WO2007058045A1 - 面状照明装置 - Google Patents
面状照明装置 Download PDFInfo
- Publication number
- WO2007058045A1 WO2007058045A1 PCT/JP2006/320776 JP2006320776W WO2007058045A1 WO 2007058045 A1 WO2007058045 A1 WO 2007058045A1 JP 2006320776 W JP2006320776 W JP 2006320776W WO 2007058045 A1 WO2007058045 A1 WO 2007058045A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light source
- heat
- fpc
- double
- led
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Definitions
- the present invention relates to a sidelight type planar illumination device, and more particularly to a planar illumination device used as an illumination device for a liquid crystal display device.
- a sidelight type planar illumination device in which a primary light source is disposed on a side end surface of a light guide plate is mainly used (hereinafter referred to as a primary light source).
- the side end face on which is arranged is also referred to as a light incident surface).
- cold cathode lamps have been used as the primary light source for sidelight surface illumination devices, but now they are easier to handle and easier to reduce in size compared to cold cathode lamps.
- a point light source such as a white LED (hereinafter also simply referred to as LED), which has excellent properties, is frequently used.
- planar illumination device using such a point light source tends to expand, and is not limited to a small liquid crystal display device mounted on a mobile phone or the like, for example, an in-vehicle navigator having a relatively large display size.
- the application as an auxiliary light source for liquid crystal display devices used in LCDs is also being studied.
- the power to increase the current supplied to each LED or the LED to be used It is desirable to increase the number.
- the increase in the current supplied to the LED and the increase in the number of LEDs are accompanied by an increase in the amount of heat generated by the LED force, resulting in a problem that the luminous efficiency of the LED decreases due to temperature rise.
- the light guide plate 2 and the LED 3 are mounted as in the surface illumination device 1 shown in FIG.
- the frame 5 is made of a metal material having excellent thermal conductivity such as aluminum, and LED3
- FPC 4 flexible printed circuit board
- the heat generated from the LED 3 is released by joining the FPC 4 to the heat sink 5a that also has the side wall force of the frame 5.
- FIG. 6 is a cross-sectional view showing a configuration example of such a light source unit.
- the FPC 4 includes a base film 6 made of polyimide, a conductor pattern 7 formed by patterning a copper foil or the like laminated on the base film 6, and a polyimide film.
- a cover film 8 is provided, and a through-hole 9 is provided at a position of the FPC 4 facing the back surface (mounting surface) 3b of the LED 3 when the LED 3 is mounted.
- the manufacturing process of the light source unit 15 shown in FIG. 6 is as follows. First, the LED3 is mounted on the front surface 4F side of the FPC 4 provided with the through-hole 9 in advance, and then the back surface 4R side force thermal conductive agent 11 of the FPC 4 is filled in the concave portion having the force of the through-hole 9 and the mounting surface 3b of LED3 Then, the back surface 4R of the FPC 4 and the heat sink 5a are fixed by the heat conductive agent 12. At this time, from the viewpoint of heat radiation efficiency and workability of assembly work, a heat conducting resin having fluidity is usually used for the heat conducting agent 11, and the heat conducting agent 12 is solid at least at room temperature.
- a heat conductive resin (hereinafter also referred to as a heat conductive tape) formed in a tape shape is used.
- a heat conductive tape formed in a tape shape is used.
- Such a configuration of the light source unit 15 is advantageous in improving heat dissipation characteristics because a heat dissipation path that does not involve the base film 6 having a low thermal conductivity is formed between the LED 3 that is a heat source and the heat dissipation plate 5a. Is.
- a through hole communicating with the through hole 9 of the FPC 4 is also provided in the heat sink 5a, and a heat conductive agent (heat conduction) (For example, see Patent Document 1).
- Patent Document 1 Japanese Patent Laid-Open No. 2002-162626 ([Claim 1], [Claim 3], FIG. 1, FIG. 2) Disclosure of the Invention
- the through hole 9 provided in the FPC 4 is made as large as possible, and the mounting surface 3b of the LED 3 It is desirable to make the contact area of the heat conductive resin 11 as large as possible.
