US7840201B2 - Communication module having tuner units that are separated and isolated from each other, and method of manufacturing the same - Google Patents
Communication module having tuner units that are separated and isolated from each other, and method of manufacturing the same Download PDFInfo
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- US7840201B2 US7840201B2 US11/629,349 US62934906A US7840201B2 US 7840201 B2 US7840201 B2 US 7840201B2 US 62934906 A US62934906 A US 62934906A US 7840201 B2 US7840201 B2 US 7840201B2
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- main surface
- circuit board
- amplifier
- mixer
- communication module
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/08—Constructional details, e.g. cabinet
- H04B1/082—Constructional details, e.g. cabinet to be used in vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Definitions
- the present invention relates to a communication module incorporating two tuners and to a method of manufacturing the module.
- FIG. 24 illustrates an example of a conventional communication module incorporating two tuners.
- the communication module is equipped with one circuit board 1 with a substantially quadrangle shape, and on the first main surface of which first tuner unit 2 a , and second tuner unit 2 b and demodulating unit 3 are implemented respectively.
- One first vertical side 1 a of circuit board 1 is provided thereon with first terminal 5 a to which first antenna 4 a is connected and second terminal 5 b to which second antenna 4 b is connected, respectively.
- First tuner unit 2 a includes first filter 6 a connected to first terminal 5 a , for processing high-frequency signals; first amplifier 7 a connected to the output terminal of first filter 6 a , for amplifying high-frequency signals; and first mixer 9 a having a first input terminal to which the output terminal of first amplifier 7 a is connected and a second input terminal to which the output terminal of local oscillator 8 a is connected.
- First tuner unit 2 a includes intermediate-frequency filter 10 a connected to the output terminal of first mixer 9 a ; and intermediate-frequency amplifier 11 a connected to the output terminal of intermediate-frequency filter 10 a .
- the output terminal of intermediate-frequency amplifier 11 a is connected to first terminal 12 a of electronic switch 12 .
- Second tuner unit 2 b includes second filter 6 b connected to second terminal 5 b , for processing high-frequency signals; second amplifier 7 b connected to the output terminal of second filter 6 b , for amplifying high-frequency signals; and second mixer 9 b to which first input terminal the output terminal of second amplifier 7 b is connected and to which second input terminal the output terminal of local oscillator 8 b is connected.
- Second tuner unit 2 b includes intermediate-frequency filter 10 b connected to the output terminal of second mixer 9 b ; and intermediate-frequency amplifier 11 b connected to the output terminal of intermediate-frequency filter 10 b .
- the output terminal of intermediate-frequency amplifier 11 b is connected to second terminal 12 b of electronic switch 12 .
- Common terminal 12 c of electronic switch 12 is connected to output terminal 13 through demodulating unit 3 .
- first terminal 5 a and second terminal 5 b are supplied with a first signal and a second signal for television broadcasting respectively, for example.
- demodulating unit 3 compares output from first tuner unit 2 a with that from second tuner unit 2 b and chooses tuner unit 2 a or tuner unit 2 b , whichever is more sensitive, with electronic switch 12 . This always enables reception with high sensitivity.
- Japanese Patent Unexamined Publication No. 2003-18123 is known, for example.
- first tuner unit 2 a and second tuner unit 2 b are implemented on common circuit board 1 .
- the following problem occurs. That is, a feeble reception signal from first terminal 5 a is amplified to increase its signal energy during the period after the first signal is amplified by first amplifier 7 a until the signal is converted to an intermediate-frequency signal (low-frequency signal) by first mixer 9 a . Accordingly, the first signal is mixed into second tuner unit 5 b to interfere with the second signal.
- a feeble reception signal from second mixer 9 b is amplified to increase the signal energy during the period after the second signal is amplified by second amplifier 7 b until the signal is converted to an intermediate-frequency signal (low-frequency signal) by second mixer 9 b . Accordingly, the second signal is undesirably mixed into first tuner unit 5 a to interfere with favorable reception.
- the present invention provides a communication module that reproduces input signals with high fidelity by separating and isolating the first and second tuner units from each other in high frequencies.
- a communication module of the present invention is equipped with a circuit board having a first main surface, and a second main surface opposite to the first main surface.
- the communication module further includes a first amplifier arranged on the first main surface of the circuit board, for amplifying a first signal; a first mixer arranged on the first main surface, for converting an input signal supplied from the first amplifier to an intermediate-frequency signal; a second amplifier arranged on the second main surface of the circuit board, for amplifying a second signal; and a second mixer arranged on the second main surface, for converting a signal supplied from the second amplifier to an intermediate-frequency signal.
- the makeup described above causes the circuit board to intervene between the first tuner unit including the first amplifier and first mixer, and the second tuner unit including the second amplifier and second mixer, resulting in the two tuners separated and isolated in high frequencies. Consequently, the first and second tuner units do not electrically interfere with each other and reproduce various types of signals independently of each other.
- the second tuner unit is arranged on the second main surface of the circuit board, identical to that with the first tuner unit arranged thereon, thus enabling the communication module to be downsized compared to a conventional one.
- FIG. 1 is a sectional view of a communication module according to the first exemplary embodiment of the present invention.
- FIG. 2 is a block diagram of the communication module according to the first exemplary embodiment.
- FIG. 3 is a plan view of the main board composing the communication module according to the first exemplary embodiment.
- FIG. 4 is a plan view of a sub board composing the communication module according to the first exemplary embodiment.
- FIG. 5 is a sectional view illustrating the first step of the process for manufacturing the communication module according to the first exemplary embodiment.
