WO2006132312A1 - 通信モジュールとその製造方法 - Google Patents
通信モジュールとその製造方法 Download PDFInfo
- Publication number
- WO2006132312A1 WO2006132312A1 PCT/JP2006/311506 JP2006311506W WO2006132312A1 WO 2006132312 A1 WO2006132312 A1 WO 2006132312A1 JP 2006311506 W JP2006311506 W JP 2006311506W WO 2006132312 A1 WO2006132312 A1 WO 2006132312A1
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- WIPO (PCT)
- Prior art keywords
- main surface
- circuit board
- amplifier
- surface side
- mixer
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/08—Constructional details, e.g. cabinet
- H04B1/082—Constructional details, e.g. cabinet to be used in vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Definitions
- the present invention relates to a communication module incorporating two tuners and a manufacturing method thereof.
- FIG. 24 shows an example of a communication module in which two conventional tuners are built.
- the communication module includes one circuit board 1 having a substantially rectangular shape, and a first tuner section 2a, a second tuner section 2b, and a demodulation section 3 are respectively provided on the first main surface side. It is disguised.
- One vertical side surface la of the circuit board 1 is provided with a first terminal 5a to which the first antenna 4a is connected and a second terminal 5b to which the second antenna 4b is connected.
- the first tuner unit 2a includes a first filter 6a that is connected to the first terminal 5a and processes a high-frequency signal, a first amplifier 7a that is connected to the output terminal of the first filter 6a and amplifies the high-frequency signal;
- the output terminal of the first amplifier 7a is connected to the first input terminal, and the second input terminal includes a first mixer 9a connected to the output terminal of the local oscillator 8a.
- the first tuner section 2a includes an intermediate frequency filter 10a connected to the output terminal of the first mixer 9a and an intermediate frequency amplifier 11a connected to the output terminal of the intermediate frequency filter 10a.
- the output terminal of the intermediate frequency amplifier 11 a is connected to the first terminal 12 a of the electronic switch 12!
- the second tuner section 2b includes a second filter 6b that is connected to the second terminal 5b and processes a high-frequency signal, a second amplifier 7b that is connected to the output terminal of the second filter 6b and amplifies the high-frequency signal.
- the output terminal of the second amplifier 7b is connected to the first input terminal, and the second input terminal is provided with a second mixer 9b to which the output terminal of the local oscillator 8b is connected.
- the second tuner unit 2b includes an intermediate frequency filter 10b connected to the output terminal of the second mixer 9b and an intermediate frequency amplifier ib connected to the output terminal of the intermediate frequency filter 10b.
- the output terminal of the intermediate frequency amplifier l ib is connected to the second terminal 12b of the electronic switch 12.
- the common terminal 12c of the electronic switch 12 is connected to the output terminal 13 via the demodulator 3. It is.
- a first signal and a second signal of television broadcasting are input to the first terminal 5a and the second terminal 5b, respectively.
- the output of the demodulator 3 compares the outputs of the first tuner 2a and the second tuner 2b, and the tuner with higher sensitivity.
- the electronic switch 12 selects the 2a or tuner section 2b. This makes it possible to always perform reception with high sensitivity.
- the first tuner section 2a and the second tuner section 2b are mounted on a common circuit board 1. For this reason, it was not sufficient to separate and insulate (isolate) the first tuner portion 2a and the second tuner portion 2b in a high frequency manner.
- the weak received signal from the first terminal 5a is amplified until the first signal is amplified by the first amplifier 7a and the force is also converted to an intermediate frequency signal (low frequency signal) by the first mixer 9a.
- the signal energy increases. For this reason, the first signal is mixed into the second tuner section 5b, causing a problem that the second signal is disturbed.
- the second signal is weakened from the second terminal 5b until the second signal is amplified by the second amplifier 7b and the force is also converted into an intermediate frequency signal (low frequency signal) by the second mixer 9b.
- the present invention provides a communication module capable of faithfully reproducing an input signal by separating and insulating a first tuner section and a second tuner section from each other in a high frequency manner.
- a communication module of the present invention includes a circuit board having a first main surface and a second main surface opposite to the first main surface.
- a first amplifier disposed on the first main surface side of the circuit board for amplifying the first signal, and a first amplifier disposed on the first main surface side for converting the input signal input to the first amplifier power into an intermediate frequency signal.
- a second mixer for converting to a wave signal.
- a circuit board is interposed between the first tuner unit including the first amplifier and the first mixer and the second tuner unit including the second amplifier and the second mixer.
- the two tuners can be isolated and insulated at high frequencies. Therefore, the problem that the first tuner unit and the second tuner unit electrically interfere with each other can be eliminated, and the two tuner units can reproduce various input signals in an independent state. Can do.
- the communication module can be made smaller than the conventional one. Can be achieved.
- FIG. 1 is a cross-sectional view of a communication module according to a first embodiment of the present invention.
- FIG. 2 is a block diagram of a communication module according to the first embodiment.
- Fig. 3 is a plan view of a mother board constituting the communication module according to the first embodiment.
- Fig. 4 is a plan view of a slave board constituting the communication module according to the first embodiment.
- FIG. 5 is a sectional view showing a first step of the communication module manufacturing process according to the first embodiment.
- FIG. 6 is a cross-sectional view showing a second step of the communication module manufacturing process according to the first embodiment.
- FIG. 7 is a sectional view showing a third step of the communication module manufacturing process according to the first embodiment.
