WO2008015834A1 - Matériau diélectrique pour écran à plasma - Google Patents
Matériau diélectrique pour écran à plasma Download PDFInfo
- Publication number
- WO2008015834A1 WO2008015834A1 PCT/JP2007/060141 JP2007060141W WO2008015834A1 WO 2008015834 A1 WO2008015834 A1 WO 2008015834A1 JP 2007060141 W JP2007060141 W JP 2007060141W WO 2008015834 A1 WO2008015834 A1 WO 2008015834A1
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- WO
- WIPO (PCT)
- Prior art keywords
- glass
- dielectric material
- plasma display
- display panel
- dielectric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
- H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
- C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/38—Dielectric or insulating layers
Definitions
- the present invention relates to a dielectric material for a plasma display panel, a method for forming a dielectric layer, and a glass plate for a plasma display panel formed by the method.
- Plasma displays are self-luminous flat panel displays that are lightweight and thin.
- a plasma display panel has a structure in which a front glass substrate and a back glass substrate are opposed to each other at a constant interval, and the periphery thereof is hermetically sealed with sealing glass.
- the inside of the panel is filled with rare gases such as Ne and Xe.
- a plasma discharge scan electrode is formed on the front glass substrate used for the above applications.
- a dielectric layer (transparent dielectric layer) for the front glass substrate for protecting the scanning electrode is formed thereon.
- an address electrode for determining the position of the plasma discharge is formed on the rear glass substrate, and a dielectric layer for the rear glass substrate (address protective dielectric) for protecting the address electrode is formed thereon. Body layer) is formed.
- barrier ribs are formed on the address protection dielectric layer to partition discharge cells, and phosphors of red (R), green (G), and blue (B) are coated in the cells. In this system, the phosphor is stimulated to emit light by generating plasma discharge and generating ultraviolet rays.
- soda lime glass and high strain point glass are used for the front glass substrate and the back glass substrate of the plasma display panel, and the scan electrode and the address electrode can be formed by an inexpensive screen printing method. Is widely used.
- a method of firing in a temperature range of about 500 to 600 ° C. is employed in order to prevent deformation of the glass substrate and suppress reaction with the electrodes. It has been. So Therefore, the dielectric material is required to conform to the thermal expansion coefficient of the glass substrate, be baked at 500 to 600 ° C., and have a high withstand voltage.
- the transparent dielectric layer is also required to have high transparency, so that the dielectric material for forming the transparent dielectric layer is free of bubbles during firing. I am also asked for it.
- PbO-BO-SiO-based lead glass powder is used to satisfy the above required characteristics.
- Dielectric materials (see Patent Document 1) have been used, but in recent years, it is hoped that lead-free glass powder will also be used for dielectric materials due to increased environmental protection and reduced use of environmentally hazardous substances. It is rare. Therefore, it is possible to lower the melting point relatively easily.
- Patent Document 2 A dielectric material using non-lead glass powder has been proposed (see Patent Document 2).
- Patent Document 1 Japanese Patent Laid-Open No. 11 11979
- Patent Document 2 Japanese Patent Laid-Open No. 9-278482
- the object of the present invention is to provide an excellent transparency in which the dielectric layer is not easily yellowed even when a lead-free glass powder is used, and has a thermal expansion coefficient suitable for the glass substrate.
- a dielectric material for a plasma display panel that can be fired at a temperature of C or lower, a method for forming a dielectric layer, and a glass plate for a plasma display panel formed by the method.
- the present inventors have found and proposed that yellowing due to Ag can be suppressed by including the above components as essential components.
- the dielectric material for a plasma display panel of the present invention is a ZnO—B 2 O-based glass.
- a dielectric material for a plasma display panel comprising a glass powder, wherein the glass powder is
- the method for forming a dielectric layer for a plasma display panel according to the present invention is characterized in that the above-described dielectric material is formed on a glass substrate on which an electrode is formed and fired.
- a glass plate for a plasma display panel of the present invention is characterized by comprising a dielectric layer formed of the above dielectric material.
