US20090090490A1 - Cooler - Google Patents

Cooler Download PDF

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Publication number
US20090090490A1
US20090090490A1 US12/293,469 US29346907A US2009090490A1 US 20090090490 A1 US20090090490 A1 US 20090090490A1 US 29346907 A US29346907 A US 29346907A US 2009090490 A1 US2009090490 A1 US 2009090490A1
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United States
Prior art keywords
flow path
substrate
coolant
secondary pipe
configuring
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US12/293,469
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English (en)
Inventor
Tadafumi Yoshida
Yutaka Yokoi
Hiroshi Osada
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Toyota Motor Corp
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Toyota Motor Corp
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Filing date
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Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA reassignment TOYOTA JIDOSHA KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OSADA, HIROSHI, YOKOI, YUTAKA, YOSHIDA, TADAFUMI
Publication of US20090090490A1 publication Critical patent/US20090090490A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Definitions

  • the present invention relates to coolers, and particularly to coolers for electric power converters.
  • a hybrid vehicle is a vehicle employing a conventional engine and in addition thereto a motor as motive power.
  • the hybrid vehicle drives the engine to obtain motive power and also converts direct current voltage that is received from a direct current power supply into alternate current voltage which is in turn used to drive the motor to obtain motive power.
  • An electric vehicle is a vehicle converting direct current voltage that is received from a direct current power supply into alternate current voltage which is in turn used to drive the motor to obtain motive power.
  • Such vehicles employing electricity as a source of motive power has an electric power converter mounted therein.
  • the electric power converter includes e.g., an inverter, a converter and/or a similar power semiconductor device.
  • the power semiconductor device includes e.g., a power MOSFET (Metal Oxide Semiconductor Field-Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), and the like.
  • An electric power converter mounted in a vehicle or the like may require large electric power to provide the vehicle with high motive power performance.
  • An electric power converter or the like of large electric power generates a large quantity of heat. Accordingly a cooler is mounted to cool the electric power converter.
  • a cooling plate or fin
  • a member that is directly adjacent to the electric power converter or the like to transfer heat across an increased area to more efficiently cool the element, or to cause a jet stream of coolant water to impinge on a region that has the electric power converter therein to cool it. Furthermore, it is effective to combine these techniques together.
  • Japanese Patent Laying-Open No. 2-100350 discloses a structure including a cooling plate having a fin for cooling an integrated circuit.
  • the disclosed structure includes: an integrated circuit having a plurality of integrated circuit devices mounted on a substrate; a substrate frame holding the substrate; a cooling plate having a counter boring at a surface of the substrate opposite to the integrated circuit devices, and also having a fin in the form of a sector disposed at a bottom surface of the counter boring; and a nozzle jetting a coolant to the center of the fin in the form of the sector.
  • the publication discloses that the structure can reduce thermal resistance between the integrated circuit devices and the coolant and reduce the coolant in flow rate to efficiently discharge heat to outside the equipment.
  • Japanese Patent Laying-Open No. 5-3274 discloses a semiconductor cooling apparatus including: a plurality of semiconductor devices aligned on a substrate; a coolant medium supplying header opposite to the substrate with a corresponding semiconductor device interposed therebetween; a tubular coolant medium supplying member communicating with the coolant medium supplying header; a coolant medium jetting outlet provided at an end of the coolant medium supplying member to jet a coolant medium that is received from the coolant medium supplying header toward a corresponding semiconductor device; and a coolant medium return header.
  • the substrate is provided perpendicularly and a coolant medium return pipe is provided to communicate with the coolant medium return head, and a diaphragm member is also provided to provide a diaphragm between the semiconductor devices.
  • this semiconductor cooling apparatus can prevent bubbles of the coolant medium generated at each device from flowing to the other devices and cool each device independently, and thus reduce the difference in temperature between the devices.
  • Japanese Patent Laying-Open No. 6-112385 discloses a structure having a radiator and a nozzle combined together for cooling a semiconductor device.
  • the radiator has a bottom heat sink and first and second perpendicular heat sinks and the bottom heat sink is provided at a heat radiating surface of a case mounted on an interconnection substrate and having a semiconductor device mounted therein.
  • the first perpendicular heat sink is formed of a plurality of curved heat radiating plates. Their curved projecting surfaces face each other, and therebetween a flow path for a jet stream is formed.
