Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
  • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
  • H01L23/4735—Jet impingement
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/30—Technical effects
  • H01L2924/301—Electrical effects
  • H01L2924/3011—Impedance

Definitions

• the present invention relates to a cooler. In particular, it relates to a power converter cooler. Background art
• a hybrid car is a motor powered car in addition to a conventional engine.
• a hybrid vehicle obtains power by driving an engine, converts DC voltage from a DC power source into AC voltage, and drives motor by the converted AC voltage.
• An electric vehicle is a vehicle that obtains power by driving a motor with an AC voltage obtained by converting a DC voltage from a DC power source.
• the power converter includes power semiconductor elements such as an inverter and a converter, for example.
• the power semiconductor element include power MOS FET (Metal Oxide Semiconductor Field-Effect Transistor), IGBT (insulated gate type bipolar transistor), and the like.
• 'Power converters installed in automobiles, etc. may require large amounts of power in order to obtain high power performance. Since large-scale power changes generate a large amount of heat, a cooler is installed to cool the power converter.
• a cooling plate When cooling a heating element such as a high-power power converter, a cooling plate (fin) is joined to a member that is in contact with the power converter, etc., and the heat transfer area is expanded to improve the efficiency. Cooling with a so-called impinging jet that collides cooling water toward the area where the power converter is located is useful. Furthermore, a method of combining these cooling methods is effective.
• Japanese Laid-Open Patent Publication No. 2-100.30 discloses an integrated circuit cooling structure including a cooling plate having fins. This cooling structure has an integrated circuit in which a plurality of integrated circuit elements are mounted on a substrate, a substrate frame that holds the substrate, and a counterbore on the opposite surface of the substrate that faces the integrated circuit element.
• a cooling plate having a fan-shaped fin disposed on the bottom surface of the hole and a nozzle for ejecting a refrigerant at the center of the fan-shaped fin are provided. According to the cooling structure of this integrated circuit, it is disclosed that the thermal resistance between the integrated circuit element and the refrigerant can be kept low, the flow rate of the refrigerant can be reduced, and the heat can be efficiently discharged outside the device. .
• Japanese Patent Laid-Open No. 5-3 2 7 a plurality of semiconductor elements arranged on a substrate, a cooling medium supply header disposed on the opposite side of the substrate across each semiconductor element, and a cooling medium A tube-shaped cooling medium supply member communicating with the supply header; and a cooling medium outlet formed at the front end of the cooling medium supply member for ejecting the cooling medium from the cooling medium supply header toward the respective semiconductor elements.
• a semiconductor cooling device including a cooling medium return header is disclosed.
• the substrate is installed in the vertical direction, a cooling medium return pipe communicating with the cooling medium return header is provided, and a partition member for partitioning the semiconductor elements is provided. According to this conductor cooling device, the cooling medium bubbles generated in each element are prevented from flowing into other elements, and each element is cooled independently. Is disclosed.
• Japanese Patent Application Laid-Open No. 6-1 1 2 3 8 5 discloses a cooling structure for a semiconductor element, which is a combination of a radiator and a nozzle.
• the heat sink has a bottom heat sink and first and second vertical heat sinks.
• the bottom heat sink is mounted on a wiring board and has a semiconductor element mounted therein. It is provided on the heat dissipation surface.
• the first vertical heat sink is composed of a plurality of curved heat sinks. The curved convex surfaces face each other, and a jet flow path is formed between the curved convex surfaces.
• the second vertical heat radiating plate is provided at the jet outlet of the passage by the first vertical heat radiating plate, and the nozzle collides with the bottom heat radiating plate through the passage by the first vertical heat radiating plate. Is to be ejected.
• the flow velocity and flow rate can be increased by causing the refrigerant once collided as a jet to collide with the heat sink as a jet again. It is disclosed that the cooling efficiency can be increased.
• Japanese Laid-Open Patent Publication No. 5-190 016 discloses a semiconductor device in which a large number of integrated circuit packages are mounted on a ceramic multilayer substrate, and a cooling jacket is mounted on each package. Yes. A flexible tube is connected to each cooling jacket. A nozzle is provided inside the flexible channel to allow the cooling fluid to flow into the cooling jacket as a slit-like jet. A space for the return of fins and cooling fluid is provided in the cooling jacket. According to this semiconductor device, water with high cooling capacity can be used as a cooling medium, flat plate type fins that can easily expand the heat transfer area can be used, and a cooling fluid is evenly supplied to each fin by a slit-like jet. Therefore, it is disclosed that a semiconductor device having an excellent cooling structure can be provided.