- the dielectric material for a plasma display panel of the present invention hardly causes yellowing due to Ag, has excellent transparency, can be baked at a temperature of 600 ° C. or less, and has a thermal expansion coefficient suitable for a glass substrate. Can be obtained.
- the glass plate for a plasma display panel uses a dielectric material that is hardly colored by Ag and also has a non-lead glass powder force, a plasma display panel having high transparency can be manufactured. Therefore, it is suitable as a dielectric material for a plasma display panel, a method for forming a dielectric layer, and a glass plate for a plasma display panel formed by the method.
- the dielectric material for a plasma display panel of the present invention can lower the melting point of glass relatively easily without containing PbO, and the thermal expansion of the dielectric material is suitable for a glass substrate.
- the basic composition is ZnO-BO-based non-lead glass, which easily obtains the coefficient. This type of glass
- this type of glass includes TiO, CuO, MoO, CeO, MnO and CoO forces Both one or more selected components (hereinafter referred to as M)
- a body layer can be obtained.
- the yellowing can be suppressed by preventing the valence change from Ag to Ag Q.
- Ti 4+ becomes Ti 3+
- the dielectric layer turns brown (titer amber).
- Ti 3+ and component M which are produced by improving yellowing, combine to form Ti 2 O-M bond to prevent browning, making it difficult to cause yellowing and discoloration due to Ti ions. I think it is possible.
- TiO is added to the glass constituting the dielectric material in an amount of 0.3 to 10%.
- the dielectric layer is likely to turn brown even if it contains component M.
- the soft spot of the glass rises and it becomes difficult to fire at a temperature of 600 ° C. or lower, or the glass crystallizes, making it difficult to obtain a transparent fired film.
- the preferred range of TiO is 0
- Component M one or more components selected from CuO, MoO, CeO, MnO and CoO
- the dielectric layer is likely to be colored by the component M.
- a preferred range for component M is 0.1-4%.
- CuO has a great effect of suppressing discoloration caused by Ti ions, and in this case, it is more preferable to use CuO as an essential component.
- the content of CuO is 0.01 to 3. 0% (preferably 0.05-2.5%), and MoO, CeO, MnO and CoO
- the content is 0 to 5% (preferably 0.01 to 5%).
- the glass when using ZnO—B 2 O-based glass, the glass is crystallized.
- a preferable range of the total amount of ZnO and B 2 O is 49 to 75%.
- the ZnO—B 2 O-based glass powder used in the present invention has transparency that hardly causes yellowing.
- ZnO is a main component constituting the glass and a component for lowering the soft spot, and its content is 20 to 50%.
- the content of ZnO decreases, the soft spot of the glass increases and it becomes difficult to fire at a temperature of 600 ° C or lower.
- the content increases, the glass tends to be easily crystallized, and it becomes difficult to obtain a transparent fired film.
- a more preferable range of ZnO is 28 to 50%.
- B 2 O is a component that forms a glass skeleton and widens the vitrification range.
- the abundance is 10-40%. As the B 2 O content decreases, the glass tends to crystallize more easily.
- a more preferred range is 15 to 35%.
- the preferred range of the total amount of ZnO and B 2 O is 4
- SiO is a component that forms a glass skeleton, and its content is 1 to 20%.
- the range is 3-18%.
- BiO is a component that adjusts the thermal expansion coefficient. It also reduces the softening point of the glass.
- Li 0, Na O which is a component that easily causes yellowing of the dielectric layer due to Ag.
- a more preferred range is 1 to 30%.
- Li O is a component that significantly lowers the soft point of glass or adjusts the thermal expansion coefficient
- the preferred range of Li 2 O is 0-5%.
- Na O is a component that lowers the soft spot of glass and adjusts the thermal expansion coefficient.
- the content is 0-10%.
- the content of Na 2 O increases, it contains TiO and component M
- the effect of suppressing yellowing of the dielectric layer due to Ag tends to be reduced.
