WO2007066572A1 - 静電チャック用電極シート及び静電チャック - Google Patents
静電チャック用電極シート及び静電チャック Download PDFInfo
- Publication number
- WO2007066572A1 WO2007066572A1 PCT/JP2006/323970 JP2006323970W WO2007066572A1 WO 2007066572 A1 WO2007066572 A1 WO 2007066572A1 JP 2006323970 W JP2006323970 W JP 2006323970W WO 2007066572 A1 WO2007066572 A1 WO 2007066572A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- electrostatic
- electrostatic chuck
- yak
- opening
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
Definitions
- the chuck is used to adsorb and hold semiconductors such as ion devices, ion devices, and plasma devices related to conductor processes. Also, in the field, a chuck is used to adsorb and hold insulating glass in a bonding device used for the operation of isolated crystals or in ion doping.
- the size of the ne size has further increased in recent years due to the need for a lane display.
- the size of the glass will exceed 2 x 2.
- the electrodes of the electrostatic yak can exert excellent adhesion.
- Electrostatic yak that can demonstrate
- Another object of Ming is to provide an electrostatic yak using the above.
- 001 that is, a first, a first, an electrode, a second, and a layered structure in which the layers are sequentially laminated, and the first is an electrostatic yacht which adsorbs the base, which is within the predetermined range.
- a static aperture having a plurality of apertures, and a second aperture and a first aperture that are projected at a position where they are projected in the direction of the electrode, and a projection that connects the apertures. It is an electric jack.
- the above is an electrostatic yak made of a metal plate. First, it is necessary to have a plurality of mouths in a given area.
- This mouth is a line of electric force (a line of electric force at 6) that is exchanged via the line of electric force generated between the first and second layers, and there is no particular limitation in that state.
- a polygon on a shape, shape, or triangle can be exemplified as the polygon. More preferably, the circular mouth is for the purpose of eliminating the risk of discharge as much as possible.
- there may be two or more openings in the shape of the opening there are a plurality of openings in the preferable shape from the viewpoint of exerting one adhesive force due to the adsorption surface. It's better to do it.
- X be the short distance between the mouths that are adjacent to each other and define a line parallel to this short distance X as a virtual line, and shade the hearts of the mouths that are in contact with this line. If the line segment obtained by the foot of the perpendicular line is then, it is preferable to add X ⁇ 5 ,, 2.5.
- X is a mark of a mark representing the mouth by the mouth with respect to the short distance X of the two adjacent mouths, and the degree of the mouth increases as the value of X increases. As the degree of this mouth increases, more electric potential () can be distributed from the second layer, that is, the electric field lines (6) generated via the electric field lines generated between the first and second layers.
- the mouth be arranged so that it has a predetermined area within it, for example, on the line including the short distance X of the mouth, the centers of the mouths adjacent to each other. It should be arranged so that it is lined up with.
- the opening response part has a connection
- the reaction section has the first opening as the electrode. At the position projected on, the projected apertures are held and these apertures are connected.
- the shadowed first mouth and the supporting part have the role of playing the second place through this mouth, and are the minimum from the viewpoint of exerting the attachment force, but are large.
- the lines of electric force (the lines of electric force at 6) generated only between the first and second regions increase, making it difficult to detect the electrostatic force based on the method.
- the electric force line (the line of force at 6) that occurs only between the outside of the aperture response part and the aperture is in principle. , Except for the lines of electric force generated in the direction perpendicular to this electrode.)
- the amount of is limited. If the product of the aperture is larger than that of the shadowed aperture, the amount of electric lines of force (the line of force at 6) generated by only that much increases, and as a result, the electrostatic amount increases. In the case where there is a large amount of static electricity in the absence of, and the presence of detects a nullness based on the difference in static electricity that increases, the potential for intelligence increases.
- the aperture section is located at the position where the first mouth section is projected in the depth direction, and the projected opening section is held.
- the projected opening is larger and the case where the projected opening is larger or smaller than the projected opening.
- the weight is reduced within 20.