• a cooler for cooling the power converter may be mounted, and in particular, cooling of a heating element such as a power converter corresponding to high power is an important issue. Disclosure of the invention
• An object of this invention is to provide the cooler of the power converter excellent in cooling performance.
• the cooler based on this invention is equipped with the board
• a heat dissipating member fixed to the other surface of the substrate is provided.
• First flow path configuring means for configuring a first flow path formed so that the refrigerant contacts the heat radiating member is provided.
• Second flow path configuring means is provided that configures a second flow path that is formed so that the refrigerant is jetted toward a region of the other surface where the heating element is disposed. The second flow path is formed separately from the first flow path.
• the heat dissipation member includes at least one of a plate-like member or a rod-like member.
• the heat dissipating member is disposed around a region where the heating element is disposed.
• the second flow path forming means includes a main pipe disposed away from the other surface of the substrate, and protrudes from the main pipe toward the substrate. And an auxiliary tube formed on the surface. The auxiliary tube is disposed so as to face a region of the substrate where the heating element is disposed.
• the first flow path includes a space sandwiched between the main pipe and the substrate.
• the auxiliary pipe includes an end face facing the substrate, and the end face is inclined so that a flow path becomes larger along a direction of the refrigerant flowing through the first flow path forming means. ing.
• the auxiliary pipe is formed in a tapered shape so as to become thinner toward the substrate.
• a third flow path constituting means for discharging the refrigerant flowing through the second flow path is provided.
• the third flow path forming means includes a separator arranged between the main pipe and the substrate.
• the auxiliary pipe is formed so as to penetrate the separator.
• the said relief tube is being fixed to the said separator plate without gap.
• the substrate is arranged such that a direction in which the one surface extends is either a lead straight direction or a direction inclined with respect to a vertical direction.
• the substrate is arranged so that the one surface faces downward in the vertical direction.
• FIG. 1 is a schematic exploded perspective view of the semiconductor device according to the first embodiment.
• FIG. 2 is a first schematic cross-sectional view of the semiconductor device according to the first embodiment.
• FIG. 3 is a second schematic cross-sectional view of the semiconductor device according to the first embodiment.
• FIG. 4 is a third schematic cross-sectional view of the semiconductor device according to the first embodiment.
• FIG. 5 is a schematic exploded perspective view of the semiconductor device according to the second embodiment.
• FIG. 6 is a first schematic cross-sectional view of the semiconductor device according to the second embodiment.
• FIG. 7 is a second schematic cross-sectional view of the semiconductor device according to the second embodiment.
• FIG. 8 is a schematic cross-sectional view of the semiconductor device according to the third embodiment.
• FIG. 9 is a first schematic cross-sectional view of the semiconductor device in the fourth embodiment.
• FIG. 10 is a second schematic cross-sectional view of the semiconductor device according to the fourth embodiment.
• the cooler in the present embodiment is a cooler for cooling a power converter as a body to be cooled.
• the power converter includes devices such as an inverter for converting DC power to AC power and a converter for changing the voltage.
• power converters include power semiconductor elements such as power MO S F E T or I G B T.
• FIG. 1 is a schematic exploded perspective view of the semiconductor device according to the present embodiment.
• the semiconductor device in the present embodiment includes a power converter as an electrical device and a cooler for cooling the power converter.
• the semiconductor device in the present embodiment includes a semiconductor element 21 as a power converter.
• the semiconductor element 21 is formed so that the planar shape is rectangular.
• the semiconductor element 21 is connected to an external electric circuit (not shown).
• the semiconductor element 21 is a heating element that generates heat when driven.
• the semiconductor element 21 is the object to be cooled.
• the cooler in the present embodiment includes a substrate 1 for arranging the semiconductor element 21 on one surface.
• the substrate 1 is formed in a plate shape.
• a plurality of semiconductor elements 21 are arranged on the front side surface of the substrate 1.
• the semiconductor element 21 is arranged such that the main surface is bonded to the substrate 1 as indicated by an arrow 54.