- the coefficient of thermal expansion tends to be larger than that of the glass substrate, making it difficult to match the coefficient of thermal expansion of the glass substrate.
- the preferred range for Na 2 O is 0-7%.
- K 2 O is a component that lowers the soft point of glass and adjusts the thermal expansion coefficient.
- the abundance is 0-15%. If the content of K 2 O increases, even if it contains TiO and component M,
- a preferred range for K 2 O is 0-13%.
- the thermal expansion coefficient tends to be larger than that of the glass substrate, and it becomes difficult to match the thermal expansion coefficient of the glass substrate.
- a more preferable range of the total amount of these components is 0.1 to 13%.
- MgO, CaO, SrO, and BaO are components added to adjust the thermal expansion coefficient of V and deviation, and their contents are 0 to 20%, respectively.
- the thermal expansion coefficient tends to be larger than that of the glass substrate, and it becomes difficult to match the thermal expansion coefficient of the glass substrate.
- a more preferable range of these components is 0 to 17%.
- the total amount of MgO, CaO, SrO and BaO is preferably 0 to 25%.
- the thermal expansion coefficient tends to be larger than that of the glass substrate, and it becomes difficult to match the thermal expansion coefficient of the glass substrate.
- a more preferable range of the total amount of these components is 0 to 20%.
- TiO is a component that suppresses yellowing, and its content is 0.3 to 10%.
- Component M one or more components selected from CuO, MoO, CeO, MnO and CoO
- the total amount is 0.01 to 6%. If the content of component M is reduced, the above effect is difficult to obtain. On the other hand, if it exceeds 6%, the dielectric layer tends to be colored by the component M.
- a preferable range of the component M is 0.1 to 4%.
- CuO has a great effect of suppressing discoloration caused by Ti ions. It is more preferable to use CuO as an essential component. In this case, the CuO content is 0.01 to 0.3% (preferably 0. 05-2. 5%), MoO, CeO
- the total amount of MnO and CoO is preferably 0 to 5% (preferably 0.01 to 5%).
- various components can be added as long as the required properties are not impaired. For example, in order to lower the soft softness point of glass, Cs 0, Rb O, etc. are combined.
- the content is preferably 5% or less.
- PbO is a component that lowers the melting point of glass, but it is also an environmentally hazardous substance, so it should be avoided to be introduced into glass substantially.
- substantially avoid introduction into glass refers to a level where it is not actively used as a raw material but mixed as an impurity. Specifically, the content is 0.1. It means less than%.
- an average particle size D of 3.0 ⁇ m or less and a maximum particle size D force of 3 ⁇ 40 ⁇ m or less may be used.
- the dielectric material for a plasma display panel of the present invention may contain a ceramic powder in addition to the glass powder in order to adjust the thermal expansion coefficient, the strength after firing, and the appearance.
- a ceramic powder for example, alumina, zirconium, zircon, titer, cordierite, mullite, silica, willemite, tin oxide, zinc oxide, etc. can be used alone or in combination.
- a part or all of the ceramic powder may be spherical.
- spherical refers to a state in which there are no angular portions on the particle surface and the particle central force has a radius of ⁇ 20% or less in the entire surface in the state observation with a photograph. It is desirable to use ceramic powder with an average particle size of 5. O / zm or less and a maximum particle size of 20 / zm or less.
- the dielectric material for a plasma display panel of the present invention is a back dielectric or a front dielectric. It can be used in any application of surface dielectric, and is formed on the lower dielectric layer in contact with the dielectric electrode having two or more dielectric structures and on the lower dielectric layer Therefore, it can also be used as a material for the upper dielectric layer that does not directly contact the electrode. Of course, it can also be used in a dielectric material formed on an electrode other than Ag, and in other applications such as a partition wall forming material. When used as a transparent dielectric material for a front glass substrate, it can be used by setting the content of the ceramic powder to 0 to 20% by mass (preferably 0 to 10% by mass). By setting the content of the ceramic powder in this way, it is possible to obtain a fired film having high transparency while suppressing the scattering of visible light due to the additive of the ceramic powder. Also back glass
- the ceramic powder When used as a back dielectric material or a barrier rib material for a substrate, the ceramic powder should be contained in the range of 0 to 50% by mass (more preferably 5 to 40% by mass, still more preferably 10 to 40% by mass). Can be used in By setting the content of the ceramic powder in this way, a fired film having high strength or excellent acid resistance can be obtained.
