WO2006080247A1 - 導電性ペースト - Google Patents
導電性ペースト Download PDFInfo
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- WO2006080247A1 WO2006080247A1 PCT/JP2006/300829 JP2006300829W WO2006080247A1 WO 2006080247 A1 WO2006080247 A1 WO 2006080247A1 JP 2006300829 W JP2006300829 W JP 2006300829W WO 2006080247 A1 WO2006080247 A1 WO 2006080247A1
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- mass
- conductive particles
- conductive paste
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Definitions
- the present invention relates to a conductive paste that is preferably used for filling via holes in printed circuit boards.
- conductive pastes used for filling via holes in printed circuit boards have been used that contain silver powder, copper powder, silver-coated copper powder, or the like as conductive particles.
- these conductive particles generally have a high melting point, they have a defect that the conductive connection reliability is poor in a thermal shock test and a moisture resistance test that are difficult to be fusion-bonded to each other by heat treatment.
- Patent Document 1 discloses a technique for improving the reliability of conductive connection by metallic bonding of alloy layers made of low melting point metal formed on the outer peripheral surface of particles.
- Patent Documents 2 to 5 are disclosed as conductive pastes in which the conductivity is stabilized by using alloy particles in which the alloy particles are melt-connected by heat treatment and the melting point changes. is there.
- the conductive particles disclosed in Patent Document 2 do not substantially contain Pb, exhibit an exothermic peak by differential scanning calorimetry, and are defined as endothermic peak temperatures by differential scanning calorimetry.
- the lowest melting point (initial minimum melting point) among these melting points is said to be due to melting of the surface portion of the particles.
- the surface portion is at least melted by heat treatment at a temperature equal to or higher than the initial minimum melting point. It is said that good connectivity is exhibited and the conductivity is stabilized.
- Patent Documents 6 to 7 the conductivity using specific conductive particles and epoxy resin is used. A paste is disclosed.
- Patent Document 1 Japanese Patent Laid-Open No. 2002-94242
- Patent Document 2 JP 2004-234900 A
- Patent Document 3 Japanese Patent Application Laid-Open No. 2004-223559
- Patent Document 4 Japanese Unexamined Patent Application Publication No. 2004-363052
- Patent Document 5 Japanese Unexamined Patent Publication No. 2005-5054
- Patent Document 6 Japanese Patent No. 3038210
- Patent Document 7 Japanese Patent No. 2603053
- the present invention has been made in view of the above circumstances, and an object thereof is to provide a conductive paste having good conductivity and excellent conductive connection reliability. Means for solving the problem
- the conductive paste of the present invention comprises a binder containing a thermosetting resin and conductive particles, and has the lowest exothermic peak temperature T (of the at least one exothermic peak by differential scanning calorimetry of the binder. ° c) and differential scanning calorimetry of the conductive particles.
- the lowest endothermic peak temperature t (° C) of at least one endothermic peak is the following formula (1
- the conductive particles have at least one exothermic peak by differential scanning calorimetry.
- the conductive particles include alloy particles (I) having at least one exothermic peak by differential scanning calorimetry and alloy particles (II) having an endothermic peak at the endothermic peak temperature t (° C). It is preferable to do.
- the conductive paste of the present invention is suitable for filling via holes in printed circuit boards.
- the conductive paste of the present invention comprises a binder containing a thermosetting resin and conductive particles, and has the lowest exothermic peak temperature T (° c) of at least one exothermic peak by differential scanning calorimetry of the binder. ) And a small amount by differential scanning calorimetry of the conductive particles.
- the lowest endothermic peak temperature t (° C) of at least one endothermic peak satisfies the following formula (1).
- the exothermic peak of the binder is caused by the curing of the thermosetting resin contained in the binder, and the exothermic peak temperature is an index of the curing temperature.
- the endothermic peak of the conductive particles is caused by melting of the conductive particles, and the endothermic peak temperature can be considered as the melting point.
- the lowest endothermic peak temperature t of the conductive particles is referred to as the lowest melting point.
- the exothermic peak of the binder and the endothermic peak of the conductive particles may be either one or two or more.
- the lowest exothermic peak temperature T (° C) of the exothermic peaks of the binder is the lowest melting point t of the conductive particles.