- FIG. 8 is a cross-sectional view showing a fourth step of the communication module manufacturing process according to the first embodiment.
- FIG. 9 is a sectional view showing a fifth step of the communication module manufacturing process according to the first embodiment.
- FIG. 10 shows a sixth step of the communication module manufacturing process according to the first embodiment. It is sectional drawing shown.
- FIG. 11 is a cross-sectional view showing a seventh step of the communication module manufacturing process that is focused on Embodiment 1.
- FIG. 12 is a cross-sectional view showing an eighth step of the communication module manufacturing process focusing on the first embodiment.
- FIG. 13 is a cross-sectional view of a main part before thermocompression bonding in a communication module manufacturing process that is emphasizing on Embodiment 1.
- FIG. 14 is a cross-sectional view of a main part after thermocompression bonding in a communication module manufacturing process that is emphasizing on Embodiment 1.
- FIG. 15 is a characteristic diagram of the viscosity of the resin in the communication module manufacturing process according to the first embodiment.
- FIG. 16 is a cross-sectional view of the communication module according to the second embodiment of the present invention.
- FIG. 17 is a sectional view showing a first step of the communication module manufacturing process according to the second embodiment of the present invention.
- FIG. 18 is a cross-sectional view showing a second step of the communication module manufacturing process according to the second embodiment of the present invention.
- FIG. 19 is a cross-sectional view showing a third step of the communication module manufacturing process according to the second embodiment of the present invention.
- FIG. 20 is a cross-sectional view showing a fourth step of the communication module manufacturing process according to the second embodiment of the present invention.
- FIG. 21 is a cross sectional view showing a fifth step of the communication module manufacturing process according to the second embodiment of the present invention.
- FIG. 22 is a block diagram of a communication module according to the third embodiment of the present invention.
- FIG. 23 is a plan view of the performance confirmation circuit board of the communication module according to the third embodiment of the present invention.
- FIG. 24 is a block diagram of a conventional communication module.
- FIG. 1 is a cross-sectional view of a communication module according to Embodiment 1 of the present invention.
- a substantially square circuit board 21 is formed of, for example, a glass base material and epoxy resin, and has a multilayer structure that is thermally cured.
- the upper layer and the lower layer of the multilayer circuit board 21 are connected by inner vias.
- a copper foil pattern is laid on at least one of the first main surface and the second main surface of each layer of the circuit board 21 to form various circuits.
- a copper foil ground plane 22 connected to the ground potential is formed on at least one layer of the multilayer.
- the ground plane 22 has two functions to separate and insulate various circuits provided on the first main surface side and the second main surface side of the circuit board 21 at high frequencies and to ensure a ground potential. Have both.
- a first tuner section 23 is provided on the first main surface side of the circuit board 21.
- electronic components 24 such as integrated circuits, transistors, diodes, chip resistors, chip capacitors and chip inductors are mounted on the land pattern formed on the circuit board 21 by, for example, soldering.
- a metal shield case 25 is provided so as to cover the electronic component 24 and other V, electronic components and the like not shown.
- a second tuner unit 26 and a demodulator 27 composed of an integrated circuit are provided on the second main surface side, which is the opposite side of the first main surface of the circuit board 21.
- an electronic component 29 or the like is attached to a land pattern formed on the circuit board 21 with, for example, solder.
- the electronic component 29 is covered with a resin part 30, and the entire outer periphery of the electronic component 29 is surrounded by a resin part 31 containing a base material.
- the electronic part 29 that constitutes the second tuner part 26 is protected by the resin part 30.
- the component-containing material 28 is formed by the resin part 30 and the resin-containing resin part 31.
- a bottom surface 32 of the communication module is formed on the outside of the component built-in material 28, that is, on the opposite side of the circuit board 21.
- a ground electrode (not shown) made of copper foil and an electrode 33 are formed.
- the electrode 33 is connected to the tuner unit 23, the tuner unit 26, and the demodulation unit 27 through holes.
- the first tuner unit 23, the second tuner unit 26, and the demodulation unit 27 include the first main surface side and the second main unit with the circuit board 21 interposed therebetween. It is formed on the surface side.
- the circuit board 21 is interposed between the first tuner unit 23, the second tuner unit 26, and the demodulation unit 27, so that they are separated. Therefore, since the first tuner section and the second tuner section are separated and insulated in high frequency, it is possible to eliminate the interference with each other and reproduce the signal faithfully.
- the communication module can be reduced in size. You can. Since the integrated circuit forming the demodulator 27 is provided on the second main surface side of the circuit board 21, adjustment components such as inductors are provided on the first main surface side of the circuit board 21 with a margin. Can be placed.
- the component built-in material 28 is formed of a resin portion 30 covering the electronic component 29 and a base material-containing resin portion 31 surrounding the outer peripheral portion of the electronic component 29, which is sufficient for the electronic component 29. Since the resin is filled without a gap, air entering the gap can be eliminated. Therefore, it is possible to eliminate the problem that the remaining air is thermally expanded and the connection between the electronic components is impaired.
- the second tuner unit 26 and the electronic component 29 are mounted on the circuit board 21 and the second tuner unit 26 is restored. Since the control section 27 can be inspected, the non-defective product rate after completion of the communication module is improved.
- the first tuner section 23 is covered and sufficiently shielded by the metal shield case 25, it can be separated and insulated from the outside in high frequency. This prevents noise from entering from the outside and suppresses leakage of high-frequency components to the outside.