- FIG. 6 is a sectional view illustrating the second step of the process for manufacturing the communication module according to the first exemplary embodiment.
- FIG. 7 is a sectional view illustrating the third step of the process for manufacturing the communication module according to the first exemplary embodiment.
- FIG. 8 is a sectional view illustrating the fourth step of the process for manufacturing the communication module according to the first exemplary embodiment.
- FIG. 9 is a sectional view illustrating the fifth step of the process for manufacturing the communication module according to the first exemplary embodiment.
- FIG. 10 is a sectional view illustrating the sixth step of the process for manufacturing the communication module according to the first exemplary embodiment.
- FIG. 11 is a sectional view illustrating the seventh step of the process for manufacturing the communication module according to the first exemplary embodiment.
- FIG. 12 is a sectional view illustrating the eighth step of the process for manufacturing the communication module according to the first exemplary embodiment.
- FIG. 13 is a sectional view of the substantial part of the process for manufacturing the communication module according to the first exemplary embodiment, before thermocompression bonding.
- FIG. 14 is a sectional view of the substantial part of the process for manufacturing the communication module according to the first exemplary embodiment, after thermocompression bonding.
- FIG. 15 is a characteristic diagram of resin viscosity in the process for manufacturing the communication module according to the first exemplary embodiment.
- FIG. 16 is a sectional view of a communication module according to the second exemplary embodiment of the present invention.
- FIG. 17 is a sectional view illustrating the first step of the process for manufacturing the communication module according to the second exemplary embodiment.
- FIG. 18 is a sectional view illustrating the second step of the process for manufacturing the communication module according to the second exemplary embodiment.
- FIG. 19 is a sectional view illustrating the third step of the process for manufacturing the communication module according to the second exemplary embodiment.
- FIG. 20 is a sectional view illustrating the fourth step of the process for manufacturing the communication module according to the second exemplary embodiment.
- FIG. 21 is a sectional view illustrating the fifth step of the process for manufacturing the communication module according to the second exemplary embodiment.
- FIG. 22 is a block diagram of a communication module according to the third exemplary embodiment of the present invention.
- FIG. 23 is a plan view of a performance evaluating circuit board of the communication module according to the third exemplary embodiment of the present invention.
- FIG. 24 is a block diagram of a conventional communication module.
- FIG. 1 is a sectional view of a communication module according to the first exemplary embodiment of the present invention.
- circuit board 21 which is shaped substantially as a quadrangle, is formed with glass base material and epoxy resin, for example, and has a multilayered structure thermally hardened.
- the upper and lower layers of circuit board 21 with a multilayered structure are connected through an inner via.
- At least one of the first and second main surfaces of each layer of circuit board 21 has a copper foil pattern laid thereon to form various types of circuits.
- at least one of the layers in the multilayer has ground plane 22 made of copper foil, connected to the ground potential.
- Ground plane 22 provides two functions: separates and isolates in high frequencies the circuits each provided separately on the first and second main surfaces of circuit board 21 ; and maintains circuit board 21 at the ground potential reliably.
- First tuner unit 23 has electronic components 24 such as an integrated circuit, transistor, diode, chip resistor, chip capacitor, and chip inductor, attached on the land pattern formed on circuit board 21 , with solder for example. Further, shielded case 25 made of metal is provided so as to cover electronic components 24 and other electronic components that are not illustrated.
- demodulating unit 27 composed of second tuner unit 26 and integrated circuits.
- Demodulating unit 27 has electronic components 29 and others attached to the land pattern formed on circuit board 21 with solder for example.
- Electronic components 29 are covered with resin part 30 , and the outer circumference of all electronic components 29 is enclosed by base-material-containing resin part 31 .
- Resin part 30 protects electronic components 29 composing second tuner unit 26 .
- Resin part 30 and base-material-containing resin part 31 form component-containing material 28 .
- the outer side of component-containing material 28 namely the side opposite to circuit board 21 , has bottom surface 32 of the communication module formed thereon.
- Bottom surface 32 has a ground electrode (not illustrated) and electrode 33 made of copper foil, formed thereon.
- Electrode 33 is connected to tuner unit 23 , tuner unit 26 , and demodulating unit 27 , with a through hole.
- Electrode 33 provided on bottom surface 32 allows the communication module to be used as a surface-mounting component.
- first tuner unit 23 , and second tuner unit 26 and demodulating unit 27 are formed on the first and second main surfaces, respectively, sandwiching circuit board 21 .
- First tuner unit 23 , and second tuner unit 26 and demodulating unit 27 are separated as a result of the circuit board 21 intervening between them. Consequently, the first and second tuner units are separated and isolated in high frequencies, and thus do not interfere with each other, to reproduce signals with high fidelity.
- the second main surface of circuit board 21 forming first tuner unit 23 has second tuner unit 26 and demodulating unit 27 formed thereon, allowing the communication module to be downsized. Still, the second main surface of circuit board 21 is provided thereon with an integrated circuit forming demodulating unit 27 , and thus the first main surface of circuit board 21 provides a sufficient space for arranging adjusting parts such as an inductor.
- component-containing material 28 is formed with resin part 30 covering electronic components 29 and base-material-containing resin part 31 surrounding the outer circumference of electronic components 29 , and electronic components 29 are filled with sufficient resin without forming any clearance, preventing air or the like from entering a clearance. This prevents poor connection between electronic components due to thermal expansion of remaining air.
- Inspection can be made for second tuner unit 26 and demodulating unit 27 while electronic components 29 are attached to circuit board 21 , thus improving the yield rate after the completion of communication modules.
