DE112007000829B4 - Anordnung aus Wechselrichter und Kühler und ihre Verwendung - Google Patents

Anordnung aus Wechselrichter und Kühler und ihre Verwendung Download PDF

Info

Publication number
DE112007000829B4
DE112007000829B4 DE112007000829T DE112007000829T DE112007000829B4 DE 112007000829 B4 DE112007000829 B4 DE 112007000829B4 DE 112007000829 T DE112007000829 T DE 112007000829T DE 112007000829 T DE112007000829 T DE 112007000829T DE 112007000829 B4 DE112007000829 B4 DE 112007000829B4
Authority
DE
Germany
Prior art keywords
coolant
substrate
flow path
inverter
main pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112007000829T
Other languages
German (de)
English (en)
Other versions
DE112007000829T5 (de
Inventor
Tadafumi Yoshida
Yutaka Yokoi
Hiroshi Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of DE112007000829T5 publication Critical patent/DE112007000829T5/de
Application granted granted Critical
Publication of DE112007000829B4 publication Critical patent/DE112007000829B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE112007000829T 2006-04-06 2007-03-28 Anordnung aus Wechselrichter und Kühler und ihre Verwendung Expired - Fee Related DE112007000829B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006105056A JP4649359B2 (ja) 2006-04-06 2006-04-06 冷却器
JP2006-105056 2006-04-06
PCT/JP2007/057522 WO2007116894A1 (ja) 2006-04-06 2007-03-28 冷却器

Publications (2)

Publication Number Publication Date
DE112007000829T5 DE112007000829T5 (de) 2009-02-12
DE112007000829B4 true DE112007000829B4 (de) 2012-07-19

Family

ID=38581184

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007000829T Expired - Fee Related DE112007000829B4 (de) 2006-04-06 2007-03-28 Anordnung aus Wechselrichter und Kühler und ihre Verwendung

Country Status (5)

Country Link
US (1) US20090090490A1 (enrdf_load_stackoverflow)
JP (1) JP4649359B2 (enrdf_load_stackoverflow)
CN (1) CN101416307B (enrdf_load_stackoverflow)
DE (1) DE112007000829B4 (enrdf_load_stackoverflow)
WO (1) WO2007116894A1 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024104109A1 (de) 2023-02-17 2024-08-22 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
DE102024113532A1 (de) 2023-05-22 2024-11-28 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
DE102024113533A1 (de) 2023-05-22 2024-11-28 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
DE102024121187A1 (de) 2023-07-27 2025-01-30 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlanordnung sowie Kühlanordnung für leistungselektronische Bauteile