  • the second perpendicular heat sink is provided at a jet stream outlet of a path formed by the first perpendicular heat sink, and the nozzle jets a coolant through the path formed by the first perpendicular heat sink to cause the coolant to impinge on the bottom heat sink.
  • the publication discloses that the structure allows the coolant that has once impinged in a jet stream to again impinge on a heat sink in a jet stream to more efficiently cool the device without increasing the coolant in flow velocity, flow rate or the like.
  • Japanese Patent Laying-Open No. 5-190716 discloses a semiconductor apparatus having on a multilayer ceramic substrate a large number of integrated circuit packages each having a cooling jacket attached thereto.
  • Each cooling jacket has a flexible tube connected thereto.
  • a flexible flow path is internally provided with a nozzle for causing a coolant fluid to flow into the cooling jacket in a jet stream in the form of a slit.
  • the cooling jacket is internally provided with a fin, and a space for returning the coolant fluid.
  • the semiconductor apparatus can utilize water, which has a high ability as a coolant, as a coolant medium, use a fin in the form of a flat plate helping to provide an increased heat transferring area, and provide a jet stream in the form of a slit allowing each fin to receive the coolant fluid uniformly, so that a semiconductor apparatus of an excellent cooling structure can be provided.
  • a cooler may be mounted to cool the electric power converter, and in particular, it is an important issue to cool the electric power converter or a similar a heat generating element accommodating large electric power.
  • the present invention contemplates a cooler excellent in performance for cooling an electric power converter.
  • the present cooler includes: a substrate for disposing a heat generating element on one surface thereof; a heat radiating member fixed to an other surface of the substrate; first flow path configuring means for configuring a first flow path formed to allow a coolant to contact the heat radiating member; and second flow path configuring means for configuring a second flow path formed to jet a coolant toward the other surface opposite to a region having the heat generating element disposed therein.
  • the second flow path is separated from the first flow path.
  • the heat radiating member includes at least one of a plate member and a bar member.
  • the heat radiating member surrounds a region opposite to that having the heat generating element disposed therein.
  • the second flow path configuring means includes a primary pipe remote from the other surface of the substrate, and a secondary pipe projecting from the primary pipe toward the substrate. The secondary pipe is opposite to the region of the substrate having the heat generating element disposed therein.
  • the first flow path includes a space sandwiched between the primary pipe and the substrate.
  • the secondary pipe has an end surface opposite to the substrate, and the end surface inclines to provide a larger flow path in a direction in which the coolant flows along the first flow path configuring means.
  • the secondary pipe is tapered to be narrower toward the substrate.
  • the present cooler further includes third flow path configuring means for discharging the coolant flowing through the second flow path.
  • the third flow path configuring means includes a diaphragm between the primary pipe and the substrate.
  • the secondary pipe penetrates the diaphragm.
  • the secondary pipe is fixed to the diaphragm without a gap.
  • the substrate has the one surface extending in one of a vertical direction and a direction inclined relative to the vertical direction.
  • the substrate has the one surface facing downward in a vertical direction.
  • FIG. 1 is a general exploded perspective view of a semiconductor apparatus in a first embodiment.
  • FIG. 2 is a first general cross section of the semiconductor apparatus in the first embodiment.
  • FIG. 3 is a second general cross section of the semiconductor apparatus in the first embodiment.
  • FIG. 4 is a third general cross section of the semiconductor apparatus in the first embodiment.
  • FIG. 5 is a general exploded perspective view of a semiconductor apparatus in a second embodiment.
  • FIG. 6 is a first general cross section of the semiconductor apparatus in the second embodiment.
  • FIG. 7 is a second general cross section of the semiconductor apparatus in the second embodiment.
  • FIG. 8 is a general cross section of a semiconductor apparatus in a third embodiment.
  • FIG. 9 is a first general cross section of a semiconductor apparatus in a fourth embodiment.
  • FIG. 10 is a second general cross section of the semiconductor apparatus in the fourth embodiment.
  • the present invention in a first embodiment provides a cooler, as will be described hereinafter.
  • the cooler is a cooler for cooling an electric power converter as an object to be cooled.
  • the electric power converter includes an inverter for converting direct current electric power to alternate current electric power, a converter for changing voltage, and other similar components.
  • the electric power converter includes a power MOSFET, an IGBT or an other similar power semiconductor device.
