CN101416307B - 冷却器 - Google Patents

冷却器 Download PDF

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Publication number
CN101416307B
CN101416307B CN2007800123917A CN200780012391A CN101416307B CN 101416307 B CN101416307 B CN 101416307B CN 2007800123917 A CN2007800123917 A CN 2007800123917A CN 200780012391 A CN200780012391 A CN 200780012391A CN 101416307 B CN101416307 B CN 101416307B
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CN
China
Prior art keywords
substrate
refrigerant
flow path
cooler
stream
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800123917A
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English (en)
Chinese (zh)
Other versions
CN101416307A (zh
Inventor
吉田忠史
横井丰
长田裕司
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Toyota Motor Corp
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Toyota Motor Corp
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Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of CN101416307A publication Critical patent/CN101416307A/zh
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Publication of CN101416307B publication Critical patent/CN101416307B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN2007800123917A 2006-04-06 2007-03-28 冷却器 Expired - Fee Related CN101416307B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006105056A JP4649359B2 (ja) 2006-04-06 2006-04-06 冷却器
JP105056/2006 2006-04-06
PCT/JP2007/057522 WO2007116894A1 (ja) 2006-04-06 2007-03-28 冷却器

Publications (2)

Publication Number Publication Date
CN101416307A CN101416307A (zh) 2009-04-22
CN101416307B true CN101416307B (zh) 2010-11-03

Family

ID=38581184

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800123917A Expired - Fee Related CN101416307B (zh) 2006-04-06 2007-03-28 冷却器

Country Status (5)

Country Link
US (1) US20090090490A1 (enrdf_load_stackoverflow)
JP (1) JP4649359B2 (enrdf_load_stackoverflow)
CN (1) CN101416307B (enrdf_load_stackoverflow)
DE (1) DE112007000829B4 (enrdf_load_stackoverflow)
WO (1) WO2007116894A1 (enrdf_load_stackoverflow)

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US8248809B2 (en) * 2008-08-26 2012-08-21 GM Global Technology Operations LLC Inverter power module with distributed support for direct substrate cooling
US8169779B2 (en) * 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
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US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
JP2013128051A (ja) * 2011-12-19 2013-06-27 Mahle Filter Systems Japan Corp インバータ回路の冷却装置
DE102012202708A1 (de) * 2012-02-22 2013-08-22 Siemens Aktiengesellschaft Vorrichtung zur Kühlung von elektrischen Bauteilen
JP5938574B2 (ja) * 2012-04-09 2016-06-22 パナソニックＩｐマネジメント株式会社 冷却装置およびこれを搭載した電気自動車
KR101540146B1 (ko) * 2012-06-22 2015-07-28 삼성전기주식회사 전력 모듈용 방열 시스템
US9353999B2 (en) * 2012-07-30 2016-05-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and electronics modules having branching microchannels
JP6015209B2 (ja) * 2012-07-31 2016-10-26 株式会社ソシオネクスト 温度調節装置、温度調節方法、電子装置の製造方法及び温度調節プログラム
CN102799244B (zh) * 2012-08-27 2016-06-22 无锡市福曼科技有限公司 计算机cpu的多流道水冷装置结构
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
WO2014152354A1 (en) 2013-03-14 2014-09-25 Rochester Institute Of Technology Heat transfer system and method incorporating tapered flow field
US9410746B2 (en) 2013-03-20 2016-08-09 Basf Se Temperature-regulating element
JP6157887B2 (ja) * 2013-03-21 2017-07-05 株式会社豊田中央研究所 冷却装置
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US9352856B1 (en) * 2013-12-04 2016-05-31 Space Systems/Loral, Llc Axially grooved crossing heat pipes
JP5880531B2 (ja) 2013-12-11 2016-03-09 トヨタ自動車株式会社 冷却器
JP6162632B2 (ja) * 2014-03-25 2017-07-12 株式会社Ｓｏｋｅｎ 冷却器
WO2016117094A1 (ja) * 2015-01-22 2016-07-28 三菱電機株式会社 半導体装置
FR3031969B1 (fr) * 2015-01-27 2017-01-27 Airbus Defence & Space Sas Satellite artificiel et procede de remplissage d'un reservoir de gaz propulsif dudit satellite artificiel
JP6448819B2 (ja) * 2015-06-02 2019-01-09 エアバス ディフェンス アンド スペース エスアーエス 人工衛星
DE102016214959B4 (de) * 2016-08-11 2018-06-28 Siemens Healthcare Gmbh Temperiereinheit für ein elektronisches Bauelement und Verfahren zu dessen Herstellung
JP6715818B2 (ja) 2017-03-22 2020-07-01 ベジ 佐々木 冷却構造体、冷却システム、発熱装置および構造物
WO2020102371A1 (en) * 2018-11-13 2020-05-22 Magna International Inc. Impinging jet coldplate for power electronics with enhanced heat transfer
US10490482B1 (en) * 2018-12-05 2019-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices including jet cooling with an intermediate mesh and methods for using the same
CN109764706B (zh) * 2019-03-12 2024-04-26 山东省科学院能源研究所 一种带有喷管的微通道换热器结构及工作方法
WO2020240777A1 (ja) 2019-05-30 2020-12-03 三菱電機株式会社 半導体装置
JP7307010B2 (ja) * 2020-02-28 2023-07-11 トヨタ自動車株式会社 冷却器
JP7580233B2 (ja) * 2020-10-01 2024-11-11 株式会社日立製作所 半導体装置およびホイール内蔵システム
JP7544881B2 (ja) * 2023-01-23 2024-09-03 Ｎｅｃプラットフォームズ株式会社 冷却器および電子機器
AT526330B1 (de) 2023-02-17 2024-02-15 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
AT527256B1 (de) 2023-05-22 2025-04-15 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
AT526921B1 (de) 2023-05-22 2024-09-15 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
AT527041B1 (de) 2023-07-27 2024-10-15 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlanordnung sowie Kühlanordnung für leistungselektronische Bauteile
DE102023211440A1 (de) * 2023-11-17 2025-05-22 Schaeffler Technologies AG & Co. KG Leistungselektronik-Kühler, Leistungselektronikvorrichtung und Inverter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2696126Y (zh) * 2004-04-06 2005-04-27 谢步明 Igbt迷宫式水冷散热器

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JPH02298054A (ja) * 1989-05-12 1990-12-10 Fujitsu Ltd 冷却装置
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
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JP4265500B2 (ja) * 2004-07-14 2009-05-20 株式会社デンソー 発熱体冷却装置
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Publication number Priority date Publication date Assignee Title
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JP特开2002-314280A 2002.10.25
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Also Published As

Publication number Publication date
JP4649359B2 (ja) 2011-03-09
CN101416307A (zh) 2009-04-22
US20090090490A1 (en) 2009-04-09
JP2007281163A (ja) 2007-10-25
WO2007116894A1 (ja) 2007-10-18
DE112007000829B4 (de) 2012-07-19
DE112007000829T5 (de) 2009-02-12

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