WO2007129820A1 - Dispositif de collecte de sous-produit pour appareil de fabrication de semi-conducteurs - Google Patents

Dispositif de collecte de sous-produit pour appareil de fabrication de semi-conducteurs Download PDF

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Publication number
WO2007129820A1
WO2007129820A1 PCT/KR2007/002008 KR2007002008W WO2007129820A1 WO 2007129820 A1 WO2007129820 A1 WO 2007129820A1 KR 2007002008 W KR2007002008 W KR 2007002008W WO 2007129820 A1 WO2007129820 A1 WO 2007129820A1
Authority
WO
WIPO (PCT)
Prior art keywords
plates
housing
exhaust gas
trap
cooling
Prior art date
Application number
PCT/KR2007/002008
Other languages
English (en)
Inventor
Che-Hoo Cho
Jung-Eui Hong
Tae-Woo Kim
In-Mun Hwang
Original Assignee
Milaebo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060040700A external-priority patent/KR100676927B1/ko
Priority claimed from KR1020060041531A external-priority patent/KR100647725B1/ko
Application filed by Milaebo Co., Ltd. filed Critical Milaebo Co., Ltd.
Priority to US12/226,994 priority Critical patent/US7988755B2/en
Priority to CN2007800148666A priority patent/CN101432847B/zh
Priority to EP07746169A priority patent/EP2013897A4/fr
Priority to JP2009507591A priority patent/JP2009535194A/ja
Publication of WO2007129820A1 publication Critical patent/WO2007129820A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S55/00—Gas separation
    • Y10S55/15—Cold traps

Definitions

  • the present invention relates to a byproduct collecting apparatus for efficiently collecting reaction-byproducts contained in an exhaust gas discharged from a process chamber during a semiconductor manufacturing process.
  • a semiconductor manufacturing process is classified into a pre- process (fabrication process) and a post-process (assembly process).
  • the pre-process means process for manufacturing a semiconductor chip by forming predetermined patterns through repeated processes of depositing a thin film on a wafer within a variety of process chambers, and selectively etching the deposited thin film.
  • the post-process means process for assembling a completed product by separating the chips manufactured in the pre-process into individual chips, and coupling the separated chips to lead frames.
  • a semiconductor manufacturing equipment includes a scrubber at a rear end of a vacuum pump for generating a vacuum state in the process chamber. The scrubber purifies an exhaust gas discharged from the process chamber and discharges the purified exhaust gas to atmosphere.
  • a powder trap unit for changing an exhaust gas discharged from a process chamber 1 into a powder state is installed between the process chamber 1 and a vacuum pump 2 as illustrated in FIG. 14. That is, as illustrated in FIG. 14, the process chamber 1 is connected with the vacuum pump 3 via a pumping line 5.
  • a trap pipe 7 for trapping and piling reaction-byproduct generated at the process chamber 1 in the form of powder branches from the pumping line 5.
  • a non-reacted gas generated while a thin film is deposited or etched within the process chamber 1 flows to the pumping line 5 having a relatively low temperature atmosphere compared to that of the process chamber 1, so that the non-reacted gas solidifies into powder 9, and is accumulated in the trap pipe 7 branching from the pumping line 5.
  • a turn around time is lengthened as much as that. That is, a next thin film deposition or etching process is not performed until reaction-byproducts generated when a thin film is deposited or etched swiftly changes into powder and are accumulated in the trap pipe, but it takes a long time for the reaction-byproducts to change into powder. Accordingly, the process chamber cannot perform a next process until all of the reaction-byproducts are removed and stands by for a long time.
  • the present invention provides a byproduct collecting apparatus capable of swiftly collecting reaction-byproducts.
  • the present invention also provides a byproduct collecting apparatus having a long replacement period.
  • Embodiments of the present invention provide byproduct collecting apparatuses including: a housing having a gas inlet port and a gas outlet port; and a trap module installed inside the housing and having first plates curved or inclined to guide an exhaust gas flow in one of curved and inclined fashions.
  • the first plates of the trap module are arranged radially.
