WO2006070947A1 - Composition de polyorganosiloxane sans solvant servant a former un film de revetement durci detachable - Google Patents

Composition de polyorganosiloxane sans solvant servant a former un film de revetement durci detachable Download PDF

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Publication number
WO2006070947A1
WO2006070947A1 PCT/JP2005/024287 JP2005024287W WO2006070947A1 WO 2006070947 A1 WO2006070947 A1 WO 2006070947A1 JP 2005024287 W JP2005024287 W JP 2005024287W WO 2006070947 A1 WO2006070947 A1 WO 2006070947A1
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Prior art keywords
group
viscosity
cured film
solvent
sheet
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PCT/JP2005/024287
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English (en)
Japanese (ja)
Inventor
Seiji Hori
Shuji Yamada
Takateru Yamada
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Dow Corning Toray Co., Ltd.
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Priority to JP2006550882A priority Critical patent/JP5101888B2/ja
Publication of WO2006070947A1 publication Critical patent/WO2006070947A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/006—Presence of polysiloxane in the substrate

Definitions

  • the present invention is easy to handle, can form a cured film on the surface of a substrate, and can impart good peelability to an adhesive substance and smooth slipping of a surface to be treated.
  • the present invention relates to a solvent-free peelable cured film-forming organopolysiloxane composition, and relates to a method for producing a sheet-like substrate having a peelable cured film obtained by curing the composition. Background art
  • a method of imparting peelability to adhesive substances by forming a cured film of an organopolysiloxane composition on the surface of various paper, laminate paper, synthetic film, metal foil, etc. Is well known.
  • an addition reaction between an organopolysiloxane having an unsaturated hydrocarbon group or an organohydrylene polysiloxane is carried out in the presence of a hydrosilylation reaction catalyst.
  • Reactive organopolysiloxane compositions see, for example, Japanese Patent Application Laid-Open No.
  • the conventional solvent-free peelable cured film-forming organopolysiloxane composition has a viscosity of organopolysiloxane as a main component of about 50 to 100 cs. It has low viscosity and does not contain high-viscosity organopolysiloxane.
  • the solventless composition using these low-viscosity organopolysiloxanes as the main agent when used as a mold release agent for craft tape, has a poorly slidable formed film, and the tape is damped. The sticking work was not performed smoothly, and the pressure-sensitive adhesive did not adhere completely and could peel off.
  • Japanese Patent Application Laid-Open No. Sho 6 1-1 5 9 4 8 0 discloses that the vinyl group content is 0.5 to 10.0 mol% or less for the purpose of improving the slipperiness of the cured film.
  • a method of adding an organopolysiloxane having a viscosity at 25 ° C of 50 to 100,000 cps has been proposed.
  • Japanese Patent Laid-Open No. Sho 6 1-266 500 2 discloses that the vinyl group content is 0.5 to 0.0% of all organic groups, and the viscosity at 25 ° C.
  • An organopolysiloxane having a molecular weight of 50 to 10 0, 0 00 cps and a substantially linear organopolysiloxane having a hydroxyl group at the end of the molecular chain and having a viscosity at 25 5 of 100 or more and OOO cps A solvent-free silicone composition for release paper having a viscosity at 25 ° C. of 50 to 10 and 0,000 cs has been proposed.
  • these compositions require the addition of a large amount of organopolysiloxane with a low content of bur groups, which increases the viscosity of the peelable cured film-forming organopolysiloxane composition and makes it difficult to handle. There was a problem. Furthermore, the slip was not satisfactory. [0005]
  • Patent Document 1 Japanese Patent Laid-Open No. 47-32072
  • Patent Document 2 Japanese Unexamined Patent Application Publication No. 2004-307691
  • Patent Document 3 Japanese Patent Application Laid-Open No. 6 1-1 5 948 0
  • Patent Document 4 Japanese Patent Application Laid-Open No. 61-2640 5 2 Disclosure of Invention
  • the present invention has been made to solve the above-mentioned problems, is easy to handle, and forms a cured solvent-free peelable cured film having excellent slipperiness of the formed cured film and excellent releasability from adhesive substances.
  • An organopolysiloxane composition is provided. Also provided are a sheet-like substrate having a peelable cured film obtained by curing the composition and a method for producing the same.
  • R 1 is a monovalent alkyl group each independently of the number of carbon atoms. 1 to 8, R 2 is R 1, from the group consisting of a monovalent alkenyl group or phenyl group having a carbon number of 2-8 The same or different groups selected, R 3 is a phenyl group, R 4 is a alkenyl group having 2 to 8 carbon atoms, and at least two of R ⁇ to 4 are alkenyl groups. 2 ⁇ x ⁇ 1 0, y is l ⁇ y ⁇ 1 0, z is 20 ⁇ z ⁇ 9 7, and x + y + Z is a number satisfying the viscosity range).