- First tuner unit 23 is covered with metal shielded case 25 and is adequately shielded, and thus is separated and isolated in high frequencies from the outside. This prevents noise from entering from the outside and a high-frequency component from leaking to the outside.
- the first main surface of circuit board 21 has an inductor for forming the local oscillator of tuner unit 23 formed thereon with a conductor pattern. Consequently, the inductance can be adjusted with relative ease by cutting the conductor pattern with laser light or the like.
- the following arrangement may be made. That is, the major part of the conductor pattern forming the inductor is formed in the inner layer of circuit board 21 , and the remaining part is formed on the surface (i.e. first main surface) of circuit board 21 after being led through an inner via, and then they are adjusted for a proper inductance. This way can reduce the area of the conductor pattern for the inductor occupying the surface of circuit board 21 .
- an inductor for forming the local oscillator may be implemented in an integrated circuit. This reduces the area of the module.
- circuit board 21 Components requiring their shape and size to be changed, such as a resistor, are attached on the surface of circuit board 21 as well. This allows the components to be changed easily.
- solder uses environmentally conscious, lead-free solder based on tin, silver, or copper.
- a conductive adhesive with a thermosetting property can be used instead of solder.
- a conductive adhesive with a higher melting temperature than solder, prevents electronic components 29 from undesirably being detached from circuit board 21 , even if soldering is performed at a high temperature near a position where the conductive adhesive is used.
- the connecting method employs a reflow method for soldering. This is for high-quality soldering. This reflow soldering enables the reflow-soldered electronic components to be secured at a given position owing to a self-alignment effect. This allows the line length of the wiring pattern connecting one electronic component to another to remain constant, and so does the line inductance of the wiring pattern, thus bringing about desired electrical performance, which is particularly important in a high-frequency circuit. Further details about component-containing material 28 are described later using FIGS. 13 through 15 .
- FIG. 2 is a block diagram of communication module 200 .
- the first main surface, which has a substantially quadrangle shape, of circuit board 21 has first tuner unit 23 implemented thereon.
- the second main surface has second tuner unit 26 and demodulating unit 27 implemented thereon through ground plain 22 formed in the layer of circuit board 21 .
- Lateral side 21 a one side at the first main surface, is provided thereon with first terminal 35 a to which first antenna 34 a is connected, where first terminal 35 a is connected to an electrode (not illustrated) formed on one lateral side of bottom surface 32 of the communication module with a through hole.
- lateral side 21 b the other side at the second main surface, namely the lateral side opposite to the other, viewing through from the first main surface, is provided thereon with second terminal 35 b to which second antenna 34 b is connected.
- Second terminal 35 b is connected to an electrode (not illustrated) formed on the other lateral side of bottom surface 32 of the communication module with a through hole.
- First tuner unit 23 includes first filter 36 a connected to first terminal 35 a , for processing high-frequency signals; first amplifier 37 a connected to the output of first filter 36 a , for amplifying high-frequency signals; and first mixer 39 a having first input terminal to which the output terminal of first amplifier 37 is connected, and having a second input terminal to which the output terminal of local oscillator 38 a is connected.
- first amplifier 37 a amplifies a first signal from first filter 36 a .
- First mixer 39 a converts the signal supplied from first amplifier 37 a to an intermediate-frequency signal.
- First tuner unit 23 includes intermediate-frequency filter 40 a connected to the output of first mixer 39 a ; and intermediate-frequency amplifier 41 a connected to the output of intermediate-frequency filter 40 a .
- the output of intermediate-frequency amplifier 41 a is led to the second main surface through a through hole (or via hole) formed in circuit board 21 and is connected to first terminal 42 a of electronic switch 42 formed at the second main surface.
- other electronic circuits such as a frequency mixer for increasing frequencies may exist between first amplifier 37 a and first mixer 39 a.
- the circuit composing first tuner unit 23 is formed with a wiring pattern formed on circuit board 21 ; and electronic component 24 .
- the ground of local oscillator 38 a is provided near shielded case 25 and is connected directly to the side of shielded case 25 with a wiring pattern.
- Second tuner unit 26 is composed of second filter 36 b connected to second terminal 35 b , for processing high-frequency signals; second amplifier 37 b connected to the output of second filter 36 b , for amplifying high-frequency signals; second mixer 39 b having a first input terminal to which the output of second amplifier 37 b is connected, and having a second input terminal to which the output terminal of local oscillator 38 b is connected; intermediate-frequency filter 40 b connected to the output of second mixer 39 b ; and intermediate-frequency amplifier 41 b connected to the output of intermediate-frequency filter 40 b .
- the output terminal of intermediate-frequency amplifier 41 b is connected to second terminal 42 b of electronic switch 42 .
- second amplifier 37 b amplifies a second signal supplied from second filter 36 b .
- Second mixer 39 b converts a signal supplied from second amplifier 37 b to an intermediate-frequency signal.
- other electronic circuits such as a frequency mixer for increasing frequencies may exist between second amplifier 37 b and second mixer 39 b.
- Common terminal 42 c of electronic switch 42 is connected to demodulating unit 27 , and demodulating unit 27 is connected to output terminal 43 .
- Output terminal 43 is connected to an electrode (not illustrated) formed on bottom surface 32 of the communication module through a through hole provided in component-containing material 28 .
- the circuit composing second tuner unit 26 and demodulating unit 27 is formed with circuit patterns with various types of shapes formed on circuit board 21 ; and electronic components 29 .
- second filter 36 b , second amplifier 37 b , second mixer 39 b , intermediate-frequency filter 40 b , and intermediate-frequency amplifier 41 b are arranged in this order from vertical side 21 c , one side adjacent to second terminal 35 b of circuit board 21 , toward vertical side 21 d , the other side.
- the ground of local oscillator 38 b is provided near the support of shielded case 25 and connected directly to shielded case 25 with a wiring pattern.
- the communication module according to the present invention is used for a mobile device and the like, ideal for receiving television broadcast waves (VHF, UHF), digital broadcast waves, digital communication waves, and others with higher sensitivity.
- VHF television broadcast waves
- UHF digital broadcast waves
- digital communication waves and others with higher sensitivity.
- communication module 200 selects a desired broadcast wave out of the supplied television broadcast waves, and chooses tuner unit 23 or tuner unit 26 , whichever is more sensitive, out of the signals for the desired broadcast wave supplied from demodulator 27 , with electronic switch 42 .
- This always enables reception with high sensitivity.
- switching diversity one of antenna 34 a and antenna 34 b , whichever has higher reception sensitivity, is always chosen to receive a broadcast wave with high reception sensitivity, even if the communication module is moving.
- switching diversity is taken as an example.
- combining diversity may be used. This method further reduces the influence of the fluctuation in the reception signal level due to phasing, thus further improving reception performance during high-speed movement.
- the first exemplary embodiment proves that circuit board 21 intervening between tuner unit 23 and tuner unit 26 has improved the separation and isolation characteristic between tuner unit 23 and tuner unit 26 by approximately 35 dB compared to a conventional one.
- the circuits from first amplifier 37 a to first mixer 39 a where a feeble reception signal supplied from first terminal 35 a and second terminal 35 b is amplified to increase its signal energy; and the circuits from second amplifier 37 b to second mixer 39 b are to be separated physically and electrically by circuit board 21 .
- ground plane 22 provided in the inner layer of circuit board 21 further improves the degree of separation and isolation by approximately 30 dB.
- first terminal 35 a and second terminal 35 b being arranged on one lateral side and the other lateral side, respectively, the degree of separation and isolation has been improved by approximately 34.4 dB compared to a conventional one.
- the improvement of the degree of separation and isolation prevents interference, to allow receiving broadcast waves with high fidelity.
- the power supply units of local oscillators 38 a , 38 b may be separately provided to be operated simultaneously with electronic switch 42 . This reduces high-frequency interference and power consumption.
- First amplifier 37 a , local oscillator 38 a , first mixer 39 a , and intermediate-frequency amplifier 41 a , all composing tuner unit 23 are implemented in a single integrated circuit.
- Second amplifier 37 b , local oscillator 38 b , second mixer 39 b , and intermediate-frequency amplifier 41 b , all composing tuner unit 26 are implemented in a single integrated circuit as well.
- Demodulating unit 27 is also implemented in a single integrated circuit.
- Local oscillators 38 a , 38 b do not need to be provided separately, but either of them can be used for commoditization.
- second filter 36 b is covered with resin part 30 on the second main surface of circuit board 21 , but may be arranged on the first main surface of circuit board 21 . If second filter 36 b is covered with resin part 30 , the capacitance at second filter 36 b changes due to resin part 30 . Consequently, the frequency band of a signal filtered by second filter 36 b undesirably changes. To prevent such a defect, second filter 36 b is arranged on the first main surface of circuit board 21 , which is the outside of resin part 30 .
- FIG. 3 is a plan view of a laminated circuit board used for manufacturing a communication module. Holes 54 for positioning are provided near the four corners of worksheet-like main board 50 thermally hardened. The peripheries of sub board 51 are linked with frame 53 .
- FIG. 4 is a plan view of sub board 51 .
- Sub boards 51 are arranged in 5 pieces in row by 6 pieces in column, forming an aggregate of 30 sub-sub boards 52 in total, for example.
- the peripheries of sub-sub board 52 are linked with frame 55 .
- Holes 56 for positioning are provided near the four corners of sub board 51 .
- Sub-sub boards 52 are implemented in circuit board 21 shown in FIG. 2 .
- FIGS. 5 through 12 illustrate respective steps of the method of manufacturing a communication module according to the present invention.
- FIG. 5 illustrates the first step, where main board 50 and sub-sub board 52 are shown.
- Integrated circuit 29 a (an example of electronic component 29 ) incorporating second tuner unit 26 and demodulating unit 27
- resistor 29 b an example of electronic component 29
- solder 46 to land pattern 45 provided on second main surface 52 b of sub-sub board 52 .
- FIG. 6 illustrates the second step of the method of manufacturing the communication module.
- FIG. 6 shows unhardened sheets 58 , 59 , each having a thermosetting property, before they are thermally hardened.
- Unhardened sheet 58 is provided thereon with integrated circuit 29 a composing tuner unit 26 and demodulating unit 27 , and hole 60 a into which resistor 29 b is inserted.
- Unhardened sheet 58 is formed by laminating six thin-layer sheets: sheets 58 a through 58 f , for example.
- the upper side of unhardened sheet 58 has unhardened sheet 59 without an opening and copper foil 61 laminated in this order, and these are integrated to form a component-containing sheet as shown in FIG. 7 .
- FIG. 7 illustrates the third step of the method of manufacturing the communication module.
- Laminated unhardened sheets 58 , 59 and copper foil 61 are placed on the side at tuner unit 26 and demodulating unit 27 provided on second main surface 52 b of sub-sub board 52 .
- clearance 63 is provided between hole 60 a and integrated circuit 29 a .
- Clearance 63 becomes resin part 30 when heated as shown in FIG. 8 to be described later. This allows unhardened sheets 58 , 59 to be easily inserted into sub-sub board 52 with integrated circuit 29 a and resistor 29 b attached thereon and to be laminated.
