WO2006112215A1 - Materiau de base a lamelles - Google Patents

Materiau de base a lamelles Download PDF

Info

Publication number
WO2006112215A1
WO2006112215A1 PCT/JP2006/304881 JP2006304881W WO2006112215A1 WO 2006112215 A1 WO2006112215 A1 WO 2006112215A1 JP 2006304881 W JP2006304881 W JP 2006304881W WO 2006112215 A1 WO2006112215 A1 WO 2006112215A1
Authority
WO
WIPO (PCT)
Prior art keywords
electroless
plating
film
less
plating film
Prior art date
Application number
PCT/JP2006/304881
Other languages
English (en)
Japanese (ja)
Inventor
Akihiro Aiba
Kazumi Kawamura
Hirofumi Takahashi
Original Assignee
Nippon Mining & Metals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to JP2007521139A priority Critical patent/JP4926053B2/ja
Priority to CN200680009942XA priority patent/CN101151399B/zh
Publication of WO2006112215A1 publication Critical patent/WO2006112215A1/fr
Priority to HK08106771.4A priority patent/HK1116838A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating

Definitions

  • the present invention has an electroless nickel plating film on a substrate surface, a substitutional electroless palladium plating film as an intermediate layer, and an electroless gold plating film as an upper layer, and has corrosion resistance and solderability of a base metal.
  • the present invention relates to a base material with excellent heat resistance.
  • Electroless gold plating is applied to terminals and circuit surfaces of electronic industrial parts such as printed wiring board circuits, IC packages, ITO substrates, and IC cards. More specifically, electroless gold plating is applied to improve the corrosion resistance, solder bondability, and bondability of copper foil or copper plated wiring on a substrate!
  • Patent Document 1 In order to solve this problem in electroless gold plating, improvement in the corrosion resistance of the base metal and improvement in the solderability have been desired. Under such circumstances, it has been proposed to improve solderability by inserting electroless palladium plating between electroless nickel plating and electroless gold plating (Patent Document 1).
  • Patent Document 1 Japanese Patent Publication No. 8-28561
  • the palladium plating layer of the intermediate layer is set to 0.01 to 0.2 / ⁇ ⁇ (10 to 2 OOnm), and the palladium plating solution is a reduced type containing a reducing agent. (Self-catalytic type) is used.
  • the problem with the reduced palladium plating solution is that bath management is very complicated due to low bath stability, and bath decomposition is likely to occur.
  • the film thickness is large as described above, a large amount of palladium, which is a noble metal, is used, which causes a problem in terms of cost.
  • the present invention provides a substrate having an electroless gold plating film that is excellent in the corrosion resistance of the base metal or can improve the solderability even when the palladium plating thickness of the intermediate layer is very thin. It is intended.
  • the present inventors have found that when a substitutional electroless palladium plating layer is formed between an electroless nickel plating layer and an electroless gold plating layer provided on a substrate, The present inventors have found that even if the palladium plating layer is a thin film having a thickness of less than lOnm, it can be provided with sufficient base metal corrosion resistance and solderability, and the present invention has been achieved.
  • the present invention provides:
  • the coating amount of noradium which is a noble metal, which is expensive, can be greatly reduced. You can get results that are virtually indistinguishable from those used.
  • the base material used in the present invention is a circuit of a printed wiring board, an IC package, an ITO substrate, a terminal of an electronic industrial component such as an IC card, or a circuit surface, but there is no particular limitation. It can be applied to substrates that require sticking.
  • the electroless nickel plating solution for forming the electroless nickel plating film used in the present invention is not particularly limited, and is usually used to form a base nickel plating film during electroless gold plating. What is used can be used. It is preferable to use a plating solution that forms a Ni-P plating film. In this case, the phosphorus content in the electroless nickel plating film is 15% by weight or less, preferably 5 to: LO weight%.
  • electroless gold plating solution for forming the electroless gold plating film one that is used as a normal substitution type electroless gold plating solution is not particularly limited. However, a sulfite-based non-cyan type is preferred.
  • the electroless palladium film inserted between the base electroless nickel plating film and the electroless gold plating film used in the present invention is a substitutional electroless palladium plating. It is. When a film is formed by reducing electroless palladium plating, the film thickness needs to be about 50 nm or more in order to control the film thickness and ensure sufficient solderability. If a type electroless plating is used, it can be made very thin. In the present invention, the thickness of the substitutional electroless palladium plating film is also important. In the present invention, the thickness of the electroless palladium plating film is formed in the range of 0.2 nm or more and less than lOnm. Or it is formed by 12.
  • 160 gZcm 2 below the range 0. 2432 / z gZcm 2 or more by weight.
  • Advantage in cost due to the increased use doses of the noble metal palladium reaches the 160 GZcm 2 If 3 ⁇ 4 is small, the strength of solder joints There is also a problem of causing a decrease.
  • substitutional electroless palladium plating solution itself for forming the intermediate plating film a known plating solution can be used.
  • the thickness of the electroless nickel base coating is preferably 1 to 20 m, and the thickness of the electroless gold coating is preferably 10 to 500 nm.
  • Examples 1 to 5 and Comparative Examples 2 to 3 as shown below, the alkaline degreasing solution, the activator, and the electroless nickel plating solution were manufactured by Nikko Metal Plating, respectively.
  • Nikko Materials products were used as substitutional electroless palladium plating solutions and electroless gold plating solutions.
  • the printed wiring boards for evaluation 1) and 2) shown below were alkaline degreased for 2 min at 45 ° C and pH 12.0 using an alkaline degreasing solution (Nikko Plating, P-1000). Next, soft etching (sulfuric acid + sodium persulfate system, 25 ° C, 2 min)
  • Electroless nickel plating (Nikko Plating, KG-530 (88 ° C, pH 4.5, 25 min, P content 7%))
  • Resist opening 1 ⁇ Printed wiring board with LOmm pad
  • Comparative Example 1 was used without the substitution type electroless palladium plating, and reduced electroless palladium plating (Nippon Materials CA-400 (Pd: 0.8gZL) was used instead of the substitution type electroless palladium plating. 43 ° C, pH 7.5, 5 min)) was used as Comparative Example 4.
  • the substrate was immersed in 20 vol% nitric acid aqueous solution for lOmin, washed with water and dried. Thereafter, the gold-plated appearance of all the pads was observed with an optical microscope at 50 times.
  • the evaluation criteria were ⁇ when the discoloration was less than 1% in 500 pads, ⁇ when less than 1-10%, and X when more than 10%.
  • the substrate was heat-treated at 160 ° C. for 24 hours. After that, flux was applied to 10 pads with 3mm openings, and 0.6 ⁇ Sn— 4.
  • OAg— 0.5Cu solder balls were placed on the center of the pad and reflowed at a peak temperature of 250 ° C in a reflow oven. Solder wetting spread is 1.5 for ⁇ 1.5 ⁇ , ⁇ for less than 1.2 to 1.5mm, and X for less than 1.2mm.
  • the substrate was heat-treated at 160 ° CX for 24 hours, and then flux was applied to 20 pads of 0.48 mm ⁇ , and 0.6 ⁇ of Sn— 4.
  • OAg— 0 . 5 Cu solder balls were mounted and reflowed at a peak temperature of 250 ° C in a reflow oven.
  • Bond strength was measured by a heated pull method using a bond tester 4000 manufactured by Digi Corporation.
  • the palladium cost is a relative cost when the palladium metal price is set to 1 in the case where a reduced-type palladium plating solution is used and a 50 nm thick palladium plating film is formed (Comparative Example 4).