- an inductor that forms a local oscillator of the tuner section 23 is formed with a conductor pattern. Therefore, the inductance can be adjusted relatively easily by cutting the inductance of the conductor pattern with a laser beam or the like.
- the conductor pattern constituting the inductor is mostly formed on the inner layer of the circuit board 21, and the remaining part is formed on the surface (first main surface side) of the circuit board 21 by inner vias. May be adjusted. By doing so, the area of the conductor pattern of the inductor occupying the surface of the circuit board 21 can be reduced.
- the inductor prepared to form the local oscillator may be implemented in an integrated circuit. Thereby, the module area can be reduced.
- resistors and the like that need to be changed in shape and size are also mounted on the surface of the circuit board 21. This makes it possible to easily exchange resistance and the like.
- solder lead-free solder using an environmentally friendly tin 'silver' copper system is used.
- a thermosetting conductive adhesive can also be used. If a conductive adhesive is used, the melting temperature of the conductive adhesive is higher than that of the solder. Therefore, even if the solder connection is made near the place where the conductive adhesive is used, the electronic component The problem that 29 is detached from the circuit board 21 can be eliminated.
- soldering is performed using a reflow method. This is for high quality soldering.
- the reflow soldered electronic component is fixed at a predetermined position by the self-facilitation effect. Therefore, the electronic component can be fixed at a predetermined position.
- the length of the wiring pattern line connecting the electronic component and other electronic components can be kept constant.
- the inductance of the wiring pattern line can be kept constant, and the desired electrical performance can be achieved. can get. This is particularly important in high frequency circuits.
- the details of the component built-in member 28 will be described with reference to FIGS.
- FIG. 2 is a block diagram of the communication module 200.
- a first tuner section 23 is mounted on the first main surface side of the circuit board 21 having a substantially rectangular shape.
- a second tuner section 26 and a demodulation section 27 are mounted on the second main surface side via a ground plane 22 formed in the layer of the circuit board 21.
- a first terminal 35a to which the first antenna 34a is connected is provided on one lateral surface 21a on the first main surface side, and the first terminal 35a is provided on the bottom surface 32 of the communication module. It is connected with an electrode (not shown) formed on one side surface through a through hole.
- the second antenna 34b is connected to the other side surface 21b on the second main surface side, that is, the side surface opposite to the one side surface as seen through the first main surface side force.
- the second terminal 35b is provided.
- the second terminal 35b is connected to an electrode (not shown) formed on the other lateral surface of the bottom surface 32 of the communication module through a through hole.
- the first tuner unit 23 includes a first filter 36a that is connected to the first terminal 35a and processes a high-frequency signal, a first amplifier 37a that is connected to the output of the first filter 36a and amplifies the high-frequency signal,
- the first amplifier 37a includes a first mixer 39a having an output terminal connected to the first input terminal and a second input terminal connected to the output terminal of the local oscillator 38a.
- the first amplifier 37a amplifies the first signal from the first filter 36a.
- the first mixer 39a converts the signal into an intermediate frequency signal input from the first amplifier 37a.
- the first tuner unit 23 includes an intermediate frequency filter 40a connected to the output of the first mixer 39a, and an intermediate frequency amplifier 41a connected to the output of the intermediate frequency filter 40a.
- the output of the intermediate frequency amplifier 4 la is led out to the second main surface side through the through hole (or via hole) formed in the circuit board 21 and the first of the electronic switch 42 formed on the second main surface side. Connected to terminal 42a.
- another electronic circuit such as a frequency mixer for increasing the frequency of the signal may exist between the first amplifier 37a and the first mixer 39a.
- the circuit constituting the first tuner section 23 is formed of a wiring pattern formed on the circuit board 21 and the electronic component 24.
- the ground of the local oscillator 38a is the shield case 25. Connected to the side of the shield case 25 with a wiring pattern. Yes.
- the second tuner unit 26 includes a second filter 36b that is connected to the second terminal 35b and processes a high-frequency signal, and a second amplifier 37b that is connected to the output of the second filter 36b and amplifies the high-frequency signal.
- the second amplifier 37b, the output of the second amplifier 37b being connected to the first input terminal and the output terminal of the local oscillator 38b being connected to the second input terminal, and the second mixer 39b
- An intermediate frequency filter 40b connected to the output and an intermediate frequency amplifier 41b connected to the output of the intermediate frequency filter 40b.
- the output terminal of the intermediate frequency amplifier 41b is connected to the second terminal 42b of the electronic switch 42.
- the second amplifier 37b amplifies the second signal input from the second filter 36b.
- the second mixer 39b converts the signal input from the second amplifier 37b into an intermediate frequency. It should be noted that another electronic circuit such as a mixer for raising the frequency of the signal may exist between the second amplifier 37b and the second mixer 39b.
- a demodulator 27 is connected to the common terminal 42 c of the electronic switch 42, and the demodulator 27 is connected to the output terminal 43.
- the output terminal 43 is connected to an electrode (not shown) formed on the bottom surface 32 of the communication module via a through hole provided in the component built-in material 28.
- the circuits constituting the second tuner unit 26 and the demodulation unit 27 are formed by circuit patterns having various shapes formed on the circuit board 21 and an electronic component 29. As shown in FIG. 2, the second filter 36b, the second amplifier 37b, and the second filter 36b are applied to one vertical side surface 21c adjacent to the second terminal 35b of the circuit board 21 from the other vertical side surface 21d. A mixer 39b, an intermediate frequency filter 40b, and an intermediate frequency amplifier 41b are arranged in this order. The ground of the local oscillator 38b is provided in the vicinity of the leg portion of the shield case 25 and is directly connected to the shield case 25 with a wiring pattern.
- the communication module according to the present invention is used for mobile equipment and the like, and is suitable for receiving television broadcast waves (VHF broadcast, UHF broadcast), digital broadcast waves, digital communication, and the like with higher sensitivity.
- VHF broadcast VHF broadcast, UHF broadcast
- digital broadcast waves digital communication, and the like with higher sensitivity.
- the communication module 200 selects a desired broadcast wave from the input television broadcast wave, and a signal of the desired broadcast wave is output from the demodulator 27.
- the tuner unit 23 or the tuner unit 26 having higher sensitivity is selected from the two tuner units 26 by switching with the electronic switch 42.
- switching diversity configuration even if the communication module is moved, it always selects one of the antenna 34a or the antenna 34b and the reception sensitivity. It is possible to receive a good wave broadcast.
- a configuration of force synthesis diversity may be used in which the configuration of switching diversity is given as an example. As a result, the influence of the level fluctuation of the received signal due to fading can be further reduced, so that the receiving performance during high-speed movement can be further improved.
- the circuit board 21 is interposed between the tuner unit 23 and the tuner unit 26, whereby the isolation (isolation) characteristic between the tuner unit 23 and the tuner unit 26 is It can be seen that it is about 35 dB better than Specifically, a weak received signal input from the first terminal 35a and the second terminal 35b is amplified to increase the signal energy, the circuit from the first amplifier 37a to the first mixer 39a, and the second amplifier The circuit from 37b to the second mixer 39b is physically and electrically separated by the circuit board 21. Further, by providing the ground plane 22 in the inner layer of the circuit board 21, the isolation / insulation degree is further improved by about 30 dB.
- the isolation / insulation degree is about 34.4 dB, which is improved compared to the conventional one. In this way, the isolation / insulation level is improved, so that interference can be eliminated and a faithful broadcast wave can be received.
- the local oscillators 38a and 38b may be provided with separate power supplies and operated in conjunction with the electronic switch 42. This can reduce high-frequency interference and save power.
- the first amplifier 37a, the local oscillator 38a, the first mixer 39a, and the intermediate frequency amplifier 41a constituting the tuner unit 23 are mounted in one integrated circuit.
- the second amplifier 37b, the local oscillator 38b, the second mixer 39b, and the intermediate frequency amplifier 41b constituting the tuner unit 26 are also mounted in one integrated circuit.
- the demodulator 27 is also mounted in one integrated circuit.
- the local oscillators 38a and 38b can be shared by using one of the local oscillators 38a and 38b.
- the second filter 36b is covered with the grease part 30 on the second main surface side of the circuit board 21 and is applied to the first main surface side of the circuit board 21. It does not matter if it is placed.
- the capacitance in the second filter 36 b is changed by the resin part 30.
- the frequency band of the signal filtered by the second filter 36b changes. Therefore, such a problem can be overcome by arranging the second filter 36b on the first main surface side of the circuit board 21, which is outside the resin portion 30.
- FIG. 3 is a plan view of a multilayer substrate used for manufacturing a communication module.
- Position alignment holes 54 are provided in the vicinity of the four corners of the thermoset worksheet-like parent substrate 50.
- the periphery of the sub board 51 is connected by a crosspiece 53.
- FIG. 4 is a plan view of the sub board 51.
- five child boards 51 are arranged in the vertical direction and six in the horizontal direction, and a total of 30 grandchild boards 52 are combined.
- the periphery of the grandchild board 52 is connected by a crosspiece 55.
- Alignment holes 56 are provided in the vicinity of the four corners of the sub board 51.
- the grandchild board 52 is mounted in the circuit board 21 shown in FIG.
- FIG. 5 to FIG. 12 show the steps of a method for manufacturing a communication module that is relevant to the present invention.
- Figure 5 shows the first step.
- FIG. 5 shows a parent board 50 and a grandchild board 52.
- the integrated circuit 29a an example of the electronic component 29
- the resistor 29b electronic component 2 in which the second tuner unit 26 and the demodulation unit 27 are built in the land pattern 45 provided on the second main surface side 52b of the grandchild substrate 52 9) is attached with solder 46.
- FIG. 6 shows a second step of the communication module manufacturing method.
- FIG. 6 shows the thermosetting uncured sheets 58 and 59 before being thermally cured.
- the uncured sheet 58 is provided with a hole 60a into which an integrated circuit 29a and a resistor 29b constituting the tuner unit 26 and the demodulation unit 27 are inserted.
- the uncured sheet 58 is configured by laminating, for example, six thin layer sheets of the sheets 58a to 58f.
- an uncured sheet 59 and a copper foil 61 that are not provided with an opening are laminated in this order, and these are integrated together as shown in FIG. 7 to form a component built-in sheet. Is formed.
- FIG. 7 shows a third step of the method for manufacturing the communication module.