- the through hole 9 is provided in the FPC 4 and the area thereof is further increased, a narrow portion is generated around the through hole 9 of the FPC 4 and the strength of the FPC 4 becomes insufficient. For this reason, planar illumination In the manufacturing process of the light device 1, there was a problem that the FPC 4 before mounting the LED 3 was likely to be deformed or disconnected.
- the heat conductive resin 11 having fluidity is preferable as the heat conductive agent filled in the through hole 9, but heat conduction is performed in the concave portion formed by the through hole 9 and the mounting surface 3b of the LED 3.
- the transition of the heat conductive resin 11 to other places is easy to occur.
- Outgoing surface 3a It is necessary to pay close attention to avoid scratches and dirt.
- the conventional configuration of the light source unit 15 shown in FIG. 6 has a problem in terms of workability in the manufacturing process.
- Patent Document 1 the light source portion is first fixed after the FPC 4 is attached and fixed to the heat radiating plate 5a with an adhesive, and then a through-hole penetrating the heat radiating plate 5a and the FPC 4 is formed. It is described that LED3 is mounted on FPC4, and is then manufactured by a series of processes in which a heat conductive adhesive filler is embedded in a through-hole and dried and solidified. In such a member configuration and manufacturing process, the above-mentioned problems do not occur, but there is a concern that costs will increase due to the procurement of new equipment necessary for carrying out the process and an increase in the manufacturing process.
- the present invention has been made in view of the above problems, and its object is to improve the workability of the heat conductive agent filling work and to efficiently dissipate the heat generated from the point light source.
- An object of the present invention is to provide a planar lighting device that can achieve high brightness.
- a planar illumination device includes a light guide plate, a point light source disposed on a side end surface of the light guide plate, and a double-sided flexible device on which the point light source is mounted.
- the double-sided flexible printed circuit board has a recess formed in a part of a surface on which the point light source is mounted, and the bottom surface of the recessed part is formed on the double-sided flexible printed circuit board.
- a space formed by the concave portion and the mounting surface of the point light source is filled with a heat conductive resin. It is characterized by.
- the planar illumination device according to the present invention is formed by forming, on the double-sided flexible printed board, a recess having a bottom surface of a conductor pattern opposite to the side where the point light source is mounted, which is not the through hole. Heat conduction without reducing the strength of double-sided flexible printed circuit boards A space for filling the resin is formed.
- the heat conductive resin filling operation is preferably performed from the side of the surface on which the point light source of the double-sided flexible printed board is mounted before the point light source is mounted.
- the heat conductive resin is held in a space formed by the concave portion and the mounting surface of the point light source, and the heat conductive resin is transferred to other members. Since it does not take into account the transfer of fat transfer ', it contributes to the improvement of workability in the subsequent process.
- the double-sided flexible printed circuit board is attached to a heat dissipation plate via a heat conductive tape, so that a heat transfer is performed from a point light source that is a heat source.
- a heat dissipation path with a high thermal conductivity that passes through the resin, conductor pattern, and heat conduction tape to the heat sink is constructed.
- the heat sink efficiently conducts heat generated from the point light source to the heat sink and dissipates it. It is.
- a thermally conductive tape that is stable at least at room temperature, the workability of attaching the double-sided flexible printed circuit board to the heat sink is improved.
- the present invention Since the present invention is configured as described above, it improves the workability of the heat conductive agent filling operation and efficiently dissipates the heat generated by the point light source power to increase the brightness of the planar lighting device. It can be achieved.
- FIG. 1 is a cross-sectional view showing a main part of a light source unit in a first embodiment of the present invention.
- FIG. 2 is a top view showing a main part of a double-sided flexible printed circuit board used in the light source unit shown in FIG.
- FIG. 3 is a cross-sectional view showing a main part of a light source unit in a second embodiment of the present invention.
