Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
  • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70216—Mask projection systems
  • G03F7/70283—Mask effects on the imaging process
  • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning

Definitions

• the present invention relates to a digital exposure apparatus, and more particularly to a double-sided digital exposure apparatus that performs digital exposure on both sides of a recording medium.
• the substrate 401 exposed and transported by the exposure machine 402 is turned upside down by the reversing machine 404, and the back surface is exposed by the exposure machine 406 to expose both the front and back sides. It can be performed.
• Patent Document 2 requires two expensive exposure machines for the entire line, As a double-sided system, it becomes expensive.
• the object of the present invention is to reduce the cost and increase the processing capability in order to solve the above problem.
• the purpose is to provide a V ⁇ digital exposure system.
• Patent Document 1 JP 2004-205632 A
• Patent Document 2 JP 2002-341550 A
• an object of the present invention is to provide a low-cost digital exposure apparatus with high processing capability.
• a digital exposure apparatus that exposes a recording medium with a light beam modulated based on image information and records an image, and transports the recording medium while conveying the recording medium.
• An exposure unit that performs scanning exposure on the recording medium, a conveyance unit that is provided in a direction orthogonal to the conveyance direction of the recording medium by the exposure unit, and that conveys the recording medium along a conveyance path, and one of the conveyance paths
• a reversing unit for reversing the front and back of the recording medium.
• a digital exposure apparatus that exposes a recording medium with a light beam modulated based on image information and records an image, and the recording medium is conveyed while the recording medium is being conveyed.
• An exposure unit that performs scanning exposure on the medium, a transport unit that is provided in a direction orthogonal to the transport direction of the recording medium by the exposure unit, and transports the recording medium along the transport path, and one of the transport paths
• a first standby stage that waits for the recording medium before exposure
• a second standby stage that is provided on the other side of the transport path and waits for the exposed recording medium, and from the standby stage to the recording medium
• a reversing unit for reversing the front and back of the recording medium.
• the optical unit includes an exposure stage on which the recording medium to be exposed is mounted and reciprocates. After the nth recording medium finishes surface exposure on the exposure stage, the first standby is performed.
• the (n + 1) th recording medium and the nth recording medium on the stage are simultaneously conveyed by the conveyance unit to the exposure stage and the second standby stage, respectively, and the n + 1 While the first recording medium is exposed on the surface of the exposure stage, the nth recording medium is conveyed to the second standby stage force by the reversing unit and turned upside down.
• the n + 1st recording medium that has been transported to the standby stage and finished surface exposure is transported to the first standby stage, and at the same time, the nth recording medium is transported to the exposure stage, and then The nth recording medium is the front The back surface is exposed on the exposure stage, and the nth recording medium after the backside exposure is completed is carried out of the apparatus via the exposure stage force and the second standby stage, and the n + 1 sheets
• the digital recording medium is configured such that the second recording medium passes through the exposure stage and is conveyed to the second standby stage, and further, the (n + 2) th recording medium is conveyed to the first standby stage.
• a digital exposure apparatus that exposes a recording medium with a light beam modulated based on image information and records an image, and the recording medium while transporting the recording medium
• An exposure unit that performs scanning exposure, a conveyance unit that is provided in a direction orthogonal to a conveyance direction of the recording medium by the exposure unit, and that conveys the recording medium along a conveyance path; and one of the conveyance paths
• a first standby stage that waits for the recording medium before exposure, a second standby stage that is provided on the other side of the transport path and waits for the exposed recording medium, and the recording from the standby stage.
• the reversing unit is close to the first standby stage of the transfer path and the first reversing unit provided at the end of the transfer path close to the second standby stage.