  • FIG. 1 is a general exploded perspective view of a semiconductor apparatus in the present embodiment.
  • the semiconductor apparatus includes an electric power converter serving as electronics, and a cooler for cooling the electric power converter.
  • the semiconductor apparatus includes the electric power converter that is implemented as a semiconductor device 21 .
  • Semiconductor device 21 is formed to be rectangular as seen in a plane.
  • Semiconductor device 21 is connected to an external electric circuit (not shown).
  • Semiconductor device 21 is a heat generating element generating heat when it is driven.
  • semiconductor device 21 is an object to be cooled.
  • the cooler includes a substrate 1 having one surface with semiconductor device 21 disposed thereon.
  • Substrate 1 is in the form of a plate.
  • substrate 1 has a front surface with a plurality of semiconductor devices 21 mounted thereon.
  • Semiconductor device 21 is disposed to have a major surface bonded to substrate 1 , as indicated by an arrow 54 .
  • substrate 1 includes a metal plate and an insulation layer deposited on a surface of the metal plate.
  • Semiconductor device 21 is fixed on a surface of the insulation layer.
  • the cooler includes a heat radiating member fixed to a surface of substrate 1 that is opposite to that having semiconductor device 21 disposed thereon.
  • the heat radiating member includes a plate member 2 .
  • Plate member 2 is for example a straight fin.
  • Plate member 2 is provided at at least one of a region opposite to that having semiconductor device 21 disposed therein and a region surrounding the region opposite to that having semiconductor device 21 disposed therein.
  • Plate member 2 is provided at a back surface of substrate 1 .
  • Plate member 2 is disposed to have a major surface substantially perpendicular to a major surface of substrate 1 .
  • FIG. 2 is a first general cross section of the semiconductor apparatus in the present embodiment.
  • FIG. 2 is a general cross section thereof cut at a plane parallel to the major surface of the substrate.
  • the semiconductor apparatus's cooler includes a plurality of plate members 2 disposed in alignment. Plate members 2 are disposed to have their respective major surfaces substantially parallel to one another. Plate member 2 is spaced from one another. Plate member 2 has a cutout portion 2 a formed in a region having a secondary pipe 12 , which will be described later.
  • FIG. 3 is a second general cross section of the semiconductor apparatus in the present embodiment.
  • FIG. 4 is a third general cross section of the semiconductor apparatus in the present embodiment.
  • FIG. 3 is a cross section taken along a line III-III in FIG. 2 and
  • FIG. 4 is a cross section taken along a line IV-IV in FIG. 2 .
  • plate member 2 is formed to be rectangular as seen in a plane. Cutout portion 2 a is formed to provide a gap between secondary pipe 12 and an end of plate member 2 .
  • An arrow 51 indicates a direction in which a coolant medium flows.
  • Plate member 2 is disposed to have the major surface substantially parallel to the direction in which the coolant flows. Plate member 2 is formed to be substantially equal in height to a first flow path described later.
  • the cooler includes first flow path configuring means formed to allow a coolant to contact a heat radiating member.
  • the first flow path configuring means is formed to configure the first flow path for the coolant.
  • the first flow path configuring means includes substrate 1 and a primary pipe 11 facing that side of substrate 1 which has plate member 2 .
  • a first flow path configuring member includes a wall member 5 provided sideways of substrate 1 and primary pipe 11 .
  • the first flow path is defined by a space surrounded by substrate 1 , primary pipe 11 and wall member 5 .
  • the cooler is formed to pass a first coolant through the first flow path sandwiched between substrate 1 and primary pipe 11 .
  • a coolant supply device (not shown) is provided for supplying the first flow path of the cooler with a coolant.
  • the cooler includes second flow path configuring means formed to cause a second coolant to impinge on the back surface of substrate 1 at a region opposite to that having the electric power converter disposed therein.
  • the second flow path configuring means is formed to jet the second coolant directly to the portion opposite to that having the electric power converter disposed thereon.
  • the second flow path configuring means is formed to configure a second flow path for a coolant.
  • the second flow path configuring member includes primary pipe 11 spaced from the back surface of substrate 1 .
  • Primary pipe 11 includes a flow path configuring plate 11 a and a flow path configuring plate 11 b spaced from each other and having their respective major surfaces parallel to each other.
  • Sideways of flow path configuring plates 11 a and 11 b, wall member 5 is provided.