- T (° C) the lowest exothermic peak temperature of the exothermic peaks of the binder.
- the temperature is higher than the temperature lower than (° C) by 20 ° C, when this conductive paste is filled into a via hole of a printed circuit board and heat-treated, the conductive particles are dispersed while being well dispersed in the binder. It can be inferred that the hardening of the binder proceeds when at least some of the conductive particles are melted and fused together. Therefore, the conductivity of the conductive paste after curing is excellent and the conductive connection reliability is good.
- the conductive paste does not satisfy the relationship of the above formula (1), and the lowest exothermic peak temperature T (° C) of the exothermic peak of the binder is determined from the lowest melting point t (° C) of the conductive particles.
- T (° C) of the exothermic peak of the binder is determined from the lowest melting point t (° C) of the conductive particles.
- the lowest exothermic peak temperature T (° C) is preferably 300 ° C or lower, more preferably 250 ° C or lower, from the viewpoint of the thermal stability of the binder.
- the minimum melting point t (° C) of the conductive particles is preferably in the range of 40 to 250 ° C.
- the conductive particles can be fused and connected without affecting other electronic components, and higher conductivity and conductive connection reliability can be exhibited.
- the type of thermosetting resin contained in the binder is not limited.
- a resol type phenol resin or a novolac type phenol resin a resol type phenol resin or a novolac type phenol resin.
- epoxy resins are preferable.
- thermosetting resin may be included in the form of a monomer in the conductive paste.
- the binder include an amine epoxy curing agent, an acid anhydride epoxy curing agent, an isocyanate curing agent, and an imidazole curing agent, which may contain a curing agent. These thermosetting resins and curing agents may be used alone or in combination of two or more. Further, the binder may contain a thermoplastic resin as necessary.
- the average particle diameter of the conductive particles is not particularly limited, but the average composition
- the particle size is point power such as conductivity. More preferably, ⁇ 50xm is:! ⁇ 30xm.
- ⁇ 50xm is:! ⁇ 30xm.
- the average particle size is less than l ⁇ m, the specific surface area of the conductive particles increases, and the surface tends to be oxidized.
- the resulting conductive paste has a high viscosity, a large amount of diluent is required, and as a result, voids tend to be generated in the via hole.
- composition of the conductive particles an alloy composition that satisfies the following conditions (1) to (6), an alloy of Sn 63 mass% and 37 mass%, an alloy of 31142 mass% and 8158 mass%, 31191 Alloys of mass% and 2 1 19 mass%, 31189 mass% and ⁇ 1 18 mass% and 3 mass% alloy, 31193 mass%, Ag 3.5 mass%, BiO. 5 mass% and 1113 mass% alloy are suitable Can be exemplified.
- Cu and Sn as the first metal species at least two selected from the group consisting of Ag, Bi, In and Zn as the second metal species, and Sb as the third metal species Al, Ga, Au, Si, Ge, Co, W, Ta, Ti, Ni, Pt, Mg, Mn, Mo, Cr, and at least one selected from the group consisting of P.
- the Cu content is 10 to 90% by mass, and the Sn content is 5 to 80% by mass.
- the total content of the third metal species is 0.01 to 3% by mass.
- the mass composition ratio Cu / Sn of Cu and Sn is 0.5 or more.
- Mass composition ratio of Bi and In Bi / In is 1 or less, and the sum of the contents of Bi and In, In + Bi, is 50 mass% or less.
- the conductive particles may be composed of one kind of particles having the alloy composition as described above.
- particles having such an alloy composition silver particles, copper particles, nickel particles Also, mixed particles containing silver-plated copper particles, etc.
- conductive particles having at least one exothermic peak by differential scanning calorimetry.
- the conductive particles have an exothermic peak suggests that the conductive particles have a metastable phase. Since such a metastable phase is likely to undergo a phase change by heating, it is considered that when conductive particles having a metastable phase are heated, at least one melting point changes due to the phase change of the metastable phase. It is done. Therefore, when conductive particles containing a metastable phase whose melting point increases due to such a phase change is heated at a temperature equal to or higher than the lowest melting point, at least a portion showing the lowest melting point is melted in the first heat treatment. In the second and subsequent heat treatments, the melting point of the portion melted by the first heat treatment has risen, so that it does not remelt.
