode film 57 provided in the connection portion 32 is extended to the outside of the partition wall 13 and plays a role of electrically connecting the electrode film 56 of the cell portion 31. Therefore, the common electrode 26 is composed of a single electrode film electrically connected, and can electrically connect the electrode films 56 provided in the individual cells 17 without complicated wiring. Further, since the common electrode 26 is provided on the facing surface 20 of the first substrate 11, the distance between the common electrode 26 and the drive electrode 27 disposed on the second substrate side 12 can be shortened.
  • the electrophoretic display medium 1 can suppress the voltage applied to these electrodes to a low level It is.
  • the drive electrodes 27 are arranged in a matrix on the surface of the second substrate 12 facing the first substrate 11.
  • the driving electrode 27 may be made of a light transmitting conductive thin film such as indium 'tin oxide (ITO) or a conductive polymer such as zinc oxide doped with metal or pentacene, or a light such as gold or silver. It may be constituted by a thin film of a non-permeable conductive material.
  • a thin film transistor 28 (see FIG. 2) functioning as a switch element is provided on the periphery of the drive electrode 27.
  • a drive circuit (not shown) for controlling each drive electrode 27 selects a selection signal for each row of the matrix. Applied.
  • control signal and the output from the thin film transistor 28 can be applied to each column of the matrix to apply a desired electric field to the charged particles 15 and the dispersion medium 16 of the individual cells 17.
  • the number of drive electrodes 27 corresponding to one pixel is not particularly limited.
  • any shape such as a square, a rectangle, or a circle, which is not particularly limited to the planar shape of the drive electrode 27, is applicable.
  • a voltage of 0 V is applied to the common electrode 26 of the first substrate 11 and ⁇ 50 V is applied to all drive electrodes 27 provided on the second substrate 12, and charging with a negative charge is performed.
  • the particles 15 are moving to the first substrate 11 side. Then, the black charged particles 15 adhere to the first substrate 11, and black is displayed on the display surface of the first substrate 11.
  • the voltage applied to the common electrode 26 and the drive electrode 27 to move the charged particles 15 is as follows: Even if this voltage is dropped and both voltages become 0 V, the first charged particle 15 The state of being attached to the substrate 11 is maintained.
  • a voltage of 0 V is applied to the common electrode 26
  • a voltage of 50 V is applied to the drive electrode 27, and charged particles 15 having a negative charge are moved to the second substrate 12 side.
  • black charged particles 15 are attached to the second substrate 12.
  • white is displayed on the entire display surface of the first substrate 11.
  • the voltage applied to each electrode can be variously changed according to the distance between the electrodes, the chargeability of the charged particles 15, and the like.
  • Example 1 which is an example of a method of manufacturing the electrophoretic display medium 1 of the present embodiment, will be described with reference to FIGS. 7 to 10.
  • each configuration shown in FIGS. 7 to 10 is illustrated with dimensions different from each configuration of the cross-sectional view shown in FIG.
  • the partition 13 and the spacer 14 are integrally formed with the first substrate 11.
  • the partition forming process will be described later in detail with reference to FIGS. 11 to 14.
  • the force that causes the spacer 14 to be integrally formed with the first substrates 11 and 13 by this process is that the spacer 14 is separated after the first substrate 11 and the partition wall 13 are formed. It may be formed of In that case, the common electrode 26 may be formed after the spacer 14 is formed, or the spacer 14 may be formed after the common electrode 26 is formed.
  • the common electrode 26 is formed on the facing surface 20 of the first substrate 11.
  • the electrode film forming process will be described later in detail with reference to FIGS. 15 to 19.
  • the charged particles 15 and the dispersion medium 16 for dispersing the charged particles 15 are dispersed in a cell 17 composed of a plurality of recesses divided by the partition walls 13. Inject the dispersion containing.
  • the second substrate 12 is bonded to the first substrate 11.
  • Drive electrodes 27, thin film transistors 28 (see FIG. 2), and drive circuits (not shown) for controlling the drive electrodes 27 are provided on the surface of the second substrate 12 facing the first substrate 11 in advance. It is equipped.
  • These drive electrodes 27, thin film transistors 28 (see FIG. 2), and drive circuits (not shown) for controlling the respective drive electrodes 27 are formed by known techniques such as photolithography.
  • 10 shows the case where a resin material is used as the material of the second substrate 12, as described above, in addition to resin materials, for example, transparent materials such as glass, etc. Materials may be used. For this reason, for example, it is made of transparent material such as stainless steel or aluminum provided with an insulating layer on the surface. It may be done.
  • the electrophoretic display medium 1 is manufactured by the steps described above. Next, the partition forming process will be described in detail with reference to FIGS. 11 to 14. Note that the number of partitions 13 formed in the partition forming step shown in FIG. 7 was eight. FIG. 11, FIG. 13 and FIG. The first substrate 11 on which two partitions 13 are formed is shown. Further, as in FIGS. 7 to 10, in order to schematically describe each step, each configuration shown in FIGS. 11, 13 and 14 has dimensions different from each configuration of the cross-sectional view shown in FIG. It is illustrated.
  • Example 1 PET, which is a thermoplastic resin, is used as a synthetic resin, and the first substrate 11, the partition 13 and the spacer 14 are integrally formed. Further, the partition wall forming step of the embodiment 1 includes a embossing step and a releasing step.
  • the embossing process the molding die 40 having the uneven molding surface 45 is pressed against the synthetic resin containing a thermoplastic resin, and the first substrate before processing is formed to match the unevenness of the molding surface 45 of the molding die 40. Do.
  • the mold release step the mold 40 is released from the first substrate containing the thermoplastic resin.
  • the molding die is pressed against the first substrate before processing including the thermoplastic resin using a press device with a heating mechanism.
  • the mold comprises a molding surface 45 having a concavo-convex shape engaged with the concavities and convexities of the partition wall 13 and the spacer 14. Therefore, in the embossing process, the first substrate before processing is formed in accordance with the concave and convex shape of the molding surface 45 of the mold 40.