• Substrate 1 in the present embodiment includes a metal plate and an insulating layer formed on the surface of the metal plate. The semiconductor element 21 is fixed to the surface of the insulating layer.
• the cooler in the present embodiment includes a heat dissipating member fixed to a surface opposite to the surface of the substrate 1 on which the semiconductor element 21 is disposed.
• the heat dissipating member in the present embodiment includes a plate-like member 2.
• the plate-like member 2 is, for example, a straight fin.
• the plate-like member 2 is disposed in at least one of a region where the semiconductor element 21 is disposed and a region around the region where the semiconductor element 21 is disposed.
• the plate-like member 2 is disposed on the back surface of the substrate 1.
• the plate-like member 2 has a main surface substantially perpendicular to the main surface of the substrate 1. It is arranged to be straight.
• FIG. 2 shows a first schematic cross-sectional view of the semiconductor device according to the present embodiment.
• FIG. 2 is a schematic sectional view taken along a plane parallel to the main surface of the substrate.
• the cooler of the semiconductor device includes a plurality of plate-like members 2, and each plate-like member 2 is arranged and arranged.
• the plate-like members 2 are arranged so that their main surfaces are substantially parallel to each other.
• the plate-like members 2 are arranged so as to be separated from each other.
• the plate-like member 2 has a notch 2a formed in a region where a catching tube 12 described later is disposed.
• FIG. 3 shows a second schematic cross-sectional view of the semiconductor device according to the present embodiment.
• FIG. 3 shows a second schematic cross-sectional view of the semiconductor device according to the present embodiment.
• FIG. 4 shows a third schematic cross-sectional view of the semiconductor device according to the present embodiment.
• 3 is a cross-sectional view taken along the line I I I-I I I in FIG. 2
• FIG. 4 is a cross-sectional view taken along the line I V—IV in FIG.
• the planar member 2 in the present embodiment has a rectangular planar shape.
• the notch 2 a is formed so that a gap is formed between the auxiliary pipe 12 and the end of the plate-like member 2.
• the direction indicated by arrow 51 is the direction in which the cooling medium flows.
• the plate-like member 2 is arranged so that the main surface is substantially parallel to the direction in which the refrigerant flows.
• the plate-like member 2 is formed so as to have substantially the same height as the first flow path described later.
• the cooler in the present embodiment includes first flow path constituting means formed so that the refrigerant contacts the heat radiating member.
• the first flow path constituting means is formed to constitute the first flow path of the cooling medium.
• the first flow path constituting step in the present embodiment includes a substrate 1 and a main pipe 11 disposed on the side of the substrate 1 where the plate-like member 2 is disposed.
• the first flow path component includes a wall member 5 disposed on the side of the substrate 1 and the main pipe 11. The first flow path is formed by a space surrounded by the substrate 1, the main pipe 11, and the wall member 5.
• the cooler in the present embodiment is formed such that the first refrigerant flows in the first flow path sandwiched between the substrate 1 and the main pipe 11.
• a refrigerant supply device for supplying the refrigerant to the first flow path of the cooler is disposed (not shown).
• the cooler in the present embodiment includes second flow path forming means formed so that the second refrigerant collides toward the region where the power converter is disposed on the back surface of the substrate 1.
• the second flow path constituting means is formed so as to eject the second refrigerant directly to a portion where the power converter is disposed.
• the second flow path constituting means in the present embodiment is formed so as to constitute the second flow path of the refrigerant.
• the second flow path component includes a main pipe 11 disposed away from the back surface of the substrate 1.
• the main pipe 11 includes a flow path component plate 1 1 a and a flow channel component plate 1 1 b.
• the flow path component plate 1 1 a and the flow channel component plate 1 1 b are arranged away from each other.
• the flow path constituting plate 1 1 a and the flow path constituting plate 1 1 b are arranged so that their main surfaces are parallel to each other.
• Wall members 5 are arranged on the sides of the flow path component plate 1 1 a and the flow channel component plate 1 1 b.
• a part of the second flow path is formed by the space surrounded by the flow path constituting plates 1 l a and 1 1 b and the wall member 5.
• the second flow path constituting means in the present embodiment includes an auxiliary pipe 12 formed so as to protrude from the main pipe 11 toward the substrate 1.
• the auxiliary tube 12 is disposed so as to face the region where the semiconductor element 21 of the substrate 1 is disposed.