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4785878B2 (ja) 2008-02-06 2011-10-05 本田技研工業株式会社 冷却装置及び該冷却装置を備える電気車両
JP4586087B2 (ja) * 2008-06-30 2010-11-24 株式会社日立製作所 パワー半導体モジュール
US8248809B2 (en) * 2008-08-26 2012-08-21 GM Global Technology Operations LLC Inverter power module with distributed support for direct substrate cooling
US8169779B2 (en) * 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
US8305755B2 (en) * 2010-03-04 2012-11-06 Toyota Motor Engineering & Manufacturing North America, Inc. Power modules, cooling devices and methods thereof
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
JP2013128051A (ja) * 2011-12-19 2013-06-27 Mahle Filter Systems Japan Corp インバータ回路の冷却装置
DE102012202708A1 (de) * 2012-02-22 2013-08-22 Siemens Aktiengesellschaft Vorrichtung zur Kühlung von elektrischen Bauteilen
JP5938574B2 (ja) * 2012-04-09 2016-06-22 パナソニックＩｐマネジメント株式会社 冷却装置およびこれを搭載した電気自動車
KR101540146B1 (ko) * 2012-06-22 2015-07-28 삼성전기주식회사 전력 모듈용 방열 시스템
US9353999B2 (en) * 2012-07-30 2016-05-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and electronics modules having branching microchannels
JP6015209B2 (ja) * 2012-07-31 2016-10-26 株式会社ソシオネクスト 温度調節装置、温度調節方法、電子装置の製造方法及び温度調節プログラム
CN102799244B (zh) * 2012-08-27 2016-06-22 无锡市福曼科技有限公司 计算机cpu的多流道水冷装置结构
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
WO2014152354A1 (en) 2013-03-14 2014-09-25 Rochester Institute Of Technology Heat transfer system and method incorporating tapered flow field
US9410746B2 (en) 2013-03-20 2016-08-09 Basf Se Temperature-regulating element
JP6157887B2 (ja) * 2013-03-21 2017-07-05 株式会社豊田中央研究所 冷却装置
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US9352856B1 (en) * 2013-12-04 2016-05-31 Space Systems/Loral, Llc Axially grooved crossing heat pipes
JP5880531B2 (ja) 2013-12-11 2016-03-09 トヨタ自動車株式会社 冷却器
JP6162632B2 (ja) * 2014-03-25 2017-07-12 株式会社Ｓｏｋｅｎ 冷却器
WO2016117094A1 (ja) * 2015-01-22 2016-07-28 三菱電機株式会社 半導体装置
FR3031969B1 (fr) * 2015-01-27 2017-01-27 Airbus Defence & Space Sas Satellite artificiel et procede de remplissage d'un reservoir de gaz propulsif dudit satellite artificiel
JP6448819B2 (ja) * 2015-06-02 2019-01-09 エアバス ディフェンス アンド スペース エスアーエス 人工衛星
DE102016214959B4 (de) * 2016-08-11 2018-06-28 Siemens Healthcare Gmbh Temperiereinheit für ein elektronisches Bauelement und Verfahren zu dessen Herstellung
JP6715818B2 (ja) 2017-03-22 2020-07-01 ベジ 佐々木 冷却構造体、冷却システム、発熱装置および構造物
WO2020102371A1 (en) * 2018-11-13 2020-05-22 Magna International Inc. Impinging jet coldplate for power electronics with enhanced heat transfer
US10490482B1 (en) * 2018-12-05 2019-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices including jet cooling with an intermediate mesh and methods for using the same
CN109764706B (zh) * 2019-03-12 2024-04-26 山东省科学院能源研究所 一种带有喷管的微通道换热器结构及工作方法
WO2020240777A1 (ja) 2019-05-30 2020-12-03 三菱電機株式会社 半導体装置
JP7307010B2 (ja) * 2020-02-28 2023-07-11 トヨタ自動車株式会社 冷却器
JP7580233B2 (ja) * 2020-10-01 2024-11-11 株式会社日立製作所 半導体装置およびホイール内蔵システム
JP7544881B2 (ja) * 2023-01-23 2024-09-03 Ｎｅｃプラットフォームズ株式会社 冷却器および電子機器
DE102023211440A1 (de) * 2023-11-17 2025-05-22 Schaeffler Technologies AG & Co. KG Leistungselektronik-Kühler, Leistungselektronikvorrichtung und Inverter

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02100350A (ja) 1988-10-06 1990-04-12 Nec Corp 集積回路の冷却構造
JPH053274A (ja) 1991-06-26 1993-01-08 Hitachi Ltd 半導体冷却装置
JPH05190716A (ja) 1992-01-08 1993-07-30 Hitachi Ltd 半導体装置及びその製造方法
JPH06112385A (ja) 1992-09-30 1994-04-22 Nec Corp 半導体素子の冷却構造
JP2004064050A (ja) * 2002-06-06 2004-02-26 Denki Kagaku Kogyo Kk モジュール構造体とそれに好適な回路基板
JP2005045027A (ja) * 2003-07-22 2005-02-17 Nippon Soken Inc 半導体素子の冷却装置
JP2005079337A (ja) * 2003-08-29 2005-03-24 Toshiba Corp 液冷装置及び液冷システム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.
JPH02298054A (ja) * 1989-05-12 1990-12-10 Fujitsu Ltd 冷却装置
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
JP3203475B2 (ja) * 1996-06-28 2001-08-27 株式会社日立製作所 半導体装置
JP3771361B2 (ja) * 1997-11-26 2006-04-26 株式会社日立製作所 燃料噴射弁
JP2002314280A (ja) * 2001-04-10 2002-10-25 Denki Kagaku Kogyo Kk 回路基板の冷却構造及び冷却方法
JP3946018B2 (ja) * 2001-09-18 2007-07-18 株式会社日立製作所 液冷却式回路装置
EP1331665B1 (de) * 2002-01-26 2009-10-14 Danfoss Silicon Power GmbH Kühlvorrichtung
JP2005136278A (ja) * 2003-10-31 2005-05-26 Mitsubishi Electric Corp パワー半導体モジュール及びその製造方法
CN2696126Y (zh) * 2004-04-06 2005-04-27 谢步明 Igbt迷宫式水冷散热器
JP4265500B2 (ja) * 2004-07-14 2009-05-20 株式会社デンソー 発熱体冷却装置
US7184269B2 (en) * 2004-12-09 2007-02-27 International Business Machines Company Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02100350A (ja) 1988-10-06 1990-04-12 Nec Corp 集積回路の冷却構造
JPH053274A (ja) 1991-06-26 1993-01-08 Hitachi Ltd 半導体冷却装置
JPH05190716A (ja) 1992-01-08 1993-07-30 Hitachi Ltd 半導体装置及びその製造方法
JPH06112385A (ja) 1992-09-30 1994-04-22 Nec Corp 半導体素子の冷却構造
JP2004064050A (ja) * 2002-06-06 2004-02-26 Denki Kagaku Kogyo Kk モジュール構造体とそれに好適な回路基板
JP2005045027A (ja) * 2003-07-22 2005-02-17 Nippon Soken Inc 半導体素子の冷却装置
JP2005079337A (ja) * 2003-08-29 2005-03-24 Toshiba Corp 液冷装置及び液冷システム