- the laminated uncured sheets 58 and 59 and the copper foil 61 are demodulated with the tuner portion 26 provided on the second main surface side 52b of the grandchild substrate 52. It is placed on the part 27 side. Note that a gap 63 is provided between the hole 60a and the integrated circuit 29a. When the gap 63 is heated as shown in FIG. Therefore, the uncured sheets 58 and 59 can be easily inserted and laminated on the grandchild substrate 52 on which the integrated circuit 29a and the resistor 29b are mounted.
- the uncured sheets 58a to 58f are formed with holes 60a into which the integrated circuit 29a and the resistor 29b are inserted. Further, an uncured sheet 59 and a copper foil 61 are laminated on the upper surface of the uncured sheet 58f. A metal reinforcing plate may be inserted between the uncured sheet 58f and the uncured sheet 59. This is to prevent warping of the communication module after thermocompression bonding.
- FIG. 8 shows a fourth step of the method for manufacturing the communication module.
- the uncured sheets 58 and 59 and the copper foil 61 are integrated by being thermocompression bonded at a temperature low enough not to melt the solder 46, and are configured as shown in FIG.
- the thermocompression bonding conditions in Embodiment 1 were performed under the following conditions, and good results were obtained. That is, the heating temperature is 180 ° C to 200 ° C, the caloric pressure is about 30 kg per square centimeter, and the pressurization time is about 1 hour.
- this heat pressing process is performed in a vacuum chamber. This is important for sufficiently removing air in the hole 60a and sufficiently filling the gap between the hole 60a and the electronic component 29 with the resin. In this manner, air between the hole 60a and the electronic component 29 can be completely eliminated by sufficiently injecting the resin.
- the resin in the uncured sheet flows out, the uncured sheet 58 becomes the cured sheet 47, the uncured sheet 59 becomes the cured sheet 48, and the resin-filled portion 31 containing the base material is formed.
- the resin that has flowed out flows into the hole (or recess) 60 in which the hole 60 a is formed by thermocompression bonding, fills the hole 60, and forms the resin part 30. Details will be described with reference to FIGS. 13 to 15 described later.
- the resin-containing part 28 is formed by the resin part 30 and the base-containing resin part 31.
- FIG. 9 shows a fifth step of the communication module manufacturing method.
- the grandchild board A hole 65 is provided between 52 and another adjacent grandchild substrate 52.
- the copper foil 61 is etched into a predetermined pattern to form the electrode 33.
- the electrode 33 is connected to the tuner section 23 provided on the first main surface side 52a of the grandchild substrate 52, the tuner section 26 and the demodulation section 27 provided on the second main surface side 52b, through the through holes 67.
- the through hole 67 is provided on the side surfaces of the grandchild substrate 52 and the base-containing resin portion 31, but it may be provided, for example, in the vicinity of the integrated circuit 29a.
- FIG. 11 shows the seventh step of the communication module manufacturing process.
- the grandchild substrate 52 is turned over, and the integrated circuit 24a and the resistor 24b constituting the tuner section 23 are attached to the first main surface side 52a of the grandchild substrate 52 with the solder 64.
- a shield case 25 is attached so as to cover the tuner unit 23 side constituted by the integrated circuit 24a and the resistor 24b.
- the legs 25 a of the shield case 25 are inserted into the through holes 67 and attached by solder 69 on the side surfaces of the grandchild substrate 52.
- solder 69 fills the gap formed between the burr 25b and the wall surface of the through hole 67 by capillary action.
- the shield case 25 can be securely attached to the grandchild substrate 52.
- FIG. 13 is a cross-sectional view of the main part before thermocompression bonding.
- the number of uncured sheets 58 is simplified for convenience of drawing and explanation. Further, the tuner unit and the demodulating unit are not shown specifically and are represented by an integrated circuit 29a.
- An integrated circuit 29 a is connected to the land pattern 45 with solder 46 on the second main surface side 52 b of the grandchild substrate 52.
- the second main surface side 52b of the grandchild substrate 52 is laminated with porous glass fibers impregnated with resin and thermosetting uncured sheets 58 and 59.
- the uncured sheets 58 and 59 have a plate shape in which a woven fabric or a non-workable fabric is impregnated with a heat-resistant resin, and a resin part 30 is formed in a portion corresponding to the outer periphery of the integrated circuit 29a.
- This is an uncured component built-in sheet provided with a hole (opening) 60a having a gap 63 formed therein.
- the hole 60a is an opening for accommodating an electronic component.
- Integrated circuit 29a provided on grandchild substrate 52 Is loosely inserted into the hole 60a having the gap 63.
- the solder ball 76 is provided as a terminal of the integrated circuit 29a, and is fixed to the land pattern 45 provided on the grandchild substrate 52 with the solder 46.
- the uncured sheets 58 and 59 are uncured thermosetting resins, and after being cured by heat and transformed into the cured sheets 47 and 48 to become the resin-filled portion 31 with the base material, Even if heated again, it does not return to the plastic state. Therefore, once the integrated circuit 29a sealed with the resin 71 is fixed.
- FIG. 15 is a characteristic diagram of the viscosity ⁇ of the resin in the manufacturing process of the communication module according to the first embodiment.
- the horizontal axis shows temperature ⁇ and the vertical axis shows viscosity 7?
- the viscosity 7? Of resin 71 gradually decreases as the ambient temperature increases, as indicated by direction D up to temperature Tmin (approximately 200 ° C).
- Tmin approximately 200 ° C
- the viscosity r? Decreases, the flowability of the resin 71 increases and the narrow gap is sufficiently filled, so that the problem of air remaining in the gap can be eliminated.