  • the trap module further comprises a plurality of second plates installed inside the housing and formed to guide the exhaust gas flow in zigzags.
  • the trap module further comprises: a first trap part in which the first plates are installed; and a second trap part in which second plates are installed, the second plates arranged in a multi- step, spaced apart with a predetermined interval, and having a plurality of openings provided as a passage through which an exhaust gas flows.
  • the second trap part is provided to a position adjacent to the gas outlet port compared to the first trap part.
  • the first plate has an outer side surface contacting an inner surface of the housing, and a cut portion is formed in the outer side surface of the first plate to allow an exhaust gas to flow between the inner surface of the housing and the outer side surface of the first plate.
  • a plurality of through holes are formed in the first plate, and sizes of the through holes reduce as the through holes become more distant from the gas inlet port.
  • the trap module further comprises: an inner tube having an inner passage through which an exhaust gas flows, and an outer periphery on which the first plates and the second plates are fixed; and a third trap part installed in the inner passage of the inner tube to collect reaction-byproducts of an exhaust gas flowing through the inner passage.
  • the third trap part comprises a support rod located vertically at a center of the inner passage of the inner tube; and third plates installed slant Iy in the support rod; and fourth plates installed horizontally in the support rod.
  • the byproduct collecting apparatus further comprises a blocking member for preventing a lump of powder detached from the tramp module from exhausting through the gas outlet port.
  • the blocking member comprises a blocking threshold protruding in a direction facing an inside of the housing from one side of the housing provided with the gas outlet port, and a blocking plate located above the gas outlet port.
  • the housing further comprises a cylindrical body whose upper and lower portions are open; an upper plate coupled to the upper portion of the body and having the gas inlet port; and a lower plate coupled to the lower portion of the body and having the gas outlet port.
  • the byproduct collecting apparatus further comprises a cooling member having a first cooling part for cooling down the housing; and a second cooling part for cooling down the inner tube of the trap module.
  • the first cooling part comprises first cooling lines provided on a wall of the housing
  • the second cooling part comprises second cooling lines provided on a wall of the inner tube.
  • the byproduct collecting apparatus further comprises a heating member for heating an exhaust gas introduced into the housing.
  • byproduct collecting apparatuses comprise: a housing having a gas inlet port and a gas outlet port; a first trap part provided inside the housing and on which first plates to collect reaction-byproducts; a second trap part provided inside the housing and on which second plates to collect reaction-byproducts, wherein the first plates and the second plates are shaped to guide an exhaust gas flow in different directions.
  • each of the first plates has an inclined shape to guide the exhaust gas flow in a curved fashion
  • each of the second plates is disposed perpendicularly to a longitudinal direction of the housing, the second plates are spaced apart with a predetermined interval to face each other, and openings are formed in the second plates such that a gas flows in zigzags.
  • the first plate has such a shape as to allow an exhaust gas to get out of a vertical flow when the exhaust gas flows in the longitudinal direction of the housing. In still other embodiments, the first plate has such a shape as to allow an exhaust gas to flow in a curved fashion when the exhaust gas flows in thelongitudinal direction of the housing.
  • each of the first plates is installed to have a slope range of 50-60°to the longitudinal direction of the housing.
  • the present invention has a particular effect of more swiftly cooling down reaction-byproducts using a double cooling line structure.
  • the present invention can improve collection efficiency of react ion- byproducts by cooling down the reaction-byproducts in an outer surface and an inner surface of a housing, simultaneously.
  • the present invention has an advantage of maximizing a collecting amount using a widened powder adsorption area by dividing an inner space of a housing into a outer annular space and a central space, and arranging plates having various shapes in each of the spaces.
  • the present invention since powder is uniformly collected over a trap module on the whole, an operation period of a collecting apparatus can be extended, a productivity reduction problem caused by operation suspension due to frequent replacement can be solved.
  • the present invention can prevent a damage of a vacuum pump by preventing powder lumps falling from a collecting module from being discharged through an gas outlet port .