  • This heating mechanism-equipped pressing apparatus is not an essential part of the present disclosure! /, So it is not illustrated in its entirety! /
  • the 1S heating mechanism-equipped pressing device includes a support plate 36 and a support plate 37 which are disposed to face each other.
  • the support plate 36 is disposed so as to be vertically movable in the vertical direction at a position opposite to the support plate 37 and at a position vertically above the support plate 37 in the press with a heating mechanism.
  • the support plate 36 internally includes a heater which is a heat source for heating the first substrate 11 to a predetermined temperature through the mold 40.
  • a molding die 40 is fixed to the lower surface of the support plate 36 with the molding surface 45 on the lower side in the vertical direction. The distance of the vertical movement of the support plate 36 can be appropriately set according to the object to be pressed.
  • the support plate 37 has its upper surface horizontal at a predetermined position in the press with heating mechanism. Is fixed.
  • the support plate 37 is internally provided with a heater which is a heat source for heating the first substrate 11 to a predetermined temperature.
  • a substrate holding portion 38 is fixed to the upper surface of the support plate 37 with the press surface on the upper side in the vertical direction.
  • the mold 40 and the substrate holder 38 are removably fixed to the support plate 36 or 37, respectively.
  • a plurality of concave portions 42 are formed at predetermined positions on a flat surface.
  • the recess 42 is a portion corresponding to the partition 13 or the spacer 14, and the shape of the recess 42 corresponding to the partition 13 is, for example, two of 20 ⁇ and 20 ⁇ m ⁇ 500 ⁇ m in depth.
  • the rectangular force has a cross-like planar shape formed to intersect at the center of each of the rectangular forces.
  • the depth of the recess corresponding to the spacer 14 is 25 and has a rectangular frame-like planar shape so as to surround the recess corresponding to the partition wall 13. Further, marks for adjusting the position, which are used in the conductive film formation process described later, are provided at two diagonally opposite corners of the four corners of the spacer 14.
  • the upper surface of the projecting portion 41 of the mold 40 in the projecting direction is the partition wall 13 which is provided erected in the opposing surface 20.
  • it has a square planar shape having a side length of 250 m and surrounded by two cross-shaped partition walls 13.
  • the cell corresponding portion 43 which is a convex portion surface corresponding to the cell portion 31 is connected and continued by the connecting portion 44 which is a convex portion surface corresponding to the connection portion 32 where the partition wall 13 is not formed.
  • the partition wall non-standing portion 21 of the first substrate 11 corresponding to the cell corresponding portion 43 and the connecting portion 44 of the molding die 40 formed by using the molding die 40 is also continuous. Therefore, by forming an electrode film on one surface of the continuous non-partition wall portion 21 formed using the molding die 40, it is possible to form the common electrode 26 formed of the continuous electrode film. As a result, electrical connection of the common electrode 26 can be secured without complicated wiring processing.
  • the distance between the recesses which is the shortest distance between the adjacent recesses 42 surrounding the connecting portion 44, is a square having a side length of 250 am-(500 ⁇ m-20 ⁇ m) / 2.
  • the length of the diagonal spring ie, 10 X ⁇ 2 ⁇ 111.
  • the direction indicated by the arrow 181 corresponds to the longitudinal direction of the electrophoretic display medium 1 indicated by the arrow 81 in FIG.
  • the direction indicated by the arrow 182 corresponds to the short direction of the electrophoretic display medium 1 indicated by the arrow 82. Therefore, even in the case where the connecting portion 44 is provided in order to secure the electrical connectivity of the electrode film 56 provided in the cell portion 31, the first formed by using such a mold 40 is not limited.
  • the predetermined direction of the present disclosure that regulates the movement of the charged particles 15 can be arbitrarily determined in accordance with the shape and application of the manufactured electrophoretic display medium, the use mode of the user, and the like. Therefore, as in the example described above, the predetermined direction of the main display may be the direction corresponding to the longitudinal direction of the electrophoretic display medium 1 and the direction corresponding to the lateral direction.
  • connection portion 44 may be arranged so as to regulate the movement of the charged particles 15 in the oblique direction.
  • the recess 42 is shown with dimensions different from those of the above-mentioned example.
  • the pressing surface of the substrate holding portion 38 is a flat surface
  • the first substrate 11 is positioned so that the center of the first substrate 11 and the center of the substrate holding portion 38 are opposed to each other. It is placed on the flat surface of the substrate holder 38 with the opposing surface up in the vertical direction.
  • a part of the first substrate 11 is made of synthetic resin, it is placed on the substrate holding portion 38 with the surface provided with the synthetic resin as the upper surface. Thereafter, the molding surface 45 of the mold 40 and the first substrate 11 are brought into contact with each other.
  • the first substrate 11 is heated by the heater incorporated in the press device with the heating mechanism.
  • the heat generated by the heater which is a heat source, is conducted to the first substrate 11 via the mold 40 or the substrate holder 38, and the first substrate 11 is heated to, for example, 140.degree.
  • the heating temperature is set to a temperature about 10 to 70 ° C. higher than the glass transition temperature (Tg) of the thermoplastic resin.
  • Tg glass transition temperature
  • the first substrate 11 formed of ET is heated to 140 ° C. to be softened and to be easily plastic-worked.
  • Example 1 press the molding die 40 against the first substrate 11 and hold it in a heated and pressurized state for a certain period of time.
  • the pressure is maintained at 5 MPa for 5 minutes.
  • a part of the softened first substrate 11 made of PET protrudes into the recess 42 of the mold 40, and a protrusion having the same shape as the recess 42 is formed on the opposing surface 20 of the first substrate 11.
  • the convex portion protruding into the concave portion 42 becomes the partition wall 13 or the spacer 14 in the electrophoretic display medium 1 described above.
  • a portion corresponding to the convex portion of the molding die 40 is the partition non-standing portion 21 of the first substrate 11 of the electrophoretic display medium 1 described above.
  • the set temperature of the heater incorporated in the heating mechanism-equipped press is set to 60 ° C., for example, and left for a certain period of time, and when cooled to about 60 ° C., the softened first substrate 11
  • the thermoplastic resin of the present invention cures more than during the embossing process. Therefore, the mold 40 and the first substrate 11 are easily peeled off.
  • the mold 40 is peeled off from the first substrate 11 to form the first substrate 1 1, the partition wall 13 and the spacer 14 in a body. Be done. Further, a mark for position adjustment is formed, which is used at the time of an electrode film forming process described later. Although the first substrate 11 is cooled in the embossing process, the cooling may be omitted only by stopping the heating in a specific temperature range.
  • the partition walls 13 and the first substrate 11 are integrally formed as described above, the partition walls 13 are separated from the first substrate 11 as described above. There is not it. For this reason, it is possible to more reliably prevent the occurrence of display unevenness due to separation of the partition wall 13 from the first substrate 11.
  • the partition wall 13 is integrally formed with the first substrate 11 before forming the common electrode 26 on the opposing surface 20 of the first substrate 11, the heat resistance of the common electrode 26 is reduced in the partition wall forming process. There is no need to consider. Therefore, the heating temperature can be set higher than in the case where the partition wall is integrally formed with the first substrate after the common electrode is formed.
  • the electrode film adheres to the surface or the side facing the second substrate 12 of the partition wall 13 or the electrode film adheres to the mold 40.
  • FIGS. 15 to 19 show a part of the partition wall 13 in an enlarged scale. First, two partitions 13 of the eight partitions 13 are formed. The substrate 11 is shown. Further, as in FIGS. 7 to 10, in order to schematically describe each step, each configuration shown in FIGS. 15 to 19 is illustrated with dimensions different from each configuration of the cross-sectional view shown in FIG. There is.
  • Example 1 first, portions of the first substrate 11 other than the partition non-standing portion 21, ie, outer peripheral portions of the partition 13 and the spacer 14, are formed by the resist film forming step, the exposure step, and the developing step. Is covered with a resist film 52. This treatment is to prevent the electrode film from being formed on the portion other than the partition non-standing portion 21 of the first substrate 11.
  • the “peripheral portion of the partition wall” refers to the surface of the partition wall facing the second substrate and the side surface of the partition wall.
  • the common electrode 26 and the electrode film 53 are formed, and the resist film 52 covering the outer peripheral portion of the partition 13 and the spacer 14 is formed on the resist film 52
  • the membrane 53 is removed in a lift-off process.
  • the spacer 14 is formed separately from the first substrate 11 and the partition wall 13 and the common electrode 26 is formed on the partition wall non-standing portion 21 of the first substrate 11, the spacer 14 is formed. In this case, only the outer peripheral portion of the partition wall 13 may be covered with the resist film.
  • a resist film 50 having a thickness sufficient to cover the partition walls 13 and the spacer 14 is formed on the opposing surface 20 of the first substrate 11.
  • Ru This resist film 50 is formed on the outer peripheral portions of the partition 13 and the spacer 14 with a resist film for a mask that prevents the electrode film constituting the common electrode 26 from adhering to the outer peripheral portions of the partition 13 and the spacer 14.
  • the resist forming the resist film 50 may be a positive resist or a negative resist.
  • a resist film 50 is formed using a positive resist based on acrylic or nopolac resin.
  • a phenol type resist may be used as the resist for forming the resist film 50.
  • a resist of the type to be applied for example, a resist film 50 is formed on the first substrate 11 by spin-coating the resist, and For example, perform beta treatment under conditions of 90 ° C and 2 min.
  • a resist film 50 is formed by affixing to the facing surface 20 of the first substrate 11 using a laminator. At this time, by adjusting the bonding pressure, the roller temperature, and the roller rotational speed, a desired resist film 50 having appropriate adhesion and no air inclusion can be obtained.
  • the partition wall 13 erected on the facing surface 20 of the first substrate 11 and the mask 51 covering the upper part of the outer peripheral part of the spacer 14 are provided.
  • the resist film 50 is irradiated with ultraviolet light indicated by an arrow 61.
  • the position adjustment of the mask 51 is performed using position adjustment marks provided at two diagonally opposite corners of the four corners of the spacer 14 formed in the partition forming step. Therefore, the mask alignment can be easily performed using the alignment adjustment mark, and the outer peripheral portions of the partition wall 13 and the spacer 14 can be reliably covered.
  • the exposure conditions are determined in accordance with the photosensitive wavelength of the resist, and for example, a wavelength of 365 nm (i-line) is irradiated for a predetermined time.
  • a wavelength of 365 nm (i-line) is irradiated for a predetermined time.
  • the resist film 50 excluding the outer peripheral portions of the partition walls 13 and the spacers 14 becomes soluble in a developer described later.
  • FIG. 16 shows the case where the resist film 50 is made of a positive type resist! // When the resist film 50 is made of a negative type resist, the partition 13 and the resist film 50 in the resist film 50 are shown. The light is irradiated to the area of the outer peripheral portion of the spacer 14
  • processing is performed in which the region excluding the outer peripheral portions of the solubilized partition walls 13 and the spacers 14 in the exposure step is dissolved with a developer.
  • a developing solution used in this step an organic alkali solution such as 2.38 wt% tetramethyl ammonium hydride (TMAH) or an inorganic alkali solution such as sodium carbonate is used.
  • TMAH tetramethyl ammonium hydride
  • an inorganic alkali solution such as sodium carbonate
  • a developing method a paddle process for developing by a developer reservoir formed on the surface of the resist placed horizontally, a dipping process for dipping the resist in the developer for developing, a spray process for developing the developer to the resist, and development Spray treatment is used. In Example 1, a paddle treatment using 2.
  • a resist film is formed which covers the outer peripheral portion formed of the side surface and the upper surface of the partition wall 13.
  • the spacer 14 is also A resist film is formed covering the outer peripheral portion consisting of the upper surface and the upper surface.
  • the partition wall non-standing portion 21 of the first substrate 11 from which the resist film has been removed in the development step and the development step remain.
  • a force S is formed on the surface of the resist film 52 on the outer peripheral portion of the dividing wall 13 with the common electrode 26 and the electrode film 53 made of a transparent electrode film.