• a second reversing unit provided at the end, and after the nth recording medium finishes surface exposure on the exposure stage, the n + 1st sheet on the first standby stage The recording medium and the nth recording medium are each simultaneously exposed to the exposure stage.
• the second standby stage is transported by the transport unit, and the n + 1th recording medium is exposed on the exposure stage while the nth recording medium is exposed to the second standby stage.
• Standby stage force The n + 1st recording medium that has been transported to the first reversing unit and turned upside down and then transported again to the second standby stage and has been subjected to surface exposure is transferred to the first standby stage. Simultaneously with the conveyance, the nth recording medium is conveyed to the exposure stage, and then the nth recording medium is exposed on the back side on the exposure unit, so that the (n + 1) th recording medium is obtained.
• nth recording medium after the backside exposure is completed is the exposure stage.
• the n + 1st recording medium is conveyed to the exposure stage and exposed on the back surface, and the n + 2th recording medium is further transferred to the first standby stage force.
• a digital exposure apparatus configured to be carried into the standby stage is provided.
• the present invention has the above-described configuration, a digital exposure apparatus with high cost and high processing capability can be obtained.
• FIG. 1 is a partially broken schematic perspective view showing a housing in which a laser exposure apparatus and a substrate transfer apparatus according to the present invention are housed.
• FIG. 2 is a schematic perspective view showing a laser exposure apparatus and a substrate transfer apparatus according to the present invention.
• FIG. 3 is a schematic plan view showing a laser exposure apparatus and a substrate transfer apparatus according to the present invention.
• FIG. 4 is a schematic perspective view of a laser exposure apparatus according to the present invention.
• FIG. 5A is a plan view showing an exposure region by the exposure head and an arrangement pattern of the exposure head according to the present invention.
• FIG. 5B is a plan view showing an exposure area by the exposure head according to the present invention and an arrangement pattern of the exposure head.
• FIG. 6A is a view showing an exposure system according to the present invention.
• FIG. 6B is a view showing an exposure system according to the present invention.
• FIG. 7A is a diagram showing a substrate exposure and inversion procedure of the exposure system according to the present invention.
• FIG. 7B is a diagram showing a substrate exposure and inversion procedure of the exposure system according to the present invention.
• FIG. 7C is a diagram showing a substrate exposure and inversion procedure of the exposure system according to the present invention.
• FIG. 7D is a diagram showing a substrate exposure and inversion procedure of the exposure system according to the present invention.
• FIG. 7E is a diagram showing a substrate exposure and inversion procedure of the exposure system according to the present invention.
• FIG. 7F is a diagram showing a substrate exposure and inversion procedure of the exposure system according to the present invention.
• FIG. 8A is a diagram showing a structure of a reversing machine according to the present invention.
• FIG. 8B is a diagram showing a structure of a reversing machine according to the present invention.
• FIG. 9A is a diagram showing the operation of the reversing machine according to the present invention.
• FIG. 9B is a diagram showing the operation of the reversing machine according to the present invention.
• FIG. 9C is a diagram showing the operation of the reversing machine according to the present invention.
• FIG. 9D is a diagram showing the operation of the reversing machine according to the present invention.
• FIG. 9E is a diagram showing the operation of the reversing machine according to the present invention.
• FIG. 10A is a view showing a turntable according to the present invention.
• FIG. 10B is a diagram showing a turntable according to the present invention.
• FIG. 11A is a diagram showing an arrangement of alignment marks according to the present invention.
• FIG. 11B is a diagram showing the alignment mark alignment according to the present invention.
• FIG. 12 is a diagram showing the alignment mark alignment according to the present invention.
• FIG. 13 is a diagram showing the alignment mark alignment according to the present invention.
• FIG. 14 is a view showing a conventional double-sided exposure system.
• FIG. 1 is a partially broken schematic perspective view showing a housing in which a laser exposure apparatus as a digital exposure apparatus according to the present invention and a substrate transfer apparatus are accommodated
• FIG. 2 is a view of the substrate transfer apparatus and the laser with the housing removed.
• FIG. 3 is a schematic perspective view showing an exposure apparatus
• FIG. 3 is a schematic plan view.