- unhardened sheet 58 Next, a description is made for lamination of unhardened sheet 58 .
- unhardened sheets 58 a through 58 f on second main surface 52 b of sub-sub board 52 are exemplified for convenience and simplification in the drawing.
- the number of unhardened sheets 58 is not limited; some other laminated circuit boards according to the present invention have 11 unhardened sheets 58 laminated.
- unhardened sheets 58 a through 58 f have hole 60 a formed into which integrated circuit 29 a and resistor 29 b are inserted.
- the top surface of unhardened sheet 58 f have unhardened sheet 59 and copper foil 61 laminated.
- a metal reinforcing plate may be inserted between unhardened sheet 58 f and unhardened sheet 59 , to prevent warpage of the communication module after thermocompression bonding.
- FIG. 8 illustrates the fourth step of the method of manufacturing the communication module.
- Unhardened sheets 58 , 59 and copper foil 61 are thermocompressed and bonded at a low enough temperature for solder 46 to remain unmelted and integrated as shown in FIG. 8 .
- the following conditions for thermocompression bonding in the first exemplary embodiment provide a favorable result. That is, the heating temperature is 180° C. to 200° C., the welding force is approximately 30 kg/cm 2 , and the welding time is approximately 1 hour.
- This thermocompression bonding is performed in a vacuum chamber, which is important for purging air from hole 60 a adequately and for filling the clearance between hole 60 a and electronic component 29 with resin adequately. As a result of resin being thus injected adequately, air between hole 60 a and electronic component 29 is completely purged.
- thermocompression bonding causes the resin in the unhardened sheet to flow out, changing unhardened sheet 58 to hardened sheet 47 ; and unhardened sheet 59 to hardened sheet 48 , to form base-material-containing resin part 31 .
- the resin that has flowed out then flows into hole (or recess) 60 formed from hole 60 a by thermocompression bonding and fills hole 60 , to form resin part 30 .
- FIGS. 13 through 15 A detailed description is made using FIGS. 13 through 15 to be discussed later.
- Resin part 30 and base-material-containing resin part 31 compose component-containing material 28 .
- FIG. 9 illustrates the fifth step of the method of manufacturing the communication module.
- sub-sub board 52 and another adjacent one are provided therebetween with hole 65 .
- copper foil 61 is etched into a given pattern to form electrode 33 .
- Electrode 33 is connected to tuner unit 23 provided on first main surface 52 a of sub-sub board 52 , tuner unit 26 provided on second main surface 52 b , and demodulating unit 27 through through hole 67 .
- Through hole 67 is provided in the side of sub-sub board 52 and base-material-containing resin part 31 in the first exemplary embodiment. However, hole 67 may be provided near integrated circuit 29 a , for example.
- FIG. 11 illustrates the seventh step of the process of manufacturing the communication module.
- Integrated circuit 24 a and resistor 24 b composing tuner unit 23 are attached with solder 64 on first main surface 52 a of sub-sub board 52 having been turned upside down.
- shielded case 25 is attached so as to cover the side at tuner unit 23 composed of integrated circuit 24 a and resistor 24 b .
- Support 25 a of shielded case 25 is inserted into through hole 67 and attached at the side of sub-sub board 52 with solder 69 .
- solder 69 is filled in the clearance formed between burr 25 b and the wall surface of through hole 67 owing to capillary tube phenomenon. This enables shielded case 25 to be securely attached to sub-sub board 52 .
- FIG. 13 is a sectional view of the substantial part before thermocompression bonding.
- the number of unhardened sheets 58 is simplified for convenience in the drawings and description.
- the tuner unit and demodulating unit are not illustrated specifically, but integrated circuit 29 a represents them.
- Second main surface 52 b of sub-sub board 52 On second main surface 52 b of sub-sub board 52 , integrated circuit 29 a is connected to land pattern 45 with solder 46 . Second main surface 52 b of sub-sub board 52 has unhardened sheets 58 , 59 laminated that are porous glass fiber with resin impregnated and have a thermosetting property.
- Unhardened sheets 58 , 59 have a plate-like shape that is woven or nonwoven textile with heat-flowable resin impregnated, and are unhardened component-containing sheets provided with hole (opening) 60 a having clearance 63 in which resin part 30 is formed where resin part 30 corresponds to the outer circumference of integrated circuit 29 a .
- Hole 60 a is an opening for housing electronic components.
- Integrated circuit 29 a provided on sub-sub board 52 loosely inserted into hole 60 a having clearance 63 .
- Solder ball 76 provided as a terminal of integrated circuit 29 a , is fastened to land pattern 45 provided on sub-sub board 52 with solder 46 .
- unhardened sheets 58 , 59 are compressed to approximately one third of their original sizes, to change to hardened sheets 47 , 48 as shown in FIG. 14 . That is, resin 71 contained in the porous fiber of unhardened sheets 58 , 59 flows out to become hardened sheets 47 , 48 , thus forming base-material-containing resin part 31 . Still, the entire clearance between hole 60 and integrated circuit 29 a is filled with resin 71 to form resin part 30 , and thus component-containing material 28 is formed with resin part 30 and base-material-containing resin part 31 .
- Resin part 30 formed in this way causes air to be purged owing to resin 71 having flowed in, resulting in no air or the like being left in resin part 30 . This prevents poor connection between the electrode of electronic component 29 and land pattern 45 due to thermal expansion of remaining air, thus improving electrical and mechanical reliability.