- the melting point of the heat-treating temperature is below the temperature of the conductive particles.
- the conductive particles are fused and connected to each other by melting the portion indicating.
- the heat treatment for such curing causes the conductive particles including the metastable phase to change phase and increase their melting point. Does not melt. Therefore, by using the conductive particles having an exothermic peak, it is possible to express excellent heat reliability that the conductivity is not lowered due to the thermal history.
- the change in melting point can be confirmed from the change in endothermic peak temperature by differential scanning calorimetry. Further, the rise in melting point at that time is preferably at least 2 ° C. Furthermore, the melting point value increased by the heat treatment is preferably 250 ° C. or higher.
- the conductive particles having at least one exothermic peak as described above may be composed of one kind of conductive particles, or may be mixed particles composed of two or more kinds of conductive particles.
- an alloy particle (I) having at least one exothermic peak by differential scanning calorimetry, that is, at least one metastable phase, and an endothermic peak at an endothermic peak temperature t (° C) are used.
- the alloy particles (I) The metastable phase and at least a part of the alloy particles (II) are combined to form a new phase. If the phase thus formed has a melting point higher than the endothermic peak temperature t (° c),
- the exothermic peak of the alloy particles (I) is preferably in the range of 50 to 400 ° C.
- the ratio of the alloy particles (I) to the alloy particles (II) in the mixed particles is not particularly limited, but when the alloy particles (I) are contained in an amount of 20% by mass or more, higher conductivity and higher Conductive connection reliability can be exhibited. Furthermore, when the alloy particle (I) is 40 to 90% by mass and the alloy particle (II) is 10 to 60% by mass, the conductive connection reliability is more excellent and suitable.
- the mixed particles may further contain silver particles, copper particles, nickel particles, silver-plated copper particles, and the like.
- alloy particles (I) and alloy particles (II) there are no particular restrictions on the method for producing alloy particles (I) and alloy particles (II), but in order to form a metastable phase or a stable alloy phase in the alloy particles, an inert gas atomizer, which is a rapid solidification method, is used. It is preferable to adopt the method. Further, in this method, it is preferable to use helium gas among the forces that normally use nitrogen gas, argon gas, helium gas, etc. as the inert gas.
- the cooling rate is preferably 500 ° C / second or more, more preferably 1000 ° C / second or more.
- the alloy particles (I) and the alloy particles (II) may be those in which the surface of the alloy particles is coated with a metal.
- a coating method it can be manufactured by a method such as a plating method, a sputtering method, a vapor method, a spray coating method, a dip method, etc., and a method of selectively thermally diffusing a specific metal.
- the plating method include an electroless plating method and an electrolytic plating method, and examples of the electroless plating method include a substitution plating method.
- a preferred composition of the alloy particles (I) is a composition comprising Cu, Sn, and at least one element selected from the group consisting of Ag, Bi, and In.
- a suitable composition of the alloy particles (II) is preferably a composition comprising In, Sn, and at least one element selected from the group consisting of Cu, Ag and Bi.
- the conductive particle force SI type having at least one exothermic peak, it has at least one exothermic peak by differential scanning calorimetry, a plurality of endothermic peaks, and among the endothermic peaks The lowest temperature endothermic peak is preferably conductive particles due to melting of at least part of the surface portion of the conductive particles.
- the lowest endothermic peak among the plurality of endothermic peaks of the conductive particles is due to melting of at least a part of the surface portion of the conductive particles.
- the conductive particles have a plurality of melting points. This means that at least a part of the surface part of the conductive particles has the lowest melting point t 1 (° C).
- the surface portion of such conductive particles is melted by heat treatment at a temperature equal to or higher than the minimum melting point t 1 (° c), so that they are firmly fused and connected to each other. Since the electrode metal part of the substrate is also fusion-bonded, higher conductivity and conductive connection reliability can be achieved. In addition, since such conductive particles have a high melting point phase that is difficult to melt, they do not melt excessively. Furthermore, heat treatment at a temperature above the minimum melting point t (° c) melts the low melting point phase on the surface and promotes atomic diffusion due to the presence of the metastable phase, increasing the melting point. As a result, both the conductivity and heat resistance reliability of the conductive particles are very excellent.
- the surface portion is the portion from the particle surface to 0.2r, where r is the radius of the conductive particles.
- the conductive particles resulting from the melting of the metal can be realized by a particle granulation process by a rapid solidification method in which an inert gas is used as a cooling medium and the metal melt is cooled at a rate of 500 ° C / second or more.
- a surface treatment process may be performed in which a specific metal is selectively thermally diffused by further surface treatment by a plating method, a sputtering method, a vapor method, a spray coating method, a dip method, or the like.
- a plating method examples include an electroless plating method and an electrolytic plating method, and examples of the electroless plating method include a substitution plating method.
- the conductive particles 0.1 more preferably it is preferred instrument oxygen content 0.:! ⁇ 3. 0 wt% 2 to 2.5 mass 0/0, more preferably from 0.3 to 2. 0 mass 0/0. Within such a range, the ion migration resistance, conductivity, and conductive connection signal of the conductive particles are within this range. Reliability and dispersibility in binder are improved.
- the conductive paste can be obtained by mixing the above-described binder and conductive particles with a planetary mixer or the like.
- a suitable ratio of the binder and the conductive particles is in the range of 3 to 16% by mass of the binder and 84 to 97% by mass of the conductive particles in these total amounts. When the ratio is such, the amount of the conductive particles and the binder becomes sufficient, and the conductive particles are well fused and the reliability is improved.
- oxide film removing agent it is preferable to add an oxide film removing agent to the conductive paste.
- oxide film removing agent By blending the oxide film removing agent, the surface oxide film of the conductive particles can be removed, and as a result, the fusion-bonding property can be improved.
- oxide film removal agents include carboxylic acids such as adipic acid and stearic acid, and block carboxylic acids and stears that block the activity of carboxylic acids using vinyl ethers. Block amines such as amines such as rillamine, and boron compounds that block the activity of amine can be used. Further, the blending amount of the oxide film removing agent is preferably 0.:!
- the method for adding the oxide film removing agent is not particularly limited.
- the conductive particles and the binder may be mixed and added directly when the paste is applied, or the conductive particles may be coated with an oxide film removing agent in advance. You may keep it.
- As a coating method an apparatus used for mixing powders or mixing and dispersing powders and liquids can be used as appropriate, and there is no limitation on the model. At that time, the oxide film removing agent may be directly brought into contact with the conductive particles.
- the oxide film removing agent is dissolved or dispersed in an appropriate liquid in advance, and the conductive particles are added to the slurry to treat it as a slurry. Also good. According to such a method, the conductive particles can be uniformly and reliably coated with the oxide film removing agent. Thereafter, a drying process using a vacuum dryer or the like may be performed as necessary.
- the conductive paste further contains other components such as a dispersant and an organic solvent as a diluent as necessary.
- a conductive paste can be used for various applications, it is particularly suitable for use in penetrating or non-penetrating via holes in multilayer printed circuit boards and mounting parts such as electronic components. And les.
- the conductive paste By printing and filling the conductive paste into the via hole, and then curing it by heat treatment, the conductive particles are fused and connected to each other in a highly dispersed state, and the electrode metal part of the substrate is also well connected.
- a multilayer printed board having excellent conductive connection reliability can be manufactured.
- a known apparatus such as a box-type hot air furnace, a continuous hot air furnace, a pine full-type heat furnace, a near-infrared furnace, a far-infrared furnace, or a vacuum heating press can be used, and the atmosphere may be an air atmosphere.
- an atmosphere with a low or low oxygen concentration that is, an inert gas atmosphere or a reducing atmosphere is desirable.
- a conductive paste was produced by mixing a binder, conductive particles, and an oxide film removing agent in a planetary mixer.
- the mass ratio of the binder to the conductive particles in each conductive paste was 1: 9.
- the mass part of the curing agent in the binder is a value relative to 100 parts by mass of the thermosetting resin
- the mass part of the oxide film removing agent (using stearic acid) is a value relative to 100 parts by mass of the conductive particles. .