- the material of the present invention can be used in the form of, for example, a paste or a green sheet.
- thermoplastic resin When used in the form of a paste, a thermoplastic resin, a plasticizer, a solvent, or the like is used together with the dielectric material described above.
- the proportion of the dielectric material in the entire paste is about 30 to 90% by mass.
- Thermoplastic resin is a component that increases film strength after drying and imparts flexibility, and its content is generally about 0.1 to 20% by mass.
- the thermoplastic resin there can be used poly (methacrylate), poly (butyral), poly (methyl methacrylate), poly (ethyl methacrylate), ethyl cellulose and the like, and these are used alone or in combination.
- the plasticizer is a component that controls the drying speed and imparts flexibility to the dried film, and the content thereof is generally about 0 to about LO mass%.
- the plasticizer butyl benzyl phthalate, dioctyl phthalate, diisooctyl phthalate, dicapryl phthalate, dibutyl phthalate and the like can be used, and these are used alone or in combination.
- the solvent is a material for pasting the material, and its content is generally about 10 to 30% by mass.
- the solvent for example, tervineol, diethylene glycol monobutyl ether acetate, 2,2,4 trimethyl-1,3 pentadiol monoisobutyrate or the like can be used alone or in combination.
- the paste can be produced by preparing the above dielectric material, thermoplastic resin, plasticizer, solvent and the like and kneading them at a predetermined ratio.
- a transparent dielectric layer or an address protection dielectric layer using such a paste first, on the front glass substrate on which the scan electrodes are formed or on the rear glass substrate on which the address electrodes are formed. Further, these pastes are applied using a screen printing method, a batch coating method, or the like to form a coating layer having a predetermined film thickness, and then dried. Then, a predetermined dielectric layer can be obtained by holding and baking at a temperature of 500 to 600 ° C. for 5 to 20 minutes. If the firing temperature is too low or the holding time is shortened, sufficient sintering cannot be performed, and it becomes difficult to form a dense film. On the other hand, if the firing temperature is too high or the holding time is long, the glass substrate is likely to be deformed, or yellowing of the dielectric layer due to Ag tends to occur.
- a paste for forming a lower dielectric layer is formed on a glass plate on which electrodes have been previously formed by a screen printing method, a batch coating method, or the like. It is applied to a film thickness of about 20 to 80 m, dried, and then fired in the same manner as described above. Subsequently, an upper dielectric layer forming paste is applied to the film thickness of about 60 to 160 / ⁇ ⁇ by screen printing or a batch coating method, and dried. Then, it can be obtained by firing in the same manner as described above.
- thermoplastic resin a plasticizer, or the like is used together with the dielectric material described above.
- the ratio of the dielectric material in the green sheet is generally about 60 to 80% by mass.
- thermoplastic rosin and plasticizer the same thermoplastic rosin and plasticizer as used in the preparation of the paste can be used. About 5 to 30% by mass is common, and the mixing ratio of the plasticizer is generally about 0 to about LO mass%.
- thermoplastic sheet Prepare a fat, a plasticizer, etc., and add a main solvent such as toluene or an auxiliary solvent such as isopropyl alcohol to make a slurry.
- a main solvent such as toluene or an auxiliary solvent such as isopropyl alcohol
- This slurry is formed on a film of polyethylene terephthalate (PET) or the like by the doctor blade method.
- PET polyethylene terephthalate
- the solvent and the solvent are removed by drying to obtain a green sheet.
- a dielectric layer can be obtained by arranging a green sheet and thermocompression-bonding to form a coating layer, followed by firing in the same manner as in the case of the paste described above.