- Unhardened sheets 58 , 59 are of thermosetting resin that is not yet hardened, and thus they lose their plastic property even if heated again after being once thermally hardened and deformed to hardened sheets 47 , 48 to become base-material-containing resin part 31 . Consequently, integrated circuit 29 a once sealed with resin 71 remains fixed.
- FIG. 15 is a characteristic diagram of viscosity ⁇ of the resin in the process of manufacturing the communication module according to the first exemplary embodiment, where the horizontal and vertical axes indicate temperature T and viscosity ⁇ , respectively.
- viscosity ⁇ of resin 71 gradually decreases as the ambient temperature increases through temperature Tmin (approximately 200° C.) as shown by direction D.
- Tmin approximately 200° C.
- the fluidity of resin 71 increases to be adequately filled in a narrow clearance, thus preventing air from undesirably remaining in a clearance.
- viscosity ⁇ gradually increases as shown by direction U to harden resin 71 gradually.
- solder 46 is preferably used that has a melting point higher than the ambient temperature at thermocompression bonding. This is because the following problem occurs. That is, when the ambient temperature rises and the internal temperature of solder 46 exceeds its melting point (approximately 200° C.), solder 46 melts and mixes with resin 71 to cause a short between solder ball 76 in integrated circuit 29 a and other solder ball 76 . To prevent this problem, solder with a high melting point is used for solder 46 .
- the present invention according to the first exemplary embodiment is outlined using the reference marks as follows. That is, the communication module according to the present invention is equipped with:
- circuit board 21 having a first main surface, and a second main surface opposite to the first one;
- first amplifier 37 a arranged on the first main surface of circuit board 21 , for amplifying a first signal
- first mixer 39 a arranged on the first main surface of circuit board 21 , for converting a signal supplied from first amplifier 37 a to an intermediate-frequency (low-frequency) signal;
- second amplifier 37 b arranged on the second main surface of circuit board 21 , for amplifying a second signal
- second mixer 39 b arranged on second main surface of circuit board 21 , for converting a signal supplied from second amplifier 37 b to an intermediate-frequency (low-frequency) signal.
- the first exemplary embodiment further discloses a method of manufacturing the communication module. That is, the embodiment lists the following steps:
- a first attaching step for attaching second electronic component 29 including second amplifier 37 b and second mixer 39 b to the second main surface of circuit board 21 thermally hardened;
- a second attaching step for attaching first electronic component 24 including first amplifier 37 a and first mixer 39 a , on the first main surface of circuit board 21 , after the integrating step;
- a shielded case attaching step for attaching metal shielded case 25 so as to cover first electronic component 24 , after the second attaching step.
- the communication module of the second exemplary embodiment is different from that of the first exemplary embodiment in that first tuner unit 23 , second tuner unit 26 , and demodulating unit 27 are each attached to separate circuit boards.
- the module is equipped with first circuit board 81 that has first tuner unit 23 attached thereon and has been hardened; and second circuit board 82 that has second tuner unit 26 and demodulating unit 27 attached thereon and has been hardened, and the module is provided with component-containing material 28 incorporating electronic components 29 between first main surface 81 a of first circuit board 81 and first main surface 82 a of second circuit board 82 .
- electrode 83 is led from first circuit board 81 or second circuit board 82 to bottom surface 84 of the communication module through a through hole.
- Ground plane 22 is provided in the inner layer of first circuit board 81 .
- first main surface 82 a of second circuit board 82 with tuner unit 26 and demodulating unit 27 attached thereon are linked to electrodes 83 formed on second main surface 82 b , namely bottom surface 84 , through through holes or inner vias, and thus their lengths become short to improve the high-frequency characteristic.
- Inserting ground plane 22 into the inner layer of second circuit board 82 improves the degree of high-frequency separation and isolation between this communication module and the main board on which the communication module is implemented.
- Forming components other than electrode 83 provided on second main surface 82 b of second circuit board 82 , with an insulating body enables the wiring pattern of the main board to be provided under the communication module. This improves the flexibility of the wiring pattern in the main board on which the communication module is implemented.
- the other features are the same as those in the first exemplary embodiment.
- a component that is the same as one in the first exemplary embodiment is given the same reference mark to simplify its description.
- FIGS. 17 through 21 illustrate respective steps for manufacturing a communication module according to the second exemplary embodiment of the present invention.
- FIG. 17 indicates second circuit board 82 thermally hardened.
- Second circuit board 82 made of the same material as that of circuit board 21 shown in FIG. 1 , is to have electronic component 29 fastened to first main surface 82 a of second circuit board 82 with solder 64 .
- unhardened sheet 58 is laminated on first main surface 82 a of second circuit board 82 with electronic component 29 attached thereon, and then first circuit board 81 thermally hardened is further laminated over unhardened sheet 58 .
- First circuit board 81 is made of the same material as that of circuit board 21 .
- unhardened sheet 58 is sandwiched between first main surface 81 a of first circuit board 81 and first main surface 82 a of circuit board 82 , to be integrated. Then, thermocompression bonding is performed in the same conditions as those in the first exemplary embodiment.
- the communication module according to the present invention thus has first circuit board 81 and second circuit board 82 thermally hardened on the top and bottom surfaces of component-containing material 28 .
- First circuit board 81 and second circuit board 82 have hardness against heat, thus preventing warpage prone to occur in a thermocompression bonding process.
- the other features are the same as those in the first exemplary embodiment.
- first circuit board 81 having first main surface 81 a , and second main surface 81 b opposite to first main surface 81 a;
- second circuit board 82 having first surface 82 a , and second main surface 82 b opposite to first surface 82 a , and arranged so that second main surface 82 b faces first main surface 81 a of first circuit board 81 ;
- first amplifier 37 a arranged on second main surface 81 b of first circuit board 81 , for amplifying a first signal
- first mixer 39 a arranged on second main surface 81 b of first circuit board 81 , for converting a signal supplied from first amplifier 37 a to an intermediate-frequency signal;
- second amplifier 37 b arranged on first main surface 82 a of second circuit board 82 , for amplifying a second signal
- second mixer 39 b arranged on first main surface 82 a of second circuit board 82 , for converting a signal supplied from second amplifier 37 b to an intermediate-frequency signal;
- resin part 30 arranged between first circuit board 81 and second circuit board 82 , for covering second amplifier 37 b and second mixer 3 b.
- a first attaching step for attaching second electronic component 29 including second amplifier 37 b and second mixer 39 b , to first main surface 82 a of second circuit board 82 thermally hardened;
- a laminating step for laminating component-containing sheets 58 , 59 yet to be hardened having opening 60 a for housing second electronic component 29 between first main surface 81 a of first circuit board 81 and first main surface 82 a of second circuit board 82 , after the first attaching step;
- an integrating step for integrating first circuit board 81 , component-containing sheets 58 , 59 , and second circuit board 82 by crimping them while heating them in a polymerized state, after the laminating step;
- a second attaching step for attaching first electronic component 24 including first amplifier 37 a and first mixer 39 a , to second main surface 81 b of first circuit board 81 , after the integrating step;
- a shielded case attaching step for attaching metal shielded case 25 to first main surface 81 b of first circuit board 81 so as to cover first electronic component 24 , after the second attaching step.
- the communication module of the third exemplary embodiment is that shown in the first exemplary embodiment, where first terminal 35 a and second terminal 35 b are formed near a pair of opposing corners of circuit board 21 .
- Local oscillators 38 a and 38 b are commoditized. This makeup prevents first tuner unit 102 and second tuner unit 103 from undesirably interfering with each other due to their high-frequency signals, while reducing power consumption.
- a component that is the same as one in the first exemplary embodiment is given the same reference mark to simplify its description.
- FIG. 22 illustrates circuit board 101 corresponding to circuit board 21 in the first exemplary embodiment.
- Circuit board 101 is the same as circuit board 21 in their material and method of manufacturing.
- the first main surface of circuit board 101 has first tuner unit 102 (corresponding to tuner unit 23 in the first exemplary embodiment) implemented thereon.
- the second main surface of circuit board 101 has second tuner unit 103 (corresponding to tuner unit 26 in the first exemplary embodiment), electronic switch 42 , and demodulating unit 27 , all implemented thereon.
- first terminal 35 a of tuner unit 102 is provided near corner C 1 of the first main surface of circuit board 101 .
- Second terminal 35 b of second tuner unit 103 is provided near corner C 2 of the second main surface of circuit board 101 . That is, first terminal 35 a and second terminal 35 b are provided near a pair of opposing corners of circuit board 101 .
- Such spatial distance further improves the degree of high-frequency separation and isolation compared to the first exemplary embodiment. More specifically, in circuit board 104 for an experiment shown in FIG.
- positions P 1 through P 16 correspond to those shown in FIG. 23 .
- Position P 1 indicates the position of first terminal 35 a .
- Positions P 2 through P 16 indicate the position of second terminal 35 b (refer to FIG. 23 ).
- Distance X shows the distance in direction X from center point Q 0 of circuit board 104 , where the positive and negative signs indicate the direction toward position P 9 and that toward position P 15 , respectively.
- the positive and negative signs indicate the direction toward position P 12 and that toward position P 4 , respectively.
- Circuit board 104 for an experiment has size: 10 mm ⁇ 10 mm, material: FR4 (flame retardant type 4, relative permittivity: 4.7), 4-layer board, thickness: 0.5 mm, terminal pitch: 1.2 mm.
- Position P 1 is indicated as X: ⁇ 3.6 mm and Y: ⁇ 5.0 mm.
- Position P 11 provided symmetrically at the opposing corner of position P 1 and thus its polarity inverted, is indicated as X: 3.6 mm and Y: 5.0 mm.
- Positions P 4 and P 12 are indicated as distance X: 0, and distance Y: ⁇ 5.0 mm and 5.0 mm, respectively.
- positions P 9 and P 15 are indicated as distance X: 5.0 mm and ⁇ 5.0 mm, respectively, and distance Y: 0.
- separation/isolation degree S 1 indicates the degree when the frequency of an input signal fed into first terminal 35 a and second terminal 35 b is 470 MHz. That is, degree S 1 indicates the strength of a signal generated at second input terminal 35 b when a 470 MHz input signal is fed into the first input terminal, namely the ratio of how much interference is removed. In the same way, separation/isolation degree S 2 indicates the strength when the frequency of an input signal is 770 MHz.
- Local oscillator 105 in the third exemplary embodiment is provided in tuner unit 103 formed on the second main surface of circuit board 101 .
- Local oscillator 105 is connected to the other input of second mixer 39 b in tuner unit 103 and to the other input of first mixer 39 a of tuner unit 102 as well. That is, they are commoditized.
- circuit board 101 ground pattern 22 , and shielded case 25 enable high-frequency separation and isolation from the outside.
- the ground of local oscillator 105 is connected directly to support 25 a of shielded case 25 with a wiring pattern, and thus the grounding of local oscillator 105 is enhanced to suppress output of a disturbing signal.
- Such an effect is extremely useful for a communication module because such a tuner incorporated in a mobile phone and the like in recent years is able to suppress interference with the mobile phone.