- the aperture part should be the same as the projected aperture part, and more preferably the aperture part with the same shape as the projection of the mouth part.
- connection for connecting the opening response parts it is possible to keep the plurality of response parts forming the second in the same position, and if there are no isolated response parts, arrange them. , Can be connected.
- the electric line of force (the line of electric force at 6) that is generated only between the connection and the outside of the opening is formed, it should be as thin as possible so that there is no risk of disconnection.
- the layer and its quality examples include tungsten, aluminium, kkke, cum, silver, platinum, budden, magnesium, radium, tantalum, etc., which is preferable in terms of productivity. More preferably it is Aum.
- the second may be the same quality or different materials.
- the first layer and the layers can be selected, but preferably 0 ⁇ to 20 /, and more preferably 0 ⁇ to / u for the first layer. However, since it may be reflected on the first surface, which is the adsorption side, a flatness of 0 to 5 can be maintained without any special treatment of the wrap. ,
- the first side can be Ra / degree.
- a method of forming the 002 layer and, for example, a foil made of a metal having the above deviation may be used to obtain a predetermined shape, or the metal may be laminated on the non-flat surface such as a body layer. It may be used to obtain a metal by drawing it in a predetermined shape.
- a foil made of a metal having the above deviation may be used to obtain a predetermined shape, or the metal may be laminated on the non-flat surface such as a body layer. It may be used to obtain a metal by drawing it in a predetermined shape.
- the electrodes may be formed by printing the metal in the form of stripes on the surface with the above deviation. Furthermore, it is also possible to form an electrode having a predetermined shape, such as a bude, a gusset, and the like, which have the above-mentioned deviations. In the case of forming the first of these, especially 0. It is preferable to use the ignition method.
- a board, a board, a board, a board, a board, a board, a board, and a resin layer composed of two or more resins selected from AK It may be composed of two or more ceramic layers selected from the above, or may be composed of two layers selected from the group consisting of hydrogen and oxygen. From the viewpoint of productivity, it is preferable to use a resin composed of two or more resins selected from a board, a post, and a binder, from the viewpoint of productivity. It's even better to have one.
- the first and the electrode may each be made of one material, or may be selectively made of different materials.
- Each of 002 2 and the electrodes can be selected and formed, but the first 50 to 300, the electrodes 25 to 0 /, and 25 to 00 are preferable.
- the electrode in the light can form an electrostatic yak as a metal plate generally used in an electrostatic yak, and such a metal plate is made of, for example, aluminum or aluminum. Umm You can name the board made of gold.
- the self-adhesive second metal plate may be used, or the second electrode metal plate may be separately formed through the adhesive film.
- an electrostatic yacht adsorbs a group such as a corrugated electrode, () with the electrode is higher when the first elastic body of the mu-system is left as it is. It is ⁇ degree. In this case, if it becomes the first, it will be dropped to this degree.
- each layer may be formed if necessary. It is possible to obtain an electrostatic yak having a laminated structure by sandwiching a diffusing type contact between them and, if necessary, further softening between the second metal plate and heat-bonding under a predetermined condition.
- the procedure for forming the laminated structure is not particularly limited.
- 0026 is a solution explanation of the bipolar YAC X made by using the electrode according to Ming.
- [22 indicates the first and second relations related to Ming.
- [33 is () indicating the first.
- [44 4] shows the second corresponding to the first shown in (3) (part).
- [55] shows the state of the lines of electric force generated at the electrodes in the conventional YAC ().
- [6 is for the type of electrode that is deeply stacked () Shows the state of the lines of electric force generated in.
- the first third which forms 003, has a plurality of
- the mouth () 3a forms a tan electrode arranged such that the opening 3a is placed at the square point.
- the second electrode 5 forming the same electrode has a reaction portion 5a having the same shape as the projected opening portion 3a at the position where the first third mouth portion 3a is projected in the direction of the electrode. 5a is preferably the same as the first 3rd mouth 3a.
- the second 5 has a connection 5b that connects the adjacent reaction parts 5a, and the opening reaction part 5a and the connection 5b form a child-shaped electrode. 2 shows that the projection 3a of the first 3rd opening 3a is projected deeply toward the second 5, and the same opening 5a of the projected opening 3a exists.