  • FIG. 1 is a view illustrating an appearance of a byproduct collecting apparatus according to an embodiment of the present invention
  • FIG. 2 is a partial sectional view of a byproduct collecting apparatus
  • FIG. 3 is an exploded perspective view of a byproduct collecting apparatus
  • FIG. 4 is a side view illustrating a byproduct collecting apparatus
  • FIG. 5 is a cross-sectional view taken along the line a ⁇ a of FIG. 4;
  • FIG. 6 is an exploded perspective view of a trap module
  • FIG. 7 is a side view of a trap module
  • FIG. 8 is a perspective view of a modified third trap part
  • FIG. 9 is a perspective view of a trap module having a modified third trap part
  • FIG. 10 is a partial sectional view of a byproduct collecting apparatus in which the trap module of FIG. 9 has been installed;
  • FIG. 11 is a view illustrating sixth plates of the third trap part of FIG.
  • FIG. 12 is a photo illustrating reaction-byproducts have been collected to a trap module of the present invention
  • FIG. 13 is a photo illustrating reaction-byproducts have been collected at a trap module where plates are disposed in a multi-step.
  • FIG. 14 is a conceptual view explaining a byproduct collecting apparatus according to prior art. [Best Mode]
  • a collecting apparatus has a structure allowing an exhaust gas to pass through a simple wide path at a front part and pass through a complicated and narrow path at a rear part, thereby allowing powder to be uniformly accumulated on not only the front part but also the rear part. Also, the collecting apparatus according to the present invention has a structure capable of doubly cooling down the temperature of the exhaust gas in an outer side and an inner side of a _ housing in order to more swiftly cooling the temperature of the exhaust gas.
  • FIG. 1 is a view illustrating an appearance of a byproduct collecting apparatus according to an embodiment of the present invention
  • FIG. 2 is a partial sectional view of a byproduct collecting apparatus
  • FIG. 3 is an exploded perspective view of a byproduct collecting apparatus
  • FIG. 1 is a view illustrating an appearance of a byproduct collecting apparatus according to an embodiment of the present invention
  • FIG. 2 is a partial sectional view of a byproduct collecting apparatus
  • FIG. 3 is an exploded perspective view of a byproduct collecting apparatus
  • FIG. 4 is a side view illustrating a byproduct collecting apparatus
  • FIG. 5 is a cross-sectional view taken along the line a-a of FIG. 4.
  • the byproduct collecting apparatus is installed a rear end of a pump on an exhaust line of a process chamber where reaction-byproducts are generated when a thin film is deposited or etched during a semiconductor or liquid crystal display device manufacturing process, or a similar process.
  • the byproduct collecting apparatus 100 includes a housing 110, a heating element 120, a trap module 130, and a cooling member 170.
  • the housing 110 includes a cylindrical body 112, an upper plate 114 coupled on an upper portion of the body 112 by bolting, and a lower plate 116 coupled on a lower protion of the body 112 by bolting.
  • the body 112 has a double wall structure including an inner wall 112a and an outer wall 112b.
  • a first cooling line 172 through which coolant circulates is installed in a spiral shape between the inner wall 112a and the outer wall 112b. A surface temperature of the body 112 and an inner temperature of the housing are lowered by the first cooling line 172.
  • the upper plate 114 has a gas inlet port 114a through which an exhaust gas is introduced, and the lower plate 116 has a gas outlet port 116a through which an exhaust gas is discharged.
  • An exhaust line connected to a process chamber is connected to the gas inlet port 114a.
  • An exhaust line connected to a vacuum pump is connected to the gas outlet port 116a.
  • an 0-ring which is a sealing element for preventing leakage of an exhaust gas, may be installed in the housing 110.
  • the housing 110 since the housing 110 has a structure easy to separate and assemble, maintenance of the housing 110 is convenient. For example, maintenance of the housing 110 is performed to remove powder deposited on the inner wall of the housing 110 (inner wall of the body 112) and the trap module.
  • the heating element 120 is installed under the upper plate 114 of the housing 110.
  • the heating element 120 includes a heater 122 and a plurality of heating plates 124 installed on an upper surface of the heater 122.
  • the heating plates 124 are installed radially so that an exhaust gas introduced to the central portion can diffuse toward peripheral outer side, i.e., the inner wall 112a of the housing 110.