  • a space surrounded by flow path configuring plates 11 a, 11 b and wall member 5 defines a portion of the second flow path.
  • the second flow path configuring means includes secondary pipe 12 projecting from primary pipe 11 toward substrate 1 .
  • Secondary pipe 12 is disposed opposite to the region of substrate 1 that has semiconductor device 21 disposed therein.
  • secondary pipe 12 is formed to be cylindrical.
  • Secondary pipe 12 is formed to project from flow path configuring plate 11 a.
  • Secondary pipe 12 is formed to communicate with primary pipe 11 .
  • Secondary pipe 12 and primary pipe 11 configure the second flow path.
  • a coolant supply device (not shown) is provided to supply the second flow path with a second coolant.
  • first and second flow paths pass the first and second coolants, respectively, of water.
  • the first and second flow paths are supplied with the coolant water by a common coolant supply device.
  • secondary pipe 12 has an end surface 12 a opposite to substrate 1 .
  • End surface 12 a inclines to provide a larger flow path in the direction in which the first flow path passes the first coolant, as indicated by arrow 51 . More specifically, end surface 12 a is formed to have a larger distance from substrate 1 in the direction in which the first coolant flows. End surface 12 a is formed to have the inclined surface facing downstream of the first coolant.
  • semiconductor device 21 generates heat, which is transferred to substrate 1 and plate member 2 .
  • a coolant supply device supplies the first coolant, which is introduced into the first flow path.
  • the first coolant flows through a space sandwiched by substrate 1 and primary pipe 11 , as indicated by arrow 51 .
  • the first coolant flows through the first flow path between plate members 2 .
  • the first coolant flows in contact with plate member 2 and substrate 1 .
  • plate member 2 and substrate 1 are cooled. Subsequently, the first coolant is exhausted.
  • Semiconductor device 21 is cooled via substrate 1 as plate member 2 is cooled.
  • the heat of semiconductor device 21 is transferred to substrate 1 and plate member 2 , and radiated from substrate 1 and plate member 2 to the first coolant.
  • the coolant supply device supplies the second coolant, which is introduced into the second flow path configured by the second flow path configuring member.
  • the second coolant is introduced into primary pipe 11 , as indicated by an arrow 52 .
  • a portion of the second coolant flowing through primary pipe 11 flows into secondary pipe 12 , as indicated by an arrow 53 .
  • the second coolant flowing into secondary pipe 12 is discharged through secondary pipe 12 at end surface 12 a, as indicated by arrow 53 .
  • the second coolant supplied through the second flow path and thus separated from the first coolant does not contribute to cooling semiconductor device 21 before the second coolant is jetted out of secondary pipe 12 .
  • the second coolant does not contact plate member 2 provided at the second flow path, and thus does not have its ability as a coolant impaired.
  • the second coolant jetted out of secondary pipe 12 impinges on the back surface of substrate 1 at the region opposite to that having semiconductor device 21 disposed therein. More specifically, the second coolant cools by an impinging jet stream the region of substrate 1 opposite to that having semiconductor device 21 disposed therein.
  • the second coolant that impinges on substrate 1 allows semiconductor device 21 to be effectively cooled.
  • the second coolant impinging on substrate 1 flows through the first flow path together with the first coolant, when the second coolant contacts and thus cools substrate 1 and plate member 2 as the second coolant proceeds. Subsequently the second coolant is exhausted together with the first coolant.
  • the present embodiment includes first flow path configuring means formed to allow a coolant to contact a heat radiating member, and second flow path configuring means for causing an impinging jet stream to impinge on a region opposite to that having a semiconductor device disposed therein, and a first flow path and a second flow path are separated.
  • the heat radiating member can be disposed to radiate heat across an increased area to efficiently remove heat.
  • a second coolant is supplied such that it is separated from a first coolant until the second coolant is jetted out of a secondary pipe.
  • the first coolant which flows through the first flow path, gradually increases in temperature as it approaches downstream of the first coolant.
  • the second coolant downstream is substantially the same in temperature as that upstream.
  • the second coolant can impinge on semiconductor device 21 at low temperature and thus efficiently cool semiconductor device 21 . Furthermore, the coolant can be prevented from having its ability as a coolant impaired as it proceeds through a flow path and approaches downstream. Semiconductor device 21 can be cooled substantially uniformly.