- FIG. 4 is an upper view showing the main part of the double-sided flexible printed circuit board used in the light source section shown in FIG.
- FIG. 5 is a perspective view showing a configuration example of a conventional planar illumination device.
- FIG. 6 is a cross-sectional view showing a configuration example of a light source unit in a conventional planar illumination device.
- planar lighting device according to the present invention has the same basic configuration as the planar lighting device 1 shown in FIG. 5, and therefore, the description of the overlapping parts is omitted, and the main characteristic portion of the present invention.
- the configuration of a certain light source section will be described in detail. In this case, the same components as those of the planar lighting device 1 shown in FIG.
- FIG. 1 is a cross-sectional view showing the main part of the light source unit 30 according to the first embodiment of the present invention.
- FIG. 2 is an upper surface showing the main part of the double-sided flexible printed circuit board 10 used in the light source unit 30.
- the double-sided flexible printed circuit board (hereinafter referred to as FPC) 10 is formed by patterning a base film 6 made of polyimide or the like and a copper foil or the like laminated on both main surfaces of the base film 6.
- the conductor pattern 7F on the surface 10F side of the FPC 10 includes a land portion 26 on which a white LED (hereinafter referred to as an LED) 3 which is a point light source in this embodiment is mounted, and a cover film 8F
- the LED 3 is mounted on the front surface 10F side of the FPC 10 so that at least the openings 24 that expose the land portions 26 are provided. Further, the rear surface 10R side of the FPC 10 is fixed to the heat radiating plate 5a via the heat conductive tape 12.
- the FPC 10 is provided with an opening 21 at a location facing the mounting surface 3b of the LED 3 of the base film 6, and the conductor pattern 7R on the back surface 10R side has at least the opening 21.
- the part 22 is patterned with the portion 22 immediately below, and a recess 23 is formed with the portion 22 immediately below the opening 21 as a bottom surface.
- a heat conductive resin 11 is filled in a space formed by the recess 23 formed in the FPC 10 and the mounting surface 3b of the LED 3 mounted on the FPC 10.
- the cover film 8R on the back surface 10R side of the FPC 10 is provided with an opening 25 so that the bottom surface 22 of the recess 23 is also exposed on the back surface 10R side.
- the heat conductive resin 11 and the heat conductive tape 12 are made of a resin material having electrical insulation and high thermal conductivity, for example, a silicone-based resin composition.
- a resin material having electrical insulation and high thermal conductivity for example, a silicone-based resin composition.
- the thermal conductive resin 11 is a type of thermal conductive agent that has a considerable fluidity and does not require a drying / solidifying step.
- the silicone conductive resin formed into an oily, greasey, or pastey form.
- a fat composition may be used.
- the heat conductive tape 12 is a solid that is stable at least at room temperature, and preferably, a heat conductive resin composition having considerable tackiness or adhesiveness and shape followability is formed into a tape shape. It is formed by molding.
- the heat conductive tape 12 may be formed by coating an acrylic resin composition on a polyethylene terephthalate film or the like that has been subjected to a release treatment.
- a resin composition that softens or melts at a high temperature as the heat conductive tape 12 may be used to further reduce the thermal resistance at the contact portion between the FPC 10 and the heat sink 5a when the LED 3 generates heat. Good.
- the heat conductive resin 11 from the LED 3 that is a heat source, the heat conductive resin 11, the bottom surface 22 including the conductor pattern 7R of the recess 23, and the heat conductive tape A heat conduction path with high thermal conductivity leading to the heat radiating plate 5a through 12 is configured, and heat generated from the LED 3 is efficiently conducted to the heat radiating plate 5a to radiate heat.
- the FPC 10 is configured such that the space for filling the thermal conductive agent 11 is configured by the recess 23 having the bottom surface 22 that is not the through-hole, so that the strength of the FPC 10 before the LED 3 is mounted is There is no decline.