  • a light transmitting conductive material such as ITO is used as a material of the electrode film.
  • a film forming method of the electrode film a sputtering method, a vacuum evaporation method, an ion plating method, a wet plating method, a coating method or the like is used.
  • the vacuum evaporation method is a method in which the electrode film material is heated, melted and evaporated in vacuum, and attached to the first substrate 11.
  • the ion plating method is a method of activating and depositing a part of evaporation particles as ions or excitation particles using gas plasma.
  • the wet plating method is a method of immersing the first substrate 11 in a plating solution, and the coating method is a method of applying an electrode film material to the first substrate 11.
  • Example 1 high energy is applied to the electrode to cause corona discharge by the sputtering method using an ITO target material and a sputtering gas of argon, and the opposing surface 20 of the first substrate 11 is subjected to corona treatment.
  • the energy at this time is, for example, 100 W'min / m or less.
  • the entire surface of the opposing surface 20 of the first substrate 11 is exposed from an oblique direction, and resist films 52 on the outer peripheral portions of the partition walls 13 and spacers 14 remaining after the development process. Is made soluble in the developer. Since the film to be lifted off is a transparent film, exposure may be performed from the vertical direction. Thereafter, all the resist films 52 are dissolved and further rinsed using the developer used in the above-mentioned development process.
  • the reaction time of the development processing is, for example, about 3 to 10 min, which is longer than the above-mentioned development step, and the resist film 52 is completely removed.
  • the resist film 52 for a mask attached to the outer peripheral part of the partition 13 and the spacer 14 and the electrode film 53 attached to the resist film 52 are completely removed.
  • a common electrode 26 is formed.
  • the resist film 52 is made of a negative resist
  • NMP N-methyl-2-pyrrolidone
  • the common electrode 26 which is an electrode film having a planar shape continuous to the partition non-standing portion 21 of the first substrate 11 is formed. Is made.
  • the electrode film is attached to these portions to avoid the adverse effect on the display. That ability S can.
  • the electrophoretic display medium 1 can be manufactured in which the deterioration of the display performance due to the separation of the partition wall 13 from the first substrate 11 is prevented.
  • the common electrode 26 disposed on the first substrate 11 side is provided on the facing surface 20 of the first substrate 11, the common electrode 26 and the drive electrode 27 disposed on the second substrate 12 side are provided. The distance between them can be shortened.
  • the first substrate 11 is made of a thermoplastic resin, and in the embossing process, the thermoplastic resin is heated and cured while being pressed, so that the conditions for curing the synthetic resin can be controlled immediately.
  • the partition wall 13 is easily formed on the first substrate 11.
  • the common electrode 26 and the electrode film 53 including the electrode film 56 and the electrode film 57 are formed. After that, the resist film 52 and the electrode film 53 formed on the resist film 52 are removed! Therefore, the common electrode 26 can be formed at a desired position on the first substrate 11 while reliably preventing the electrode film from being formed on the surface or the side of the partition wall 13 facing the second substrate 12. . Further, since the common electrode 26 is formed of a transparent electrode, the force S is required to make the first substrate side 11 a display surface.
  • the cell corresponding portion 43 of the mold 40 corresponding to the cell portion 31 of the first substrate 11 is a connecting portion 44. Connected through and continuous. Therefore, the partition non-standing portion 21 provided with the cell portion 31 and the connection portion 32 of the first substrate 11 formed using the mold 40 is also continuous. For this reason, it is possible to form the common electrode 26 continuously connected to the facing surface 20 of the first substrate 11 which is not subjected to the process of electrically connecting the individual electrode films.
  • the electrophoretic display medium, the method of manufacturing the electrophoretic display medium, and the electrophoretic display device of the present disclosure are not limited to the embodiments described above, but are within the scope not departing from the gist of the present disclosure. Various changes may be added.
  • the present embodiment has been described as a small panel that can be included in a portable electronic device, the size of the electrophoretic display medium may be variously selected from the electrophoretic display devices and the like provided with the electrophoretic display medium. Yes, not limited to this.
  • the force described in the case of forming the display surface may form the display surface.
  • the second substrate 12 is formed of a transparent or translucent material, and the first substrate 11 and the partition walls 13 and the common electrode 26 may be formed using a material which is neither transparent nor translucent. Good.
  • the partition wall 13 affects the display, so it is desirable that the first substrate 11 and the partition wall 13 be formed of a material with low visibility. Yes.
  • the present disclosure relates to the electrophoretic display medium in which the charged particles 15 move in the gas. Is also applicable.
  • the gas containing the charged particles 15 is sealed by a known method in the dispersion injection step shown in FIG.
  • the drive electrode 27 corresponds to one cell 17
  • a plurality of drive electrodes may correspond to one cell.
  • a set of cells may correspond to a plurality of cells.
  • the cell corresponding portion 43 is continuous by the connection portion 44, but is not limited thereto.
  • the cell corresponding portion 43 is connected by the connecting portion 44 and there is no! Also, you may connect some cell counterparts 43! /. Further, in the case of providing the connecting portion 44 in order to secure the electrical connectivity of the electrode film 56, the arrangement of the connecting portion 44 may be determined so that the cell corresponding portion 43 is continuous by the connecting portion 44.
  • the force applied to the embossing process after heating the first substrate 11 is not limited to this, and depending on the synthetic resin to be used, Various conditions can be defined.
  • a synthetic resin it is possible to use a stimulus curable resin which is cured by external stimuli such as heat, light such as ultraviolet light, oxygen and mixing (stirring).
  • the ultraviolet curable resin is irradiated with ultraviolet rays by pressing a mold having light transparency to the ultraviolet curable resin.
  • the first substrate before processing including the ultraviolet curable resin may be formed in accordance with the concavo-convex shape of the molding surface of the molding die.
  • the curing reaction can be easily adjusted by adjusting the irradiation conditions of the ultraviolet ray irradiated to the ultraviolet curable resin, and the resin may be filled in the molding die.
  • a thermosetting resin that cures upon heating may be used as the stimulus curable resin.