  • an impinging jet stream, and the cooling by convection of a heat transfer member can be provided substantially separately, and an object to be cooled can be cooled effectively.
  • the second flow path configuring means includes a primary pipe and a secondary pipe.
  • a first flow path includes a space sandwiched between the primary pipe and a substrate.
  • a plate member is disposed to surround a region opposite to that having a semiconductor device disposed therein. This configuration facilitates forming the first flow path configuring means and the second flow path configuring means. Furthermore a cooler having a simplified configuration can be provided.
  • secondary pipe 12 has end surface 12 a inclined to provide a larger path in a direction in which the first coolant flows. This configuration allows an impinging jet stream jetted from secondary pipe 12 to be guided downstream of the first coolant.
  • the cooler includes a substrate having a surface with a semiconductor device disposed thereon, that faces vertically upward.
  • the cooler may have a substrate having a surface with a semiconductor device disposed thereon, that faces vertically downward. This configuration allows bubbles generated in the first flow path or the second flow path to be guided to a side that is opposite to that having the substrate, and can thus prevent the bubbles from staying at the back surface of the substrate and removing a layer of liquid on the back surface of the substrate, and thus contributing to inefficient heat transfer.
  • the cooler may have the substrate disposed such that the surface of the substrate that has a semiconductor device disposed thereon extends in a vertical direction or a direction inclined relative the vertical direction.
  • This configuration allows bubbles caused in the first flow path or the second flow path to be moved vertically upward. This can prevent the bubbles from staying at the back surface of the substrate. If bubbles are generated in the first flow path or the second flow path, a layer of liquid can be ensured at the back surface of the substrate.
  • vapors may be generated in the coolant. Any of the above configurations can expel such vapors from the cooler or move the vapors to a periphery of the cooler. This can prevent an object to be cooled from being cooled inefficiently as bubbles are generated.
  • a plate member serving as a heat radiating member is formed to be substantially equal in height to the first flow path. This configuration allows the plate member to be provided along the entire height of the first flow path to transfer heat across an increased area. This allows the first coolant to effectively cool an object to be cooled.
  • a plurality of semiconductor devices are disposed in a direction in which a coolant flows, and for the semiconductor devices, secondary pipes identical in geometry are provided.
  • the secondary pipes are not limited thereto, and may be different from each other in size and geometry.
  • the secondary pipe is cylindrical, it is not limited thereto and may have any form.
  • a secondary pipe of a large diameter may be provided, and for an object generating a small quantity of heat, a secondary pipe of a small diameter may be provided.
  • the cooler can facilitate adjusting a quantity of heat to be removed in accordance with each object to be cooled.
  • the secondary pipe or the primary pipe may be provided with a valve adjusting a flow rate of a coolant jetted through a particular secondary pipe, a valve interrupting a flow through a particular secondary pipe, and the like.
  • This configuration allows an impinging jet stream to be adjusted in flow rate to correspond to a quantity of heat generated by an object to be cooled, and an impinging jet stream to intermittently cool an object to be cooled.
  • an impinging jet stream having a flow rate changed in accordance with such variation in the quantity of heat generated can be provided to optimally cool the object.
  • a plate member serving as a heat radiating member has a cutout portion.
  • the plate member is not limited thereto and may not have a cutout portion.
  • the plate member may penetrate the secondary pipe.
  • the plate member is not limited to having a flat surface. It may be formed to have a curved surface.
  • first coolant and the second coolant are identical. Alternatively, they may be different coolants. Furthermore, they are not limited to liquid and may contain gas.
  • the cooler is formed to have the first flow path and the second flow path passing the first coolant and the second coolant, respectively, in a single direction.
  • it is not limited thereto, and may be formed to have the first flow path and the second flow path passing the first coolant and the second coolant in different directions, respectively.
  • the coolant supply device may be a coolant supply device for supplying the first coolant and that for supplying the second coolant.
  • it may include a circulation device circulating a coolant while cooling it.
  • the object to be cooled is an electric power converter of large electric power by way of example.
  • the present invention is applicable to a cooler for any object to be cooled.
  • the present invention is also applicable for example to coolers for an electric power converter of small electric power and other objects to be cooled.
  • the present invention in a second embodiment provides a cooler, as will now be described hereinafter.
  • the cooler is a cooler for cooling an electric power converter.
  • the cooler includes first flow path configuring means and second flow path configuring means, similarly as described in the first embodiment.