  • An exhaust gas is uniformly diffused to peripheral portions where the inner wall of the housing 110 is located by the heating plates 124 installed radially on the heater 122.
  • the heating plates 124 provide a heating path until an exhaust gas reaches the upper center of the heater 122 and immediately diffuses to edges. Accordingly, the exhaust gas is sufficiently heated by the heat plates 124 to receive energy required for chemical change.
  • the heater 122 is connected to an external power source and has a hot wire therein.
  • the heater 122 may be formed of a material such as ceramic and inconel.
  • a sheathing pipe 127 for inserting and drawing a hot wire from the outside of the housing 110 is connected to the heater 122.
  • the heater 120 includes a cylindrical guide 128 for guiding an exhaust gas flow so that an exhaust gas introduced into the housing 110 via the gas inlet port 114a flows to a central portion.
  • the cylindrical guide 128 is installed on the heating plates 124.
  • the heating plates 128 according to the present invention can be somewhat modified to guarantee the exhaust gas flow under vacuum pressure.
  • the trap module 130 is a very crucial element in col let ing powder.
  • the trap module 130 includes a first trap part 134, a second trap part 142, a third trap part 150, and an inner tube 132.
  • the inner tube 132 is located at the center of the housing 110.
  • the inner tube 132 is spaced apart with a predetermined distance from the lower plate of the housing 110 by a plurality of horizontal support pins 133.
  • the horizontal support pins 133 are installed at a flange ring 119 of the housing 110.
  • the first trap part 134 and the second trap part 142 are installed on the outer periphery of the inner tube 132.
  • the third trap part 150 is installed inside the inner tube 132.
  • the inner tube 132 is cooled down by a second cooling line 174.
  • the second cooling line 174 is installed in a spiral shape between an outer wall 132b and an inner wall 132a of the inner tube 132.
  • an inner space of the housing 110 is divided by the inner tube 132 into a outer annular space al corresponding to an outer side of the inner tube 132 and an inner central space a2 corresponding to an inner side (inner path) of the inner tube 132.
  • a portion of an exhaust gas introduced to the inner space of the housing 110 flows to the outer annular space al, and the rest of the exhaust gas flows to the inner central space a2.
  • the first and second trap parts 134 and 142 are located in the outer annular space al.
  • the third trap part 150 is located in the inner central space a2. The temperature of the exhaust gas that flows to the outer annular space al falls down under an temperature influence of the housing 110 and the inner tube 132.
  • the temperature of the exhaust gas that flows to the inner central space a2 falls down under a temperature influence of the inner tube 132. Since an exhaust gas passing through the inner space of the housing 110 is uniformly cooled down according to the present invention as described above, the trap module 130 may change reaction-byproducts into powder and collect powder more efficiently.
  • the powder collecting apparatus 130 of the present invention is characterized in that it not only includes a structure having the housing 110 and the inner tube 132 located inside the housing 110, but also includes a multi-cooling structure in which both the housing 110 and the inner tube 132 are cooled down.
  • the first trap part 134 includes six first plates 136 installed radially (with an interval of 60°) and slant Iy on the outer periphery of the inner tube 132.
  • the first plates 136 are curve-shaped in order to guide an exhaust gas flow in a curved fashion.
  • the first plates 136 are spaced apart with a sufficient distance for swift flow of the exhaust gas. That is, the first plates with curved shape are installed slantly on the outer periphery of the inner tube.
  • the first plates 136 may be installed with a slope of a predetermined angle of 50-60°. For example, when the slopes of the first plates 136 are large (that is, the first plates 136 are laid much), powder is concentrated on only the first plates 136.
  • the first plates 136 include a plurality of through holes 136a.
  • the through holes 136a may reduce in their sizes as the through holes 136a become more distant from the gas inlet port 114a. Since an outer side surface 137 of the first plate 136 contacts the inner side 112a of the housing 110 (i.e., the inner wall of the body), heat exchange with the housing 110 is easily performed. That is, the first plates 136 are cooled down by the inner tube 132 and the housing 110.
