WO2006123469A1 - 難燃性ポリアミド組成物 - Google Patents
難燃性ポリアミド組成物 Download PDFInfo
- Publication number
- WO2006123469A1 WO2006123469A1 PCT/JP2006/304654 JP2006304654W WO2006123469A1 WO 2006123469 A1 WO2006123469 A1 WO 2006123469A1 JP 2006304654 W JP2006304654 W JP 2006304654W WO 2006123469 A1 WO2006123469 A1 WO 2006123469A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flame retardant
- flame
- mass
- polyamide composition
- composition according
- Prior art date
Links
- 239000003063 flame retardant Substances 0.000 title claims abstract description 119
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 118
- 239000004952 Polyamide Substances 0.000 title claims abstract description 82
- 229920002647 polyamide Polymers 0.000 title claims abstract description 82
- 239000000203 mixture Substances 0.000 title claims abstract description 77
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 44
- 238000000465 moulding Methods 0.000 claims abstract description 42
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 19
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 18
- 238000002844 melting Methods 0.000 claims description 29
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 29
- 230000008018 melting Effects 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 23
- 150000001732 carboxylic acid derivatives Chemical group 0.000 claims description 21
- 150000001412 amines Chemical class 0.000 claims description 14
- 239000012779 reinforcing material Substances 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- BIOOACNPATUQFW-UHFFFAOYSA-N calcium;dioxido(dioxo)molybdenum Chemical compound [Ca+2].[O-][Mo]([O-])(=O)=O BIOOACNPATUQFW-UHFFFAOYSA-N 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 6
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 claims description 4
- 229910000165 zinc phosphate Inorganic materials 0.000 claims description 4
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 claims description 3
- 150000001463 antimony compounds Chemical class 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 claims description 3
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 claims description 2
- 150000001450 anions Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 30
- -1 hydrotalcite compound Chemical class 0.000 abstract description 28
- 238000005476 soldering Methods 0.000 abstract description 13
- 229960001545 hydrotalcite Drugs 0.000 abstract description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 abstract description 3
- 238000009472 formulation Methods 0.000 abstract 1
- 239000004793 Polystyrene Substances 0.000 description 21
- 229920002223 polystyrene Polymers 0.000 description 21
- 238000012360 testing method Methods 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000000835 fiber Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 239000004677 Nylon Substances 0.000 description 10
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 10
- 239000007789 gas Substances 0.000 description 10
- 229920001778 nylon Polymers 0.000 description 10
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 150000003440 styrenes Chemical class 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 7
- 239000004760 aramid Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000005227 gel permeation chromatography Methods 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229920003235 aromatic polyamide Polymers 0.000 description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical group OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 6
- 125000001246 bromo group Chemical group Br* 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000001361 adipic acid Substances 0.000 description 5
- 235000011037 adipic acid Nutrition 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000000454 talc Substances 0.000 description 5
- 229910052623 talc Inorganic materials 0.000 description 5
- 235000002566 Capsicum Nutrition 0.000 description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 4
- 239000006002 Pepper Substances 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 241000722363 Piper Species 0.000 description 4
- 235000016761 Piper aduncum Nutrition 0.000 description 4
- 235000017804 Piper guineense Nutrition 0.000 description 4
- 235000008184 Piper nigrum Nutrition 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000006068 polycondensation reaction Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000007790 solid phase Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004953 Aliphatic polyamide Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229920003231 aliphatic polyamide Polymers 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000012765 fibrous filler Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 150000002484 inorganic compounds Chemical class 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- JWHOQZUREKYPBY-UHFFFAOYSA-N rubonic acid Natural products CC1(C)CCC2(CCC3(C)C(=CCC4C5(C)CCC(=O)C(C)(C)C5CC(=O)C34C)C2C1)C(=O)O JWHOQZUREKYPBY-UHFFFAOYSA-N 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 3
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 3
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical compound NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 2
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920006124 polyolefin elastomer Polymers 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 239000012488 sample solution Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- BTURAGWYSMTVOW-UHFFFAOYSA-M sodium dodecanoate Chemical compound [Na+].CCCCCCCCCCCC([O-])=O BTURAGWYSMTVOW-UHFFFAOYSA-M 0.000 description 2
- 229940082004 sodium laurate Drugs 0.000 description 2
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 2
- 241000894007 species Species 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- UNEATYXSUBPPKP-UHFFFAOYSA-N 1,3-Diisopropylbenzene Chemical compound CC(C)C1=CC=CC(C(C)C)=C1 UNEATYXSUBPPKP-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- HXJZEGBVQCRLOD-UHFFFAOYSA-N 1-triethoxysilylpropan-2-amine Chemical compound CCO[Si](CC(C)N)(OCC)OCC HXJZEGBVQCRLOD-UHFFFAOYSA-N 0.000 description 1
- CCXLOQVMDTWRSP-UHFFFAOYSA-N 2-cyclohexylpropan-2-ylcyclohexane Chemical compound C1CCCCC1C(C)(C)C1CCCCC1 CCXLOQVMDTWRSP-UHFFFAOYSA-N 0.000 description 1
- HCUZVMHXDRSBKX-UHFFFAOYSA-N 2-decylpropanedioic acid Chemical compound CCCCCCCCCCC(C(O)=O)C(O)=O HCUZVMHXDRSBKX-UHFFFAOYSA-N 0.000 description 1
- RGHQFGJBVNNZMF-UHFFFAOYSA-N 2-methyldecane-1,10-diamine Chemical compound NCC(C)CCCCCCCCN RGHQFGJBVNNZMF-UHFFFAOYSA-N 0.000 description 1
- IHGZNTAZIJXDST-UHFFFAOYSA-N 2-methylnonane-1,9-diamine Chemical compound NCC(C)CCCCCCCN IHGZNTAZIJXDST-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 description 1
- SIKONVOBFDHQST-UHFFFAOYSA-N 2-methylundecane-1,11-diamine Chemical compound NCC(C)CCCCCCCCCN SIKONVOBFDHQST-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- IKJHGONQSDCPLS-UHFFFAOYSA-N 3-cyclohexylpentan-3-ylcyclohexane Chemical compound C1CCCCC1C(CC)(CC)C1CCCCC1 IKJHGONQSDCPLS-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- BDBZTOMUANOKRT-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)propan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C)(C)C1CCC(N)CC1 BDBZTOMUANOKRT-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000005700 Putrescine Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229920003385 Stanyl® TS250F6D Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 230000031709 bromination Effects 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229940014144 folate Drugs 0.000 description 1
- OVBPIULPVIDEAO-LBPRGKRZSA-N folic acid Chemical compound C=1N=C2NC(N)=NC(=O)C2=NC=1CNC1=CC=C(C(=O)N[C@@H](CCC(O)=O)C(O)=O)C=C1 OVBPIULPVIDEAO-LBPRGKRZSA-N 0.000 description 1
- 235000019152 folic acid Nutrition 0.000 description 1
- 239000011724 folic acid Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910001380 potassium hypophosphite Inorganic materials 0.000 description 1
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 description 1
- 229940039790 sodium oxalate Drugs 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- CFUDQABJYSJIQY-UHFFFAOYSA-N triethoxy-[2-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CC(C)OCC1CO1 CFUDQABJYSJIQY-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
Definitions
- the present invention relates to a flame retardant polyamide composition having excellent mechanical properties such as toughness, heat resistance in a reflow soldering process, particularly fluidity, and good thermal stability during molding.
- the present invention is particularly useful for forming electrical and electronic parts such as fine pitch connectors with a short distance between connector terminals and using a high-melting solder such as lead-free solder.
- the present invention relates to a flame retardant polyamide composition suitable for the above.
- a polyamide resin that can be molded by heating and melting into a predetermined shape has been used as a material for molding an electronic component.
- 6 nylon, 66 nylon, etc. are widely used as polyamides, but such aliphatic polyamides have good formability but are not suitable for connectors exposed to high temperatures such as in the reflow soldering process. It does not have sufficient heat resistance as a raw material for manufacturing surface mount components.
- 46 nylon has been developed as a polyamide with high heat resistance, and there is a problem of high water absorption.
- electrical and electronic parts molded using 46 nylon resin composition may change in dimensions due to water absorption, and if the molded body absorbs water, a pre-star, so-called bulging, will occur due to heating during the reflow soldering process.
- the surface mounting method using lead-free solder is being shifted, but lead-free solder has a higher melting point than conventional lead solder, and inevitably the mounting temperature is 10-20. The temperature has risen, and the use of 46 nylon has become difficult.
- Aromatic polyamides are more excellent in heat resistance and low water absorption than aliphatic polyamides such as 46 nylon.
- the development of materials with high toughness is desired because phenomena such as product cracking and whitening occur if the connector material does not have toughness during terminal press-fitting and insertion / extraction operations.
- toughness can be improved by increasing the proportion of polyamide resin and reducing the amount of flame retardant.
- electronic components such as connectors are generally used in underwriters ⁇ It is difficult to obtain good toughness without impairing the flame retardancy because it is required to have high flame retardancy such as V-0 as defined by Laboratories Standard UL94.
- brominated polyphenylene ether as a flame retardant and polyfluorinated styrene having an epoxy group in the molecule are used. It is a known technique to use. However, in the case of a resin having a very high molding temperature, such as aromatic polyamide resin, the thermal stability during molding is not sufficient, so that the molding material is decomposed and the mechanical properties of the product are changed or lowered. In some cases, the use was limited due to the occurrence of discoloration.
- Patent Document 1 discloses a flame-retardant polyamide resin composition comprising an aromatic polyamide and a low-viscosity brominated polystyrene.
- Patent Document 2 discloses a flame-retardant resin composition comprising an aliphatic polyamide and a brominated polystyrene having a specific molecular weight, but has problems in heat resistance and fluidity.
- Patent Document 3 discloses a flame retardant polyamide resin composition using polybrominated styrene as a flame retardant, but there is a problem that sufficient heat resistance cannot be obtained.
- the flame retardant composition using aromatic polyamide resin having a melting point of 300 ° C or higher has a very high molding temperature, so that the bromine group contained in the flame retardant is not contained. Molding due to partial detachment, discoloration of the molded product and corrosion of the mold due to bromine gas generation! /, And the phenomenon is likely to occur.Therefore, development of a material with good moldability is desired. .
- Patent Documents 4 and 5 disclose technologies relating to flame retardant compositions using nylon 4, 6 and aromatic halogen compounds and talcite compounds as flame retardants.
- Patent Document 6 discloses a flame retardant composition comprising an aromatic polyamide resin, a terminal-modified polybromophenol-oxide and a hydrated talcite compound from which 30% or more of water of crystallization is excluded as a flame retardant. It is disclosed. However, even in the flame retardant composition, the thermal stability at the time of molding at a high temperature for a long time is insufficient.
- Patent Document 1 JP-A-6-263985
- Patent Document 2 Japanese Patent Laid-Open No. 9-227625
- Patent Document 3 Japanese Patent Application Laid-Open No. 5-194842
- Patent Document 4 Japanese Patent Laid-Open No. 63-223060
- Patent Document 5 JP-A-6-345963
- Patent Document 6 Japanese Patent Laid-Open No. 2001-31863
- the problem of the present invention is that it has excellent thermal stability during molding under high temperature conditions, and has flame resistance, fluidity, toughness, and heat resistance in a reflow soldering process in surface mounting using lead-free solder.
- the object is to provide a good flame retardant polyamide composition.
- the present inventors have found that as a polyamide resin, a brominated polystyrene having a specific bromine content and molecular weight as a flame retardant and a flame retardant aid, and further necessary Reflow soldering process in surface mounting using lead-free solder, with flame retardant polyamide composition containing a specific talcite compound with a specific hydride mouth, with excellent molding stability, flame retardancy, fluidity and toughness As a result, the present invention has been completed.
- the present invention provides:
- a flame retardant polyamide composition wherein the flame retardant (B) has a bromine content of 65 to 71 mass% and a weight average molecular weight of 1000 to 4800
- Polyamide ⁇ (A) force terephthalic acid component unit (2) Polyamide ⁇ (A) force terephthalic acid component unit.
- Polyamide resin (A) has a melting point of 280 to 340 ° C and an intrinsic viscosity [ ⁇ ?] Measured in concentrated sulfuric acid at a temperature of 25 ° C of 0.5 to 1.2 dlZg ( Flame retardant polyamide composition according to 1)
- Flame retardant aid (C) is at least one selected from antimony compounds, zinc borate, zinc stannate, zinc phosphate, calcium borate and calcium molybdate (1)
- the flame-retardant polyamide composition of the present invention in addition to thermal stability, flame retardancy, fluidity, and toughness during molding, it has excellent heat resistance required for surface mounting using lead-free solder. Molded products can be obtained, and the industrial value is extremely high.
- FIG. 1 is a diagram showing the relationship between temperature and time in a reflow process of a reflow heat resistance test performed in Examples and Comparative Examples of the present invention.
- the polyamide resin (A) of the present invention comprises a polyfunctional carboxylic acid component unit (a-1) and a polyfunctional amine component unit (a-2).
- the polyfunctional carboxylic acid component unit (a-1) constituting the polyamide resin (A) used in the present invention is composed of terephthalic acid component unit 30-: L 00 mol%, aromatic polyfunctional power other than terephthalic acid rubonic acid
- the total amount of these polyfunctional carboxylic acid component units is preferably 0 to 70 mol% and Z or C 4-20 aliphatic polyfunctional carboxylic acid component units, preferably 0 to 70 mol%. Mol%.
- aromatic carboxylic acid component units other than terephthalic acid examples include isophthalic acid, 2-methylterephthalic acid, naphthalenedicarboxylic acid, phthalic anhydride, trimellitic acid, pyromellitic acid, trimellitic anhydride, and pyromellitic anhydride. Of these, isophthalic acid is particularly preferable. These may be used alone or in combination of two or more. When using trifunctional or higher polyfunctional compounds, it is necessary to add them so that the resin does not gel. Specifically, it should be 10 mol% or less of the total 100 mol% of rubonic acid component units. .
- the aliphatic polyfunctional carboxylic acid of LO having 4 to 20, preferably 6 to 12, more preferably 6: LO.
- Use compound include, for example, adipic acid, suberic acid, azelaic acid, sebacic acid. Acid, decanedicarboxylic acid, undecanedicarboxylic acid, dodecanedicarboxylic acid and the like.
- adipic acid is particularly preferable from the viewpoint of improving mechanical properties.
- a polyfunctional carboxylic acid compound having three or more functional groups can be used as needed. However, the addition amount should not be changed so that the resin does not gel. It must be 10 mol% or less of the total 100 mol% of rubonic acid component units.
- the amount of the aromatic polyfunctional carboxylic acid component increases, the amount of moisture absorption decreases and the reflow heat resistance tends to improve.
- the terephthalic acid component unit is preferably 60 mol% or more.
- the amount of aromatic polyfunctional carboxylic acid components other than terephthalic acid tends to increase the mechanical properties, particularly toughness, of the molded product because the crystallinity of polyamide resin increases as the content decreases.
- the aliphatic polyfunctional carboxylic acid component unit having 4 to 20 carbon atoms should be contained in an amount of 0 to 70 mol%, preferably 0 to 60 mol%, more preferably 20 to 60 mol%. Is preferred!
- the polyfunctional amine component unit (a-2) constituting the polyamide resin (A) used in the present invention has 4 to 25 carbon atoms having a straight chain or a side chain, preferably 4 to 8, more preferably a straight chain.
- a polyfunctional amine component unit having a carbon atom power of ⁇ 8 in the chain is mentioned, and the total amount of these polyfunctional amine component units is 100 mol%.
- linear polyfunctional amine component unit examples include 1,4-diaminobutane, 1,6-diaminohexane, 1,7 diaminoheptane, 1,8 diaminooctane, 1,9-diaminononane, 1, 10 —Diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, etc. Of these, 1,6 diaminohexane is preferred.
- linear aliphatic diamine component unit having a side chain examples include 2-methylolene 1,5-diaminopentane, 2-methinolay 1,6-diaminohexane, 2-methinole 1,7 -Diaminoheptane, 2-methyl-1,8 diaminooctane, 2-methyl-1,9-diaminononane, 2-methyl-1,10-diaminodecane, 2-methyl-1,11-diaminoundecane and the like.
- 2-methyl 1,5 diaminopentane and 2-methyl 1,8-diaminooctane are preferable.
- Alicyclic polyfunctional amine component units include 1,3 diaminocyclohexane, 1,4-diaminocyclohexane, 1,3 bis (aminomethyl) cyclohexane, 1,4 bis (aminomethyl).
- the component unit derived from the alicyclic diamine of FIG. Among these alicyclic diamine component units, 1,3 diaminocyclohexane, 1,4-diaminocyclohexane, bis (aminomethyl) cyclohexane, bis (4-aminocyclohexyl) methane, 4, 4 '—Diamino-1,3, -dimethyldicyclohexylmethane is preferred, especially 1,3 diaminocyclohexyl, 1,4-diaminocyclohexyl, bis (4 aminocyclohexyl) methane, 1,3 bis (Aminoshi black hexyl) methane, 1, 3 - bis (aminomethyl) component units derived from the alicyclic Jiamin such cyclohexane are preferred. When using polyfunctional compounds with 3 or more functional groups, it is necessary to add them so that the resin does not become gelled, specifically, 10 mol% or less of the total 100
- any known method can be employed in producing the polyamide rosin (A) used in the present invention.
- it can be produced by adding a polyfunctional amine component and a polyfunctional carboxylic acid component as described above and heating in the presence of a catalyst.
- the total number of moles of the polyfunctional amine component is greater than the total number of moles of the polyfunctional carboxylic acid component.
- the functional amine component is 100 to 120 equivalents.
- This reaction is usually carried out in an inert gas atmosphere, and generally the inside of the reaction vessel is replaced with an inert gas such as nitrogen gas.
- it is desirable to enclose water in advance, and it contains water-soluble organic solvents such as alcohols such as methanol and ethanol! Moyo! /.
- the catalyst used in producing the polyamide resin (A) used in the present invention includes phosphoric acid, its salt and ester compound; phosphorous acid, its salt and ester compound; Phosphoric acid, its salts and ester compounds can be used.
- phosphoric acid, its salt and ester compound phosphorous acid, its salt and ester compound
- Phosphoric acid, its salts and ester compounds can be used.
- sodium phosphate, sodium phosphite, potassium hypophosphite, sodium hypophosphite and the like are preferable.
- These phosphorus compounds can be used alone or in combination.
- Such a phosphorus compound is usually used in 100 moles of the polyfunctional carboxylic acid as described above in an amount of 0.01 to 5 monolayers, preferably 0.05 to 2 monolayers.
- an end-capping agent As this end-capping agent, benzoic acid, an alkali metal salt of benzoic acid, acetic acid or the like can be used. Such an end-capping agent is usually used in an amount in the range of 0.1 to 5 mol, preferably 0.5 to 2 mol, per 100 mol of the polyfunctional carboxylic acid. By adjusting the amount of the end-capping agent used, the intrinsic viscosity [r?] Of the polycondensate obtained can be controlled.
- the reaction conditions for preparing such a polycondensate are specifically a reaction temperature of usually 200 to 290 ° C, preferably 220 to 280 ° C, and a reaction time of usually 0.5 to 5 hours, preferably 1 to 3 hours. Furthermore, this reaction can be carried out under any conditions of normal pressure and pressure, but the reaction pressure that is preferably carried out under pressure is usually 2 to 5 MPa. Is set within the range of 2.5-4MPa.
- the intrinsic viscosity [7?] Measured with an Ubbelohde viscometer in 96.5% sulfuric acid at 25 ° C is usually 0.05 to Low-order condensates can be obtained which are in the range of 0.6 dlZg, preferably in the range of 0.08 to 0.3 dlZg.
- the aqueous medium The polyamide low-order condensate produced in the body is separated from the reaction solution.
- a method such as filtration or centrifugation can be employed for the separation of the polyamide low-order condensate and the reaction solution.
- the reaction solution containing the generated polyamide low-order condensate is passed through a nozzle. A method of solid-liquid separation by flashing in the atmosphere is efficient.
- the polyamide low-order condensate obtained as described above is further subjected to post-polymerization.
- This post-polymerization is preferably carried out after drying the polyamide low-order condensate and heating it to a molten state while applying shear stress to the melt.
- the product is heated to a temperature at which the dried polyamide low-order condensate is at least melted. In general, it is heated to a temperature equal to or higher than the melting point of the dry polyamide low-order condensate, preferably 10 to 60 ° C. higher than the melting point.
- the shear stress can be applied to the melt by using, for example, a twin screw extruder with a vent or an ader. By applying shear stress to the melt in this way, it is considered that the dried polyamide low-order condensate in the molten state undergoes polycondensation with each other and the polycondensation reaction of the condensate also proceeds.
- the polyamide low-order condensate obtained as described above is further subjected to solid phase polymerization.
- the polyamide low-order condensate obtained as described above was subjected to solid phase polymerization by a publicly known method, and the intrinsic viscosity [r?] Measured by the above method was 0.5 to 1.
- Polyamides in the range of 2 dlZg can be prepared.
- the polyamide low-order condensate obtained as described above is subjected to solid-phase polymerization and then melt polymerization.
- the polyamide low-order condensate obtained as described above is subjected to solid-phase polymerization by a publicly known and publicly used method, and then melt-polymerized to have an intrinsic viscosity [r?] Of 0.5 to 1.2.
- Polyamides in the dl / g range can be prepared.
- the polyamide resin (A) of the present invention has an intrinsic viscosity measured in a sulfuric acid at a temperature of 25 ° C and 96.5%
- the polyamide resin (A) used in the present invention has a melting point because it is crystalline, and the polyamide resin obtained by the above production method is analyzed using a differential scanning calorimeter (DSC).
- DSC differential scanning calorimeter
- the melting point is preferably 280 to 340 ° C, more preferably 300 to 340 ° C. Is 310 to 335 ° C, more preferably 315 to 330 ° C.
- Polyamide resin having a melting point in such a range has particularly excellent heat resistance.
- the melting point is 280 ° C or higher, more than 300 ° C, especially 320 to 330 ° C, sufficient heat resistance is exhibited when using lead-free reflow soldering process, especially lead-free solder with high melting point. can do.
- the melting point is 340 ° C or lower, sufficient heat stability is achieved without causing foaming, gas generation, or discoloration of the molded product at the time of molding below 350 ° C, which is the decomposition point of polyamide. 'You can get sex.
- the flame retardant (B) used in the present invention is added for the purpose of reducing the flammability of the resin, and is added to the flame retardant polyamide composition of the present invention at the time of molding at a temperature of 300 ° C or higher.
- a specific bromine content And brominated polystyrene having a specific molecular weight should be used.
- the brominated polystyrene used in the present invention is produced by brominating polystyrene or poly (X-methylstyrene.
- Polystyrene or the like is polymerized and produced using styrene or a- methylstyrene as a raw material.
- the fluorinated polystyrene obtained by bromination is a force in which some of the hydrogen atoms bonded to the carbon atoms forming the aromatic ring are replaced with odorous atoms.
- some of the hydrogen atoms forming the alkyl chain formed are substituted with bromine atoms, and in the present invention, some of the hydrogen atoms bonded to the carbon atoms forming the aromatic ring are bromine atoms.
- a hydrogen atom that forms an alkyl chain that forms the main skeleton of a polymer is substantially substituted with a bromine atom, which means that a hydrogen atom that forms an alkyl chain that forms the main skeleton of a polymer the ratio of the substitution with bromine atoms is 0-0. 5 wt%, preferably 0-0. 2% by weight, more preferably 0-0. a 1 mass 0/0, such brominated polystyrene thermal
- the stability is good, and further the thermal stability of the flame retardant polyamide composition obtained by using it is improved.
- the thermal stability of such a flame retardant can be confirmed by the amount of hydrogen bromide generated when the flame retardant is heated. The lower the amount generated, the better the thermal stability.
- polybrominated styrene obtained by polymerizing brominated styrene can also be cited as a known material.
- a high bromine-containing product of 67% by mass or more is produced. Is difficult and extremely difficult to obtain. Therefore, it is difficult to achieve high toughness without impairing the flame retardancy of the molded product by using the flame retardant polyamide composition and the molded product.
- brominated styrene monomers or oligomers with a low degree of polymerization remain in polybrominated styrene, so that the thermal stability during long-time continuous molding is poor.
- another feature of the present invention is that high fluidity can be obtained at the time of molding without impairing various physical properties such as flame retardancy, heat resistance and toughness.
- a flame retardant polyamide composition having high fluidity it is necessary to use a brominated polystyrene having a specific molecular weight.
- gel permeation chromatography Molecular weight force of brominated polystyrene determined by polystyrene conversion using GPC
- Weight average molecular weight (Mw) is 1000 to 4800, and 2000 to 4500.
- MFR mail flow
- the mail flow (MFR) force is 200 to 1000 gZlO minutes, preferably 400 to 900 gZlO minutes.
- the weight average molecular weight is a value obtained by measurement in terms of polystyrene, measured using a differential refractometer detector at a column temperature of 40 ° C. using GPC with a moving bed as a black mouth form.
- MFR has a load of 1200g and a temperature of 270. C, measured when the orifice diameter is 2.095 mm.
- MFR load 2160g, temperature 220 ° C, orifice inner diameter 2 It is also possible to measure at 095mm, in this case the MFR is 4-15gZlO min
- the molecular weight is preferably the above-mentioned weight average molecular weight, the number average molecular weight (Mn) is 800 to 4800, and the molecular weight distribution (MwZMn) is 1.05 to L25.
- Mn number average molecular weight
- MwZMn molecular weight distribution
- the molecular weight of the brominated polystyrene is not less than the lower limit of the above range, that is, the MFR is not more than the upper limit, sufficient flame retardancy and toughness are imparted to a molded product obtained by molding the flame retardant polyamide resin of the present invention. can do. If the molecular weight is not more than the upper limit of the above range, that is, if the MFR is not less than the lower limit, good fluidity during molding can be obtained, and the toughness of the resulting molded product is not impaired.
- Brominated polystyrene which is the flame retardant (B) used in the present invention, is easily available on the market.
- SAYTEX HP-3010 SAY TEX HP-3010G manufactured by Albemarle Co., Ltd.
- SAYTEX HP-3010P SAYTEX HP-3010P.
- the flame retardant aid (C) known ones can be used as long as they can be used together with the flame retardant (B) to significantly enhance the flame retardancy.
- antimony compounds such as antimony trioxide, antimony tetraoxide, antimony tetraoxide, antimony pentoxide, and sodium antimonate, 2 ⁇ ⁇ 3 ⁇ ⁇ , 4 ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ 0, 2 ⁇ ⁇ 3 ⁇ ⁇ ⁇ 3.5 ⁇
- Zinc borate such as firewood
- Examples thereof include zinc folate, zinc phosphate, calcium borate, and calcium molybdate, and these may be used alone or in combination of two or more.
- sodium antimonate, zinc borate, and zinc phosphate are more preferred, and sodium antimonate and zinc borate anhydrides, that is, 2 ⁇ ⁇ 3 ⁇ .
- the flame retardant aid (C) used in the present invention is a total amount of 100% by mass of the polyamide resin ( ⁇ ), the flame retardant ( ⁇ ), the flame retardant aid (C) and the reinforcing material (D).
- 0.5 to: L is preferably added in an amount of 0% by mass, more preferably 0.5 to 5% by mass, and more preferably 1 to 4% by mass.
- the reinforcing material (D) may be used as necessary.
- Various inorganic fillers having shapes such as shapes, granules, plates, needles, cloths, and mats can be used. More specifically, silica, silica alumina, alumina, calcium carbonate, titanium dioxide, talc, wollastonite, diatomaceous earth, clay, kaolin, spherical glass, my strength, gypsum, bengara, magnesium oxide and acid ⁇ Powder or plate-like inorganic compounds such as zinc, needle-like inorganic compounds such as potassium titanate, glass fiber (Dallas fiber), potassium titanate fiber, metal-coated glass fiber, ceramic fiber, wollastonite, carbon Examples thereof include inorganic fibers such as fibers, metal carbide fibers, metal-cured fibers, asbestos fibers and boron fibers, and organic fibers such as aramid fibers and carbon fibers.
- glass fiber is particularly preferable.
- the moldability of the composition is improved, and mechanical properties such as tensile strength, bending strength, and flexural modulus of molded articles formed from the polyamide composition, and heat resistance characteristics such as thermal deformation temperature.
- the average length of the glass fiber as described above is usually in the range of 0.1 to 20 mm, preferably 0.3 to 6 mm, and the aspect ratio (L (average length of fiber) ZD (outside of average fiber) The diameter)) is usually in the range of 10 to 5000, preferably 2000 to 3000. It is preferable to use glass fibers having an average length and an aspect ratio within such ranges.
- fillers Two or more of these fillers can be used in combination. Further, these fillers can be used after being treated with a silane coupling agent or a titanium coupling agent. For example, it may be surface-treated with a silane compound such as butyltriethoxysilane, 2-aminopropyltriethoxysilane, or 2-glycidoxypropyltriethoxysilane.
- a silane compound such as butyltriethoxysilane, 2-aminopropyltriethoxysilane, or 2-glycidoxypropyltriethoxysilane.
- the fibrous filler which is the reinforcing material (D) in the present invention may be coated with a sizing agent, and is acrylic, acrylic Z maleic acid modified, epoxy, urethane, urethane. Z maleic acid modified compounds and urethane Z amine modified compounds are preferably used.
- a sizing agent acrylic, acrylic Z maleic acid modified, epoxy, urethane, urethane.
- Z maleic acid modified compounds and urethane Z amine modified compounds are preferably used.
- the surface treatment agent is used in combination with the sizing agent, the binding between the fibrous filler in the composition of the present invention and other components in the composition is improved, and the appearance and strength are improved. The characteristics are improved.
- the Hyde mouth talcite compound is used as a heat stabilizer, Force Suppresses discoloration and carbonization of the flame retardant polyamide composition by capturing the free bromine group.
- a particularly preferred hide-mouthed talcite compound in the present invention is represented by the following chemical formula (1).
- MgZAl 0.65 / 0.35 to 0.73 / 0.27, preferably 0.67 / 0.33 to 0.3. 70 / 0.30.
- cation species A OH-, CO 2 SO 2 and the like can be used, and preferably CO 2
- the number of water of crystallization (m in the formula (1)) existing between the layers of the hydrated talcite compound may not be contained, but if it is contained, it is 0.3 per mol of the compound.
- Those having no crystallization water are inferior in bromine group-capturing ability compared to those containing crystallization water, and tend to generate bromine gas and form discolored carbides during formation. If the value of m exceeds the above range, the heat resistance (blister resistance) in the reflow soldering process tends to decrease.
- particles of Hyde port Tarusaitoi ⁇ product according to the present invention more preferably it is preferred instrument BET specific surface area value of 7 to 30 m 2 is 7 ⁇ 15M 2, the powder pH value 7. 5 to 9.5, preferably 7.5 to 9.0.
- coating materials that preferably coat the surface of the particle powder include sodium stearate, sodium laurate, and sodium oleate.
- Silane compounds such as higher fatty acid compounds, decyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropyltrimethoxysilane, and the like, more preferably sodium stearate, sodium laurate , Sodium oleate.
- the flame retardant polyamide composition according to the present invention includes the above-described components and the present invention. Heat stabilizers, weather stabilizers, fluidity improvers, plasticizers, thickeners, antistatic agents, mold release agents, pigments, dyes, inorganic or organic fillers, cores Various known additives such as inorganic compounds such as agents, fiber reinforcing agents, carbon black, talc, clay, and my strength may be contained.
- the flame retardant polyamide composition according to the present invention is further improved in heat resistance, flame retardancy, rigidity, tensile strength, bending strength, and impact strength by incorporating a fiber reinforcing agent among the above.
- the flame retardant polyamide composition according to the present invention may contain other polymers within the range not impairing the object of the present invention.
- other polymers include polyethylene and polypropylene.
- modified polyolefins and the like may be mentioned.
- a modified polyolefin elastomer such as a modified hydride or a modified ethylene / propylene copolymer.
- each component is mixed with a Henschel mixer, a V blender, a ribbon blender, a tumbler blender, or the like.
- the flame retardant polyamide composition of the present invention comprises a total amount of polyamide resin (A), flame retardant (B), flame retardant aid (C), reinforcing material (D) and Hyde mouth talcite compound (E). in 100 parts by weight polyamide bromide ⁇ the (a) 20 to 80 weight 0/0, preferably from 40 to 60 weight 0/0, more preferably preferred that a proportion of 40 to 50 mass%.
- polyamide resin (A) in flame retardant polyamide composition When the amount is 20% by mass or more, sufficient toughness can be obtained, and when it is 80% by mass or less, sufficient flame retardant and flame retardant aid can be contained, and flame retardancy can be obtained.
- the flame retardant (B) is preferably contained in an amount of 5 to 40% by mass, preferably 10 to 30% by mass, and more preferably 17 to 25% by mass.
- the content of the flame retardant (B) in the flame retardant polyamide composition is 5% by mass or more, sufficient flame retardancy can be obtained, and when it is 40% by mass or less, It ’s good because it ’s not going to drop!
- the flame retardant aid (C) is contained in a proportion of 0.5 to: LO mass%, preferably 0.5 to 5 mass%, more preferably 1 to 4 mass%.
- LO mass% preferably 0.5 to 5 mass%, more preferably 1 to 4 mass%.
- the content of the flame retardant aid (C) in the composition is 0.5% by mass or more, good flame retardancy can be imparted to the polyamide resin, and when it is 10% by mass or less, the composition is melted. This is preferable because the amount of gas generated during molding and the amount of discolored material generated in the molded product do not increase and the toughness does not decrease.
- the reinforcing material (D) is preferably contained in a proportion of 0 to 60% by mass, preferably 10 to 50% by mass, more preferably 20 to 45% by mass.
- a reinforcing material By adding a reinforcing material, rigidity can be imparted to the flame retardant polyamide composition.
- the content of the reinforcing material (D) in the flame-retardant polyamide composition is 60% by mass or less, the appearance of the molded product surface will not be impaired. I like it.
- Hyde port hydrotalcite compound (E) and from 0.05 to 0.4 mass 0/0, preferably from 0.1 to 0. It is desirable instrument amount in a proportion of 3 wt% 0 If it is more than 05% by mass, the generation of discolored carbides during molding tends to decrease, and if it is less than 0.4% by mass, the heat resistance (blister resistance) in the reflow soldering process will be good. ,.
- the flame retardant polyamide composition of the present invention may contain the above-mentioned [other additives] within a range not impairing the object of the present invention.
- the flame-retardant polyamide composition of the present invention has a flammability evaluation according to UL94 standards of V-0, and is reflow heat resistant after absorbing moisture for 96 hours at a temperature of 40 ° C and a relative humidity of 95%.
- the temperature is 250-280.
- C ⁇ preferably 255-280. More preferably C-260. C is more preferably 265 to 270 ° C.
- the fracture energy which is an indicator of mechanical properties, that is, toughness, is 50 to 70 mm: preferably 53 to 70 mJ.
- the flow length obtained by injection molding of the resin into the bar flow mold is 55 to 90 mm, preferably 60 to 80 mm, and more preferably 65 Excellent heat resistance required for surface mounting using lead-free solder, high toughness equivalent to 46 nylon, high melt flowability, flame resistance And a material having molding stability, which can be suitably used particularly for electric and electronic parts.
- the flame-retardant polyamide composition of the present invention can be molded into various molded articles by using known molding methods such as compression molding, injection molding, and extrusion molding.
- the flame-retardant polyamide composition of the present invention is excellent in molding stability, heat resistance, and mechanical properties, and can be used in fields requiring these characteristics or in precision molding fields. it can. Specific examples include electrical parts for automobiles, current breakers, connectors, electrical and electronic parts such as LED reflecting materials, and various molded bodies such as coil bobbins and housings. Example
- the temperature was maintained at 330 ° C for 5 minutes, then cooled to 23 ° C at a rate of 10 ° CZ, and then measured by raising the temperature at 10 ° CZ.
- the endothermic peak based on the melting at this time was defined as the melting point.
- the sum of the flaming combustion time after the completion of flame contact twice (total 10 times) for five test pieces is shorter. It was evaluated as having excellent flame retardancy.
- the standard for the total flame burning time is 50 seconds or less.
- Molding machine Sodick Plustec Co., Ltd., Pepper TR40S3A, molding machine cylinder temperature: melting point of each polyamide resin + 10 ° C, mold temperature: 120 ° C.
- test piece of length 64 mm, width 6 mm, and thickness 0.8 mm prepared by injection molding was conditioned for 96 hours at a temperature of 40 ° C and a relative humidity of 95%.
- Molding machine Sodick Plustech Co., Ltd., Pepper TR40S3A, molding machine cylinder temperature: melting point of each polyamide resin + 10 ° C, mold temperature: 100 ° C.
- a temperature profile reflow step shown in Fig. 1 was performed using a hair reflow soldering apparatus (AIS-20-82-C, manufactured by Atec Techtron Co., Ltd.).
- the test piece subjected to the above-described humidity control treatment was placed on a glass epoxy substrate having a thickness of 1 mm, and a temperature sensor was placed on the substrate to measure the profile.
- the predetermined temperature (a is 270. C, b is 265.
- C, c is 260. C, d is 255.
- C E is 235.C)
- the maximum value was defined as the reflow heat resistance temperature.
- the reflow heat-resistant temperature of the moisture-absorbed specimen tends to be inferior to that in the absolutely dry state.
- the reflow heat resistance temperature tends to decrease as the ratio of the amount of polyamide rosin Z flame retardant decreases.
- a test piece of length 64 mm, width 6 mm, and thickness 0.8 mm prepared by injection molding was allowed to stand for 24 hours in a nitrogen atmosphere at a temperature of 23 ° C.
- NTESCO AB5 a bending tester in an atmosphere with a temperature of 23 ° C and a relative humidity of 50%: NTESCO AB5, span 26mm, bending speed 5mmZ min.
- Molding machine Sodick Plustech Co., Ltd., Pepper TR40S3A, molding machine cylinder temperature: melting point of each polyamide resin + 10 ° C, mold temperature: 100 ° C.
- a bar flow mold having a width of 10 mm and a thickness of 0.5 mm was used for injection under the following conditions, and the flow length (mm) of the resin in the mold was measured.
- Injection set pressure 2000kgZcm 2
- cylinder set temperature melting point of each polyamide resin + 10
- the flame retardant polyamide composition was retained and held in a molding machine in units of 60 seconds under a cylinder temperature condition of 330 ° C., and then the mold of the bending test piece was injection molded. In the obtained molded product, the residence time when discoloration and black carbide were confirmed was recorded.
- Molding machine Sodick Plustech Co., Ltd., Pepper TR40S3A, molding machine cylinder temperature: 330 ° C, mold temperature: 100 ° C.
- Flame Retardant Polyamide Composition 1 Og is collected in a hydrazine aqueous solution by heating for 30 minutes at 330 ° C in a sealed quartz tube using a heat generating gas unit in an argon gas atmosphere. The amount of bromine gas generated by ion chromatography was measured.
- the polyamide resin (A), the flame retardant (B), the flame retardant aid (C), the reinforcing material (D) and the hydrated talcite compound (E) have the following components: used.
- composition dicarboxylic acid component unit (terephthalic acid: 62.5 mol 0/0, adipic acid: 37.5 mol 0/0), Jiamin component unit (1, hexane 6 Jiamino: 100 mole 0/0)
- composition dicarboxylic acid component unit (terephthalic acid: 62.5 mol 0/0, adipic acid: 37.5 mol 0/0), Jiamin component unit (1, hexane 6 Jiamino: 100 mole 0/0)
- composition dicarboxylic acid component unit (terephthalic acid: 55 mol 0/0, adipic acid: 45 mol 0/0), di Amin component unit (1, hexane 6 Jiamino: 100 mole 0/0)
- Composition dicarboxylic acid component unit (terephthalic acid: 100 moles 0/0), Jiamin component unit (1, 9 - Nonanjiamin: 82 mol 0/0, 2-methyl-1, 8-Okutanjiamin: 18 mol 0/0) Intrinsic viscosity [7?]: 1. Odl / g
- the average molecular weight and MFR of each flame retardant were measured under the following conditions.
- Measuring device Automatic extrusion plastometer
- Orifice inner diameter 2.095mm, load 1200g, temperature 270.
- Orifice inner diameter 2.095mm, load 2160g, temperature 220.