  • the present embodiment differs from the first embodiment by a heat radiating member for radiating the heat of an object to be cooled.
  • FIG. 5 is a general exploded perspective view of a semiconductor apparatus in the present embodiment.
  • the heat radiating member includes a bar member 3 fixed to and projecting from the back surface of substrate 1 .
  • bar member 3 has a longitudinal direction substantially perpendicular to the back surface of substrate 1 .
  • FIG. 6 is a first general cross section of the semiconductor apparatus in the present embodiment.
  • FIG. 6 is a general cross section as cut at a plane parallel to the major surface of the substrate.
  • Bar member 3 surrounds secondary pipe 12 .
  • Bar member 3 surrounds a region opposite to that having semiconductor device 21 disposed therein.
  • Bar member 3 is disposed in a vicinity of the region opposite to that having semiconductor device 21 disposed therein.
  • four bar members 3 are provided for a single semiconductor device 21 .
  • the first coolant flows in direction 51 .
  • FIG. 7 is a second general cross section of the semiconductor apparatus in the present embodiment.
  • FIG. 7 is a cross section taken along a line VII-VII in FIG. 6 .
  • Bar member 3 is formed to have a length substantially equal to the height of the first flow path sandwiched between primary pipe 11 and substrate 1 .
  • the heat radiating member includes a bar member.
  • the bar member can be varied in position, length, number, and the like to allow the heat radiating member to remove heat at a different position and contact a coolant at a different area.
  • bar members surround a region opposite to that having disposed therein an object to be cooled.
  • the bar member may be provided at any position and in any number that do not prevent the second coolant having impinged on a surface of the substrate to be cooled from radically spreading and do not prevent the first coolant from flowing.
  • the bar member is substantially equal in height to the first flow path passing the first coolant. This configuration allows the bar member to be disposed along substantially the entire height of the first flow path to allow the first coolant to effectively cool it.
  • the present invention in a third embodiment provides a cooler, as will be described hereinafter.
  • the cooler includes first flow path configuring means and second flow path configuring means, similarly as described in the first embodiment.
  • the cooler of the present embodiment is different from that of the first embodiment in the geometry of the heat radiating member and that of the secondary pipe of the second flow path configuring means.
  • FIG. 8 is a general cross section of the cooler in the present embodiment.
  • FIG. 8 is a general cross section as cut at a plane perpendicular to the major surface of the substrate.
  • the cooler includes a secondary pipe 13 formed to project from a surface of primary pipe 11 .
  • Secondary pipe 13 is formed to have a cross section in the form of a mountain.
  • Secondary pipe 13 is tapered to provide a narrower flow path toward substrate 1 .
  • secondary pipe 13 is formed to have an end surface substantially parallel to substrate 1 .
  • the cooler includes a plate member 4 .
  • Plate member 4 has a cutout portion 4 a.
  • Cutout portion 4 a is formed to incline along the geometry of secondary pipe 13 .
  • Cutout portion 4 a inclines to have a cross section narrower toward substrate 1 .
  • Cutout portion 4 a is formed to space plate member 4 from secondary pipe 13 .
  • the second coolant flowing in as indicated by arrow 52 is discharged from secondary pipe 13 , as indicated by an arrow 55 .
  • Secondary pipe 13 that is tapered allows an impinging jet stream of the second coolant to smoothly join the first coolant.
  • the secondary pipe can be tapered variously to facilitate adjusting the impinging jet stream in pressure and flow rate.
  • secondary pipe 13 configuring the second flow path, that is tapered as seen in cross section can help the first coolant of the first flow path to approach substrate 1 and the second coolant having impinged on substrate 1 can be collected to substrate 1 . This allows the second coolant to cool substrate 1 more effectively. Furthermore in the first flow path the first coolant and the second coolant can flow in different layers and thus be prevented from being mixed together. Small pressure loss can thus be achieved.
  • the present invention in a fourth embodiment provides a cooler, as will be described hereinafter.
  • the cooler includes the first flow path configuring means and the second flow path configuring means, and in addition, third flow path configuring means. More specifically in the present embodiment the cooler has the first flow path and the second flow path, and in addition, a third flow path. The third flow path is formed to communicate with the second flow path.
  • FIG. 9 is a first general cross section of the cooler in the present embodiment.