- each of the obtained conductive pastes was filled in the through via hole of a pre-preda (Risho Kogyo Co., Ltd. Resho Prepreda ES-3305) in which a through via hole having a diameter of 0.2 mm was formed, and a copper foil was filled.
- a pre-preda Rho Kogyo Co., Ltd. Resho Prepreda ES-3305
- a press temperature of 220 ° C and a pressure of 50 kg / cm 2 ( 4.9 ⁇ 10 6 Pa) with a hot press to form a double-sided copper-clad plate
- a circuit was formed on this by etching to produce a printed circuit board.
- the via resistance value (shown as the initial resistance value in the table) The ) was measured, evaluation of the fusion-bonding property between the conductive particles and between the conductive particles and the copper foil, and a moisture reflow test were conducted.
- a via resistance value of 20 ⁇ or less is sufficiently practical.
- fusion splicing is evaluated by observing the cross section of the printed circuit board at a magnification of 1000 times with a JEOL's scanning electron microscope, and fusion splicing between conductive particles and between conductive particles and copper foil. The mark was marked with ⁇ for those that were visible, and X for those that were not visible.
- Moisture reflow test is 65 ° C, 95. Reflow was performed at a peak temperature of 260 ° C after being allowed to stand for 96 hours in an environment of 0 / RH, and the rate of change in via resistance before and after that was calculated based on the following formula and listed in the table.
- Moisture resistance reflow test rate of change (Q / o) (via resistance value after test one via resistance value before test) / via resistance value before test X 100
- the rate of change in moisture reflow test is 100% or less, it can be used sufficiently.
- Ep807 Japan Epoxy Resin Bisphenol F-type Epoxy Resin Epicoat 807 D—330: Nippon Kayaku Multivalent Atylate Monomer KAYARAD D—330 [Curing Agent]
- Conductive particles 2 Alloy particles (average particle size 20-30 / 1 111) made by Mitsui Mining & Smelting Co., Ltd. and consisting of 31163% by mass and 13 ⁇ 437% by mass.
- Conductive particles 3 Made by Mitsui Mining & Smelting Co., Ltd. Alloy particles consisting of 31142 mass% and 58 mass% (average particle size 5 ⁇ m)
- Conductive particles 4 Mitsui Metal Mining Co., Ltd. 31191 mass% and ⁇ mass. /. Alloy particles (average particle size 20-30 ⁇ m)
- Conductive particles 5 31189% by mass and 30% by mass produced by Mitsui Mining & Smelting Co., Ltd. /. And 813 mass% alloy particles (average particle size 20-30 ⁇ m)
- Conductive particles 6 Mitsui Mining & Smelting Co., Ltd. 3 1 Alloy particles consisting of 193 mass%, Ag3.5 mass%, BiO. 5 mass% and 1113 mass% (average particle size 20-30 ⁇ m)
- Conductive particles 7 Reduced copper powder from Mitsui Mining & Smelting Co., Ltd. (average particle size 5 11 m)
- conductive particles 1 are alloy particles (I a) and alloy particles produced by the following method. It is a mixed particle in which (II-a) is mixed at a mass ratio of 75:25.
- Cu particles 1 Okg (purity 99 mass% or more), Sn particles 4.8 kg (purity 99 mass% or more), Ag particles 3.2 kg (purity 99 mass% or more), Bi particles 0.5 kg (purity 99 mass% or more) ), 0.5 kg of In particles (purity 99% by mass or more) were placed in a graphite crucible, and the mixed particles were heated and melted to 1400 ° C. with a high-frequency induction heating device in a helium gas atmosphere of 99% by volume or more. Next, this molten metal is introduced from the crucible tip into the helium gas atmosphere spray tank, and then helium gas (purity 99 vol% or more, oxygen concentration less than 0.1 vol%) is provided from the gas nozzle provided near the crucible tip.
- helium gas purity 99 vol% or more, oxygen concentration less than 0.1 vol%
- the pressure was 2.5 MPa) and atomization was performed to obtain alloy particles.
- the cooling rate at this time was 2600 ° C / sec.