- the step existing on the back surface 10R side of the FPC10 is only the thickness of the cover film 8R in the opening 25. The level difference can be absorbed. Therefore, on the back surface 10R side of the FPC 10, the back surface 10R of the FPC 10 is not adhered to the portion immediately below the LED 3 and the other portions without performing treatment such as filling different heat conduction agents. Since the entire side can be filled without any gaps, workability is improved and heat dissipation efficiency of heat generated from the LED 3 is improved.
- the heat conductive tape 12 protects the conductor pattern 7R. If insulation is sufficiently secured, the FPC 10 can be configured without using the cover film 8R without using the cover film 8R. May be. In these cases, the heat dissipation efficiency of the heat generated from the LED 3 is further improved.
- a conductive through pattern (not shown) is formed in a copper clad laminate made by laminating copper foil on both main surfaces of a base film 6 made of polyimide or the like. 7F, 7R are formed. Next, an opening 21 is formed at a predetermined location on the surface 10F side of the base film 6 by chemical etching or the like. Next, the FPC 10 is completed by laminating the force bar film 8F and the cover film 8R (if necessary) by thermocompression bonding or the like.
- the thermal conductive resin 11 is filled in the recess 23 of the FPC 10, and then the LED 3 is mounted on the land portion 26.
- the back side 10R of the FPC10 and the heat sink 5a are And fix the FPC10 to the heat sink 5a. Thereby, the light source unit 30 is completed.
- the filling operation of the heat conductive resin 11 is performed immediately before the mounting of the LED 3, and in particular, a mounting apparatus having a filling function is used.
- a mounting apparatus having a filling function is used.
- the heat conducting resin 11 is held in a space formed by the recess 23 and the mounting surface 3b of the LED 3 after the LED 3 is mounted, the subsequent mounting process of the FPC to the heat sink 5a is conducted as a heat conducting resin. It can be implemented without considering the transfer or adhesion of grease 11 to other members, and its workability is greatly improved.
- a heat conductive resin having fluidity that is advantageous in terms of adhesion to the heating element and filling into the space can be suitably used.
- FIGS. 3 and 4 a second embodiment of the present invention will be described with reference to FIGS. 3 and 4.
- the same components as those in the first embodiment described above are the same. Reference numerals are assigned, and descriptions of overlapping parts are omitted as appropriate.
- FIG. 3 is a cross-sectional view showing the main part of the light source unit 50 in the second embodiment of the present invention
- FIG. 4 is a top view showing the main part of the FPC 40 used in the light source unit 50.
- the FPC 40 in this embodiment has the same basic configuration as the FPC 10 and the light source unit 30 shown in FIGS. 1 and 2, and is laminated on both main surfaces of the base film 46 made of polyimide and the like and the base film 46.
- Conductor patterns 47F and 47R formed by patterning the copper foil and the like, and cover films 48F and other layers such as polyimide laminated so as to cover the conductor patterns 47F and 47R (required
- a cover film 48R is provided, and the space formed by the recess 23 provided on the FPC 40 and the mounting surface 3b of the LED 3 is filled with the thermal conductive resin 11, and the back surface 40R side of the FPC 40 is applied to the thermal conductive tape 12 To the heat sink 5a via the heat source LED3, the heat conductive resin 11, the bottom surface 22 made of the conductor pattern 47R of the recess 23, and the heat conductive tape 12 to reach the heat sink 5a. It constitutes a heat dissipation path with high thermal conductivity.
- the cover film 48R is provided on the back side of the FPC 40, the cover film 48R is provided with an opening 25 so that the bottom surface 22 of the recess 23 is also exposed on the back surface 40R side.
- a region A continuous with the land portion 36 of the conductor pattern 47F on the front side 40F has a corresponding portion of the conductor pattern 47R on the back surface 40R side.
- a through-hole 41 is formed to be connected to the conductive pattern 47R, and a heat radiation pattern 42 having an area including at least the through-hole 41 is formed in the conductor pattern 47R on the back surface 40R side.
