CN102799244B - 计算机cpu的多流道水冷装置结构 - Google Patents

计算机cpu的多流道水冷装置结构 Download PDF

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CN102799244B
CN102799244B CN201210307273.1A CN201210307273A CN102799244B CN 102799244 B CN102799244 B CN 102799244B CN 201210307273 A CN201210307273 A CN 201210307273A CN 102799244 B CN102799244 B CN 102799244B
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CN102799244A (zh
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谈士权
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Li Yang
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Wuxi Formen Technical Co Ltd
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Abstract

本发明提供了计算机CPU的多流道水冷装置结构，其能够将将发热器件的温度降到低于环境温度，其能够适用于各种环境场合，适用范围大，且其安静无噪音。其包括上部盖板、微切割冷却板，所述上部盖板的上端面设置有出水口、进水口，所述上部盖板盖装于所述微切割冷却板，其特征在于：所述上部盖板、微切割冷却板所形成的空腔内设置有喷射分流板，所述喷射分流板开有至少四条平行的流道槽口，所述进水口沿着所述喷射分流板的上表面连通至平行的所述流道槽口，所述流道槽口的下方为所述微切割冷却板的散热区域，所述微切割冷却板的散热区域排布有呈矩形阵列的散热柱。

Description

计算机CPU的多流道水冷装置结构
技术领域
本发明涉及计算机CPU的冷却技术领域，具体为计算机CPU的多流道水冷装置结构。
背景技术
目前的计算机CPU冷却，一般采用风冷和水冷这两种方式，伴随着显卡处理芯片的不断发展，其在工作过程中所产生的发热量不断提升，为了保证良好的散热性能和显卡正常工作，其风冷必须采用高转速风扇冷却，高转速风扇带来巨大噪音和震动，让人心烦。而现有的水冷冷却方式，其水冷却模块冷却效果最多只能将温度降低到环境温度，其不适于在环境温度比较高的应用场合，其适用范围小。
发明内容
针对上述问题，本发明提供了计算机CPU的多流道水冷装置结构，其能够将将发热器件的温度降到低于环境温度，其能够适用于各种环境场合，适用范围大，且其安静无噪音。
计算机CPU的多流道水冷装置结构，其技术方案是这样的：其包括上部盖板、微切割冷却板，所述上部盖板的上端面设置有出水口、进水口，所述上部盖板盖装于所述微切割冷却板，其特征在于：所述上部盖板、微切割冷却板所形成的空腔内设置有喷射分流板，所述喷射分流板开有至少四条平行的流道槽口，所述进水口沿着所述喷射分流板的上表面连通至平行的所述流道槽口，所述流道槽口的下方为所述微切割冷却板的散热区域，所述微切割冷却板的散热区域排布有呈矩形阵列的散热柱，所述喷射分流板的底部外边缘设置有导流槽、出水孔，所述导流槽通向所述出水孔，所述出水孔连通所述出水口，所述喷射分流板的底部通过外缘密封圈压装于所述微切割冷却板的上端面。
使用本发明的结构后，冷却水通入进水口后，进入到喷射分流板的上端面，然后冷却水从喷射分流板的平行的流道槽口流向至微切割冷却板的散热区域，之后冷却水顺着散热柱之间的间隙流入至喷射分流板的底部外边缘的导流槽，冷却水顺着导流槽流至出水孔，然后从出水口流出，其至少四条平行的流道槽口使得冷却水有至少四条流道，使得水压流失小、流程短，散热不会留有死角，其能够将将发热器件的温度降到低于环境温度，其能够适用于各种环境场合，适用范围大，且其安静无噪音。
附图说明
图1为本发明的结构示意组装立体图；
图2为本发明的喷射分流板的背面结构示意图。
具体实施方式
见图1、图2，其包括上部盖板1、微切割冷却板2，上部盖板1的上端面设置有出水口3、进水口4，上部盖板1盖装于微切割冷却板2，上部盖板1、微切割冷却板2所形成的空腔内设置有喷射分流板5，喷射分流板5开有四条平行的流道槽口6，进水口4沿着喷射分流板5的上表面连通至四条平行的流道槽口6，流道槽口6的下方为微切割冷却板2的散热区域，微切割冷却板2的散热区域排布有呈矩形阵列的散热柱7，喷射分流板5的底部外边缘设置有导流槽8、出水孔9，导流槽8通向出水孔9，出水孔9连通出水口3，喷射分流板5的底部通过外缘密封圈10压装于微切割冷却板2的上端面。

Claims (1)

1.计算机CPU的多流道水冷装置结构，其包括上部盖板、微切割冷却板，所述上部盖板的上端面设置有出水口、进水口，所述上部盖板盖装于所述微切割冷却板，其特征在于：所述上部盖板、微切割冷却板所形成的空腔内设置有喷射分流板，所述喷射分流板开有四条平行的流道槽口，所述进水口沿着所述喷射分流板的上表面连通至平行的所述流道槽口，所述流道槽口的下方为所述微切割冷却板的散热区域，所述微切割冷却板的散热区域排布有呈矩形阵列的散热柱，所述喷射分流板的底部外边缘设置有导流槽、出水孔，所述导流槽通向所述出水孔，所述出水孔连通所述出水口，所述喷射分流板的底部通过外缘密封圈压装于所述微切割冷却板的上端面。
CN201210307273.1A 2012-08-27 2012-08-27 计算机cpu的多流道水冷装置结构 Expired - Fee Related CN102799244B (zh)

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Citations (8)

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WO2002042703A2 (en) * 2000-11-21 2002-05-30 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
WO2003060414A1 (en) * 2002-01-14 2003-07-24 Marconi Intellectual Property (Ringfence) Inc. Small scale chip cooler assembly
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling
EP1728278A1 (de) * 2004-03-26 2006-12-06 ebm-papst St. Georgen GmbH & Co. KG Wärmetauscher
CN101048057A (zh) * 2006-03-30 2007-10-03 国际商业机器公司 用于热控制的热分布组件、系统和方法
CN101416307A (zh) * 2006-04-06 2009-04-22 丰田自动车株式会社 冷却器
TW201128154A (en) * 2010-02-12 2011-08-16 Micro Base Technology Corp Cooling and heat-dissipation system, and cooling device thereof
CN102566722A (zh) * 2012-01-05 2012-07-11 南京佳力图空调机电有限公司 一种cpu水冷散热器及其应用方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002042703A2 (en) * 2000-11-21 2002-05-30 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
WO2003060414A1 (en) * 2002-01-14 2003-07-24 Marconi Intellectual Property (Ringfence) Inc. Small scale chip cooler assembly
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling
EP1728278A1 (de) * 2004-03-26 2006-12-06 ebm-papst St. Georgen GmbH & Co. KG Wärmetauscher
CN101048057A (zh) * 2006-03-30 2007-10-03 国际商业机器公司 用于热控制的热分布组件、系统和方法
CN101416307A (zh) * 2006-04-06 2009-04-22 丰田自动车株式会社 冷却器
TW201128154A (en) * 2010-02-12 2011-08-16 Micro Base Technology Corp Cooling and heat-dissipation system, and cooling device thereof
CN102566722A (zh) * 2012-01-05 2012-07-11 南京佳力图空调机电有限公司 一种cpu水冷散热器及其应用方法

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