  • the viscosity at 25 ° C is 100, 00 OmPa ⁇ s or more, and 90% by mole or more of all organic groups bonded to the silicon atom is a non-reactive alkyl group or aryl.
  • Organopolysiloxane 0.5 to 15 parts by weight
  • Solvent-free peelable cured film-forming organopolysiloxane composition characterized by comprising: a sheet-like substrate having a peelable cured film obtained by curing the composition; and The present invention has been reached. [0 0 0 8] That is, the present invention provides:
  • R 1 is each independently a monovalent alkyl group having 1 to 8 carbon atoms
  • R 2 is selected from the group consisting of a monovalent alkeninole group or phenyl group having 2 to 8 carbon atoms.
  • R 3 is a phenyl group
  • R 4 is an alkenyl tomb having 2 to 8 carbon atoms
  • at least two of R 1 to R 4 are alkenyl groups
  • X is 2 ⁇ x ⁇ 1
  • y is l ⁇ y ⁇ 1
  • z is 2 0 ⁇ z ⁇ 9 7 and
  • x + y + z is a number satisfying the viscosity range
  • the viscosity at 25 ° C is 10 000, 00 OmPa ⁇ s or more, and 90% by mole or more of all organic groups bonded to the silicon atom is a non-reactive alkyl group or alkyl Organopolysiloxane which is a single group: 0.5 to 15 parts by weight
  • Viscosity at 25 ° C is 1-1,000 mPas, has at least 3 C atom-bonded hydrogen atoms in one molecule, and has aliphatic unsaturated bonds Shi Not organohydrogen polysiloxane: 0.5-30 parts by weight, and
  • a solvent-free peelable cured film-forming organopolysiloxane composition comprising:
  • the component (B) is the same or selected from the group consisting of a trimethylsiloxy group, a silanol group or a bull group at the molecular chain end whose viscosity at 25 ° C is 100,000 mPa ⁇ s or more
  • a solvent-free releasable cured film-forming organic poly which is easy to handle and has excellent slipperiness of the formed cured film and excellent releasability from adhesive substances.
  • a siloxane composition can be provided.
  • the sheet-like base material which has a peelable hardened film formed by hardening this composition and its manufacturing method can be provided.
  • Component (A) is the main component of the present invention, and imparts slipperiness to the cured film.
  • component (B) Since the compatibility with component (B) is low, the surface of the cured film formed by the addition reaction ( B) The component can be effectively raised. For this reason, excellent slipperiness can be imparted to the cured film only by adding a small amount of the component (B).
  • the component (A) has a viscosity of 20-30 OmPa's at 25 ° C., and has at least two carbon atom-bonded alkenyl groups and at least two key atom bonds in one molecule. It is an organopolysiloxane having a phenyl group.
  • the component (A) will be specifically described.
  • the component has a viscosity of 20 to 300 mPa ⁇ s at 25 ° C, and is represented by the following general formula: Organopolysiloxane with at least two carbon atom-bonded phenyl groups
  • each R 1 is independently a monovalent alkyl group having 1 to 8 carbon atoms, specifically, a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, a heptyl group, or an octyl group.
  • the group include a methyl group.
  • R 2 is scale 1, a monovalent are identical or different groups selected from the group consisting of Arukeyuru group or Fuweniru groups, in particular said R 1 and Biel group having a carbon number of 2-8, Ariru group And alkenyl groups such as a plutyl group, a pentyl group, a hexenyl group, a heptul group, and an octenyl group, or a phenyl group.
  • R 3 is a phenyl group
  • R 4 is an alkenyl group having 2 to 8 carbon atoms,! ⁇ 1 ⁇ ! ⁇ At least 2 of 4 are alkenyl groups.
  • X is 2 ⁇ x ⁇ l 0, and has at least two key atom-bonded phenyl groups in one molecule.
  • Y is 1 ⁇ y ⁇ 1 0, and at least one key atom bond Group.
  • z is 20 ⁇ z97, and x + y + z is a number satisfying the viscosity range.
  • the viscosity at 5 ° C is 20 to 300 mPa ⁇ s, more preferably 50 to 250 mPa ⁇ s.
  • the viscosity of the component (A) exceeds the above upper limit, the viscosity of the composition becomes too high, resulting in poor coatability.
  • the component (B) acts as an additive for producing slip in the composition of the present invention.
  • the component (B) is a diorganopolysiloxane having a viscosity at 25 ° C of 100, OO OmPa-s or more.