• the net support pipe 12 in the present embodiment is formed in a cylindrical shape.
• the auxiliary pipe 12 is formed so as to protrude from the flow path component plate 1 1 a.
• the catcher tube 1 2 is formed so as to communicate with the main tube 1 1.
• the auxiliary pipe 12 and the main pipe 11 constitute a second flow path.
• a refrigerant supply device for supplying the second refrigerant to the second flow path is arranged (not shown).
• water is used for each of the first refrigerant flowing through the first flow path and the second refrigerant flowing through the second flow path. Cooling water is supplied to the first flow path and the second flow path by a common refrigerant supply device.
• auxiliary pipe 12 in the present embodiment includes an end face 12a.
• the end face 1 2 a faces the substrate 1.
• End face 12 a is inclined so that the flow path becomes larger along the direction of the first refrigerant flowing through the first flow path indicated by arrow 51. That is, the end face 12 a is formed so that the distance from the substrate 1 increases along the direction in which the first refrigerant flows.
• the end surface 12 a is formed so that the inclined surface faces the downstream side of the first refrigerant.
• the heat generated by semiconductor element 21 is transferred to substrate 1 and plate-like member 2.
• the first refrigerant supplied by the refrigerant supply device is introduced into the first flow path. Is done.
• the first refrigerant flows through the space between the substrate 1 and the main pipe 11 as indicated by an arrow 51.
• the first refrigerant flows between the plate-like members 2 in the first flow path.
• the first refrigerant flows while contacting the plate-like member 2 and the substrate 1.
• the plate-like member 2 and the substrate 1 are cooled. After this, the first refrigerant is discharged.
• the semiconductor element 21 is cooled via the substrate 1.
• the semiconductor element 21 is cooled through the substrate 1 by cooling the plate-like member 2.
• the heat of the semiconductor element 21 is transmitted to the substrate 1 and the plate-like member 2 and is released from the substrate 1 and the plate-like member 2 to the first refrigerant.
• the second refrigerant supplied by the refrigerant supply device is introduced into the second flow path constituted by the second flow path constituting member.
• the second refrigerant is introduced into the main pipe 11 as indicated by an arrow 52.
• a part of the second refrigerant flowing in the main pipe 11 flows into the auxiliary pipe 12 as indicated by an arrow 53.
• the second refrigerant that has flowed into the auxiliary pipe 12 is discharged from the end surface 1 2 a portion of the auxiliary pipe 12 as indicated by an arrow 53.
• the second refrigerant supplied from the second flow path isolated from the first refrigerant contributes to the cooling of the semiconductor element 21 for the first time when it is ejected from the auxiliary pipe 12.
• the second refrigerant is not in contact with the plate-like member 2 arranged in the second flow path until it is ejected from the auxiliary pipe 12, so that the cooling capacity is not lowered.
• the second refrigerant When the second refrigerant is ejected from the auxiliary pipe 12, it collides with a region of the back surface of the substrate 1 where the semiconductor element 21 is disposed. That is, the second refrigerant cools the region of the substrate 1 where the semiconductor element 21 is disposed with a collision jet. When the second refrigerant collides with the substrate 1, the semiconductor element 21 can be effectively cooled.
• the second refrigerant that has collided with the substrate 1 flows through the first flow path together with the first refrigerant.
• the second refrigerant advances while cooling the substrate 1 and the plate-like member 2 by contacting the substrate 1 and the plate-like member 2. Thereafter, the second refrigerant is discharged together with the first refrigerant.
• the first flow path forming means formed so that the refrigerant contacts the heat radiating member, and the collision jet flow to collide with the region where the semiconductor element is disposed.
• Second flow path constituting means and the first flow path and the second flow path are separated.
• the first flow path by disposing the heat dissipating member, the heat dissipating area is expanded and heat can be removed efficiently.
• the second refrigerant is supplied in a state separated from the first refrigerant until it is ejected from the auxiliary pipe.
• the temperature of the first refrigerant flowing through the first flow path gradually increases toward the downstream side of the first refrigerant, but the temperature of the second refrigerant is substantially the same on the downstream side as well.
• the second coolant having a low temperature can collide with the semiconductor element 21, and the semiconductor element 21 can be efficiently cooled. Further, it is possible to suppress the cooling capacity from decreasing in the refrigerant flow path toward the downstream side, and the semiconductor element 21 can be cooled almost uniformly.