  • the first plate 136 includes a cut portion 136b formed by cutting a portion of the first plate 136 along an outer side surface 137.
  • the first plate 136 may have a flat plate shape and be inclined by a predetermined angle on an outer periphery of the inner tube.
  • An exhaust gas flow on the first trap part 134 will be described below.
  • An exhaust gas flows while it turns around along curved passages between the first plates 136.
  • a portion of the exhaust gas flows downwardly through the through holes 136a and the cut portions 136b of the first plates 136.
  • the first trap part 134 provides a plurality of auxiliary vertical paths besides a main inclined path.
  • the second trap part 142 is located at a lower end of the first trap part 134.
  • the second trap part 142 includes three-step second plates 144 for providing horizontal and vertical paths through which an exhaust gas can flow in zigzags on an outer periphery of the inner tube 132.
  • the horizontal paths are provided between the second plates 144, and the vertical paths are provided by a plurality of openings 144a formed in the second plates 144.
  • the openings 144a of the second plates 144 are formed in different locations.
  • the second plate 144 located at an uppermost end adjacent to the first trap part 134 has an inclined portion 144b inclined upward so that an exhaust gas that has passed between the first plates 136 of the first trap part 132 may be easily introduced to the second trap part 142.
  • the length of the first trap part 134 is longer than that of the second trap part 142.
  • a length ratio of the first trap part 134 to the second trap part 142 may be 7:3.
  • a length ratio of the first trap part to the second trap part is controlled to 5:5, there occurs a phenomenon that reaction-byproducts are concentrated on the first trap part. This phenomenon may be generated due to accumulation of byproducts at the first trap part. The accumulation of the byproducts may be caused by slope angles of the first plates of the first trap part and a long movement path of the second trap part.
  • the third trap part 150 is installed in the inner path a2 of the inner tube 132.
  • the third trap part 150 is designed for collecting reaction- byproducts of the exhaust gas that flows through the inner path a2 of the inner tube 132.
  • the third trap part 150 includes a support rod 152 vertically located at the center of the inner path a2 of the inner tube 132, four third plates 154 installed to be inclined at the support rod 152, and fourth plates 156 horizontally installed at the support rod 152.
  • An upper portion of the support rod 152 is coupled to the inner tube 132 using three bolts.
  • the fourth plates 154 are installed at the support rod in six-step.
  • the fourth plate 154 installed at a lowermost end is formed in a circular shape so that a lump of powder does not fall down to the gas outlet port 116a, and has an outer surface formed in a curved shape to allow an exhaust gas to be easily discharged.
  • FIGS. 8 to 11 are views illustrating various modifications of the third trap part .
  • FIG. 8 illustrates a third trap part 150a including a support rod 152 and fourth plates 158 installed at the support rod 152 in a multi-step.
  • FIGS. 9 to 11 illustrate a third trap part 150a including six fifth plates 159 having through holes 159a and horizontal sixth plates 160.
  • the fifth plates 159 are positioned to be inclined with respect to an inner path a2 of an inner tube 132 and installed such that inner sides of the fifth plates contact an inner surface 132a of the inner tube 132.
  • the sixth plates 160 are installed in a multi-step with being supported from the upper surface of a lower plate 116 by three support rods 161.
  • the byproduct collecting apparatus according to the present invention includes a blocking member.
  • the blocking member blocks powder so that a lump of powder detached from a trap module 130 does not get out through an gas outlet port 116a.
  • the blocking member includes a blocking threshold 162 protruding upward from the inner surface of the lower plate 116.
  • the blocking threshold is designed for blocking a lump of powder introduced from side directions.
  • the blocking member can be installed at the third trap part 130.
  • the fourth plate 154 located at a lowermost end of the third trap part 150 illustrated in FIG. 6, and the sixth plate located at a lowermost end of the third trap part 150b illustrated in FIG. 10 serve as blocking plates.
  • the number of plates installed in the trap module 130 a swift flow of an exhaust gas is hindered when too many plates are installed. Also, in the case where an interval between the plates is too narrow, a path is rapidly blocked when powder is deposited. Therefore, the number of the plates installed can be appropriately selected with general consideration of various factors such as an installation environment, an inner pressure of the housing, and a process to be performed on the whole.