  • the thermosetting resin is pressed against the thermosetting resin and the thermosetting resin is heated to match the thermosetting resin to the uneven shape of the molding surface of the molding. do it.
  • the curing reaction of the thermosetting resin can be easily adjusted by adjusting the heating conditions of the thermosetting resin.
  • the curable resin when a curable resin which is cured by contact with oxygen is used as the stimulus-curable resin, the curable resin may be exposed in an oxygen atmosphere to be shaped in the embossing step.
  • the material of the curable resin when using a curable resin that cures when a plurality of materials are mixed, the material of the curable resin is simply mixed, and then it is used in the embossing step.
  • the curable resin may be molded. In these cases, the synthetic resin can be cured without using a special device such as a heating device or an ultraviolet light source.
  • the partition wall 13 has a lattice-like shape in plan view.
  • Various shapes are adopted to define a space sandwiched by the first substrate and the second substrate which is not limited thereto. It is possible.
  • the partition wall may be formed by a mold having a recess having a rectangular, circular or elliptical planar shape in plan view.
  • modifications 1 to 3 will be described with reference to FIGS. 20 to 22.
  • the direction indicated by the arrow 281 is the longitudinal direction of the electrophoretic display medium according to the modification
  • the direction shown by the arrow 282 is the lateral direction of the electrophoresis display medium according to the modification.
  • the electrophoretic display medium of the modification 1 is provided with a common electrode 126 in the partition wall non-standing portion 121 of the first substrate 11 as in the above-described electrophoretic display medium 1.
  • the partition wall non-standing portion 121 includes a cell portion 131, a connection portion 132 and a connection portion 133.
  • the common electrode 126 is composed of electrode films 156 to 158, which are continuous.
  • the electrophoretic display medium of Modification 1 has the following configuration in order to further restrict the movement of charged particles between cells in the lateral direction (longitudinal direction in FIG. 20).
  • the connection portions 132 and 133 arranged in a row in the longitudinal direction (horizontal direction in FIG. 20) of the electrophoretic display medium 1 indicated by the arrow 281 compared with the connection portion 32 of the present embodiment, the connection portions 132 and 133 are surrounded.
  • the minimum distance on the plane of the partition wall 113 reduces the number of connection portions 132 in which the average particle diameter of the charged particles 15 is larger.
  • the partition wall 113 is configured by the partition wall 115 having a cross-shaped plane shape and the partition wall 114 in which the end portions of the cross-shaped plane shape partition wall 115 are joined. Then, an electrode film 158 is formed on the connection portion 133 provided at the joint of the partition wall 114, and the electrode film 156 formed on the cell portion 131 is electrically connected. However, the width of the gap surrounded by the partition wall 113 of the connection portion 133 is such that the charged particles 15 smaller than the average particle diameter of the charged particles 15 can not pass through.
  • the partition walls 114 are arranged in a row in the lateral direction (vertical direction in FIG. 20) of the electrophoretic display medium.
  • the longitudinal direction of the electrophoretic display medium indicated by the arrow 281 (FIG. 20) is obtained. It is possible to partially increase the distance in the plane between the connection portions 132 provided in the plane and in which the charged particles can pass through, which are arranged in the middle lateral direction. Therefore, the movement of the charged particles in this direction between cells can be more effectively restricted.
  • the number and location of the portions for reducing the number of connections 132 through which charged particles 15 can pass may be determined regularly, such as in an alternate arrangement as in the first modification, or between charged cells. It may be determined irregularly according to the direction or position where you want to restrict movement.
  • the direction corresponding to the predetermined direction of the present disclosure the direction for reducing the number of the connection portions 132 through which the charged particles 15 can pass is arbitrarily determined according to the form and use of the electrophoretic display medium, and the use mode of the user. It can be determined. Furthermore, in order to reduce the number of connections 132 through which the charged particles 15 can pass, as in the first modification, the length in which the charged particles 15 can not pass through the planar width of the gap of the connection enclosed by the partition wall. You may completely close the gap.
  • the structure of the partition 113 of the modification 1 can be obtained by performing the partition forming step using a mold provided with a recess corresponding to the partition 113.
  • the predetermined direction of the present disclosure is the direction corresponding to the longitudinal direction of the electrophoretic display medium and the direction corresponding to the lateral direction.
  • the mold used for manufacturing the electrophoretic display medium of the modification 1 is in a direction corresponding to the longitudinal direction of the manufactured electrophoretic display medium in comparison with the mold 40 used in the above-mentioned embodiment.
  • the number of connected parts is reduced.
  • the number of connections may be reduced, and the distance between the recesses is smaller than the average particle diameter of the charged particles. It may be
  • the direction indicated by the arrow 381 is the longitudinal direction of the electrophoretic display medium according to the modification
  • the direction shown by the arrow 382 is the lateral direction of the electrophoresis display medium according to the modification.
  • the space sandwiched between the first substrate and the second substrate is partitioned into cells having a hexagonal planar shape by the partition wall 213 having a rectangular planar shape.
  • An electrode film 256 having a hexagonal planar shape provided inside each cell portion 231 is electrically connected by an electrode film 257 provided in the connection portion 232.
  • the continuous common electrode 226 is formed on the surface of the partition wall non-standing portion 221 of the first substrate including the cell portion 231 and the connection portion 232.
  • the shape of the cells partitioned by the partition wall 213 is limited to the case of a square. It is not decided.
  • the structure of the partition 213 of the second modification can be obtained by performing the partition forming process using a mold having a recess corresponding to the partition 213.
  • the direction indicated by the arrow 481 is the longitudinal direction of the electrophoretic display medium according to the modification
  • the direction indicated by the arrow 482 is the lateral direction of the electrophoresis display medium according to the modification.
  • the space sandwiched between the first substrate and the second substrate by the partition 313 having a Y-shaped planar shape has a hexagonal planar shape similar to that of the second modification.
  • the connecting portion 232 is provided at the vertex of the polygon, and as in the third modification, it is provided at any position of the side of the polygon.
  • connection portion 332 may be provided.
  • An electrode film 356 having a hexagonal planar shape provided in each cell portion 331 is electrically connected by an electrode film 357 provided in the connection portion 332.