• FIG. 4 is a schematic perspective view of the laser exposure apparatus.
• This laser exposure system 10 In the case of 0, a thin plate-like substrate material 200, which is a material of a printed wiring board (or a liquid crystal display substrate or the like!), Is exposed by a laser beam modulated by image information, and the substrate material is obtained. In the drawing area 200, an image (latent image) corresponding to the wiring pattern of the printed wiring board is formed.
• the moving direction of the stage member 110 is the sub-scanning direction (indicated by an arrow S in FIG. 4), and the direction orthogonal thereto is the main scanning direction (indicated by the arrow M in FIG. 4).
• the laser exposure apparatus 100 is provided with a support base 102 having a predetermined thickness.
• the upper surface of the support base 102 is a substantially rectangular shape whose longitudinal direction is the sub-scanning direction with respect to the substrate material 200.
• the support base 102 is horizontally placed on the floor via a vibration isolating rubber 104 or the like so that vibration is blocked. Is installed.
• the substrate material 200 is transported from a first standby stage 310 provided at the front stage of the support base 102, and after exposure is completed on the support base 102, it is transported to a second standby stage 312 provided at the rear stage.
• a pair of guide rails 106 are arranged on the upper surface of the support base 102 in parallel with the sub-scanning direction, and a stage member 110 for placing a substrate is placed on the guide rails 106. It is arranged to be movable.
• the stage member 110 has a substantially rectangular shape with the upper surface shape having a longitudinal direction in the sub-scanning direction with respect to the substrate material 200, and linearly along the sub-scanning direction at the lower surface and at the four corners.
• a guide member 108 having a substantially inverted “concave” shape extending in cross-sectional view is attached. These guide members 108 are slidably fitted to the guide rail 106.
• a ball screw 112 extends along the sub-scanning direction (guide rail) via a bearing (not shown) such as a bearing fixed on the support base 102. In parallel with Le 106).
• One end of the ball screw 112 is provided with a drive motor 114 that rotationally drives the ball screw 112.
• a support gate 116 having a substantially “recessed” shape in a front view is erected so as to straddle the stage member 110 at approximately the center in the sub-scanning direction on the support base 102.
• a plurality of (for example, four) CCD cameras 118 for reading a plurality of alignment marks provided on the substrate material 200 are disposed at predetermined positions of the support gate 116.
• Each CCD camera 118 has a built-in strobe with a very short light emission time as a light source during imaging, and its sensitivity is adjusted so that it can be imaged only when this strobe light is emitted.
• each CCD camera 118 emits a strobe at a predetermined timing when the stage member 110 passes through the imaging position located on the optical axis, thereby aligning the alignment mark on the substrate material 200. It is now possible to image each of the imaging ranges including.
• Each CCD camera 118 has a different imaging area along the width direction (main scanning direction) of the substrate material 200, and a plurality of alignment marks formed on the substrate material 200 to be imaged. Depending on the position, it is disposed in advance at a predetermined position.
• An exposure unit 124 that supports the plurality of exposure heads 120 is disposed downstream of the support gate 116 to which the CCD camera 118 is attached in the sub-scanning direction.
• the exposure head 120 irradiates the exposure surface 202 of the substrate material 200 with a plurality of laser beams modulated based on the image information when the substrate material 200 passes through the exposure position directly below the exposure head 202.
• an image (latent image) corresponding to the wiring pattern of the printed wiring board is formed.
• the exposure heads 120 are arranged in a substantially matrix form of m rows and n columns (eg, 2 rows and 4 columns) along the width direction (main scanning direction) of the support base 102, as shown in FIG. As shown in B), the exposure area 122 by one exposure head 120 has a rectangular shape with the short side in the sub-scanning direction and is inclined at a predetermined inclination angle with respect to the sub-scanning direction! /
• a light source unit (not shown) is disposed in a place that does not hinder the movement of the stage member 110 (for example, the farthest side from the door 92 in FIG. 1).
• This light source unit contains a laser generator, and laser light emitted from the laser generator is sent to each exposure head via an optical fiber (not shown).
