JP5880531B2 - 冷却器 - Google Patents
冷却器 Download PDFInfo
- Publication number
- JP5880531B2 JP5880531B2 JP2013256059A JP2013256059A JP5880531B2 JP 5880531 B2 JP5880531 B2 JP 5880531B2 JP 2013256059 A JP2013256059 A JP 2013256059A JP 2013256059 A JP2013256059 A JP 2013256059A JP 5880531 B2 JP5880531 B2 JP 5880531B2
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- nozzle
- pressure receiving
- cooler
- flow path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003507 refrigerant Substances 0.000 claims description 141
- 238000001816 cooling Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000002826 coolant Substances 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- -1 for example Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F25/00—Component parts of trickle coolers
- F28F25/02—Component parts of trickle coolers for distributing, circulating, and accumulating liquid
- F28F25/06—Spray nozzles or spray pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
以下、図面を参照して実施の形態1について説明する。図1は、実施の形態1に係る冷却器の構成を示している。図1(b)は、ケース蓋を除いてケース蓋側から見た冷却器の平面図であり、図1(a)は、図1(b)における冷却器のA1−A2断面図であり、図1(c)は、図1(b)における冷却器のA3−A4断面図である。
本実施の形態では、実施の形態1の冷却器におけるノズルの他の例について説明する。ノズルの構成以外は実施の形態1と同様である。
本実施の形態では、実施の形態1及び2の冷却器におけるノズルの他の例について説明する。ノズルの構成以外は実施の形態1及び2と同様である。
本実施の形態では、実施の形態1〜3の冷却器、特に実施の形態3の冷却器におけるノズルの他の例について説明する。ノズルの構成以外は実施の形態1〜3と同様である。
本実施の形態では、実施の形態1〜4の冷却器を積層構造とする例について説明する。冷却器の内部構成は、実施の形態1〜4と同様である。
10 ノズル
11 ノズル部材
12 冷媒供給穴
13 流路壁
14 ノズル先端部
15 薄肉部
16 受圧部
17 先端部材
18 受圧部材
20 フィン
20a 被吐出面
21 隙間
26 冷媒供給穴
30 ケース本体
31 ベース板
31a フィン配置面
31b 冷却面
32 ベース側壁
40 ケース蓋
50 半導体素子
51 絶縁層
101 流入路
102 排冷媒路
110 フィン間領域
110a 冷媒流入口
121 入口
122 出口
200 積層型冷却器
210 冷却プレート
211 冷媒供給ヘッダ
212 冷媒排出ヘッダ
220 パワーカード
Claims (8)
- 冷媒流入口を有する伝熱部材と、供給された冷媒を前記冷媒流入口に向けて吐出するノズルとを備え、
前記ノズルは、
前記供給された冷媒の流路を形成する流路壁と、
前記流路に流れる冷媒を吐出する吐出口を形成する先端部と、
前記流路壁と前記吐出口との間に設けられ、前記冷媒の吐出方向の力を受ける受圧部と、
前記流路壁と前記受圧部との間、または、前記受圧部に設けられ、前記受圧部が受けた前記冷媒の吐出方向の力に応じて、前記吐出口を前記冷媒の吐出方向に変位させる変形部と、
を備え、
前記受圧部は、前記吐出される冷媒を受ける凹状の湾曲面を有している、
冷却器。 - 前記変形部は、前記流路壁よりも剛性が低い、
請求項1に記載の冷却器。 - 前記変形部の厚さは、前記流路壁よりも薄い、
請求項2に記載の冷却器。 - 前記変形部は、前記流路壁よりも剛性が低い素材によって形成されている、
請求項2または3に記載の冷却器。 - 前記受圧部は、前記流路壁から前記吐出口へ向かって前記吐出口近傍の幅が狭くなるように傾斜した傾斜面に形成されている、
請求項1乃至4のいずれか一項に記載の冷却器。 - 前記吐出口の周辺部に、前記凹状の湾曲面を有する先端部材を備える、
請求項1乃至5のいずれか一項に記載の冷却器。 - 前記吐出口の周辺部は、前記伝熱部材の前記吐出口と対向する面に沿って形成されている、
請求項1乃至6のいずれか一項に記載の冷却器。 - 前記冷媒流入口を有する伝熱部材は、冷却対象物を冷却するための放熱フィンである、
請求項1乃至7のいずれか一項に記載の冷却器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013256059A JP5880531B2 (ja) | 2013-12-11 | 2013-12-11 | 冷却器 |
US15/102,732 US10147669B2 (en) | 2013-12-11 | 2014-11-26 | Cooler |
PCT/IB2014/002568 WO2015087121A1 (en) | 2013-12-11 | 2014-11-26 | Cooler |
DE112014005635.9T DE112014005635B4 (de) | 2013-12-11 | 2014-11-26 | Kühler |
CN201480066865.6A CN105981163B (zh) | 2013-12-11 | 2014-11-26 | 冷却器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013256059A JP5880531B2 (ja) | 2013-12-11 | 2013-12-11 | 冷却器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015115445A JP2015115445A (ja) | 2015-06-22 |
JP5880531B2 true JP5880531B2 (ja) | 2016-03-09 |
Family
ID=52464414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013256059A Active JP5880531B2 (ja) | 2013-12-11 | 2013-12-11 | 冷却器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10147669B2 (ja) |
JP (1) | JP5880531B2 (ja) |
CN (1) | CN105981163B (ja) |
DE (1) | DE112014005635B4 (ja) |
WO (1) | WO2015087121A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6658364B2 (ja) * | 2016-07-07 | 2020-03-04 | トヨタ自動車株式会社 | 半導体装置 |
JP6724613B2 (ja) * | 2016-07-08 | 2020-07-15 | トヨタ自動車株式会社 | 半導体装置 |
WO2019211889A1 (ja) | 2018-05-01 | 2019-11-07 | 三菱電機株式会社 | 半導体装置 |
US20210366806A1 (en) * | 2020-05-20 | 2021-11-25 | Google Llc | Spring Loaded Compliant Coolant Distribution Manifold for Direct Liquid Cooled Modules |
US20230262947A1 (en) * | 2022-02-17 | 2023-08-17 | Dana Canada Corporation | Systems for a heat exchanger |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
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GB1380003A (en) * | 1971-07-23 | 1975-01-08 | Thermo Electron Corp | Jet impingement heat exchanger |
US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