- the first 3 shown in 003 3 shows a deformation in which the element of the opening 3a is different. . Focusing on the?, Which is the opening 3a consisting of these three holes, is that C ,,,, G are adjacent to each other at the shortest distance X, and correspond to the position of a regular hexagonal point. C ,,, G are arranged. , Considering that the adjacent mouth portions 3a are in contact with each other at the shortest distance X, the circles are the objects that are in contact with each other at the shortest distance X. In addition, focusing on, for example, C and C in these three, they form a square and can be regarded as forming a pole.
- Numeral 003 the second 5 corresponding to 3 in FIG. 3 is shown in 4.
- a circular reaction part 5a at the position where the first 3rd mouth part 3a (?) Shown in 2nd and 5th in this 4 is projected in the depth direction to the second 5, and there is a circular reaction part 5a.
- the responding parts 5a adjacent to each other at the position of the regular hexagon are arranged at the shortest distance X.
- These opening reaction parts 5a are connected by the connection 5b.
- the reaction parts 5a are connected by the four connections 5b to form the second 5 in a child shape.
- all the adjacent reaction parts 5a may be connected by the connection 5b.
- the connection 5b By increasing the number of 5b, the risk of wire breakage can be reduced as much as possible, but from the viewpoint of reducing the static amount between the 1st, 25th, and 4th, 4 (a) is more preferable. I like it.
- the value when connecting 5b, it is preferable that the value is 0 to 0.5. It is relatively difficult to obtain a finer value than 0 in the case of reasoning.On the other hand, the amount of electrodes thicker than 0.5 is increased.
- an electrode was prepared using the first 3 shown in 3, the second 5 shown in 4 corresponding to this, and a bipolar yak X using this was obtained.
- 206 x 206, and 50 (* Depon product name: Cap) were prepared, and in order to smooth this side, both sides were treated with an ion to form a cum layer of 0 *. . And this
- Electrode 4 was used as the electrode, and an electrode made of 0.4 copper was formed on the surface by the ion plating method.
- One of these was formed into the first 3 shown in Fig. 3, and the other was formed into the second 25 shown in Fig. 4 by means of the Chigi theory.
- this 3 there are multiple 3a of diameter * 2 in the area of 200 X 2000, and these? 3a are located at the point of a regular hexagon with 3a of the person 3a as the center of contact with the shortest distance X * 0. Formed.
- the domes of 206 x 206 x 2 / were combined and put together.
- a doom of 206 x 206 x 4 (• Deploy product name: Cap) was put together and done in the second.
- the cushion materials were laminated on the 1st 2nd surface and the 2nd 6th surface, respectively, and these were set in a press machine and heated under the conditions of a thickness of 2 Pa, heating of 50 C, and 5 minutes.
- the first 2, the third 3, the electrode 4, the second An electrode 9 having a layered structure in which 5 and 6 were sequentially laminated was prepared.
- the first 2 and the electrode 46 are 3 and 5, respectively.
- the electrode obtained above was laid on the surface of the flat porous ceramic so that the first 2 faces the porous ceramic, and the second 6 side has a high 0.7 and a diameter. 8 via a 5 mm spacer.
- This A8 is made of Aum (5056) and has a diameter of 84.
- the self-adhesive film (G product name: T E3663) is injected into the electrode of 8 electrodes made by the spacer, and after vacuuming, the vacuum is applied through the above-mentioned porous ceramic.
- the electrodes and electrodes were placed in close contact with the surface of this porous ceramic and left for about a day and a few minutes. In this way,
- the electrode A 8 was assembled via 7 to complete the bipolar YAC X. , 2 () of completion is
- the created bipolar YAC X has a diameter of 200 X 0.8
- a chuck X was manufactured in the same manner as in Example 5, except that the surface in the area of 200 X 200 (0 ⁇ ) was a plane where the electrode became the electrode.
- electrostatic X related to this in the same manner as in the case of implementation, between static (3) and (5) when c (5, 4) is adsorbed and (3) (2) 5 when nothing is adsorbed. I asked for C2. Show the results.
- the electrostatic quantity (C C2) 1) when the battery is not present is 0.024, and it may be misidentified when it is discriminated by the existing device.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Controlling Sheets Or Webs (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007549093A JP4825220B2 (ja) | 2005-12-06 | 2006-11-30 | 静電チャック用電極シート及び静電チャック |
EP06833773A EP1959488A4 (en) | 2005-12-06 | 2006-11-30 | ELECTRODE SHEET FOR ELECTROSTATIC CHUCK, AND ELECTROSTATIC CHUCK |
US12/085,349 US7881036B2 (en) | 2005-12-06 | 2006-11-30 | Electrode sheet for electrostatic chuck, and electrostatic chuck |
CN2006800461073A CN101326627B (zh) | 2005-12-06 | 2006-11-30 | 静电卡盘用电极片以及静电卡盘 |
HK09101508.4A HK1124688A1 (en) | 2005-12-06 | 2009-02-18 | Electrode sheet for electrostatic chuck, and electrostatic chuck |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-351441 | 2005-12-06 | ||
JP2005351441 | 2005-12-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007066572A1 true WO2007066572A1 (ja) | 2007-06-14 |
Family
ID=38122718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/323970 WO2007066572A1 (ja) | 2005-12-06 | 2006-11-30 | 静電チャック用電極シート及び静電チャック |
Country Status (8)
Country | Link |
---|---|
US (1) | US7881036B2 (ja) |
EP (1) | EP1959488A4 (ja) |
JP (1) | JP4825220B2 (ja) |
KR (1) | KR100994299B1 (ja) |
CN (1) | CN101326627B (ja) |
HK (1) | HK1124688A1 (ja) |
TW (1) | TW200735258A (ja) |
WO (1) | WO2007066572A1 (ja) |
Cited By (8)
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JP2008294174A (ja) * | 2007-05-24 | 2008-12-04 | Taiheiyo Cement Corp | ガラス質静電チャック及びその製造方法 |
WO2010095720A1 (ja) * | 2009-02-20 | 2010-08-26 | 日本碍子株式会社 | セラミックス-金属接合体及びその製法 |
WO2011001978A1 (ja) * | 2009-07-02 | 2011-01-06 | 株式会社クリエイティブ テクノロジー | 静電吸着構造体及びその製造方法 |
WO2012005294A1 (ja) * | 2010-07-09 | 2012-01-12 | 株式会社クリエイティブ テクノロジー | 静電チャック装置及びその製造方法 |
US8363377B2 (en) * | 2007-12-03 | 2013-01-29 | Adp Engineering Co., Ltd. | Electrostatic chuck and apparatus having the same |
CN109872978A (zh) * | 2017-12-01 | 2019-06-11 | 英飞凌科技股份有限公司 | 包括多个外部触点的半导体芯片,芯片布置装置和用于检查半导体芯片的位置对准的方法 |
WO2023058652A1 (ja) | 2021-10-06 | 2023-04-13 | 株式会社クリエイティブテクノロジー | 電気集塵機及びそれを用いた集塵方法 |
WO2023058651A1 (ja) | 2021-10-06 | 2023-04-13 | 株式会社クリエイティブテクノロジー | プレス金型用電気集塵機及びそれを用いたプレス金型 |
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JP4684222B2 (ja) * | 2004-03-19 | 2011-05-18 | 株式会社クリエイティブ テクノロジー | 双極型静電チャック |
KR100976320B1 (ko) * | 2005-07-08 | 2010-08-16 | 가부시키가이샤 크리에이티브 테크놀러지 | 정전척 및 정전척용 전극 시트 |
US8477472B2 (en) * | 2009-06-30 | 2013-07-02 | Asml Holding N.V. | Image-compensating addressable electrostatic chuck system |