• Each exposure head 120 is a digital micromirror device (hereinafter referred to as “DMD”), not shown, which is a spatial light modulation element for the incident laser light guided by an optical fiber.
• DMD digital micromirror device
• the dot pattern is exposed to the substrate material 200! /.
• the density of one pixel is expressed using these multiple dot patterns.
• each dot 1S arranged in the sub-scanning direction passes between dots arranged in the direction intersecting with the sub-scanning direction. For this reason, a substantial pitch between dots can be narrowed, and high resolution can be realized.
• the operation of the laser exposure apparatus 100 will be described.
• the ball screw 112 is rotated by the drive motor 114 and the stage member 110 is moved in the sub-scanning direction.
• the alignment mark is imaged by the CCD camera 118.
• the positions of a plurality of alignment marks provided corresponding to one drawing area are determined, respectively, and the position force of these alignment marks is determined in the drawing area.
• the position along the sub-scanning direction and the main scanning direction (width direction) and the amount of inclination of the drawing area with respect to the sub-scanning direction are determined.
• the content of the conversion process includes coordinates for rotating image information around the coordinate origin. Conversion processing, image rotation processing along the sub-scanning direction, and coordinate conversion processing for translating image information along the coordinate axes corresponding to the main scanning direction (width direction) are included. Furthermore, a distortion correction process for expanding or contracting the image information is performed according to the expansion amount and the reduction amount along the main scanning direction (width direction) and the sub-scanning direction of the drawing area as necessary.
• the stage member 110 moves and the image information stored in the frame memory is stored for each of a plurality of lines in synchronism with the timing when the leading edge of the drawing area in the substrate material 200 reaches the exposure position just below the exposure head 120.
• Each DMD is sequentially turned on and off based on the image information.
• the laser light force reflected when the DMD is in the on state forms an image on the exposure surface 202 of the substrate material 200 by a lens system (not shown).
• the laser light emitted from the light source unit is turned on and off for each pixel, so that the drawing area of the substrate material 200 has approximately the same number of pixel units (exposure area) as the number of used pixels of the DMD. 122).
• the substrate material 200 is scanned and exposed with a plurality of laser beams in a direction opposite to the moving direction of the stage member 110, and is formed in a strip shape for each exposure head 120.
• the exposed area 204 is formed (see FIG. 5A).
• FIGS. 6A to 6B show an exposure apparatus system 1 according to the first embodiment of the present invention.
• the exposure apparatus system 1 waits before the substrate material 200 is conveyed to the laser exposure apparatus 100 on the upstream side (left side in the figure) of the laser exposure apparatus 100 in the conveyance direction.
• a second standby stage 312 that waits after the substrate material 200 is once exposed by the laser exposure apparatus 100 is provided on the downstream side in the transport direction (right side in the figure).
• a reversing machine 300 that reverses the substrate material 200 from the second standby stage 312 is provided downstream of the second standby stage 312, and the substrate material 200 transported from the second standby stage 312 is reversed upside down.
• the substrate material 200 is sent back to the standby stage 312 again, or the substrate material 200 that has been exposed on both the front and back surfaces is transported downstream.
• FIGS. 7A to 7F show the exposure sequence of the exposure apparatus system according to the first embodiment of the present invention.
• the front and back sides of the substrate material are the front side exposed first.
• FIG. 7A first, when the surface of the first substrate material 200 (200-1) is exposed by the laser exposure apparatus 100, it passes through the second standby stage 312 and is conveyed to the reversing machine 300. The At this time, a second substrate material 200 (200-2) is waiting on the first standby stage 310.
• the substrate material 200-1 is turned upside down by the reversing machine 300!
• the surface of the substrate material 200-2 is exposed by the laser exposure machine 100.
• the laser exposure machine 100 is a digital exposure machine
• alignment values such as position, dimensions, and distortion amount can be read in the forward path (upward in the figure), and scanning exposure can be performed in the backward path (downward in the figure).
• the second substrate material 200 can be exposed on one side while the first substrate material 200 is reversed, the processing speed of the entire exposure apparatus system can be increased.