Abstract

L’invention concerne un matériau de base ayant un film de revêtement autocatalytique qui est excellent pour résister à la corrosion d’un matériau de base, peut améliorer le raccordement par le brasage, et est en outre avantageux par rapport à un film de revêtement conventionnel du point de vue du coût de production. Un matériau de base à lamelles qui a un matériau de base et un film multicouches formé dessus, caractérisé en ce que le film multicouches comprend un film de revêtement autocatalytique en nickel en tant que sous-couche, un type de substitution de film de revêtement autocatalytique en palladium ayant une épaisseur supérieure ou égale à 0,02 nm et inférieure ou égale à 10 nm ou un poids supérieur ou égal à 0,2432 µg/cm2 et inférieur ou égal à 12,160 µg/cm2 en tant que film intermédiaire, et un film de revêtement autocatalytique en or en tant que couche supérieure.
PCT/JP2006/304881 2005-04-01 2006-03-13 Materiau de base a lamelles WO2006112215A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007521139A JP4926053B2 (ja) 2005-04-01 2006-03-13 めっき基材
CN200680009942XA CN101151399B (zh) 2005-04-01 2006-03-13 镀覆基材
HK08106771.4A HK1116838A1 (en) 2005-04-01 2008-06-18 Plated base material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005105625 2005-04-01
JP2005-105625 2005-04-01

Publications (1)

Publication Number Publication Date
WO2006112215A1 true WO2006112215A1 (fr) 2006-10-26

Family

ID=37114947

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/304881 WO2006112215A1 (fr) 2005-04-01 2006-03-13 Materiau de base a lamelles

Country Status (6)