- the cover film 48R on the back surface 40R side is used, the cover film 48R is provided with an opening 27 that exposes the heat radiation pattern 42.
- the electrode terminal 3c of the LED 3 and the land portion 36 of the conductor pattern 47F A heat dissipation path to the heat dissipation plate 5a through the through hole 41, the heat dissipation pattern 42, and the heat conductive tape 12 is formed, and the heat dissipation efficiency of the heat generated from the LED 3 is further improved.
- a portion of the conductor pattern 47F that is continuous with the land portion 36 has a width W that is substantially the same as the land portion 36.
- the portion of the conductor pattern 47F that continues to the land portion 36 has a width equal to or larger than the width W of the land portion 36 in the region A, and accordingly, the conductor pattern 47F needs to be required. It is possible to provide as many through holes 41 as possible that constitute the heat dissipation path while ensuring a cross-sectional area.
- a preferable manufacturing process of the light source unit 50 in the present embodiment is basically the same as the manufacturing process of the light source unit 30 described above.
- a copper foil is laminated on both main surfaces of the base film 46.
- the difference is that the through holes 41 and the heat release pattern 42 are formed together with these components.
- the conductor patterns 7R and 47R on the back surface 10R and 40R side of the FPCs 10 and 40 described above are used.
- the pattern 22 constituting the bottom surface of the recess 23 and the heat radiation pattern 42 can have any appropriate shape and area as long as they cover at least a predetermined region.
- the electrical connection mode of these patterns 22 and 42 for example, whether or not to connect to a specific wiring pattern (for example, a ground line) included in the conductor patterns 7R and 47R, Whether or not these wiring pattern forces are electrically insulated is appropriately set according to the specific design specifications of the FPCs 10 and 40.
- the through hole 41 of the FPC 40 may also serve as a through hole for conduction.
- the force described above for the preferred embodiment of the present invention is not limited to the above-described embodiment.
- the cover film on the back side that constitutes the FPC is sufficiently thin and the influence on the heat conduction to the LED heat sink is negligible, the cover film on the back side should It is not always necessary to provide an opening such as the opening 25 shown in FIG. 5A.
- a cover film may be laminated on the entire back surface side of the FPC.
- a high heat conducting tape 12 such as that shown in FIGS. It is also possible to apply a normal adhesive tape or adhesive that does not necessarily require the use of a thermally conductive member.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/084,635 US20090201699A1 (en) | 2005-11-21 | 2006-10-18 | Planar Illumination Device and Manufacturing Method of Same |
DE112006003139T DE112006003139T5 (de) | 2005-11-21 | 2006-10-18 | Ebene Beleuchtungsvorrichtung und Verfahren zum Herstellen derselben |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005335986A JP4798432B2 (ja) | 2005-11-21 | 2005-11-21 | 面状照明装置 |
JP2005-335986 | 2005-11-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007058045A1 true WO2007058045A1 (ja) | 2007-05-24 |
Family
ID=38048436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/320776 WO2007058045A1 (ja) | 2005-11-21 | 2006-10-18 | 面状照明装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090201699A1 (ja) |
JP (1) | JP4798432B2 (ja) |
DE (1) | DE112006003139T5 (ja) |
WO (1) | WO2007058045A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009121739A1 (de) * | 2008-04-02 | 2009-10-08 | Continental Automotive Gmbh | Elektrisches gerät |
JP2009267008A (ja) * | 2008-04-24 | 2009-11-12 | Rohm Co Ltd | Ledランプ |
WO2010013523A1 (ja) * | 2008-07-31 | 2010-02-04 | シャープ株式会社 | 発光モジュールユニット、導光ユニット、バックライトユニット、および液晶表示装置 |
CN102200658A (zh) * | 2010-03-26 | 2011-09-28 | 日立民用电子株式会社 | 液晶显示装置 |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4976982B2 (ja) * | 2007-10-30 | 2012-07-18 | パナソニック株式会社 | Ledユニット |
KR101535064B1 (ko) * | 2008-01-17 | 2015-07-09 | 삼성디스플레이 주식회사 | 표시 장치용 광원 모듈 및 이를 포함하는 표시 장치 |
KR101498682B1 (ko) * | 2008-08-20 | 2015-03-04 | 삼성전자주식회사 | 발광 다이오드 모듈 |
JP5245980B2 (ja) * | 2008-09-30 | 2013-07-24 | 豊田合成株式会社 | 発光装置及びその製造方法 |
KR101534659B1 (ko) * | 2008-12-31 | 2015-07-07 | 서울반도체 주식회사 | 연성 인쇄회로기판 및 이를 갖는 백라이트 유닛 |
JP5134582B2 (ja) * | 2009-02-13 | 2013-01-30 | 日立オートモティブシステムズ株式会社 | 接続構造およびパワーモジュール |
JP5556116B2 (ja) * | 2009-10-09 | 2014-07-23 | 三菱電機株式会社 | 光源ユニットならびに照明装置 |
DE102009054840A1 (de) * | 2009-12-17 | 2011-06-22 | Poly-Tech Service GmbH, 67681 | Leuchtmittel mit einer Mehrzahl von Leuchtdioden |
TWI495936B (zh) * | 2010-01-14 | 2015-08-11 | Wistron Corp | 發光二極體裝置及顯示器 |
JP2011228602A (ja) * | 2010-04-23 | 2011-11-10 | Toray Ind Inc | Led発光装置およびその製造方法 |
JP2011238367A (ja) * | 2010-05-06 | 2011-11-24 | Funai Electric Co Ltd | 面発光装置の光源取付構造 |
JP5463205B2 (ja) * | 2010-05-27 | 2014-04-09 | 日本メクトロン株式会社 | フレキシブル回路基板 |
KR101731810B1 (ko) * | 2010-11-26 | 2017-05-11 | 엘지이노텍 주식회사 | 발광소자 어레이 |
EP2656700B8 (en) * | 2010-12-22 | 2022-03-02 | Linxens Holding | Circuit for a light emitting component and method of manufacturing the same |
US9716061B2 (en) | 2011-02-18 | 2017-07-25 | 3M Innovative Properties Company | Flexible light emitting semiconductor device |
JP5432201B2 (ja) | 2011-03-30 | 2014-03-05 | Jx日鉱日石金属株式会社 | 放熱性及び繰り返し曲げ加工性に優れた銅合金板 |
KR101916030B1 (ko) | 2011-08-12 | 2018-11-08 | 엘지이노텍 주식회사 | 발광 모듈 및 이를 구비한 라이트 유닛 |
WO2013025402A2 (en) * | 2011-08-17 | 2013-02-21 | 3M Innovative Properties Company | Two part flexible light emitting semiconductor device |
KR102008901B1 (ko) * | 2011-12-06 | 2019-08-09 | 엘지디스플레이 주식회사 | 액정표시장치 |
JP5973171B2 (ja) | 2012-01-20 | 2016-08-23 | ミネベア株式会社 | 面状照明装置 |