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024104109A1 (de) 2023-02-17 2024-08-22 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
DE102024113532A1 (de) 2023-05-22 2024-11-28 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
DE102024113533A1 (de) 2023-05-22 2024-11-28 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
DE102024121187A1 (de) 2023-07-27 2025-01-30 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlanordnung sowie Kühlanordnung für leistungselektronische Bauteile

Also Published As

Publication number Publication date
JP4649359B2 (ja) 2011-03-09
CN101416307A (zh) 2009-04-22
US20090090490A1 (en) 2009-04-09
JP2007281163A (ja) 2007-10-25
WO2007116894A1 (ja) 2007-10-18
CN101416307B (zh) 2010-11-03
DE112007000829T5 (de) 2009-02-12

Similar Documents

Publication Publication Date Title
DE112007000829B4 (de) Anordnung aus Wechselrichter und Kühler und ihre Verwendung
DE69626662T2 (de) Mit flüssigkeit gekühlter kühlkorper zur kühlung von elektronischen bauteilen
DE112007001424B4 (de) Kühler
DE112008000040B4 (de) Kühlstruktur einer Wärmesenke für eine Wärme erzeugende Komponente und Antriebseinheit
DE60208953T2 (de) Kühlplatte mit plattem Schlauch zur Flüssigkeitskühlung elektrischer Komponenten
DE102021105438B4 (de) Wärmeableitvorrichtung zur flüssigkeitskühlung
DE102008026550B4 (de) Halbleitereinrichtungen mit Schichten mit erweiterten Umfängen für eine verbesserte Kühlung und Verfahren zum Kühlen von Halbleitereinrichtungen
DE102010043904A1 (de) Leistungselektroniksubstrat für direkte Substratkühlung
DE102021105437A1 (de) Mehrkanal-wasserkühlungsradiator mit hohem wirkungsgrad
DE112014004930B4 (de) Kühlkörper für Leistungsmodule einer Leistungswandleranordnung, Leistungswandleranordnung mit einem solchen Kühlkörper und Herstellungsverfahren für einen solchen Kühlkörper
DE102013101747A1 (de) Kühler und kühleinrichtung
DE10393588T5 (de) Optimales Ausbreitungssystem, Vorrichtung und Verfahren für flüssigkeitsgekühlten, mikroskalierten Wärmetausch
DE102007063173A1 (de) Thermoelektrischer Generator
EP2003744A1 (de) Gasgekühltes Lasergerät für hochkompakte Laserstrahlquellen
DE102016110043A1 (de) Flüssigkeitsgekühlte Kühleinrichtung, um einen wärmeerzeugenden Körper zu kühlen, der z.B. elektronische Komponenten wie Halbleiterbauteile umfasst
DE112006003812T5 (de) Kühlvorrichtung
DE112014005635B4 (de) Kühler
DE112018005305B4 (de) Kühlkörperanordnung
DE102012206360B4 (de) Kühlvorrichtung
DE102020213849A1 (de) Flüssigkeits-Kühlkörper, insbesondere zur Kühlung von Leistungselektronik-Bauelementen
DE102005034998B4 (de) Verfahren zur Herstellung einer Vorrichtung zur Kühlung von elektronischen Bauelementen sowie Vorrichtung zur Kühlung von elektronischen Bauelementen
DE102018218049B4 (de) Kühlmodul für ein Fahrzeug-Steuergerät, Fahrzeug-Steuergerät mit einem Kühlmodul und Verfahren zur Wasserkühlung eines Fahrzeug-Steuergeräts
WO2020011438A1 (de) Leistungselektronikeinheit
EP3997730B1 (de) Verfahren zur herstellung eines kühlelements und kühlelement hergestellt mit einem solchen verfahren
DE102021131736A1 (de) Kühlanordnung

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R016 Response to examination communication
R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20121020

R084 Declaration of willingness to licence
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee