JP2011517023A - 電気装置 - Google Patents
電気装置 Download PDFInfo
- Publication number
- JP2011517023A JP2011517023A JP2011502333A JP2011502333A JP2011517023A JP 2011517023 A JP2011517023 A JP 2011517023A JP 2011502333 A JP2011502333 A JP 2011502333A JP 2011502333 A JP2011502333 A JP 2011502333A JP 2011517023 A JP2011517023 A JP 2011517023A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electrical device
- flexible printed
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000009975 flexible effect Effects 0.000 claims abstract description 69
- 238000007789 sealing Methods 0.000 claims abstract description 55
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 238000005516 engineering process Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims description 20
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000000806 elastomer Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000002788 crimping Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
Abstract
Description
Claims (18)
- 電気装置、特に自動車のためのメカトロニクス技術を用いた変速装置制御装置、駆動装置制御装置又は制動装置制御装置において、
‐電子的な構成素子(2)を備え、該構成素子(2)が該構成素子(2)の電気的な接点接続のための少なくとも1つの電気的なコンタクト面(3,4)を備え、
‐フレキシブルなプリント基板(5)を備え、該フレキシブルなプリント基板(5)において、少なくとも1つのコンタクトパッド(6,7)と導体路とを備える導体パターン構造が、2つのフレキシブルな非伝導性のシート(27,28)間に配置されており、少なくとも1つのコンタクト箇所(8,9)を形成するために、前記フレキシブルなプリント基板(5)のそれぞれのコンタクトパッド(6,7)が、前記構成素子(2)のそれぞれのコンタクト面(3,4)に電気的に、特に溶接により接続されており、かつ
‐シール部材(10)を備え、該シール部材(10)が、前記フレキシブルなプリント基板(5)の、前記構成素子(2)とは反対側に配置され、かつ壁(11)により画成される内室を有しており、前記シール部材(10)が前記壁(11)の縁部(13)でもって前記フレキシブルなプリント基板(5)に圧着されていて、前記縁部(13)が前記コンタクト箇所(8,9)の少なくとも1つを包囲している
ことを特徴とする、電気装置。 - 前記壁(11)が、二重に形成され、外側の側壁(14)と、前記内室に隣接する内側の側壁(15,16)とを備え、前記壁(11)の、前記外側の側壁(14)と前記内側の側壁(15,16)とを結合する区分(31)が、前記縁部(13)を形成する、請求項1記載の電気装置。
- 前記縁部(13)内に、前記外側の側壁(14)と前記内側の側壁(15,16)との間で、溝(17)が形成されている、請求項2記載の電気装置。
- 前記内室が単数又は複数の室(18,19)を備え、該室(18,19)がそれぞれの内側の側壁(15,16)により形成されており、それぞれの室(18,19)が1つのコンタクト箇所(8,9)をシールするために設けられている、請求項2又は3記載の電気装置。
- 前記外側の側壁が、前記室(18,19)の前記内側の側壁を包囲する1つの共通の壁(11)を形成する、請求項4記載の電気装置。
- 前記シール部材(10)が、可逆に変形可能なプラスチック、特にエラストマーから形成されている、請求項1から5までのいずれか1項記載の電気装置。
- 前記シール部材(10)が、実質的に変形不能な材料からなる環状のフレーム(20)内に固定されている、請求項1から6までのいずれか1項記載の電気装置。
- 前記外側の側壁(14)だけが前記フレーム(20)により固定されている、請求項2から6までのいずれか1項を引用する請求項7記載の電気装置。
- 前記シール部材(10)の前記内室が、さらに、底(21;22,23)により画成されており、前記フレーム(20)が、前記シール部材(10)の前記内室の前記底(21;22,23)の領域で切欠かれている、請求項7又は8記載の電気装置。
- 前記フレーム(20)が複数の係止部材(32,33)を備え、該係止部材(32,33)により前記フレーム(20)が、第1のハウジング構成部分(36)にか、又は該第1のハウジング構成部分(36)の、前記フレーム(20)に対応する切欠き(37)内に、破壊することなく解離可能に固定されている、請求項8又は9記載の電気装置。
- 前記フレーム(20)及び前記切欠き(37)の寸法は、前記フレーム(20)が前記切欠き(37)内で、前記フレキシブルなプリント基板(5)の平面に対して平行に所定の限度内で可動に支承されているように選択されている、請求項10記載の電気装置。
- 前記シール部材(10)が前記フレキシブルなプリント基板(5)の平面に対して平行に、該フレキシブルなプリント基板(5)に対して相対的に固定されている、請求項11記載の電気装置。
- 前記フレーム(20)の、実質的に前記シール部材(10)の前記底(21;22,23)の平面内にある区分(34,35)が、専ら、前記フレキシブルなプリント基板(5)の平面に対して垂直に作用する力を受容するために設けられている、請求項8から12までのいずれか1項記載の電気装置。
- 前記シール部材(10)の前記底(21;22,23)と前記第1のハウジング構成部分(36)との間に、所定の高さのギャップ(43)が形成されている、請求項10から13までのいずれか1項記載の電気装置。
- 前記フレキシブルなプリント基板(5)と前記シール部材(10)との間に形成されるシールが、少なくとも粒子に対して密である、請求項1から14までのいずれか1項記載の電気装置。
- 前記構成素子(2)が、少なくとも1つのコンタクト面(3,4)とは反対側の主面で、第2のハウジング構成部分(44)に固定されている、請求項1から15までのいずれか1項記載の電気装置。
- 前記第1及び第2のハウジング構成部分(36,44)が機械的に互いに結合されている、請求項16記載の装置。
- オイル浴又は流体浴内に固定することが予定されている、請求項1から17までのいずれか1項記載の電気装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008016899A DE102008016899A1 (de) | 2008-04-02 | 2008-04-02 | Elektrisches Gerät |
DE102008016899.8 | 2008-04-02 | ||
PCT/EP2009/053342 WO2009121739A1 (de) | 2008-04-02 | 2009-03-23 | Elektrisches gerät |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011517023A true JP2011517023A (ja) | 2011-05-26 |
JP5069373B2 JP5069373B2 (ja) | 2012-11-07 |
Family
ID=40983327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011502333A Expired - Fee Related JP5069373B2 (ja) | 2008-04-02 | 2009-03-23 | 電気装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8344258B2 (ja) |
EP (1) | EP2272310B1 (ja) |
JP (1) | JP5069373B2 (ja) |
DE (1) | DE102008016899A1 (ja) |
WO (1) | WO2009121739A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010039146A1 (de) * | 2010-08-10 | 2012-02-16 | Robert Bosch Gmbh | Verfahren zum elektrisch leitenden Verbinden von Leiterbahnen in Leitungsträgern und System umfassend solche Leitungsträger |
US10439118B2 (en) * | 2014-12-04 | 2019-10-08 | Maxim Integrated Products, Inc. | MEMS-based wafer level packaging for thermo-electric IR detectors |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483669B1 (en) * | 1999-09-17 | 2002-11-19 | Hutchinson Technology Incorporated | Integrated lead suspension with IC chip and method of manufacture |
US20030114022A1 (en) * | 2000-07-28 | 2003-06-19 | Frank Franzen | Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner |
US20060071325A1 (en) * | 2004-10-05 | 2006-04-06 | Yasuhiko Tanaka | Semiconductor device and electronic apparatus |
WO2007058045A1 (ja) * | 2005-11-21 | 2007-05-24 | Minebea Co., Ltd. | 面状照明装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6300566B1 (en) * | 1998-03-13 | 2001-10-09 | Siemens Aktiengesellschaft | Electrical connection of a circuit carrier to a conductor-track carrier |
DE102006033477B3 (de) | 2006-07-19 | 2008-01-24 | Siemens Ag | Leiterträger und Anordnung mit Leiterträger |
-
2008
- 2008-04-02 DE DE102008016899A patent/DE102008016899A1/de not_active Withdrawn
-
2009
- 2009-03-23 US US12/936,018 patent/US8344258B2/en not_active Expired - Fee Related
- 2009-03-23 WO PCT/EP2009/053342 patent/WO2009121739A1/de active Application Filing
- 2009-03-23 EP EP09726766.0A patent/EP2272310B1/de not_active Not-in-force
- 2009-03-23 JP JP2011502333A patent/JP5069373B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483669B1 (en) * | 1999-09-17 | 2002-11-19 | Hutchinson Technology Incorporated | Integrated lead suspension with IC chip and method of manufacture |
US20030114022A1 (en) * | 2000-07-28 | 2003-06-19 | Frank Franzen | Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner |
US20060071325A1 (en) * | 2004-10-05 | 2006-04-06 | Yasuhiko Tanaka | Semiconductor device and electronic apparatus |
WO2007058045A1 (ja) * | 2005-11-21 | 2007-05-24 | Minebea Co., Ltd. | 面状照明装置 |
Also Published As
Publication number | Publication date |
---|---|
US8344258B2 (en) | 2013-01-01 |
WO2009121739A1 (de) | 2009-10-08 |
JP5069373B2 (ja) | 2012-11-07 |
EP2272310A1 (de) | 2011-01-12 |
EP2272310B1 (de) | 2018-06-20 |
US20110017497A1 (en) | 2011-01-27 |
DE102008016899A1 (de) | 2009-10-22 |
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