US8963195B2 (en) | 2013-03-15 | 2015-02-24 | Grote Industries, Llc | Flexible lighting device including a heat-spreading layer |
US20140264423A1 (en) * | 2013-03-15 | 2014-09-18 | Grote Industries, Llc | Flexible lighting device including a protective conformal coating |
US9136441B2 (en) * | 2013-03-15 | 2015-09-15 | Grote Industries, Llc | Flexible lighting device |
JP6046015B2 (ja) * | 2013-09-25 | 2016-12-14 | ミネベア株式会社 | 面状照明装置 |
TW201523924A (zh) * | 2013-12-03 | 2015-06-16 | Lextar Electronics Corp | 發光二極體封裝結構 |
JP6533372B2 (ja) * | 2014-04-09 | 2019-06-19 | 住友電工プリントサーキット株式会社 | 照明装置 |
KR101593415B1 (ko) * | 2015-02-17 | 2016-02-15 | 삼성디스플레이 주식회사 | 표시 장치용 광원 모듈 및 이를 포함하는 표시 장치 |
CN211045429U (zh) * | 2016-07-15 | 2020-07-17 | 3M创新有限公司 | 柔性多层构造以及lesd封装 |
EP3503694B1 (de) * | 2017-12-21 | 2024-07-03 | ZKW Group GmbH | Verfahren zum herstellen einer wärmeleitenden verbindung zwischen einem leistungsbauteil und einer metallischen schicht eines schaltungsträgers |
KR102679250B1 (ko) * | 2018-09-12 | 2024-06-28 | 엘지이노텍 주식회사 | 연성 회로기판 및 이를 포함하는 칩 패키지, 및 이를 포함하는 전자 디바이스 |
CN114335304A (zh) * | 2020-09-29 | 2022-04-12 | 日亚化学工业株式会社 | 面发光光源以及其制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08125227A (ja) * | 1994-10-21 | 1996-05-17 | Shichizun Denshi:Kk | 発光ダイオード |
JP2002353515A (ja) * | 2001-05-24 | 2002-12-06 | Samsung Electro Mech Co Ltd | 発光ダイオード及びこれを用いた発光装置とその製造方法 |
JP2003281924A (ja) * | 2002-03-22 | 2003-10-03 | Sony Corp | 光源装置、光源装置の製造方法、面照明装置及び液晶表示装置 |
JP2005051088A (ja) * | 2003-07-30 | 2005-02-24 | Japan Radio Co Ltd | 熱伝導部材付きプリント基板及びその製造方法 |
JP2005064047A (ja) * | 2003-08-13 | 2005-03-10 | Citizen Electronics Co Ltd | 発光ダイオード |
JP2005276950A (ja) * | 2004-03-23 | 2005-10-06 | Matsushita Electric Ind Co Ltd | 半導体チップの実装基板、半導体装置、半導体チップの実装基板の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3516789B2 (ja) * | 1995-11-15 | 2004-04-05 | 三菱電機株式会社 | 半導体パワーモジュール |
JP2002162626A (ja) | 2000-11-22 | 2002-06-07 | Sony Corp | 液晶表示用光源の放熱装置及びその製造方法 |
US6920046B2 (en) * | 2003-06-25 | 2005-07-19 | Eaton Corporation | Dissipating heat in an array of circuit components |
US7220040B2 (en) * | 2004-11-12 | 2007-05-22 | Harris Corporation | LED light engine for backlighting a liquid crystal display |
US7296916B2 (en) * | 2004-12-21 | 2007-11-20 | 3M Innovative Properties Company | Illumination assembly and method of making same |
-
2005
- 2005-11-21 JP JP2005335986A patent/JP4798432B2/ja not_active Expired - Fee Related
-
2006
- 2006-10-18 WO PCT/JP2006/320776 patent/WO2007058045A1/ja active Application Filing
- 2006-10-18 US US12/084,635 patent/US20090201699A1/en not_active Abandoned
- 2006-10-18 DE DE112006003139T patent/DE112006003139T5/de not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08125227A (ja) * | 1994-10-21 | 1996-05-17 | Shichizun Denshi:Kk | 発光ダイオード |
JP2002353515A (ja) * | 2001-05-24 | 2002-12-06 | Samsung Electro Mech Co Ltd | 発光ダイオード及びこれを用いた発光装置とその製造方法 |
JP2003281924A (ja) * | 2002-03-22 | 2003-10-03 | Sony Corp | 光源装置、光源装置の製造方法、面照明装置及び液晶表示装置 |
JP2005051088A (ja) * | 2003-07-30 | 2005-02-24 | Japan Radio Co Ltd | 熱伝導部材付きプリント基板及びその製造方法 |
