HK1116838A1 - Plated base material - Google Patents
Plated base materialInfo
- Publication number
- HK1116838A1 HK1116838A1 HK08106771.4A HK08106771A HK1116838A1 HK 1116838 A1 HK1116838 A1 HK 1116838A1 HK 08106771 A HK08106771 A HK 08106771A HK 1116838 A1 HK1116838 A1 HK 1116838A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- base material
- plated base
- plated
- base
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005105625 | 2005-04-01 | ||
PCT/JP2006/304881 WO2006112215A1 (ja) | 2005-04-01 | 2006-03-13 | めっき基材 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1116838A1 true HK1116838A1 (en) | 2009-01-02 |
Family
ID=37114947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK08106771.4A HK1116838A1 (en) | 2005-04-01 | 2008-06-18 | Plated base material |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4926053B2 (xx) |
KR (1) | KR20070114391A (xx) |
CN (2) | CN101942652B (xx) |
HK (1) | HK1116838A1 (xx) |
TW (1) | TWI316095B (xx) |
WO (1) | WO2006112215A1 (xx) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007031740A (ja) * | 2005-07-22 | 2007-02-08 | Shinko Electric Ind Co Ltd | 電子部品及びその製造方法 |
JP5288362B2 (ja) * | 2007-01-17 | 2013-09-11 | 奥野製薬工業株式会社 | 多層めっき皮膜及びプリント配線板 |
JP5013077B2 (ja) | 2007-04-16 | 2012-08-29 | 上村工業株式会社 | 無電解金めっき方法及び電子部品 |
EP2177646B1 (en) * | 2008-10-17 | 2011-03-23 | ATOTECH Deutschland GmbH | Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces |
JP5680342B2 (ja) | 2009-09-02 | 2015-03-04 | Tdk株式会社 | めっき膜、プリント配線板及びモジュール基板 |
JPWO2011099597A1 (ja) * | 2010-02-15 | 2013-06-17 | 株式会社Jcu | プリント配線板の製造方法 |
CN102802364B (zh) * | 2012-09-11 | 2014-11-05 | 深圳市和美精艺科技有限公司 | 一种在印刷电路板的导电层中设置金属钯层的方法及其层状结构 |
JP6466521B2 (ja) * | 2017-06-28 | 2019-02-06 | 小島化学薬品株式会社 | 無電解めっきプロセス |
US11114399B2 (en) * | 2017-12-19 | 2021-09-07 | Jx Nippon Mining & Metals Coproration | Semiconductor wafer with void suppression and method for producing same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04307736A (ja) * | 1991-04-04 | 1992-10-29 | Canon Inc | 微細多層構造半導体素子の配線方法 |
JPH081980B2 (ja) * | 1993-11-25 | 1996-01-10 | 大日工業株式会社 | プリント配線板及びその製造方法 |
JP2785102B2 (ja) * | 1994-03-31 | 1998-08-13 | 株式会社ジャパンエナジー | 無電解金めっき方法 |
JP3345529B2 (ja) * | 1995-06-20 | 2002-11-18 | 日立化成工業株式会社 | ワイヤボンディング用端子とその製造方法並びにそのワイヤボンディング端子を用いた半導体搭載用基板の製造方法 |
JPH09172236A (ja) * | 1995-12-20 | 1997-06-30 | Seiichi Serizawa | プリント配線板 |
JPH10287994A (ja) * | 1997-04-14 | 1998-10-27 | World Metal:Kk | ボンディング部のメッキ構造 |
JP2001358164A (ja) * | 2000-06-13 | 2001-12-26 | Ne Chemcat Corp | 無電解多層めっき皮膜が形成された電極及びその製造方法 |
CN1143656C (zh) * | 2001-01-10 | 2004-03-31 | 中国科学院上海原子核研究所 | 一种32p放射性血管支架及其制作方法 |
JP2003226993A (ja) * | 2002-02-01 | 2003-08-15 | Electroplating Eng Of Japan Co | 金メッキ液及び金メッキ処理方法 |
-
2006
- 2006-03-13 KR KR1020077023727A patent/KR20070114391A/ko not_active Application Discontinuation
- 2006-03-13 CN CN2010101334459A patent/CN101942652B/zh active Active
- 2006-03-13 CN CN200680009942XA patent/CN101151399B/zh active Active
- 2006-03-13 WO PCT/JP2006/304881 patent/WO2006112215A1/ja active Application Filing
- 2006-03-13 JP JP2007521139A patent/JP4926053B2/ja active Active
- 2006-03-31 TW TW095111454A patent/TWI316095B/zh active
-
2008
- 2008-06-18 HK HK08106771.4A patent/HK1116838A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
TWI316095B (en) | 2009-10-21 |
JP4926053B2 (ja) | 2012-05-09 |
TW200643215A (en) | 2006-12-16 |
CN101942652B (zh) | 2012-06-27 |
WO2006112215A1 (ja) | 2006-10-26 |
CN101942652A (zh) | 2011-01-12 |
KR20070114391A (ko) | 2007-12-03 |
JPWO2006112215A1 (ja) | 2008-12-04 |
CN101151399A (zh) | 2008-03-26 |
CN101151399B (zh) | 2010-12-29 |
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