  • a common electrode 326 which is continuous as a whole is formed on the surface of the partition wall non-standing portion 321 of the first substrate including the cell portion 331 and the connection portion 332.
  • the connection portions 332 provided in the longitudinal direction (lateral direction in FIG. 22) of the electrophoretic display medium indicated by the arrow 481 are arranged in a row without sandwiching the partition walls 313.
  • the connection portions may be arranged in a row without sandwiching the partition walls 313.
  • connection portion may be provided only on one side of the force where the connection portion 332 is provided on each side of the hexagon. Therefore, for example, the first modification may be applied to the third modification to reduce the number of connections in a predetermined direction, and to limit the movement of the charged particles in that direction. Further, as in the case of the first and second modifications, the structure of the partition 313 of the third modification is obtained by performing the partition forming process using a mold having a recess corresponding to the partition 313.
  • Example 2 for producing 1 will be described with reference to FIG.
  • the steps other than the electrode film forming step are the same as in the first embodiment, and thus the description thereof is omitted.
  • each configuration shown in FIG. 23 shows only two partitions with dimensions different from each configuration of the cross sectional view shown in FIG. ing.
  • the exposure process and the development process are performed in the electrode film formation process.
  • the sandblasting step is performed to remove the resist film except the peripheral portions of the partition walls 13 and the spacers 14 by sandblasting.
  • the resist film formation process described above in Example 1 in the sand blast process, as shown in FIG. 23, the upper part of the portion where the resist film 50 is not removed, ie, the upper part of the outer peripheral part of the partition wall 13 and the spacer 14 Place mask 151 and perform sand blasting using abrasive grains.
  • the resist film in the portion not provided with the mask 151 at the upper part is scraped off by the abrasive grains discharged in the direction perpendicular to the resist film 50 indicated by the arrow 161, and the partition wall 13 provided with the mask 151 at the upper part
  • the resist film remains only on the outer peripheral portion of the spacer 14.
  • the amount of removal of the resist film can be easily controlled by adjusting the type of abrasive (particle diameter, composition, density, hardness, strength), the pressure and angle of air for discharging the abrasive, and the amount of discharge.
  • the spacer is formed separately from the first substrate and the partition wall, and the spacer is not set up on the first substrate before the conductive film deposition process, only the outer peripheral portion of the partition wall is formed. May be covered with a resist film.
  • Example 2 after the sandblasting step, the same conductive film forming step as in Example 1 is performed, and in the subsequent lift-off step, the resist film on the outer peripheral portion of partition 13 remaining after the sandblasting step. And removing the electrode film formed on the resist film.
  • the resist film formed on the outer peripheral portion of the partition wall 13 does not go through the exposure process, so even when a negative resist is used as a material of the resist film, normal development is performed. The solution can be removed.
  • the processing conditions of the lift-off process are the same as in the first embodiment.
  • Example 3 of manufacturing the electrophoretic display medium 1 Will be described with reference to FIG.
  • the steps other than the electrode film formation step are the same as those in the first embodiment, and thus the description thereof is omitted.
  • Example 1 in order to schematically explain the sand blasting process, each configuration shown in FIG. 24 is shown in FIG. Only two partitions are illustrated with dimensions different from each configuration of the sectional view.
  • Example 1 the resist film formation process, the exposure process, and the development process are performed in the electrode film formation process, and a resist film for a mask is formed.
  • a resist application step is performed in which a resist is directly applied only to the outer peripheral portion of the partition wall 13 by the inkjet method to form a resist film.
  • a resist is directly applied by an ink jet method to the portions where a mask is required in the conductive film formation process, that is, the outer peripheral portions of the partition walls 13 and the spacers 14
  • a resist film 252 is formed.
  • the resist for forming the resist film 252 may be a positive resist or a negative resist.
  • the resist can be applied only to the outer peripheral portion of the partition 13 and the spacer 14, and in addition, the resist film 252 can be formed on the outer peripheral portion of the partition 13 in one step.
  • the manufacturing process can be simplified.
  • the thickness of the resist film 252 can be easily adjusted.
  • the spacer is formed separately from the first substrate and the partition walls, and the spacer is set up on the first substrate before the conductive film forming step. In the case, if only the outer periphery of the partition is covered with a resist film
  • Example 3 the same conductive film formation process as in Example 1 is performed after the resist application step. Then, in the subsequent lift-off process, the resist film 252 on the outer peripheral portion of the partition 13 and the spacer 14 formed in the resist application process and the electrode film formed on the resist film 252 are removed. As in the case of the second embodiment, the resist film 252 formed on the outer peripheral portion of the partition wall 13 does not go through the exposure process unlike the case of the first embodiment. Therefore, even when a negative resist is used as the material of the resist film 252, it can be removed using a common developer.
  • the processing conditions of the lift-off process are the same as in the first embodiment.
  • the electrode film forming step an embodiment 4 in which the electrode film is directly formed on the partition wall non-standing portion 21 of the first substrate 11 by the inkjet method to manufacture the electrophoretic display medium 1 will be described.
  • the steps other than the electrode film forming step are the same as in the first embodiment, and thus the description thereof is omitted.
  • the electrode film in the electrode film forming step, as in the first to third embodiments described above, the electrode film is directly formed by the ink jet method without forming the resist film covering the outer peripheral portion of the partition wall 13. It is formed in the partition non-standing portion 21 of the plate 11. According to this method, in order to prevent the electrode film from being formed on the portion other than the partition non-standing portion 21 of the first substrate such as the outer peripheral portion of the partition 13, a resist film for a mask is not formed. An electrode film can be formed only on the partition wall non-standing portion 21 of one substrate 11. Therefore, according to this method, it is possible to reliably form a continuous electrode film by a simple processing step.
  • the electrophoretic display medium manufactured by the method of the present disclosure can And the partition is hard to peel off from the first substrate. For this reason, it is possible to prevent a decrease in display performance due to the separation of the partition wall from the first substrate. Further, since the electrode provided on the first substrate side is provided on the facing surface of the first substrate, the distance between this electrode and the electrode provided on the second substrate side can be shortened. For this reason, the electrophoretic display medium manufactured according to the manufacturing method of the present disclosure is compared to the case where the electrode provided on the first substrate side is provided on the surface opposite to the opposing surface of the first substrate. It is possible to keep the voltage applied to these electrodes low.