Country Link
JP (1) JP4926053B2 (fr)
KR (1) KR20070114391A (fr)
CN (2) CN101942652B (fr)
HK (1) HK1116838A1 (fr)
TW (1) TWI316095B (fr)
WO (1) WO2006112215A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007031740A (ja) * 2005-07-22 2007-02-08 Shinko Electric Ind Co Ltd 電子部品及びその製造方法
JP2008177261A (ja) * 2007-01-17 2008-07-31 Okuno Chem Ind Co Ltd 多層めっき皮膜及びプリント配線板
EP2309830A1 (fr) * 2009-09-02 2011-04-13 TDK Corporation Film de placage, carte de circuit imprimé et substrat de module
US8124174B2 (en) 2007-04-16 2012-02-28 C. Uyemura & Co., Ltd. Electroless gold plating method and electronic parts
JP2012505964A (ja) * 2008-10-17 2012-03-08 アトテック・ドイチュラント・ゲーエムベーハー 接合可能なウェハ表面のための応力が低減されたＮｉ−Ｐ／Ｐｄ積層
JPWO2011099597A1 (ja) * 2010-02-15 2013-06-17 株式会社Ｊｃｕ プリント配線板の製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102802364B (zh) * 2012-09-11 2014-11-05 深圳市和美精艺科技有限公司 一种在印刷电路板的导电层中设置金属钯层的方法及其层状结构
JP6466521B2 (ja) * 2017-06-28 2019-02-06 小島化学薬品株式会社 無電解めっきプロセス
US11114399B2 (en) * 2017-12-19 2021-09-07 Jx Nippon Mining & Metals Coproration Semiconductor wafer with void suppression and method for producing same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04307736A (ja) * 1991-04-04 1992-10-29 Canon Inc 微細多層構造半導体素子の配線方法
JPH07147478A (ja) * 1993-11-25 1995-06-06 Dainichi Kogyo Kk プリント配線板及びその製造方法
JPH07268640A (ja) * 1994-03-31 1995-10-17 Japan Energy Corp 無電解金めっき方法
JPH098438A (ja) * 1995-06-20 1997-01-10 Hitachi Chem Co Ltd ワイヤボンディング用端子とその製造方法並びにそのワイヤボンディング端子を用いた半導体搭載用基板の製造方法
JPH09172236A (ja) * 1995-12-20 1997-06-30 Seiichi Serizawa プリント配線板
JPH10287994A (ja) * 1997-04-14 1998-10-27 World Metal:Kk ボンディング部のメッキ構造
JP2001358164A (ja) * 2000-06-13 2001-12-26 Ne Chemcat Corp 無電解多層めっき皮膜が形成された電極及びその製造方法
JP2003226993A (ja) * 2002-02-01 2003-08-15 Electroplating Eng Of Japan Co 金メッキ液及び金メッキ処理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1143656C (zh) * 2001-01-10 2004-03-31 中国科学院上海原子核研究所 一种32p放射性血管支架及其制作方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04307736A (ja) * 1991-04-04 1992-10-29 Canon Inc 微細多層構造半導体素子の配線方法
JPH07147478A (ja) * 1993-11-25 1995-06-06 Dainichi Kogyo Kk プリント配線板及びその製造方法
JPH07268640A (ja) * 1994-03-31 1995-10-17 Japan Energy Corp 無電解金めっき方法
JPH098438A (ja) * 1995-06-20 1997-01-10 Hitachi Chem Co Ltd ワイヤボンディング用端子とその製造方法並びにそのワイヤボンディング端子を用いた半導体搭載用基板の製造方法
JPH09172236A (ja) * 1995-12-20 1997-06-30 Seiichi Serizawa プリント配線板
JPH10287994A (ja) * 1997-04-14 1998-10-27 World Metal:Kk ボンディング部のメッキ構造
JP2001358164A (ja) * 2000-06-13 2001-12-26 Ne Chemcat Corp 無電解多層めっき皮膜が形成された電極及びその製造方法
JP2003226993A (ja) * 2002-02-01 2003-08-15 Electroplating Eng Of Japan Co 金メッキ液及び金メッキ処理方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007031740A (ja) * 2005-07-22 2007-02-08 Shinko Electric Ind Co Ltd 電子部品及びその製造方法
JP2008177261A (ja) * 2007-01-17 2008-07-31 Okuno Chem Ind Co Ltd 多層めっき皮膜及びプリント配線板
US8124174B2 (en) 2007-04-16 2012-02-28 C. Uyemura & Co., Ltd. Electroless gold plating method and electronic parts
JP2012505964A (ja) * 2008-10-17 2012-03-08 アトテック・ドイチュラント・ゲーエムベーハー 接合可能なウェハ表面のための応力が低減されたＮｉ−Ｐ／Ｐｄ積層
EP2309830A1 (fr) * 2009-09-02 2011-04-13 TDK Corporation Film de placage, carte de circuit imprimé et substrat de module
US8183463B2 (en) 2009-09-02 2012-05-22 Tdk Corporation Plating film, printed wiring board, and module substrate
JPWO2011099597A1 (ja) * 2010-02-15 2013-06-17 株式会社Ｊｃｕ プリント配線板の製造方法

Also Published As

Publication number Publication date
TWI316095B (en) 2009-10-21
JP4926053B2 (ja) 2012-05-09
HK1116838A1 (en) 2009-01-02
TW200643215A (en) 2006-12-16
CN101942652B (zh) 2012-06-27
CN101942652A (zh) 2011-01-12
KR20070114391A (ko) 2007-12-03
JPWO2006112215A1 (ja) 2008-12-04
CN101151399A (zh) 2008-03-26
CN101151399B (zh) 2010-12-29

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