• the second substrate material 200-2 having been exposed to the surface is returned to the first standby stage 310, and the transfer path for the first substrate material 200-2 is obtained. Free up.
• the substrate material 200-1 (represented by a circled number) that has been reversed here is conveyed again to the laser exposure apparatus 100, and this time the back surface is exposed.
• the substrate material 200-1 that has been exposed on both sides is passed through the second standby stage 312 and the reversing machine 300 and is carried out of the exposure apparatus system (right side in the figure).
• the conveyance path is vacant. Therefore, the substrate material 200-2 waiting at the first standby stage 310 is Subsequent to the plate material 200—1, it is conveyed to the reversing machine 300.
• the third substrate material 200-3 is conveyed to the first standby stage 310, and the surface Wait for exposure.
• the surface of the third substrate material 200-3 is exposed by the laser exposure apparatus 100. That is, as in FIG. 7B, the other apparatus performs exposure while one sheet is reversed, so that the waiting time of the entire apparatus can always be reduced and the processing capacity can be increased.
• double-sided exposure can be performed on the substrate material 200 with one laser exposure machine 100, and since it is a digital exposure machine, physical mask replacement is not required unlike an analog machine. is there. This makes it possible to construct a double-sided exposure system at low cost because only one expensive exposure machine is required.
• next substrate material 200 is exposed while the first substrate material 200 is reversed, the next substrate material 200 is exposed during exposure (alignment reading), and reversed by the reversing machine 300. Subsequent and after the second and subsequent surface exposure of the substrate material 200, the substrate material 200 is reversely conveyed upstream in the conveyance direction, so that the substrate material 200 is exposed one by one from front exposure ⁇ reverse ⁇ back exposure ⁇ discharge. In addition, since it is possible to work on a plurality of substrate materials 200 at the same time, productivity can be increased.
• a subframe 302 pivotally supported by a rotation shaft L and a turntable 320 to be described later are provided to convey the substrate material 200, Alternatively, the front and back Z can be rotated 180 degrees while holding.
• a carry-in port 303 and a carry-out port 305 are provided at both ends of the subframe 302, that is, both ends (left and right ends in the figure) in the transfer direction in which the substrate material 200 is transferred.
• the substrate material 200 is loaded / unloaded from the page 312.
• a plurality of roller pairs 304 driven by a motor 306 are provided inside the subframe 302 to sandwich the substrate material 200 that has been loaded. It is carried and held at a predetermined position.
• the roller pair 304 sandwiches and conveys the substrate material 200 (black arrow in the figure). ), And held at a predetermined position inside the subframe 302.
• the sub-frame 302 starts rotating around a rotation shaft (not shown) while holding the substrate material 200, and the substrate material 200 is turned upside down.
• Rotating axis is substrate material 2
• the direction may not be perpendicular to the transport direction as shown in FIG.
• the sub-frame 302 rotates again by 180 degrees in preparation for receiving the next substrate material 200 as shown in FIG. 9D, and returns to the initial position as shown in FIG. 9E. Return. As a result, when the next substrate material 200 having been subjected to the surface exposure is transported, it is again 1
• the subframe 302 rotates 180 degrees and then rotates 180 degrees in the opposite direction again to return to the initial position. Therefore, the wiring to the motor 306 may be twisted or entangled so that a free layout can be taken. it can.
• the substrate material 200 is turned upside down using the above-described reversing machine 300, not only the surface but also the leading position is reversed between the front surface exposure and the back surface exposure. As described later, the alignment mark can be read by the mark position. However, since the top and rear edges of the exposure must be aligned on the front and back of the substrate material, the direction of travel is set separately from the front and back inversion. It is necessary to rotate it.
• a turntable as shown in FIGS. 10A to 10B is provided at the front stage of the reversing machine 300, that is, between the second standby stage 312 and the reversing machine 300, and the substrate material 200 is placed in the carrying direction.
• the turntable 320 includes a plurality of holes 322 and a drive shaft 324 that pivotally supports the conveying roller 323 at a position matching the hole 322.