  • FIG. 9 is a general cross section as cut at a plane parallel to the major surface of the substrate.
  • FIG. 10 is a second general cross section of the cooler in the present embodiment.
  • FIG. 10 is a cross section taken along a line X-X in FIG. 9 .
  • the cooler includes third flow path configuring means for configuring a third flow path for discharging a coolant flowing through the second flow path.
  • the third flow path configuring means includes a diaphragm 6 .
  • Diaphragm 6 is disposed between primary pipe 11 and substrate 1 .
  • Diaphragm 6 is in the form of a flat plate.
  • Diaphragm 6 is disposed to have a major surface substantially parallel to the back surface of substrate 1 .
  • Diaphragm 6 is disposed to divide the first flow path into two flow paths.
  • the second flow path configuring member includes a secondary pipe 14 .
  • Secondary pipe 14 penetrates diaphragm 6 .
  • Secondary pipe 14 has a jet outlet in a space sandwiched between substrate 1 and diaphragm 6 .
  • Secondary pipe 14 is fixed to diaphragm 6 without a gap. More specifically, there is no gap between secondary pipe 14 and diaphragm 6 .
  • the cooler includes the heat radiating member that is implemented by a plate member 7 .
  • Plate member 7 is formed to penetrate diaphragm 6 .
  • Plate member 7 has a cutout portion 7 a. Cutout portion 7 a is formed to be circular as seen in a plane. Cutout portion 7 a is formed along the geometry of secondary pipe 14 .
  • the first flow path is defined by a space sandwiched by primary pipe 11 and diaphragm 6 .
  • the third flow path is defined by a space sandwiched by substrate 1 and diaphragm 6 .
  • Primary pipe 11 and secondary pipe 14 define the second flow path.
  • the coolant supply device is formed to supply a coolant directly to the first flow path and the second flow path and avoid supplying a coolant directly to the third flow path.
  • the first flow path and the second flow path are isolated from each other.
  • the first coolant cools plate member 7 as the first coolant proceeds through the first flow path, as indicated by arrow 51 .
  • the second coolant flows through the second flow path and is jetted from secondary pipe 14 , as indicated by arrow 53 .
  • the second coolant forms an impinging jet stream and thus cools the back surface of substrate 1 .
  • the second coolant flows through the third flow path.
  • the coolant flows toward an exhaust port, as indicated by an arrow 56 .
  • the second coolant cools substrate 1 and plate member 7 as the second coolant proceeds.
  • the first path is completely separated from the second and third paths.
  • the cooler has a path cooling an object by an impinging jet stream and a path cooling the heat radiating member, separated from each other.
  • the cooler is formed to prevent the second coolant forming an impinging jet stream and the first coolant cooling the heat radiating member from being mixed together. This can reduce or prevent the interference of the first coolant cooling the heat radiating member with the second coolant forming the impinging jet stream, to allow the impinging jet stream to more effectively cool the object.
  • the cooler can avoid the first coolant and the second coolant mixed together.
  • the first coolant and the second coolant can be different coolants, respectively.
  • the coolant supply device can be a coolant supply device including a circulation device for the first coolant and that for the second coolant different than the first coolant.
  • a plate member has a cutout portion and the cutout portion is formed along the geometry of a secondary pipe.
  • the secondary pipe jets out the second coolant, which spreads radially along the geometry of the secondary pipe. This configuration can prevent the plate member from significantly preventing the second coolant from spreading.
  • the present invention can thus provide a cooler providing excellent performance to cool an electric power converter.
  • the present invention is applicable to a cooler.