• the impinging jet and the cooling by the convection of the heat transfer member can be performed substantially separately, and the object to be cooled can be effectively cooled.
• the second flow path constituting means includes a main pipe and an auxiliary pipe.
• the first flow path includes a space sandwiched between the main pipe and the substrate.
• the plate-like member is arranged around the region where the semiconductor element is arranged.
• end surface 12 a of auxiliary pipe 12 is inclined so that the flow path becomes larger along the flow direction of the first refrigerant.
• the cooler in the present embodiment is arranged so that the surface on which the semiconductor element of the substrate is arranged faces the upper side in the vertical direction.
• the cooler is not limited to this form, and the cooler includes the semiconductor element of the substrate.
• the cooler is arranged so that the direction in which the surface of the substrate on which the semiconductor element is arranged extends is either the lead straight direction or the direction inclined with respect to the vertical direction. It does not matter.
• bubbles generated in the first channel or the second channel can be moved upward in the vertical direction. Air bubbles can be prevented from staying on the back side of the substrate. Even when air bubbles are generated in the first flow path or the second flow path, a liquid film can be secured on the back surface of the substrate.
• the plate-like member as the heat radiating member in the present embodiment is formed so that the height is substantially the same as the height of the first flow path. With this configuration, the plate-like member can be disposed over the entire height direction of the first flow path, and the heat transfer area can be increased. As a result, cooling with the first refrigerant can be performed effectively.
• a plurality of semiconductor elements are arranged along the direction in which the refrigerant flows, and an auxiliary tube having the same shape is arranged for each semiconductor element.
• the auxiliary pipe is not limited to this form, and auxiliary pipes of different sizes and different shapes may be arranged.
• a cylindrical tube is arranged as an auxiliary tube.
• the present invention is not limited to this configuration, and an arbitrary fl ⁇ shape can be adopted as the auxiliary tube.
• an auxiliary pipe with a large diameter is arranged for the object to be cooled with a large calorific value
• an auxiliary pipe with a small diameter is arranged for the object to be cooled with a small calorific value. You may arrange.
• the cooler in the present embodiment can easily adjust the amount of heat removal in accordance with each object to be cooled.
• an adjustment valve for adjusting the flow rate of the refrigerant ejected from the specific auxiliary pipe, a shut-off valve for blocking the flow of the specific auxiliary pipe, or the like may be arranged on the capture pipe or the main pipe. Absent. With this configuration, it is possible to adjust the flow rate of the collision jet in accordance with the heat generation amount of the object to be cooled, or to perform intermittent cooling by the collision jet. Furthermore, the heat generation amount of the cooled object may change in time series, but the flow rate of the collision jet can be changed in response to such fluctuations in the heat generation amount, and optimal cooling can be performed. . Further, in the present embodiment, the notch is formed in the plate member as the heat radiating member.
• the present invention is not limited to this form, and the plate member may not have the notch.
• the plate-like member may be formed so as to penetrate the auxiliary pipe.
• the plate-like member is not limited to a planar shape, and may be formed to have a curved surface.
• the same refrigerant is used for the first refrigerant and the second refrigerant.
• the present invention is not limited to this form, and different refrigerants may be used.
• the refrigerant is not limited to liquid but may contain gas.
• the cooler in the present embodiment is formed so that the direction of the flow of the first refrigerant in the first flow path and the direction of the flow of the second refrigerant in the second flow path are the same,
• the present invention is not limited to this configuration, and the flow direction of the first refrigerant in the first flow path and the flow direction of the second refrigerant in the second flow path may be different from each other.
• a refrigerant supply device for supplying the first refrigerant and a refrigerant supply device for supplying the second refrigerant may be arranged.
• the refrigerant supply device may include a circulation device that circulates while cooling the refrigerant.
• a description has been given by taking a high-power power converter as an example of a cooled object.
• the present invention is not limited to this form, and the present invention is applied to a cooler of an arbitrary cooled object. Can do.
• the present invention can be applied to a power converter with low power and a cooler for other objects to be cooled.
• the cooler in the present embodiment is a cooler for cooling the power converter.
• the cooler includes the first flow path forming means and the second flow path forming means as in the first embodiment.
• the heat radiating member for radiating the heat of the object to be cooled is different from the first embodiment.