US20140064905A1 (en) * | 2011-01-10 | 2014-03-06 | Sri International | Electroadhesive System for Capturing Objects |
KR101413898B1 (ko) * | 2012-11-06 | 2014-06-30 | 엔지케이 인슐레이터 엘티디 | 서셉터 |
WO2015013142A1 (en) | 2013-07-22 | 2015-01-29 | Applied Materials, Inc. | An electrostatic chuck for high temperature process applications |
KR102139682B1 (ko) | 2013-08-05 | 2020-07-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 얇은 기판 취급을 위한 정전 캐리어 |
KR101876501B1 (ko) | 2013-08-05 | 2018-07-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 인-시츄 제거 가능한 정전 척 |
KR101905158B1 (ko) | 2013-08-06 | 2018-10-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 국부적으로 가열되는 다-구역 기판 지지부 |
KR20160058917A (ko) | 2013-09-20 | 2016-05-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 통합된 정전 척을 갖는 기판 캐리어 |
US9460950B2 (en) | 2013-12-06 | 2016-10-04 | Applied Materials, Inc. | Wafer carrier for smaller wafers and wafer pieces |
US10406365B2 (en) * | 2014-01-15 | 2019-09-10 | Board Of Regents, The University Of Texas System | Regenerative interface electrode |
CN106575720B (zh) | 2014-05-09 | 2019-01-15 | 应用材料公司 | 具有保护覆盖物的基板载体系统 |
JP2017516294A (ja) | 2014-05-09 | 2017-06-15 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板キャリアシステム及びそれを使用するための方法 |
US9959961B2 (en) | 2014-06-02 | 2018-05-01 | Applied Materials, Inc. | Permanent magnetic chuck for OLED mask chucking |
TWI582061B (zh) * | 2014-09-04 | 2017-05-11 | Ngk Insulators Ltd | Wafer fixed table and its preparation method |
WO2016159239A1 (ja) * | 2015-04-02 | 2016-10-06 | 株式会社アルバック | 吸着装置及び真空処理装置 |
US10332773B2 (en) | 2015-06-04 | 2019-06-25 | Applied Materials, Inc. | Transparent electrostatic carrier |
WO2017209325A1 (ko) * | 2016-06-01 | 2017-12-07 | (주)브이앤아이솔루션 | 정전척 및 그 제조방법 |
US11532497B2 (en) * | 2016-06-07 | 2022-12-20 | Applied Materials, Inc. | High power electrostatic chuck design with radio frequency coupling |
KR102643141B1 (ko) | 2016-11-03 | 2024-03-04 | 삼성디스플레이 주식회사 | 정전 척 및 정전 흡착 장치 |
TWI819046B (zh) * | 2018-08-02 | 2023-10-21 | 日商創意科技股份有限公司 | 靜電吸附體 |
CN111323460B (zh) * | 2018-12-13 | 2022-11-22 | 夏泰鑫半导体(青岛)有限公司 | 感测元件及应用其对静电吸附卡盘进行检测的方法 |
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JPH077074A (ja) | 1993-03-10 | 1995-01-10 | Eaton Corp | ウエハを解放する方法及び装置 |
JP2000164684A (ja) * | 1998-11-25 | 2000-06-16 | Applied Materials Inc | 静電チャックのワ―クピ―ス支持面上でワ―クピ―スを支持するための導電性ポリマ―パッド |
JP2000228440A (ja) | 1999-02-04 | 2000-08-15 | Nissin Electric Co Ltd | 監視回路付基板保持装置 |
WO2005091356A1 (ja) | 2004-03-19 | 2005-09-29 | Creative Technology Corporation | 双極型静電チャック |
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EP0635870A1 (en) * | 1993-07-20 | 1995-01-25 | Applied Materials, Inc. | An electrostatic chuck having a grooved surface |
US5535507A (en) * | 1993-12-20 | 1996-07-16 | International Business Machines Corporation | Method of making electrostatic chuck with oxide insulator |