• the turntable 320 moves upward as shown in the figure while the substrate material 200 is placed on the upper surface, turns 180 degrees, and moves downward again to rotate the traveling direction of the substrate material 200 by 180 degrees.
• the traveling direction can be reversed by rotating it 180 degrees once. Monkey.
• the substrate material 200 is supported on the transfer roller 323 on the turntable 320. However, when the turntable 320 is lifted by the lifting mechanism 326 as shown in FIG. Rotate 180 degrees with material 200 placed. When the rotation is completed, the turntable 320 is lowered again by the lifting mechanism 326, and the substrate material 200 is again supported on the driving roller 323. As a result, the substrate material 200 is reversed in the front-rear direction with respect to the transport direction, and is transported to the second standby stage 312 so that it can be prepared for backside exposure.
• the substrate material 200 is rotated by 90 degrees in the front stage of the reversing machine 300, reversed by the reversing machine 300, and then rotated by 90 degrees again.
• the apparatus can be miniaturized.
• FIG. 11A-FIG. 11B and FIG. 12 show the alignment mark arrangement of the substrate material according to the present invention.
• alignment marks 330aZ330b provided on the substrate material 200 are provided at positions symmetrical with respect to the reversal axis L when they are reversed by the reversing machine 300.
• the position of the alignment mark 330aZ330b after reversal also changes to the position before reversal. Therefore, when the alignment mark 330a / b is photographed with the CCD camera 118, the alignment mark misalignment is Fits 118 views. That is, camera position correction by moving the CCD camera 118 can be made unnecessary even if the substrate material 200 is reversed.
• the alignment mark 330a when the alignment mark 330a is read by the CCD camera 118a and the 330b is read by the CCD camera 118b at the time of surface exposure, the alignment mark 330b of the substrate material 200 that is reversed upside down can be read by the CCD camera 118a. If the alignment mark 330aZb is symmetric with respect to the reversal axis L and the pitch of both is equal to the CCD camera 118aZb, the alignment mark 330a / b can be read by the CCD camera 118b Za at the time of reversing the front and back. Can do.
• the back and front identification mark 334 may be provided separately from the alignment mark 330 arranged symmetrically with respect to the reversal axis L. As shown in FIG. 13, a front / back identification mark 334 is provided on the substrate material 200, and a CCD camera 119 is photographed to recognize the front surface (or back surface).
• the back and front identification mark 334 cannot be confirmed by the CCD camera 119, so that the back surface (or front surface) of the substrate material 200 can be recognized. Based on this result, it can be judged whether or not it is reversed.
• FIG. 6B shows an exposure system according to the second embodiment of the present invention.
• the exposure system 2 is provided with a reversing device 300b in the upstream of the first standby stage 310, that is, on the upstream side of the conveyance, in addition to the reversing device 3OOa on the downstream side of the second standby stage 312.
• the substrate material 200 that waits at the first standby stage 310 is reversed by the reversing machine 300b, so that a reversing machine is provided at both the front and rear stages of the laser exposure apparatus 100.
• the substrate material 200 can be inverted at both timings during the backside exposure, and the productivity can be further increased.
• the even-numbered substrate material 200 whose surface has been exposed is reversed by the reversing machine 300b, and the even-numbered substrate material 200 is exposed during the exposure. If the odd-numbered substrate material 200 that has already been exposed is reversed by the reversing machine 300a, it is on standby. Since the so-called waiting time during which the substrate material 200 waits for processing can be reduced, the productivity can be further increased.
• the configuration of the present invention can be used as long as the system includes a process for performing precise processing such as coating and cutting on both sides in addition to exposure.

Landscapes

• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Projection-Type Copiers In General (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

Family

ID=37942655

Family Applications (1)

Country Status (5)

Cited By (2)

Families Citing this family (16)

Citations (7)

Family Cites Families (9)

• 2005
  • 2005-10-07 JP JP2005295496A patent/JP4606990B2/ja active Active
• 2006
  • 2006-10-04 CN CNA2006800370144A patent/CN101283312A/zh active Pending
  • 2006-10-04 WO PCT/JP2006/319869 patent/WO2007043411A1/ja active Application Filing
  • 2006-10-04 KR KR1020087008154A patent/KR101302594B1/ko active IP Right Grant
  • 2006-10-05 TW TW095137008A patent/TW200719100A/zh unknown

Patent Citations (7)

Also Published As

Similar Documents

Legal Events