- Tmin is exceeded, the viscosity 7? Gradually increases as shown by the direction U, and the resin 71 gradually hardens.
- the ambient temperature of the solder 46 is set to be equal to or lower than the melting point of the internal temperature of the solder 46. That is, it is preferable to use solder 46 having a melting point higher than the ambient temperature at the time of thermocompression bonding. This is because when the ambient temperature rises and the temperature inside the solder 46 becomes higher than the melting point (approximately 200 ° C), the solder 46 melts and mixes with the resin 71, and the solder ball 76 of the integrated circuit 29a And other solder balls 76 are short-circuited. In order to avoid this, high melting point solder is used for the solder 46.
- the communication module according to the present invention is arranged on the first main surface side of the circuit board 21 having the first main surface and the second main surface opposite to the first main surface, and the first signal surface.
- Embodiment 1 discloses a method for manufacturing a communication module. That is, a first mounting step of mounting the second electronic component 29 including the second amplifier 37b and the second mixer 39b on the second main surface side of the circuit board 21 that has been thermoset, and the first mounting After the step, a laminating step for laminating the uncured component built-in sheets 5 8 and 59 on the second main surface side of the circuit board 21 with an opening 60a for accommodating the second electronic component 29, and a laminating step After the integration step, the circuit board 21 and the component built-in sheets 58, 59 are integrated by heating and bonding in a superposed state, and after the integration step, the first main surface side of the circuit board 21 is 1 A second mounting step for mounting the first electronic component 24 including the amplifier 37a and the first mixer 39a, and a metal shield so as to cover the first electronic component 24 after the second mounting step. The shield case attachment step for attaching Case 25 is shown.
- the communication module according to the second embodiment is different from the communication module according to the first embodiment in that the first tuner section 23, the second tuner section 26, and the demodulation section 27 are mounted on different circuit boards.
- the second circuit board 82, and the electronic component 29 is incorporated between the first main surface 81a of the first circuit board 81 and the first main surface 82a of the second circuit board 82.
- the component built-in material 28 is provided.
- the electrode 83 is led out from the first circuit board 81 or the second circuit board 82 to the bottom face 84 of the communication module through a through hole.
- the ground plane 22 is the first circuit. It is provided in the inner layer of the substrate 81.
- FIGS. 17 to 21 show each manufacturing step related to the second embodiment of the communication module of the present invention. Note that the description of the same components as those in Embodiment 1 is simplified.
- FIG. 17 shows a second circuit board 82 that has been heat-cured.
- the second circuit board 82 has the same material force as the circuit board 21 shown in FIG. 1, and the electronic component 29 is fixed to the first main surface 82a side of the second circuit board 82 with the solder 64.
- an uncured sheet 58 is laminated on the first main surface 82a side of the second circuit board 82 on which the electronic component 29 is mounted, and further, above the uncured sheet 58.
- the first circuit board 81 that is thermally cured is laminated.
- the first circuit board 81 is also made of the same material material as the circuit board 21.
- an uncured sheet 58 is sandwiched between the first main surface 81a side of the first circuit board 81 and the first main surface 82a side of the circuit board 82. Hesitate. After that, heat pressure bonding is performed under the same conditions as in Embodiment 1.
- the uncured sheet 58 is cured to form the base-containing resin part 31.
- the resin part 30 is formed by the resin 71 that has flowed out.
- the electronic component 24 that forms the tuner portion 23 is fixed to the second main surface 81 b side of the first circuit board 81 with solder 64.
- a shield case 25 (see FIG. 1) is mounted so as to cover the electronic component 24.
- the communication module as shown in Fig. 16 is completed by dividing it.
- the communication module according to the present invention has the first circuit board 81 and the second circuit board 82 that are thermo-cured on the upper and lower surfaces of the component-containing material 28. Since the first circuit board 81 and the second circuit board 82 have a high hardness against heat, it is possible to eliminate the warp that easily occurs in the thermocompression bonding process. Other features are the same as in the first embodiment.
- another communication module according to the present invention includes a first circuit board 81 having a first main surface 81a and a second main surface 81b opposite to the first main surface 81a, and the first surface 82a and the first surface.
- a second circuit board 82 having a second main surface 82b opposite to the first main circuit board 81 and disposed on the first main surface 81a of the first circuit board 81 so as to face the second main surface 82b; Arranged on the second main surface 81b side of the circuit board 81 and a first amplifier 37a for amplifying the first signal, and disposed on the second main surface 81b side of the first circuit board 81 and input from the first amplifier 37a A first mixer 39a for converting the generated signal into an intermediate frequency, a second amplifier 37b disposed on the first main surface 82a side of the second circuit board 82, for amplifying the second signal, and a second A second mixer 39b that is disposed on the first main surface 82a side of the circuit board 82 and converts the signal input from the second amplifier 37b to an intermediate frequency, and the first circuit board 81 and the second circuit board. Between 82 It is disposed, and a ⁇ 3 0 covering the second amplifier 37b and the second mixer 3b.
- Embodiment 2 discloses another method for manufacturing a communication module. That is, a first mounting step of mounting the second electronic component 29 including the second amplifier 37b and the second mixer 39b on the first main surface 82a side of the second circuit board 82 that has been thermally cured, After the mounting step 1, the uncured component built-in sheets 58 and 59 having the opening 60 a for accommodating the second electronic component 29 are attached to the first main surface 81 a of the first circuit board 81.