KR100404631B1 (ko) * | 1994-01-31 | 2004-02-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 두께가일정한절연체막을갖는정전기척 |
US5764471A (en) * | 1996-05-08 | 1998-06-09 | Applied Materials, Inc. | Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck |
US6117246A (en) * | 1997-01-31 | 2000-09-12 | Applied Materials, Inc. | Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck |
JP4057977B2 (ja) * | 2003-08-08 | 2008-03-05 | 株式会社巴川製紙所 | 静電チャック装置用電極シート、静電チャック装置および吸着方法 |
-
2006
- 2006-11-30 EP EP06833773A patent/EP1959488A4/en not_active Withdrawn
- 2006-11-30 WO PCT/JP2006/323970 patent/WO2007066572A1/ja active Application Filing
- 2006-11-30 US US12/085,349 patent/US7881036B2/en active Active
- 2006-11-30 KR KR1020087016260A patent/KR100994299B1/ko not_active IP Right Cessation
- 2006-11-30 CN CN2006800461073A patent/CN101326627B/zh not_active Expired - Fee Related
- 2006-11-30 JP JP2007549093A patent/JP4825220B2/ja active Active
- 2006-12-01 TW TW095144842A patent/TW200735258A/zh unknown
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2009
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Cited By (12)
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JP2008294174A (ja) * | 2007-05-24 | 2008-12-04 | Taiheiyo Cement Corp | ガラス質静電チャック及びその製造方法 |
US8363377B2 (en) * | 2007-12-03 | 2013-01-29 | Adp Engineering Co., Ltd. | Electrostatic chuck and apparatus having the same |
WO2010095720A1 (ja) * | 2009-02-20 | 2010-08-26 | 日本碍子株式会社 | セラミックス-金属接合体及びその製法 |
US8361271B2 (en) | 2009-02-20 | 2013-01-29 | Ngk Insulators, Ltd. | Ceramic-metal bonded body and method of producing the same |
WO2011001978A1 (ja) * | 2009-07-02 | 2011-01-06 | 株式会社クリエイティブ テクノロジー | 静電吸着構造体及びその製造方法 |
JP5500172B2 (ja) * | 2009-07-02 | 2014-05-21 | 株式会社クリエイティブ テクノロジー | 静電吸着構造体及びその製造方法 |
WO2012005294A1 (ja) * | 2010-07-09 | 2012-01-12 | 株式会社クリエイティブ テクノロジー | 静電チャック装置及びその製造方法 |
CN109872978A (zh) * | 2017-12-01 | 2019-06-11 | 英飞凌科技股份有限公司 | 包括多个外部触点的半导体芯片,芯片布置装置和用于检查半导体芯片的位置对准的方法 |
WO2023058652A1 (ja) | 2021-10-06 | 2023-04-13 | 株式会社クリエイティブテクノロジー | 電気集塵機及びそれを用いた集塵方法 |
WO2023058651A1 (ja) | 2021-10-06 | 2023-04-13 | 株式会社クリエイティブテクノロジー | プレス金型用電気集塵機及びそれを用いたプレス金型 |
KR20240066182A (ko) | 2021-10-06 | 2024-05-14 | 가부시키가이샤 크리에이티브 테크놀러지 | 전기 집진기 및 그것을 이용한 집진 방법 |
KR20240089177A (ko) | 2021-10-06 | 2024-06-20 | 가부시키가이샤 크리에이티브 테크놀러지 | 프레스 금형용 전기 집진기 및 그것을 이용한 프레스 금형 |
Also Published As
Publication number | Publication date |
---|---|
KR100994299B1 (ko) | 2010-11-12 |
EP1959488A1 (en) | 2008-08-20 |
HK1124688A1 (en) | 2009-07-17 |
EP1959488A4 (en) | 2011-01-26 |
JPWO2007066572A1 (ja) | 2009-05-21 |
JP4825220B2 (ja) | 2011-11-30 |
KR20080081014A (ko) | 2008-09-05 |
US7881036B2 (en) | 2011-02-01 |
CN101326627A (zh) | 2008-12-17 |
TWI369752B (ja) | 2012-08-01 |
US20090040681A1 (en) | 2009-02-12 |
TW200735258A (en) | 2007-09-16 |
CN101326627B (zh) | 2010-06-09 |
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