• FIG. 5 is a schematic exploded perspective view of the semiconductor device according to the present embodiment.
• the heat radiating member in the present embodiment includes a rod-shaped member 3.
• the rod-shaped member 3 is fixed to the back surface of the substrate 1.
• the rod-shaped member 3 is disposed so as to protrude from the back surface of the substrate 1.
• the longitudinal direction is substantially perpendicular to the back surface of the substrate 1
• FIG. 6 shows a first schematic cross-sectional view of the semiconductor device according to the present embodiment.
• FIG. 6 is a schematic sectional view taken along a plane parallel to the main surface of the substrate.
• the rod-shaped member 3 is arranged around the auxiliary pipe 12.
• the rod-shaped member 3 is disposed around a region where the semiconductor element 21 is disposed.
• the rod-shaped member 3 is disposed in the vicinity of the region where the semiconductor element 21 is disposed.
• four rod-like members 3 are arranged for one semiconductor element 21.
• the first refrigerant flows in the direction indicated by arrow 51.
• FIG. 7 shows a second schematic cross-sectional view of the semiconductor device according to the present embodiment.
• FIG. 7 is a cross-sectional view taken along the line V I I—V I I in FIG.
• the rod-shaped member 3 is formed so as to have substantially the same length as the height of the first flow path sandwiched between the main pipe 11 and the substrate 1.
• the heat radiating member in the present embodiment includes a rod-shaped member. By changing the position, length, number, etc. of the rod-shaped members, the position where heat is removed by the heat radiating member and the contact area with the cooling medium can be easily changed.
• the rod-shaped member is disposed so as to surround the region where the body to be cooled is disposed.
• the present invention is not limited to this configuration, and the rod-shaped member collides with the cooling surface of the substrate. Thereafter, an arbitrary position and an arbitrary number can be arranged so as not to disturb the radial spread as much as possible and not to disturb the flow of the first refrigerant.
• the rod-like member in the present embodiment has substantially the same height as the first flow path through which the first refrigerant flows. By adopting this configuration, the rod-shaped member can be disposed over substantially the entire height direction of the first flow path, and cooling with the first refrigerant can be performed effectively.
• the cooler is provided with the first flow path forming means and the second flow path forming means as in the first embodiment.
• the cooler in the present embodiment includes the shape of the heat radiating member and the second The shape of the auxiliary pipe of the flow path forming means is different from that of the first embodiment.
• FIG. 8 shows a schematic cross-sectional view of the cooler in the present embodiment.
• FIG. 8 is a schematic sectional view taken along a plane perpendicular to the main surface of the substrate.
• the cooler in the present embodiment includes an auxiliary pipe 13 formed so as to protrude from the surface of the main pipe 11.
• the auxiliary pipe 13 is formed so that the cross-sectional shape is a mountain shape.
• the catching tube 13 is formed in a tapered shape so that the flow path becomes narrower toward the substrate 1.
• the end face of the auxiliary tube 13 in the present embodiment is formed so as to be substantially parallel to the substrate 1.
• the cooler in the present embodiment includes a plate-like member 4.
• the plate-like member 4 has a notch 4a.
• the notch 4 a is formed so as to incline along the shape of the auxiliary pipe 13.
• the notch 4 a is inclined so that the cross-sectional shape becomes narrower toward the substrate 1.
• the notch 4 a is formed so that the plate-like member 4 is separated from the auxiliary pipe 13.
• the second refrigerant flowing in as shown by the arrow 52 is discharged from the auxiliary pipe 13 as shown by the arrow 55.
• the second refrigerant is discharged from the auxiliary pipe 13 as shown by the arrow 55.
• the collision jet flow by the second refrigerant can be smoothly merged with the first refrigerant.
• the pressure and flow rate of the impinging jet can be easily adjusted by changing the tapered shape of the auxiliary pipe.
• the first refrigerant in the first flow path tends to move closer to the substrate 1, and the second refrigerant after colliding with the substrate 1 is removed. You can stop at board 1. For this reason, the cooling effect of the board
• coolant can be improved. Furthermore, the first refrigerant and the second refrigerant can be flowed in the first flow path, and the pressure loss due to the mixture of both refrigerants can be reduced. Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof will not be repeated here.
• the cooler in the present embodiment includes third flow path configuring means in addition to the first flow path configuring means and the second flow path configuring means. That is, in this embodiment, The cooler has a third flow path in addition to the first flow path and the second flow path.