  • it is advantageously applicable to a cooler for an electric power converter.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/293,469 2006-04-06 2007-03-28 Cooler Abandoned US20090090490A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006105056A JP4649359B2 (ja) 2006-04-06 2006-04-06 冷却器
JP2006-105056 2006-04-06
PCT/JP2007/057522 WO2007116894A1 (ja) 2006-04-06 2007-03-28 冷却器

Publications (1)

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US20090090490A1 true US20090090490A1 (en) 2009-04-09

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US (1) US20090090490A1 (enrdf_load_stackoverflow)
JP (1) JP4649359B2 (enrdf_load_stackoverflow)
CN (1) CN101416307B (enrdf_load_stackoverflow)
DE (1) DE112007000829B4 (enrdf_load_stackoverflow)
WO (1) WO2007116894A1 (enrdf_load_stackoverflow)

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US9352856B1 (en) * 2013-12-04 2016-05-31 Space Systems/Loral, Llc Axially grooved crossing heat pipes
US9410746B2 (en) 2013-03-20 2016-08-09 Basf Se Temperature-regulating element
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US20180049347A1 (en) * 2016-08-11 2018-02-15 Siemens Healthcare Gmbh Temperature-Control Unit For An Electronic Component
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US10118717B2 (en) * 2015-06-02 2018-11-06 Airbus Defence And Space Sas Artificial Satellite
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US8248809B2 (en) 2008-08-26 2012-08-21 GM Global Technology Operations LLC Inverter power module with distributed support for direct substrate cooling
US20100053889A1 (en) * 2008-08-26 2010-03-04 Gm Global Technology Operations, Inc. Inverter power module for with distributed support for direct substrate cooling
US20110141690A1 (en) * 2009-12-15 2011-06-16 Gm Global Technology Operations, Inc. Power electronics substrate for direct substrate cooling
US8169779B2 (en) * 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
US20110216502A1 (en) * 2010-03-04 2011-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Power modules, cooling devices and methods thereof
US8305755B2 (en) 2010-03-04 2012-11-06 Toyota Motor Engineering & Manufacturing North America, Inc. Power modules, cooling devices and methods thereof
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
WO2013124013A1 (de) * 2012-02-22 2013-08-29 Siemens Aktiengesellschaft Vorrichtung zur kühlung von elektrischen bauteilen
US20140029199A1 (en) * 2012-07-30 2014-01-30 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and electronics modules having branching microchannels
US9353999B2 (en) * 2012-07-30 2016-05-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and electronics modules having branching microchannels
US8786078B1 (en) 2013-01-04 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features
WO2014152354A1 (en) * 2013-03-14 2014-09-25 Rochester Institute Of Technology Heat transfer system and method incorporating tapered flow field
US11143466B2 (en) 2013-03-14 2021-10-12 Rochester Institute Of Technology Heat transfer system and method incorporating tapered flow field
US10018430B2 (en) 2013-03-14 2018-07-10 Rochester Institute Of Technology Heat transfer system and method incorporating tapered flow field
US9410746B2 (en) 2013-03-20 2016-08-09 Basf Se Temperature-regulating element
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US9352856B1 (en) * 2013-12-04 2016-05-31 Space Systems/Loral, Llc Axially grooved crossing heat pipes
US20160365301A1 (en) * 2013-12-11 2016-12-15 Toyota Jidosha Kabushiki Kaisha Cooler
US10147669B2 (en) * 2013-12-11 2018-12-04 Toyota Jidosha Kabushiki Kaisha Cooler
US9902507B2 (en) * 2015-01-27 2018-02-27 Airbus Defence And Space Sas Artificial satellite and method for filling a tank of propellent gas of said artificial satellite
US10118717B2 (en) * 2015-06-02 2018-11-06 Airbus Defence And Space Sas Artificial Satellite
US20180049347A1 (en) * 2016-08-11 2018-02-15 Siemens Healthcare Gmbh Temperature-Control Unit For An Electronic Component
US10477727B2 (en) * 2016-08-11 2019-11-12 Siemens Healthcare Gmbh Temperature-control unit for an electronic component
WO2020102371A1 (en) * 2018-11-13 2020-05-22 Magna International Inc. Impinging jet coldplate for power electronics with enhanced heat transfer
CN112997303A (zh) * 2018-11-13 2021-06-18 麦格纳国际公司 具有增强的热传递的用于电力电子装置的冲击射流冷却板
US10490482B1 (en) * 2018-12-05 2019-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices including jet cooling with an intermediate mesh and methods for using the same
US11984383B2 (en) 2019-05-30 2024-05-14 Mitsubishi Electric Corporation Semiconductor device
WO2025103891A1 (de) * 2023-11-17 2025-05-22 Schaeffler Technologies AG & Co. KG Leistungselektronik-kühler, leistungselektronikvorrichtung und inverter

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CN101416307A (zh) 2009-04-22
JP2007281163A (ja) 2007-10-25
WO2007116894A1 (ja) 2007-10-18
CN101416307B (zh) 2010-11-03
DE112007000829B4 (de) 2012-07-19
DE112007000829T5 (de) 2009-02-12

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