  • the byproduct collecting apparatus is characterized in that powder is uniformly deposited not only at a front portion but also at a rear portion by allowing an exhaust gas to pass through simple wide movement paths at the front portion and to pass through complicated narrow movement paths at the rear portion.
  • reaction-byproducts of an exhaust gas introduced into the housing 110 are changed into powder by a low temperature atmosphere of the housing 110.
  • a portion of the ⁇ powder changed from the exhaust gas is accumulated on the outer surface of the first plates 136 of the first trap part 134 and the inner tube 132 while the exhaust gas passes through the inclined wide movement paths of the first trap part 134.
  • the rest of the powder of the exhaust gas that has passed through the first trap part 134 is accumulated on the surfaces of the second plates 144 and the outer periphery of the inner tube 132 while the exhaust gas passes through the complicated narrow paths provided by the second plates 144 of the second trap part 142.
  • the cooling member 170 is designed for making the inside of the housing 110 a low temperature atmosphere in order to trap reaction-byproduct contained in an exhaust gas introduced into the housing 110.
  • the cooling member 170 includes a first cooling line 172 for cooling down a body 112 of the housing 110, a second cooling line 174 for cooling down the inner tube 132 of the trap module 130, a supply pipe 176 for supplying coolant to the first and second cooling lines 172 and 174, and a discharge pipe 177 for discharging coolant that has passed through the cooling lines.
  • the first and second cooling lines 172 and 174 not only cool down the surfaces of the housing 110 and the inner tube 132, but also lower the inner temperature of the housing 110 and the temperature of the plates of the trap module 130.
  • coolant is introduced to the first and second cooling lines 172 and 174, inner temperatures of the housing 110, inner tube 132, and plates 136, 144, 154, and 156 considerably and relatively reduce compared to the temperature of an exhaust gas. Therefore, an exhaust gas (particularly, reaction-byproducts) is introduced to the housing 110 and heated by the heating member 120.
  • the housing 110 and the inner tube 132 are cooled down by the first and second cooling lines 172 and 174 to rapidly cool down the inner temperature of the housing 110 and the / surface temperature of the plates 136, 144, 154, and 156.
  • the first and second plates 136 and 144 are installed to contact the inner wall of the housing 110 and the outer wall of the inner tube 132
  • the third and fourth plates 154 and 156 are installed to contact the inner wall of the inner tube 132 to increase a heat exchange area of the plates 136, 144, 154, and 156. Therefore, an atmosphere under which reaction-byproducts introduced to the housing 110 can solidify more rapidly is formed.
  • the byproduct collecting apparatus has a structure that can cool down reaction-byproducts doubly in the outside and inside of the housing in order to more rapidly solidify the reaction-byproducts introduced to the housing.
  • coolant is supplied to the first cooling line 410 and the second cooling line 420 via a coolant supply pipe 40 connected to an external coolant tank.
  • the surface temperatures of the housing, inner tube, and plates, and the inner temperature of the housing fall down while coolant flows through the first and second cooling lines.
  • the heater 220 of the heating element operates to emit high temperature heat
  • the heating plates 210 contacting the heater 220 are heated to high temperature.
  • an exhaust gas containing a large amount of reaction-byproducts generated from the process chamber connected to the collecting apparatus is introduced into the housing via the gas inlet port.
  • the exhaust gas is heated by the heating element and diffused to the inner space of the housing 110.
  • a portion of the exhaust gas that has diffused to the inner space of the housing 110 flows to the outer annular space al, and the rest of the exhaust gas flows to the central space a2.
  • the portion of the exhaust gas that flows to the outer annular space al contacts the inner wall of the housing 110, and outer wall surfaces of the first plates and inner tube that have been already cooled down to low temperature.
  • the portion of the exhaust gas is cooled down at the moment when it contacts the inner wall of the housing 110, and outer wall surfaces of the first plates and inner tube, and deposited on each surface while it rapidly solidifies from its vapor state.