  • the electrode film adheres to the surface of the partition facing the second substrate. And the display may be adversely affected.
  • the electrode film is formed except for the portion where the partition wall is formed, there arises a problem that the electrode film remains on the side surface of the partition wall when the position of the mold is shifted or the like.
  • the electrode film is formed on the opposing surface of the first substrate after the formation of the partition walls, such a problem does not occur.
  • the synthetic resin contains a stimulus curable resin that cures by an external stimulus
  • controlling the external stimulus facilitates the synthetic resin. It is possible to harden it into S.
  • the stimulus-curable resin provided on the facing surface of the first substrate contains a thermoplastic resin.
  • the thermoplastic resin is pressed while being cooled, and the first substrate before processing is formed in accordance with the concavo-convex shape of the forming surface of the forming die.
  • the curing conditions of the synthetic resin it is sufficient to control the cooling conditions, so the conditions for curing the synthetic resin can be controlled immediately , It is easy to form a partition on the first substrate.
  • the stimulus curable resin provided on the facing surface of the first substrate contains a thermosetting resin.
  • the thermosetting resin is heated while being pressed, and the first substrate before processing is formed in conformity with the concavo-convex shape of the forming surface of the forming die.
  • heating conditions may be controlled. For this reason, it is easy to form the partition on the first substrate by controlling the conditions for curing the synthetic resin as soon as possible.
  • the stimulus curable resin provided on the facing surface of the first substrate is made of an ultraviolet curable resin. Then, while pressing the UV curable resin, the UV curable resin is pressed and irradiated with ultraviolet rays to mold the first substrate before processing according to the uneven shape of the molding surface of the molding die.
  • the curing conditions of the synthetic resin it is sufficient to control the ultraviolet irradiation conditions, so the conditions for curing the synthetic resin are controlled. Therefore, it is easy to form the partition walls on the first substrate.
  • the electrode film is formed and then formed on the resist film and the resist film.
  • the electrode film is removed. Therefore, the electrode film can be formed at a desired position of the first substrate while reliably preventing the electrode film from being formed on the surface or the side facing the second substrate of the partition wall.
  • the electrode film is formed and then formed on the resist film and the resist film.
  • the electrode film is removed. Therefore, the electrode film can be formed at a desired position on the first substrate while reliably preventing the electrode film from being formed on the surface or the side facing the second substrate of the partition wall.
  • the resist film formed on the partition non-standing portion forming the electrode film is removed by sand blasting to form a resist film covering the outer peripheral portion of the partition walls.
  • the amount and range of removal of the resist film can be easily controlled. it can. For this reason, it is possible to easily obtain a resist film covering the outer peripheral portion of the partition wall. Furthermore, according to the method of manufacturing an electrophoretic display medium of the present disclosure, after the outer peripheral portion of the partition wall where the electrode is not formed is covered with the resist film, the electrode film is formed and then formed on the resist film and the resist film. The electrode film is removed.
  • the electrode film can be formed at a desired position on the first substrate while reliably preventing the electrode film from being formed on the surface or the side facing the second substrate of the partition wall. Further, since the step of covering the outer peripheral portion of the partition with the resist film is performed by the ink jet method, only the outer peripheral portion of the partition can be reliably covered with the resist film.
  • the electrode film is formed by the ink jet method! /, So that the electrode is formed at the desired position on the partition non-standing portion of the first substrate. It is a force to form a film.
  • the electrode film is made of a transparent electrode
  • the first substrate is formed of a transparent or semitransparent material. Therefore, the electrophoretic display medium manufactured by this method can have the first substrate side as the display surface.
  • the section is continuous. Therefore, the partition non-standing portion of the first substrate corresponding to the convex surface of the mold is also continuous. For this reason, it is possible to form a continuous electrode film on the partition non-standing portion of the first substrate which is not subjected to the process of electrically connecting the individual electrode films.
  • the arrangement of the connection portion of the mold corresponding to the portion connecting the electrode films of each cell is ensured in order to ensure the continuity of the electrode films.
  • the charged particles are arranged so as not to move linearly in a predetermined direction. That is, the connecting portions in which the distance between concave portions satisfies the condition of the average particle diameter or more of the charged particles are arranged via the connecting portion satisfying the conditions in which the distance between concave portions and concave portions of the mold is smaller than the average particle diameter of the charged particles. It is done.
  • the distance between the recesses is the minimum distance on the plane between the adjacent recesses between the plurality of recesses surrounding the connecting portion.
  • connection portion is provided to secure the conductivity of the electrode film of each cell
  • the first substrate and the partition wall integrally molded using such a molding die have cells in a predetermined direction. It is difficult for the charged particles to move through the connection portion corresponding to the connection portion. As a result, the charged particles move between the cells to cause display unevenness. The fear can be reduced.
  • the electrophoretic display medium when used by being tilted by the user, it is often one of the longitudinal direction and the lateral direction of the electrophoretic display medium.
  • the method of manufacturing an electrophoretic display medium of the present disclosure in order to restrict movement of charged particles between cells, at least one of the longitudinal direction and the lateral direction of the electrophoretic display medium can be accommodated.
  • the distance between the connecting portions through which the charged particles can pass is increased in the direction of Therefore, in the present disclosure, since the coupling portion is arranged to limit the movement of the charged particles in the cells in these directions, the movement of the charged particles can be effectively restricted.
  • the partition wall is integrally formed with the first substrate by the method of producing an electrophoretic display medium of the present disclosure. Therefore, it is possible to obtain an electrophoretic display medium in which the deterioration of the display performance due to the separation of the partition wall from the first substrate is prevented. Further, since the electrode provided on the first substrate side is provided on the facing surface of the first substrate, the distance between this electrode and the electrode provided on the second substrate side can be shortened. For this reason, it is possible to suppress the voltage applied to these electrodes to a low level as compared with the case where the electrodes provided on the first substrate side are provided on the surface opposite to the opposing surface of the first substrate.