- Brominated polystyrene Albemarle, HP-3010-1 Bromine content: 68% by mass
- Mn Number average molecular weight (Mn): 3400, weight average molecular weight (Mw): 4000, Mw / Mn: l.2
- Brominated polystyrene Albemarle, HP-3010-2 Bromine content: 68% by mass
- Mn Number average molecular weight (Mn): 2800, weight average molecular weight (Mw): 3200, Mw / Mn: l.2
- Zinc borate Borax, FIREBREAK500 (2ZnO-3B O)
- maleated SEBS (trade name: Tuftec M1913, manufactured by Asahi Chemicals Co., Ltd.) is used to prevent drip in order to prevent the resin from liquefying and dripping due to heat melting during combustion.
- wax (Clariant Japan Co., Ltd., trade name: Hostermont CAV102) and talc (Matsumura Sangyo Co., Ltd., trade name: High Filler # 100 Hakudo 95), polyamide slag (A), flame retardant (B), flame retardant agent (C), reinforcement (D), Hyde port hydrotalcite compound (E), maleated SEBS, in total 100 mass 0/0 of wax and talc, maleated SEBS 1. 4 mass 0/0, wax 0.3 mass 0/0 was added Caro so that talc 0.7 weight 0/0.
- Example 9 13 Decreased heating temperature upon heating The above components were mixed at the quantitative ratios shown in Table 4 and the extruder with a twin screw vent set to a temperature of 320 ° C. And melt-kneaded to obtain a pellet-shaped composition. Table 4 shows the results of evaluating the properties of the obtained flame-retardant polyamide composition.
- Table 5 shows the results of evaluating the properties of the obtained flame-retardant polyamide composition.
- the flame-retardant polyamide composition of the present invention is excellent in mechanical properties such as toughness, heat resistance in the reflow soldering process, flame retardancy and fluidity, and has good thermal stability during molding.
- thin-walled molded products such as fine pitch connectors can be used for high melting It can be suitably used for electrical / electronic applications that use spot solder to create parts by surface mounting, or for applications in the precision molding field.
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Abstract
Description
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JP2015131887A (ja) * | 2014-01-10 | 2015-07-23 | 東レ株式会社 | 難燃性熱可塑性樹脂組成物 |
CN116396610A (zh) * | 2023-05-22 | 2023-07-07 | 江苏发安建设工程有限公司 | 一种阻燃电缆电线材料及其制备方法 |
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WO2008062755A1 (en) * | 2006-11-20 | 2008-05-29 | Mitsui Chemicals, Inc. | Flame-retardant polyamide composition |
KR101333579B1 (ko) * | 2010-12-15 | 2013-11-28 | 제일모직주식회사 | 반사성, 내열성 및 내습성이 우수한 폴리아마이드 수지 조성물. |
CN102219995B (zh) * | 2011-05-25 | 2013-01-23 | 上海梵和聚合材料有限公司 | 具有高灼热丝温度的阻燃增强共聚尼龙复合材料及其工艺 |
FR2976946B1 (fr) * | 2011-06-24 | 2014-01-24 | Arkema France | Composition comprenant un polyamide semi-aromatique et ses utilisations, notamment pour un reflecteur a diode electroluminescente |
EP2610313B1 (en) | 2011-12-29 | 2017-05-31 | Lotte Advanced Materials Co., Ltd. | Polyamide resin composition having improved physical properties including thin-wall moldability |
TWI457353B (zh) | 2012-05-08 | 2014-10-21 | Ind Tech Res Inst | 高分子、高分子混摻物、與阻燃材料 |
KR101566063B1 (ko) | 2012-12-31 | 2015-11-04 | 제일모직주식회사 | 표면광택도, 반사성, 내황변성 및 성형성이 우수한 열가소성 수지 조성물 |
US10301449B2 (en) | 2013-11-29 | 2019-05-28 | Lotte Advanced Materials Co., Ltd. | Thermoplastic resin composition having excellent light stability at high temperature |
KR101690829B1 (ko) | 2013-12-30 | 2016-12-28 | 롯데첨단소재(주) | 내충격성 및 내광성이 우수한 열가소성 수지 조성물 |
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KR101849830B1 (ko) | 2015-06-30 | 2018-04-18 | 롯데첨단소재(주) | 내충격성 및 광신뢰성이 우수한 폴리에스테르 수지 조성물 및 이를 이용한 성형품 |
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CN111849157A (zh) * | 2020-07-30 | 2020-10-30 | 宁波耀众模塑科技有限公司 | 一种聚氨酯发泡产品用阻燃性聚酰胺混合物 |
CN114196199B (zh) * | 2021-12-03 | 2024-03-19 | 江苏金发科技新材料有限公司 | 一种阻燃尼龙组合物及其制备方法和应用 |
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- 2006-03-09 JP JP2007516214A patent/JP5199663B2/ja active Active
- 2006-03-09 KR KR1020077029255A patent/KR100901043B1/ko active IP Right Grant
- 2006-03-09 WO PCT/JP2006/304654 patent/WO2006123469A1/ja active Application Filing
- 2006-03-09 CN CN2006800167732A patent/CN101175821B/zh active Active
- 2006-03-29 TW TW095110901A patent/TW200641048A/zh unknown
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CN116396610A (zh) * | 2023-05-22 | 2023-07-07 | 江苏发安建设工程有限公司 | 一种阻燃电缆电线材料及其制备方法 |
Also Published As
Publication number | Publication date |
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KR100901043B1 (ko) | 2009-06-04 |
TWI298736B (ja) | 2008-07-11 |
US7645825B2 (en) | 2010-01-12 |
US20090069479A1 (en) | 2009-03-12 |
CN101175821B (zh) | 2012-02-15 |
KR20080015009A (ko) | 2008-02-15 |
JP5199663B2 (ja) | 2013-05-15 |
TW200641048A (en) | 2006-12-01 |
JPWO2006123469A1 (ja) | 2008-12-25 |
CN101175821A (zh) | 2008-05-07 |
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