- another communication module has first terminal 35 a arranged near the corner of circuit boards 21 , 101 , each having a substantially quadrangle shape, for supplying a first signal to first filter 36 a ; and second terminal 35 b arranged near the opposing corner of the corner of circuit board 21 , for supplying a second signal to second filter 36 b.
- a communication module of the present invention improves the separation and isolation characteristic in high frequencies between the first and second tuner units, can be used for a diversity receiver and the like, and thus has wide industrial applicability.
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Receivers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
TABLE 1 | ||||
Separation/ | Separation/ | |||
isolation | isolation | |||
Position | Distance | Distance | degree S1 | degree S2 |
P | X (mm) | Y (mm) | (470 MHz) | (770 MHz) |
P1 | −3.6 | −5.0 | — | — |
P2 | −2.4 | −5.0 | −54.3 | −50.0 |
P3 | −1.2 | −5.0 | −78.0 | −72.3 |
P4 | 0.0 | −5.0 | −82.9 | −77.0 |
P5 | 1.2 | −5.0 | −84.7 | −79.3 |
P6 | 2.4 | −5.0 | −85.6 | −80.5 |
P7 | 3.6 | −5.0 | −86.1 | −81.2 |
P8 | 5.0 | −2.4 | −87.6 | −84.1 |
P9 | 5.0 | 0.0 | −87.9 | −85.1 |
P10 | 5.0 | 2.4 | −88.6 | −86.0 |
P11 | 3.6 | 5.0 | −88.5 | −85.6 |
P12 | 0.0 | 5.0 | −88.2 | −85.8 |
P13 | 3.6 | 5.0 | −87.7 | −84.4 |
P14 | −5.0 | 2.4 | −86.7 | −82.5 |
P15 | −5.0 | 0.0 | −84.5 | −79.9 |
P16 | −5.0 | 2.4 | −82.6 | −76.6 |
Claims (9)
Applications Claiming Priority (3)
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JP2005-169148 | 2005-06-09 | ||
JP2005169148 | 2005-06-09 | ||
PCT/JP2006/311506 WO2006132312A1 (en) | 2005-06-09 | 2006-06-08 | Communication module and its manufacturing method |
Publications (2)
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US20090011726A1 US20090011726A1 (en) | 2009-01-08 |
US7840201B2 true US7840201B2 (en) | 2010-11-23 |
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US11/629,349 Expired - Fee Related US7840201B2 (en) | 2005-06-09 | 2006-06-08 | Communication module having tuner units that are separated and isolated from each other, and method of manufacturing the same |
Country Status (5)
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US (1) | US7840201B2 (en) |
EP (1) | EP1890389A4 (en) |
JP (1) | JPWO2006132312A1 (en) |
CN (1) | CN101006651A (en) |
WO (1) | WO2006132312A1 (en) |
Cited By (1)
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US8774734B1 (en) * | 2010-07-02 | 2014-07-08 | Qualcomm Incorporated | Module that can be used as a plug-in module and as a solder-down module |
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JPWO2009019792A1 (en) * | 2007-08-09 | 2010-10-28 | パナソニック株式会社 | Circuit module and electronic device using the same |
JP4870053B2 (en) * | 2007-09-18 | 2012-02-08 | 矢崎総業株式会社 | Optical module |
JP2010200129A (en) * | 2009-02-26 | 2010-09-09 | Hitachi Media Electoronics Co Ltd | Tuner |
JP5756500B2 (en) * | 2013-08-07 | 2015-07-29 | 太陽誘電株式会社 | Circuit module |
US10178494B2 (en) | 2015-01-30 | 2019-01-08 | Cassia Networks Inc. | Bluetooth transparent relay |
US10681479B2 (en) | 2015-01-30 | 2020-06-09 | Cassia Networks Inc. | Methods, devices and systems for bluetooth audio transmission |
US9769594B2 (en) | 2015-01-30 | 2017-09-19 | Cassia Networks Inc. | Methods, devices and systems for increasing wireless communication range |
TWM516240U (en) * | 2015-09-24 | 2016-01-21 | 詠業科技股份有限公司 | Radio frequency device with mechanisms for the adjustment of the impedances and frequencies of its antennas |
JP2017200183A (en) * | 2016-04-29 | 2017-11-02 | スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. | Shielded diversity receiving module |
JP6729790B2 (en) * | 2017-03-14 | 2020-07-22 | 株式会社村田製作所 | High frequency module |
US11352258B2 (en) | 2019-03-04 | 2022-06-07 | Honda Motor Co., Ltd. | Multifunctional conductive wire and method of making |
WO2021002271A1 (en) | 2019-07-03 | 2021-01-07 | 株式会社村田製作所 | Radio-frequency module and communication device |
JP2021100213A (en) * | 2019-12-23 | 2021-07-01 | 株式会社村田製作所 | High frequency module and communication device |
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- 2006-06-08 CN CNA2006800006266A patent/CN101006651A/en active Pending
- 2006-06-08 US US11/629,349 patent/US7840201B2/en not_active Expired - Fee Related
- 2006-06-08 WO PCT/JP2006/311506 patent/WO2006132312A1/en active Application Filing
- 2006-06-08 EP EP06766481.3A patent/EP1890389A4/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
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CN101006651A (en) | 2007-07-25 |
WO2006132312A1 (en) | 2006-12-14 |
EP1890389A1 (en) | 2008-02-20 |
US20090011726A1 (en) | 2009-01-08 |
JPWO2006132312A1 (en) | 2009-01-08 |
EP1890389A4 (en) | 2015-01-14 |
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