- a metal shield case 25 is provided on the first main surface 81b side of the first circuit board 81 so as to cover the first electronic component 24.
- the communication module of the third embodiment is such that the first terminal 35a and the second terminal 35b of the communication module shown in the first embodiment are formed in the vicinity of a pair of diagonals of the circuit board 21. Further, the local oscillators 38a and 38b are shared. With this configuration, it is possible to suppress the inconvenience that the first tuner unit 102 and the second tuner unit 103 interfere with each other by the high-frequency signals, and to save power. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and the description is simplified.
- FIG. 22 shows a circuit board 101 corresponding to the circuit board 21 of the first embodiment.
- the material and manufacturing method of the circuit board 101 and the circuit board 21 are the same.
- a first tuner section 102 (corresponding to the tuner section 23 of the first embodiment) is mounted on the first main surface side of the circuit board 101.
- a second tuner section 103 (corresponding to the tuner section 26 of the first embodiment), an electronic switch 42, and a demodulation section 27 are mounted on the second main surface side of the circuit board 101.
- the first terminal 35 a of the tuner unit 102 is provided in the vicinity of the corner C 1 on the first main surface side of the circuit board 101.
- the second terminal 35b of the second tuner unit 103 is provided in the vicinity of the corner C2 on the second main surface side of the circuit board 101. That is, the first terminal 35 a and the second terminal 35 b are provided in the vicinity of a pair of diagonals of the circuit board 101.
- the isolation level of 35.6 dB 85. 6—50.0
- positions P1 to P16 correspond to the positions shown in FIG.
- the position PI indicates the position of the first terminal 35a.
- Positions P2 to P16 indicate the position of the second terminal 35b (see Fig. 23).
- the distance X indicates the distance in the X direction from the center point Q0 of the circuit board 104.
- the directional force direction is positive (+) on the position P9 side, and the directional force direction is negative (-) on the position P15 side.
- the directional force direction is positive (+) from the center point Q0 to P12, and the directional force direction is negative (one) at position P4.
- the size of the experimental circuit board 104 is 10 mm x 10 mm, and the material FR4 (F lame Retardant Type 4) (dielectric constant 4.7), 4-layer substrate, thickness 0.5mm, terminal pitch 1.2mm.
- the center of the position P1 is displayed as X is 3.6 mm and Y is 5. Omm.
- the position P11 provided diagonally opposite to the position P1 is displayed with the polarity reversed from that of the position P1, so that X is 3.6 mm and Y is 5. Omm.
- the distance X between positions P4 and P12 is 0, and the distance Y is displayed as 5. Omm and 5. Omm, respectively.
- the distance Y between positions P9 and P15 is 0, and the distance X is displayed as 5. Omm and -5. Omm, respectively.
- the isolation / insulation degree S1 indicates the isolation / insulation degree when the input signal frequency input to the first terminal 35a and the second terminal 35b is 470 MHz. That is, it indicates the magnitude of the signal generated at the second input terminal 35b when a 470 Mz input signal is input to the first input terminal, that is, how much interference can be removed.
- isolation 'insulation degree S2' indicates when the frequency of the input signal is 770Mz.
- the opposite lateral side surfaces P2 and P13 provide an improvement of 34.4 dB (84.4-50.0).
- local oscillator 105 in Embodiment 3 is provided in tuner section 103 formed on the second main surface side of circuit board 101.
- the local oscillator 105 is connected to the other input of the second mixer 39b of the tuner unit 103 and is also connected to the other input of the first mixer 39a of the tuner unit 102. That is, it is shared.
- the local oscillator 105 can be configured in one stage, so that the output signal of the interference wave can be suppressed, and the power consumption can be reduced. Further, the circuit board 101, the ground pattern 22, and the shield case 25 can be isolated and insulated at high frequency from the outside. Since the ground of the local oscillator 105 is directly connected to the leg 25a of the shield case 25 with a wiring pattern, the ground signal of the local oscillator 105 is strengthened and the output of an interference signal can be suppressed. Such an effect is extremely useful as a communication module in a tuner built in a recent cellular phone or the like because interference with the cellular phone can be suppressed.
- circuit boards 21 and 101 are substantially square, are arranged in the vicinity of the corners of the circuit boards 21 and 101, and are connected to the first filter 36a. And a second terminal 35b for inputting the second signal to the second filter 36b, which is disposed in the vicinity of the diagonal of the corner of the circuit board 21.