  • the portion of the exhaust gas that flows to the central space contacts the inner wall of the inner tube and the surfaces of the third plates that have been already cooled down to low temperature.
  • the portion of the exhaust gas that flows to the central space is cooled down at the moment when it contacts the inner wall of the inner tube and the surfaces of the third plates, and deposited on each surface while it rapidly solidifies from its vapor state. Since the present invention has a structure of performing a cooling operation doubly in the outside and inside of the housing as described above, the inner temperature of the housing can be maintained low and thus reaction-byproducts can solidifies more rapidly. For reference, reaction- byproducts in a gas state change into powder having strong adsorption characteristic when temperature rapidly falls down.
  • reaction-byproducts have a stronger adsorption characteristic at a portion cooled down to a predetermined temperature or less. Therefore, reaction- byproducts that pass through the inner space of the housing 110 are rapidly cooled down, so that the trap module 130 may change reaction-byproducts into powder and collect powder more efficiently.
  • reaction-byproducts that have not been collected by the first trap part of the trap module are cooled down to a predetermined temperature or less, solidifies and are accumulated on the surfaces of the second plates, outer wall of the inner tube, and inner wall of the housing while they pass through horizontal and vertical paths of the second trap part in zigzags.
  • other reaction-byproducts that have not been collected at the upper end of the third trap part solidifies and are accumulated on the surfaces of the fourth plates and the inner wall of the inner tube while they pass through the fourth plates of the third trap part in zigzags. Accordingly, powder is uniformly deposited on the trap module on the whole as illustrated in FIG. 12. Referring to FIG. 13, since power is accumulated on only the upper surfaces of the upper plates on an upper portion in a trap module where disk-shaped plates are installed in a multi- step, not only a replacement period is very short, but also collecting efficiency remarkably reduces.
  • the byproduct collecting apparatus has a structure allowing an exhaust gas to pass through a simple wide path at a front part and pass through a complicated and narrow path at a rear part, thereby allowing powder to be uniformly accumulated on not only the front part but also the rear part. Therefore, a replacement period of the collecting apparatus is remarkably extended, and thus a process delay reduces, productivity improves, and manufacturing costs reduce.
  • the present invention can be applied to all of equipments manufacturing semiconductor and an LCD.
  • a byproduct collecting apparatus according to the present invention is applied on an exhaust line of a process chamber where reaction-byproducts are generated when a thin film is deposited or etched during a semiconductor, LCD manufacturing process, or other similar processes to efficiently collect reaction-byproducts exhausted onto the exhaust line.

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  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Chemical Vapour Deposition (AREA)
  • Separating Particles In Gases By Inertia (AREA)
  • Drying Of Semiconductors (AREA)
  • Treating Waste Gases (AREA)

Abstract

Dispositif de collecte efficace de sous-produits de réaction contenus dans un gaz d'échappement rejeté par une chambre de traitement d'appareil de fabrication de semi-conducteurs. Ce dispositif comprend une enceinte et un module piège, l'enceinte ayant des orifices d'entrée et de sortie de gaz. Le module piège se trouve dans l'enceinte et comporte des premières plaques courbes ou inclinées pour guider un flux de gaz d'échappement selon une orientation courbe.
PCT/KR2007/002008 2006-05-04 2007-04-25 Dispositif de collecte de sous-produit pour appareil de fabrication de semi-conducteurs WO2007129820A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/226,994 US7988755B2 (en) 2006-05-04 2007-04-25 Byproduct collecting apparatus of semiconductor apparatus
CN2007800148666A CN101432847B (zh) 2006-05-04 2007-04-25 半导体设备的副产品收集装置
EP07746169A EP2013897A4 (fr) 2006-05-04 2007-04-25 Dispositif de collecte de sous-produit pour appareil de fabrication de semi-conducteurs
JP2009507591A JP2009535194A (ja) 2006-05-04 2007-04-25 半導体装置の副産物捕集装置

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KR1020060041531A KR100647725B1 (ko) 2006-05-09 2006-05-09 반도체 장치의 부산물 포집장치
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JP2009535194A (ja) 2009-10-01
EP2013897A1 (fr) 2009-01-14

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