JP2005064047A (ja) * | 2003-08-13 | 2005-03-10 | Citizen Electronics Co Ltd | 発光ダイオード |
JP2005276950A (ja) * | 2004-03-23 | 2005-10-06 | Matsushita Electric Ind Co Ltd | 半導体チップの実装基板、半導体装置、半導体チップの実装基板の製造方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009121739A1 (de) * | 2008-04-02 | 2009-10-08 | Continental Automotive Gmbh | Elektrisches gerät |
JP2011517023A (ja) * | 2008-04-02 | 2011-05-26 | コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 電気装置 |
US8344258B2 (en) | 2008-04-02 | 2013-01-01 | Continental Automotive Gmbh | Electric device |
JP2009267008A (ja) * | 2008-04-24 | 2009-11-12 | Rohm Co Ltd | Ledランプ |
WO2010013523A1 (ja) * | 2008-07-31 | 2010-02-04 | シャープ株式会社 | 発光モジュールユニット、導光ユニット、バックライトユニット、および液晶表示装置 |
CN102200658A (zh) * | 2010-03-26 | 2011-09-28 | 日立民用电子株式会社 | 液晶显示装置 |
JP2011203633A (ja) * | 2010-03-26 | 2011-10-13 | Hitachi Consumer Electronics Co Ltd | 液晶表示装置 |
CN102200658B (zh) * | 2010-03-26 | 2014-10-22 | 日立民用电子株式会社 | 液晶显示装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2007141729A (ja) | 2007-06-07 |
DE112006003139T5 (de) | 2008-09-25 |
US20090201699A1 (en) | 2009-08-13 |
JP4798432B2 (ja) | 2011-10-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4798432B2 (ja) | 面状照明装置 | |
JP4654942B2 (ja) | 面状照明装置 | |
JP4573128B2 (ja) | 面状照明装置 | |
JP4697533B2 (ja) | 面状照明装置 | |
US8100567B2 (en) | Light-emitting devices and related systems | |
JP3713088B2 (ja) | 表示装置 | |
US20080099777A1 (en) | Light-emitting devices and related systems | |
JPH11330750A (ja) | 伝熱経路の形成方法および伝熱経路装置 | |
KR20080102300A (ko) | 열적 비아와 통합되는 led | |
EP1615488A3 (fr) | Assemblage électronique à drain thermique notamment pour module de commande de lampe à décharge de projecteurs de véhicule automobile | |
JP2011238367A (ja) | 面発光装置の光源取付構造 | |
JP2004095586A (ja) | 電気装置および配線基板 | |
WO2010108361A1 (zh) | 包括具有可导热及散热油墨的散热结构的pcb板 | |
GB2471497A (en) | Double sided multi-layer metal substrate PCB with SMD components mounted to top traces and lead wire components mounted to opposite side for heat dissipation | |
JP2001111237A (ja) | 多層プリント基板及び電子機器 | |
CN1972585A (zh) | 具有双重散热结构的电子装置 | |
JP2003264387A (ja) | 回路基板 | |
CN217406796U (zh) | 便于电子器件连接的覆铜箔 | |
CN217406795U (zh) | 用于支撑印制电路板的覆铜箔 | |
WO2007047469A2 (en) | Light-emitting devices and related systems | |
KR101105006B1 (ko) | 엘이디방열어셈블리 및 엘이디방열어셈블리의 제조방법 | |
TW574760B (en) | LED display module having high heat dissipation property and its substrate | |
KR200433460Y1 (ko) | 열 방사 시트를 갖는 회로 기판 | |
KR101944756B1 (ko) | 전자부품 방열 기판 | |
KR20090122026A (ko) | 방열패턴을 갖는 인쇄회로기판 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 12084635 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1120060031392 Country of ref document: DE |
|
RET | De translation (de og part 6b) |
Ref document number: 112006003139 Country of ref document: DE Date of ref document: 20080925 Kind code of ref document: P |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 06811969 Country of ref document: EP Kind code of ref document: A1 |