- the alloy particles thus obtained were spherical as a result of observation with a scanning electron microscope (manufactured by Hitachi, Ltd .: S-2700). Subsequently, the alloy particles were classified by an airflow classifier (Nisshin Engineering Co., Ltd .: TC-15N) to obtain alloy particles (Ia) having an average particle diameter of 10 ⁇ m.
- the alloy particles (Ia) were subjected to differential scanning calorimetry using a DSC6220 measuring machine manufactured by SII Nano Technology. The measurement was carried out in the range of 30 to 600 ° C under a nitrogen atmosphere at a heating rate of 10 ° C / min. As a result, an exothermic peak of 118.6 ° C was observed, confirming that the alloy particles (Ia) had a metastable alloy phase. In addition, endothermic peaks at 192.8 ° C, 360.5 ° C, and 415.3 ° C were observed, confirming that the alloy particles (Ia) have multiple melting points. In this scanning calorimetry, peaks with a calorific value of ⁇ 1.5 j / g or more were quantified as peaks derived from alloy particles (Ia), and peaks below that were excluded from the viewpoint of analysis accuracy.
- alloy particles Less than pressure 2.5M Atomization was performed by ejecting Pa) to obtain alloy particles.
- the cooling rate at this time was 2600 ° C / sec.
- the alloy particles thus obtained were spherical as a result of observation with a scanning electron microscope (manufactured by Hitachi, Ltd .: S-2700). Subsequently, the alloy particles were classified by an airflow classifier (manufactured by Nisshin Engineering Co., Ltd .: TC_15N) to obtain alloy particles (II-a) having an average particle diameter of 10 am.
- the alloy particles (II-a) were subjected to differential scanning calorimetry using a DSC6220 measuring machine manufactured by SII Nano Technology. The measurement was performed in the range of 30 to 600 ° C under a nitrogen atmosphere under the condition of a heating rate of 10 ° CZ. As a result, an endothermic peak at 129.6 ° C was observed, but there was no characteristic exothermic peak. In this calorimetric calorimetry, peaks having a calorific value of ⁇ 1.5 j / g or more were quantified as peaks derived from alloy particles (II_a), and peaks less than that were excluded from the viewpoint of analysis accuracy.
- the conductive particle 1 is a mixed particle of an alloy particle (I_a) having an exothermic peak by differential scanning calorimetry and an alloy particle (II_a) having an endothermic peak, and therefore when the printed circuit board is produced.
- the conductive particles 1 The minimum melting point is higher than 129.6 ° C in the printed circuit board, and it can be inferred that the moisture reflow test results are very good.
- a print substrate was prepared, measured and evaluated in the same manner as in Test Example 4 except that the mass ratio between the conductive particles 1 and the binder was changed. The results are shown in Table 4.
- this conductive paste having good conductivity and excellent conductive connection reliability, it can be used for through-holes or non-through-holes in multilayer printed boards and for mounting parts such as electronic parts. Can be used.
- the conductive paste By printing and filling the conductive paste into the via hole, and then curing by heat treatment, the conductive particles are fused and connected to each other in a highly dispersed state, and the electrode metal part of the substrate is also well connected.
- a multilayer printed circuit board with excellent conductive connection reliability can be manufactured.