- a lower dielectric film is formed by thermocompression bonding a green sheet for forming a lower dielectric layer on a glass plate on which electrodes have been previously formed. After the formation, it is fired in the same manner as in the case of the paste described above. Subsequently, the upper dielectric layer forming green sheet is thermocompression-bonded thereon to form an upper dielectric layer, and then fired in the same manner as described above.
- a dielectric layer having two or more dielectric structures when the upper dielectric layer is formed, the temperature at which the lower dielectric layer is fired, whether paste or green sheet is used ⁇ 20 If the upper dielectric material is baked in the temperature range of ° C, yellowing of the dielectric layer due to Ag can be suppressed, and foaming at the interface between the lower and upper layers can be achieved while maintaining the shape of the lower dielectric layer. Can be suppressed. Further, when the firing temperatures of the upper dielectric material and the lower dielectric material are the same, in addition to the above formation method, after drying the lower dielectric film, forming the upper dielectric film, drying, Adopting a method of firing both layers simultaneously at a temperature.
- the lower dielectric layer may be formed using a paste, and the upper dielectric layer may be formed using a green or yellow formation method using a green sheet.
- the dielectric material of the present invention is applied or disposed on a glass substrate on which an electrode is formed, and baked to form a dielectric layer.
- the glass plate for a plasma display panel of the present invention can be obtained with excellent transparency.
- the method of forming a dielectric material is described by taking the method of using a paste or a green sheet as an example.
- the dielectric material for a plasma display panel of the present invention is described.
- the material is not limited to these methods, but can be applied to other forming methods such as a photosensitive paste method and a photosensitive green sheet method.
- Tables 1 to 5 show examples of the present invention (Sample Nos. 1 to 19) and comparative examples (Sample Nos. 20 to 26), respectively.
- Sample No. 20 is a ZnO-B 2 O system that has been proposed in the past.
- a sample having a glass powder strength of 50 or less and a maximum particle size D of 20 ⁇ m or less was obtained.
- the obtained glass powder was evaluated for glass stability, thermal expansion coefficient, softening point, dielectric constant, and yellowing due to Ag.
- Sample Nos. 20 and 21 which are comparative examples, yellowing occurred around the Ag electrode when the dielectric layer was formed on the Ag electrode.
- Samples Nos. 22 and 23 turned brown.
- the dielectric itself turned dark blue.
- the raw material was vitrified in the melting process, but crystals were precipitated.
- the raw material did not vitrify during the melting process.
- the raw material was melted, and a glass sample formed into a thin plate shape was observed with an optical microscope.
- the raw material was vitrified in the melting step, and crystals were precipitated in the glass.
- “ ⁇ ” indicates that the power was not recognized at all
- “X” indicates that the raw material was vitrified in the melting process but crystals were precipitated, or that the raw material was vitrified in the melting process. It was.
- each sample was powder-pressed, fired at 580 ° C for 10 minutes, polished into a cylinder with a diameter of 4 mm and a length of 40 mm, and measured according to JIS R3102. Values in the temperature range of 0 to 300 ° C were determined.
- the soft spot of the glass was measured using a macro differential thermal analyzer, and the value of the fourth inflection point was taken as the soft spot.
- each sample was powder press-molded, fired at 580 ° C for 10 minutes, polished to a 2 mm plate, measured according to JIS C2141, 25 ° C, 1MHz The value at was obtained.
- the paste prepared as described above was screen printed on a soda lime glass substrate on which an Ag electrode was formed so that a fired film of about 30 m was obtained. After coating, drying and baking at 580 ° C for 10 minutes, visual observation of the periphery of the electrode This was done by measuring a * and b * using a color difference meter. The higher the value of a *, the more red it is. If a * is + 5.0 or less, it is judged that the color has not changed, and the higher the value of b *, the more yellow it is. If b * is +25.0 or less, it was judged that yellowing did not occur!