  • the electrophoretic display medium manufactured by the method of manufacturing the electrophoretic display medium of the present disclosure is provided. Therefore, it is possible to avoid a decrease in display performance due to the separation of the partition walls from the first substrate from the first substrate.
  • the electrode provided on the first substrate side is provided on the facing surface of the first substrate, the distance between this electrode and the electrode provided on the second substrate side can be shortened. For this reason, it is possible to suppress the voltage applied to these electrodes to a low level as compared with the case where the electrodes provided on the first substrate side are provided on the surface opposite to the facing surface of the first substrate.

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PCT/JP2007/064476 2006-08-22 2007-07-24 support d'affichage électrophorétique, son processus de fabrication, et appareil d'affichage électrophorétique Ceased WO2008023524A1 (fr)

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Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009237434A (ja) * 2008-03-28 2009-10-15 Brother Ind Ltd 帯電粒子移動型表示パネルの製造方法、帯電粒子移動型表示パネル及び帯電粒子移動型表示装置
JP2009294275A (ja) * 2008-06-03 2009-12-17 Brother Ind Ltd 帯電粒子移動型表示パネル、帯電粒子移動型表示パネルの製造方法及び帯電粒子移動型表示装置
JP2010044385A (ja) * 2008-08-11 2010-02-25 Samsung Electro-Mechanics Co Ltd 電子ペーパー表示素子及びその製造方法
US8159741B2 (en) * 2008-08-22 2012-04-17 Samsung Electro-Mechanics Co., Ltd. Electronic paper display device and manufacturing method thereof
KR101043329B1 (ko) * 2008-08-22 2011-06-22 삼성전기주식회사 전자종이 표시소자 및 그 제조방법
JP2010054816A (ja) * 2008-08-28 2010-03-11 Fuji Xerox Co Ltd 表示媒体、表示素子、表示装置、及び表示媒体の製造方法
WO2010095301A1 (ja) * 2009-02-20 2010-08-26 シャープ株式会社 表示素子、及びこれを用いた電気機器
KR101141424B1 (ko) * 2009-09-14 2012-05-04 삼성전기주식회사 전자 종이 표시장치 및 그 제조방법
JP5573182B2 (ja) * 2010-01-18 2014-08-20 富士ゼロックス株式会社 表示媒体及び表示装置
KR20110133811A (ko) * 2010-06-07 2011-12-14 삼성전기주식회사 전자종이 표시장치 및 그 제조 방법
JP5757822B2 (ja) * 2011-08-12 2015-08-05 三菱鉛筆株式会社 電気泳動表示シート及びこれを用いた電気泳動表示媒体
JP5757821B2 (ja) * 2011-08-12 2015-08-05 三菱鉛筆株式会社 電気泳動表示シート及びこれを用いた電気泳動表示媒体
JP5757823B2 (ja) * 2011-08-12 2015-08-05 三菱鉛筆株式会社 電気泳動表示シート及びこれを用いた電気泳動表示媒体
US9110347B2 (en) * 2012-10-12 2015-08-18 Electronics And Telecommunications Research Institute Method of fabricating display apparatus and display apparatus fabricated thereby
CN103838051B (zh) * 2012-11-27 2017-02-08 京东方科技集团股份有限公司 电致变色显示盒及电致变色显示装置
US20140166991A1 (en) * 2012-12-17 2014-06-19 Dmitri E. Nikonov Transparent light-emitting display
US9403318B2 (en) * 2013-02-07 2016-08-02 GM Global Technology Operations LLC Heat stake joining of adhesively bonded thermoplastic components
WO2016017191A1 (ja) * 2014-07-31 2016-02-04 Jsr株式会社 表示素子、感光性組成物およびエレクトロウェッティングディスプレイ
KR101959488B1 (ko) * 2015-09-08 2019-03-18 주식회사 엘지화학 광학 소자의 제조 방법
JP2018092088A (ja) * 2016-12-07 2018-06-14 セイコーエプソン株式会社 電気泳動装置、電子機器、および電気泳動装置の製造方法
KR101797062B1 (ko) 2017-04-12 2017-11-14 서경수 양자점 광학 필름 및 이의 이용한 장치.
CN108267906A (zh) * 2018-03-01 2018-07-10 无锡威峰科技股份有限公司 一种图案化结构的显示电浆模组及其制造方法
JP7010448B2 (ja) 2018-01-19 2022-02-10 ウーシー ビジョン ピーク テクノロジ カンパニー リミテッド 電気泳動ディスプレイモジュール及びその製造方法
WO2020008264A2 (en) * 2018-07-05 2020-01-09 Displaydata Limited Reflective displays with added colours and methods for making the same
US11456397B2 (en) * 2019-03-12 2022-09-27 E Ink Corporation Energy harvesting electro-optic displays

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001343672A (ja) * 2000-05-30 2001-12-14 Seiko Epson Corp 電気泳動表示装置およびその製造方法
JP2004317526A (ja) * 2003-02-27 2004-11-11 Bridgestone Corp 画像表示用パネル及び画像表示装置
JP2005352316A (ja) * 2004-06-11 2005-12-22 Canon Inc 電気泳動表示装置及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7233429B2 (en) * 2000-03-03 2007-06-19 Sipix Imaging, Inc. Electrophoretic display
JP2007147829A (ja) * 2005-11-25 2007-06-14 Brother Ind Ltd 電気泳動表示媒体における隔壁及び基板の製造方法、及び、電気泳動表示媒体
JP2008242044A (ja) * 2007-03-27 2008-10-09 Toshiba Corp 可変形状ミラー装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001343672A (ja) * 2000-05-30 2001-12-14 Seiko Epson Corp 電気泳動表示装置およびその製造方法
JP2004317526A (ja) * 2003-02-27 2004-11-11 Bridgestone Corp 画像表示用パネル及び画像表示装置
JP2005352316A (ja) * 2004-06-11 2005-12-22 Canon Inc 電気泳動表示装置及びその製造方法

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