• the third channel is formed so as to communicate with the second channel.
• FIG. 9 shows a first schematic cross-sectional view of the cooler in the present embodiment.
• FIG. 9 is a schematic cross-sectional view taken along a plane parallel to the main surface of the substrate.
• FIG. 10 shows a second schematic cross-sectional view of the cooler in the present embodiment.
• FIG. 10 is a cross-sectional view taken along the line X—X in FIG.
• the cooler in the present embodiment includes third flow path configuring means that constitutes a third flow path for discharging the refrigerant flowing in the second flow path.
• the third flow path forming means includes a separator 6.
• the separator 6 is disposed between the main pipe 11 and the substrate 1.
• the separator 6 is formed in a flat plate shape.
• the separator 6 is arranged so that the main surface is substantially parallel to the back surface of the substrate 1.
• the separator 6 is arranged so as to divide the first flow path into two flow paths.
• the second flow path component in the present embodiment includes an auxiliary pipe 14.
• the auxiliary pipe 14 is disposed so as to penetrate the separator 6.
• the spout of the auxiliary pipe 14 is disposed in a space sandwiched between the substrate 1 and the separator plate 6.
• the auxiliary pipe 14 is fixed to the separator 6 without a gap. In other words, ⁇ is formed so that there is no gap between the auxiliary pipe 14 and the separator 6.
• the cooler in the present embodiment includes a plate-like member 7 as a heat radiating member.
• the plate-like member 7 is formed so as to penetrate the separator plate 6.
• the plate-like member 7 has a notch 7a.
• the notch 7 a is formed so that the planar shape is circular.
• the notch 7 a is formed along the shape of the auxiliary pipe 14.
• the first flow path is formed by a space sandwiched between the main pipe 11 and the separator 6.
• a third flow path is formed by a space sandwiched between the substrate 1 and the separator 6.
• a second flow path is formed by the main pipe 11 and the auxiliary pipe 14.
• the refrigerant supply device in the present embodiment is formed so as to supply the refrigerant directly to the first flow path and the second flow path, and is configured not to supply the refrigerant directly to the third flow path. Has been.
• the first channel and the second channel are isolated.
• 1st refrigerant Proceeds in the first flow path while cooling the plate-like member 7 as indicated by an arrow 51.
• the second refrigerant is ejected from the auxiliary pipe 14 as indicated by an arrow 53 in the second flow path.
• the second refrigerant cools the back surface of the substrate 1 as a collision jet.
• the second refrigerant flows through the third flow path after colliding with the substrate 1. In the third flow path, it flows toward the discharge port as indicated by an arrow 56. In the third flow path, the second refrigerant proceeds while cooling the substrate 1 and the plate-like member 7. The first route is completely separated from the second and third routes.
• the path for cooling by the impinging jet is separated from the path for cooling the heat radiating member.
• the second refrigerant for the impinging jet and the first refrigerant for cooling the heat dissipating member are not mixed.
• the cooler in the present embodiment can avoid mixing the first refrigerant and the second refrigerant.
• different refrigerants can be used as the first refrigerant and the second refrigerant, respectively.
• the refrigerant supply device may be a supply device including a first refrigerant circulation device and a second refrigerant circulation device different from the first refrigerant.
• the plate-like member has a notch, and the notch is formed along the shape of the auxiliary pipe.
• the second refrigerant ejected from the auxiliary pipe spreads radially along the shape of the catching pipe, but this configuration can prevent the spread of the second refrigerant from being obstructed by the plate-like member.
• the cooler of the power converter excellent in cooling performance can be provided.
• the present invention can be applied to a cooler.
• it can be advantageously applied to a cooler of a power converter.

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• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)

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• 2006
  • 2006-04-06 JP JP2006105056A patent/JP4649359B2/ja not_active Expired - Fee Related
• 2007
  • 2007-03-28 WO PCT/JP2007/057522 patent/WO2007116894A1/ja active Application Filing
  • 2007-03-28 CN CN2007800123917A patent/CN101416307B/zh not_active Expired - Fee Related
  • 2007-03-28 DE DE112007000829T patent/DE112007000829B4/de not_active Expired - Fee Related
  • 2007-03-28 US US12/293,469 patent/US20090090490A1/en not_active Abandoned

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