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- Microelectronics & Electronic Packaging (AREA)
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- Spectroscopy & Molecular Physics (AREA)
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- Manufacturing Of Printed Wiring (AREA)
Abstract
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800026363A CN101107678B (zh) | 2005-01-25 | 2006-01-20 | 导电浆料 |
EP06712054A EP1850352A4 (en) | 2005-01-25 | 2006-01-20 | CONDUCTIVE PASTE |
US11/814,535 US20090020733A1 (en) | 2005-01-25 | 2006-01-20 | Conductive paste |
KR1020077016173A KR101086358B1 (ko) | 2005-01-25 | 2006-01-20 | 도전성 페이스트 |
JP2007500485A JPWO2006080247A1 (ja) | 2005-01-25 | 2006-01-20 | 導電性ペースト |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2005-016965 | 2005-01-25 | ||
JP2005016965 | 2005-01-25 |
Publications (1)
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WO2006080247A1 true WO2006080247A1 (ja) | 2006-08-03 |
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PCT/JP2006/300829 WO2006080247A1 (ja) | 2005-01-25 | 2006-01-20 | 導電性ペースト |
Country Status (7)
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US (1) | US20090020733A1 (ja) |
EP (1) | EP1850352A4 (ja) |
JP (1) | JPWO2006080247A1 (ja) |
KR (1) | KR101086358B1 (ja) |
CN (1) | CN101107678B (ja) |
TW (1) | TWI342570B (ja) |
WO (1) | WO2006080247A1 (ja) |
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JP2008231395A (ja) * | 2006-08-07 | 2008-10-02 | Toray Ind Inc | プリプレグおよび炭素繊維強化複合材料 |
US7686982B2 (en) | 2006-06-30 | 2010-03-30 | Asahi Kasei Emd Corporation | Conductive filler |
US8540903B2 (en) | 2007-11-28 | 2013-09-24 | Panasonic Corporation | Electrically conductive paste, and electrical and electronic device comprising the same |
KR20140056045A (ko) * | 2012-10-31 | 2014-05-09 | 주식회사 동진쎄미켐 | 인쇄전자용 구리 페이스트 조성물 |
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WO2017002762A1 (ja) * | 2015-06-27 | 2017-01-05 | 株式会社山本金属製作所 | リアルタイム状況検知用のセンサ付き回転加工工具 |
JPWO2020189697A1 (ja) * | 2019-03-19 | 2020-09-24 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2010280904A (ja) * | 2006-08-07 | 2010-12-16 | Toray Ind Inc | プリプレグおよび炭素繊維強化複合材料 |
JP2011219766A (ja) * | 2006-08-07 | 2011-11-04 | Toray Ind Inc | プリプレグおよび炭素繊維強化複合材料 |
JP2011231331A (ja) * | 2006-08-07 | 2011-11-17 | Toray Ind Inc | 炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料 |
JP2008098058A (ja) * | 2006-10-13 | 2008-04-24 | Fujikura Ltd | 導電性組成物およびこれを用いた導電体 |
US8540903B2 (en) | 2007-11-28 | 2013-09-24 | Panasonic Corporation | Electrically conductive paste, and electrical and electronic device comprising the same |
KR20140056045A (ko) * | 2012-10-31 | 2014-05-09 | 주식회사 동진쎄미켐 | 인쇄전자용 구리 페이스트 조성물 |
JP2016502752A (ja) * | 2012-10-31 | 2016-01-28 | ドンジン セミケム カンパニー リミテッド | プリンテッドエレクトロニクス用銅ペースト組成物 |
KR102109427B1 (ko) * | 2012-10-31 | 2020-05-28 | 주식회사 동진쎄미켐 | 인쇄전자용 구리 페이스트 조성물 |
JP2016048691A (ja) * | 2014-03-07 | 2016-04-07 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
WO2017002762A1 (ja) * | 2015-06-27 | 2017-01-05 | 株式会社山本金属製作所 | リアルタイム状況検知用のセンサ付き回転加工工具 |
JPWO2020189697A1 (ja) * | 2019-03-19 | 2020-09-24 | ||
WO2020189697A1 (ja) * | 2019-03-19 | 2020-09-24 | 積水化学工業株式会社 | 樹脂粒子、導電性粒子、導電材料及び接続構造体 |
JP7411553B2 (ja) | 2019-03-19 | 2024-01-11 | 積水化学工業株式会社 | 樹脂粒子、導電性粒子、導電材料及び接続構造体 |
US11884782B2 (en) | 2019-03-19 | 2024-01-30 | Sekisui Chemical Co., Ltd. | Resin particles, conductive particles, conductive material and connection structure |
Also Published As
Publication number | Publication date |
---|---|
US20090020733A1 (en) | 2009-01-22 |
EP1850352A1 (en) | 2007-10-31 |
CN101107678B (zh) | 2012-03-07 |
TWI342570B (en) | 2011-05-21 |
JPWO2006080247A1 (ja) | 2008-06-19 |
KR101086358B1 (ko) | 2011-11-23 |
TW200643984A (en) | 2006-12-16 |
EP1850352A4 (en) | 2012-11-28 |
CN101107678A (zh) | 2008-01-16 |
KR20070094625A (ko) | 2007-09-20 |
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