US5365400A (en) * | 1988-09-09 | 1994-11-15 | Hitachi, Ltd. | Heat sinks and semiconductor cooling device using the heat sinks |
US5183104A (en) * | 1989-06-16 | 1993-02-02 | Digital Equipment Corporation | Closed-cycle expansion-valve impingement cooling system |
US5294830A (en) * | 1991-05-21 | 1994-03-15 | International Business Machines Corporation | Apparatus for indirect impingement cooling of integrated circuit chips |
US5249358A (en) * | 1992-04-28 | 1993-10-05 | Minnesota Mining And Manufacturing Company | Jet impingment plate and method of making |
JPH06252300A (ja) * | 1992-12-28 | 1994-09-09 | Hitachi Ltd | 冷却装置を備えた集積回路チップ及びその製造方法 |
US5403783A (en) * | 1992-12-28 | 1995-04-04 | Hitachi, Ltd. | Integrated circuit substrate with cooling accelerator substrate |
JPH0766339A (ja) * | 1993-08-31 | 1995-03-10 | Hitachi Ltd | 半導体冷却装置 |
JPH07297584A (ja) | 1994-04-27 | 1995-11-10 | Hitachi Ltd | 電子機器装置の冷却構造 |
US5992769A (en) * | 1995-06-09 | 1999-11-30 | The Regents Of The University Of Michigan | Microchannel system for fluid delivery |
US5687577A (en) * | 1996-04-10 | 1997-11-18 | Motorola, Inc. | Apparatus and method for spray-cooling an electronic module |
US5777384A (en) * | 1996-10-11 | 1998-07-07 | Motorola, Inc. | Tunable semiconductor device |
EP0905353B1 (de) * | 1997-09-30 | 2003-01-15 | ALSTOM (Switzerland) Ltd | Prallanordnung für ein konvektives Kühl- oder Heizverfahren |
JP4052417B2 (ja) | 1999-10-29 | 2008-02-27 | Toto株式会社 | 給水機構及び給水機構を備えた局部洗浄装置 |
US6431260B1 (en) * | 2000-12-21 | 2002-08-13 | International Business Machines Corporation | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof |
US6644058B2 (en) * | 2001-02-22 | 2003-11-11 | Hewlett-Packard Development Company, L.P. | Modular sprayjet cooling system |
GB0121377D0 (en) * | 2001-09-04 | 2001-10-24 | Aqualisa Products Ltd | Shower handset |
US8464781B2 (en) * | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
JP4429251B2 (ja) | 2005-10-17 | 2010-03-10 | 三菱電機株式会社 | 電力変換装置 |
JP4832882B2 (ja) * | 2005-12-14 | 2011-12-07 | 株式会社ティラド | ヒートシンク |
JP4649359B2 (ja) | 2006-04-06 | 2011-03-09 | トヨタ自動車株式会社 | 冷却器 |
US7362574B2 (en) * | 2006-08-07 | 2008-04-22 | International Business Machines Corporation | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
US8944151B2 (en) * | 2008-05-28 | 2015-02-03 | International Business Machines Corporation | Method and apparatus for chip cooling |
US8266802B2 (en) * | 2008-06-18 | 2012-09-18 | International Business Machines Corporation | Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins |
JP5476585B2 (ja) | 2010-01-15 | 2014-04-23 | 株式会社豊田中央研究所 | 冷却器 |
US8199505B2 (en) * | 2010-09-13 | 2012-06-12 | Toyota Motor Engineering & Manufacturing Norh America, Inc. | Jet impingement heat exchanger apparatuses and power electronics modules |
US8667682B2 (en) * | 2011-04-27 | 2014-03-11 | Siemens Energy, Inc. | Method of fabricating a nearwall nozzle impingement cooled component for an internal combustion engine |
US8826668B2 (en) * | 2011-08-02 | 2014-09-09 | Siemens Energy, Inc. | Two stage serial impingement cooling for isogrid structures |
US9247672B2 (en) * | 2013-01-21 | 2016-01-26 | Parker-Hannifin Corporation | Passively controlled smart microjet cooling array |
US9131631B2 (en) * | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
-
2013
- 2013-12-11 JP JP2013256059A patent/JP5880531B2/ja active Active
-
2014
- 2014-11-26 CN CN201480066865.6A patent/CN105981163B/zh not_active Expired - Fee Related
- 2014-11-26 US US15/102,732 patent/US10147669B2/en active Active
- 2014-11-26 WO PCT/IB2014/002568 patent/WO2015087121A1/en active Application Filing
- 2014-11-26 DE DE112014005635.9T patent/DE112014005635B4/de active Active
Also Published As
Publication number | Publication date |
---|---|
DE112014005635B4 (de) | 2024-06-20 |
CN105981163A (zh) | 2016-09-28 |
WO2015087121A1 (en) | 2015-06-18 |
DE112014005635T5 (de) | 2016-09-08 |
CN105981163B (zh) | 2018-11-16 |
US10147669B2 (en) | 2018-12-04 |
JP2015115445A (ja) | 2015-06-22 |
US20160365301A1 (en) | 2016-12-15 |
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