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- Chemical Kinetics & Catalysis (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
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- Inorganic Chemistry (AREA)
- Glass Compositions (AREA)
- Gas-Filled Discharge Tubes (AREA)
Description
Claims
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2006213125 | 2006-08-04 | ||
JP2006-213125 | 2006-08-04 | ||
JP2007121359A JP4924985B2 (ja) | 2006-08-04 | 2007-05-02 | プラズマディスプレイパネル用誘電体材料 |
JP2007-121359 | 2007-05-02 |
Publications (1)
Publication Number | Publication Date |
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WO2008015834A1 true WO2008015834A1 (fr) | 2008-02-07 |
Family
ID=38997018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2007/060141 WO2008015834A1 (fr) | 2006-08-04 | 2007-05-17 | Matériau diélectrique pour écran à plasma |
Country Status (3)
Country | Link |
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JP (1) | JP4924985B2 (ja) |
KR (1) | KR20090040405A (ja) |
WO (1) | WO2008015834A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101952930A (zh) * | 2009-03-13 | 2011-01-19 | 松下电器产业株式会社 | 等离子显示面板 |
CN102245524A (zh) * | 2008-12-09 | 2011-11-16 | 日本电气硝子株式会社 | 等离子体显示面板用电介质材料和等离子体显示面板用玻璃板 |
US8125150B2 (en) | 2008-10-20 | 2012-02-28 | Samsung Sdi Co., Ltd. | Lead free plasma display panel and method of manufacturing the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008277100A (ja) * | 2007-04-27 | 2008-11-13 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネル |
JP4958078B2 (ja) * | 2008-06-25 | 2012-06-20 | 日本電気硝子株式会社 | プラズマディスプレイパネル用材料、プラズマディスプレイパネル用背面ガラス基板の製造方法及びその方法で製造されてなるプラズマディスプレイパネル用背面ガラス基板。 |
KR100984489B1 (ko) * | 2008-10-14 | 2010-10-01 | 주식회사 다이온 | 플라즈마 디스플레이 패널용 드라이 필름의 제조를 위한 무연 투명유전체 조성물 |
Citations (6)
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JP2000226232A (ja) * | 1999-02-08 | 2000-08-15 | Okuno Chem Ind Co Ltd | 無鉛低融点ガラス組成物 |
JP2003192376A (ja) * | 2001-12-27 | 2003-07-09 | Asahi Glass Co Ltd | 低融点ガラス、ガラスセラミックス組成物およびプラズマディスプレイパネル背面基板 |
JP2003246644A (ja) * | 2001-12-21 | 2003-09-02 | Shoei Chem Ind Co | ガラスおよびこれを用いた導体ペースト |
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JP2006193385A (ja) * | 2005-01-14 | 2006-07-27 | Asahi Glass Co Ltd | 電極被覆用ガラス、プラズマディスプレイパネル前面基板およびプラズマディスプレイパネル背面基板 |
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2007
- 2007-05-02 JP JP2007121359A patent/JP4924985B2/ja not_active Expired - Fee Related
- 2007-05-17 KR KR1020087029115A patent/KR20090040405A/ko active IP Right Grant
- 2007-05-17 WO PCT/JP2007/060141 patent/WO2008015834A1/ja active Application Filing
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US8125150B2 (en) | 2008-10-20 | 2012-02-28 | Samsung Sdi Co., Ltd. | Lead free plasma display panel and method of manufacturing the same |
CN102245524A (zh) * | 2008-12-09 | 2011-11-16 | 日本电气硝子株式会社 | 等离子体显示面板用电介质材料和等离子体显示面板用玻璃板 |
CN101952930A (zh) * | 2009-03-13 | 2011-01-19 | 松下电器产业株式会社 | 等离子显示面板 |
US8362680B2 (en) | 2009-03-13 | 2013-01-29 | Panasonic Corporation | Plasma display panel having low residual stress |
Also Published As
Publication number | Publication date |
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KR20090040405A (ko) | 2009-04-24 |
JP4924985B2 (ja) | 2012-04-25 |
JP2008060064A (ja) | 2008-03-13 |
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