- the communication module of the present invention improves the high-frequency separation and insulation characteristics between the first tuner unit and the second tuner unit, and can be used for a diversity receiver or the like. Therefore, its industrial applicability is high.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Structure Of Receivers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06766481.3A EP1890389A4 (en) | 2005-06-09 | 2006-06-08 | COMMUNICATION MODULE AND MANUFACTURING METHOD THEREFOR |
JP2006535885A JPWO2006132312A1 (ja) | 2005-06-09 | 2006-06-08 | 通信モジュールとその製造方法 |
US11/629,349 US7840201B2 (en) | 2005-06-09 | 2006-06-08 | Communication module having tuner units that are separated and isolated from each other, and method of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2005-169148 | 2005-06-09 | ||
JP2005169148 | 2005-06-09 |
Publications (1)
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WO2006132312A1 true WO2006132312A1 (ja) | 2006-12-14 |
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ID=37498508
Family Applications (1)
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PCT/JP2006/311506 WO2006132312A1 (ja) | 2005-06-09 | 2006-06-08 | 通信モジュールとその製造方法 |
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US (1) | US7840201B2 (ja) |
EP (1) | EP1890389A4 (ja) |
JP (1) | JPWO2006132312A1 (ja) |
CN (1) | CN101006651A (ja) |
WO (1) | WO2006132312A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009069710A (ja) * | 2007-09-18 | 2009-04-02 | Yazaki Corp | 光モジュール |
JP2010200129A (ja) * | 2009-02-26 | 2010-09-09 | Hitachi Media Electoronics Co Ltd | チューナ |
JP2015053298A (ja) * | 2013-08-07 | 2015-03-19 | 太陽誘電株式会社 | 回路モジュール |
Families Citing this family (11)
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JPWO2009019792A1 (ja) * | 2007-08-09 | 2010-10-28 | パナソニック株式会社 | 回路モジュールおよびこれを用いた電子機器 |
US8774734B1 (en) * | 2010-07-02 | 2014-07-08 | Qualcomm Incorporated | Module that can be used as a plug-in module and as a solder-down module |
US10681479B2 (en) | 2015-01-30 | 2020-06-09 | Cassia Networks Inc. | Methods, devices and systems for bluetooth audio transmission |
US9769594B2 (en) | 2015-01-30 | 2017-09-19 | Cassia Networks Inc. | Methods, devices and systems for increasing wireless communication range |
US10178494B2 (en) | 2015-01-30 | 2019-01-08 | Cassia Networks Inc. | Bluetooth transparent relay |
TWM516240U (zh) * | 2015-09-24 | 2016-01-21 | 詠業科技股份有限公司 | 可調整天線阻抗及天線頻率的射頻裝置 |
JP2017200183A (ja) * | 2016-04-29 | 2017-11-02 | スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. | 遮蔽されたダイバーシティ受信モジュール |
CN110392926B (zh) * | 2017-03-14 | 2022-12-06 | 株式会社村田制作所 | 高频模块 |
US11352258B2 (en) | 2019-03-04 | 2022-06-07 | Honda Motor Co., Ltd. | Multifunctional conductive wire and method of making |
WO2021002271A1 (ja) * | 2019-07-03 | 2021-01-07 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
JP2021100213A (ja) * | 2019-12-23 | 2021-07-01 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
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JPH11341374A (ja) * | 1998-05-22 | 1999-12-10 | Matsushita Electric Ind Co Ltd | 複数放送波の受信装置 |
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DE8319031U1 (de) * | 1983-07-01 | 1983-09-29 | Deutsche Thomson-Brandt Gmbh, 7730 Villingen-Schwenningen | Hf-baugruppen integriert in ein einplatinenchassis eines fernsehgeraetes |
JP2592661B2 (ja) * | 1988-08-26 | 1997-03-19 | 松下電器産業株式会社 | マイクロ波受信装置 |
JPH0513098A (ja) | 1991-07-01 | 1993-01-22 | Matsushita Electric Ind Co Ltd | 固体二次電池とその製造法 |
JP2002135669A (ja) * | 2000-10-26 | 2002-05-10 | Alps Electric Co Ltd | デジタル放送受信チューナ |
JP4747409B2 (ja) * | 2000-11-09 | 2011-08-17 | ソニー株式会社 | 受信装置 |
JP2003018123A (ja) | 2001-07-05 | 2003-01-17 | Alps Electric Co Ltd | Ofdm受信装置 |
EP1494362A4 (en) * | 2002-04-08 | 2010-06-09 | Sony Corp | SIGNAL RECEPTION DEVICE, SIGNAL RECEPTION CIRCUIT, AND RECEPTION DEVICE |
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2006
- 2006-06-08 JP JP2006535885A patent/JPWO2006132312A1/ja active Pending
- 2006-06-08 CN CNA2006800006266A patent/CN101006651A/zh active Pending
- 2006-06-08 US US11/629,349 patent/US7840201B2/en not_active Expired - Fee Related
- 2006-06-08 WO PCT/JP2006/311506 patent/WO2006132312A1/ja active Application Filing
- 2006-06-08 EP EP06766481.3A patent/EP1890389A4/en not_active Withdrawn
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JPH0513098U (ja) * | 1991-07-26 | 1993-02-19 | 国際電気株式会社 | 回路基板 |
JPH11317687A (ja) * | 1998-05-06 | 1999-11-16 | Matsushita Electric Ind Co Ltd | 電子チューナ |
JPH11341374A (ja) * | 1998-05-22 | 1999-12-10 | Matsushita Electric Ind Co Ltd | 複数放送波の受信装置 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009069710A (ja) * | 2007-09-18 | 2009-04-02 | Yazaki Corp | 光モジュール |
JP2010200129A (ja) * | 2009-02-26 | 2010-09-09 | Hitachi Media Electoronics Co Ltd | チューナ |
JP2015053298A (ja) * | 2013-08-07 | 2015-03-19 | 太陽誘電株式会社 | 回路モジュール |
Also Published As
Publication number | Publication date |
---|---|
EP1890389A1 (en) | 2008-02-20 |
US20090011726A1 (en) | 2009-01-08 |
EP1890389A4 (en) | 2015-01-14 |
JPWO2006132312A1 (ja) | 2009-01-08 |
US7840201B2 (en) | 2010-11-23 |
CN101006651A (zh) | 2007-07-25 |
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