  • the organic group bonded to the silicon atom include a methyl group, an ethyl group, and a propyl group.
  • Alkyl groups such as butyl groups; alkenyl groups such as butyl groups, allyl groups, 5-hexenyl groups; aryl groups such as phenyl groups; 3,3,3-trifurenoleo propyl groups, nonafluoro hexyl groups, etc.
  • the properties of the components may be liquids of over 100 000 mPa ⁇ s or raw rubber. In the case of liquids, the viscosity is preferably over 1 000, OO OmPa's. ,.
  • component (B) when component (B) is in the form of raw rubber, its plasticity (plasticity measured with a plasticity meter according to the method specified in JISK 6 249: 4.2 g spherical sample at 25 ° C
  • the value when a 1 kgf concubine is applied for 3 minutes is preferably within the range of 0.5 to 10 Omm, and in particular within the range of 0.9 to 3.0 mm. preferable.
  • component (B) specifically, an identical group selected from the group consisting of an alkyl group, an anolekenyl group, an aryleno group, a haloalkyl group, or a silanol group, in which the molecular chain ends are bonded to a silicon atom.
  • an identical group selected from the group consisting of an alkyl group, an anolekenyl group, an aryleno group, a haloalkyl group, or a silanol group, in which the molecular chain ends are bonded to a silicon atom.
  • polydimethylsiloxane, dimethylsiloxane 'phenylmethylsiloxane copolymer, and dimethylsiloxane' diphenylsiloxane copolymer blocked with different groups are exemplified.
  • component (B) a linear or branched dimethylpolysiloxane whose molecular chain end is blocked with the same or different group selected from the group consisting of trimethylsiloxy group, silanol group or bur group.
  • Loxane is particularly preferred.
  • a mixture of polydimethylsiloxanes having different degrees of polymerization may be used.
  • the solvent-free peelable cured film-forming organopolysiloxane composition of the present invention contains (B) component in an amount of 0.5 to 15 with respect to 100 parts by weight of component (A). Including heavy parts. (B) If the content of the component is less than the lower limit, the surface of the cured film is insufficiently slipped. If the upper limit is exceeded, the viscosity of the organopolysiloxane composition becomes too high, which hinders actual work. . [00 1 5]
  • the component (C) has a viscosity of 1 to 1 at 25 ° C, OO OmP a 's, and has at least 3 hydrogen atoms bonded to one molecule.
  • the component (C) needs to have at least three silicon atom-bonded hydrogen atoms in one molecule, and the bonding position is not particularly limited. of the total polysiloxane composition from 0.1 to 2. is preferably 0 wt 0/0, 0.5 to 1.8 wt% der Rukoto is more preferable.
  • the amount of hydrogen atoms directly bonded to the silicon atom relative to the amount of alkenyl group contained in the component (A) should be in the range of 1.0 to 5.0 in terms of molar ratio. preferable. When the molar ratio is less than the lower limit, curability is lowered, and when the upper limit is exceeded, peeling resistance increases, and practical peelability cannot be obtained.
  • examples of the organic group bonded to the silicon atom contained in the component (C) include a methyl group, an ethyl group, a propyl group, a butyl group, and an octyl group alkyl group, which is a methyl group. It is preferable.
  • examples of the molecular structure include straight chain, branched chain, and branched ring. In the case of a straight chain or branched chain, examples of the molecular chain terminal group include a trimethylsiloxy group and a dimethylhydroxysiloxy group.
  • the component (C) is 5 to 500 mPa's. This is because when the viscosity at 25 ° C is less than 1 mPa ⁇ s, the component (C) tends to volatilize out of the organopolysiloxane composition, and when the viscosity exceeds 1,000 mPa ⁇ s, Long curing time for siloxane compositions It is to become.
  • Specific examples of such a component (C) include: both end trimethyl hydroxyl group-capped dimethylsiloxane / methylhydroxide siloxane copolymer, both end dimethylhydroxy group-capped dimethylsiloxane and methylhydridesiloxane copolymer.
  • Examples are polymers, methylhydroxide polysiloxanes blocked with trimethylsiloxy groups at both ends, cyclic methylhydrene polysiloxanes, cyclic methylhydrene disiloxanesiloxanes, and dimethylsiloxane copolymers.
  • the solvent-free peelable cured film-forming organopolysiloxane composition of the present invention contains 0 parts by weight of the (C) component relative to 100 parts by weight of the (A) component. It contains 5 to 30 parts by weight, preferably 1 to 20 parts by weight.
  • the content of the component (C) is less than the above lower limit, the curing of the organopolysiloxane composition becomes insufficient, and when the upper limit is exceeded, the peel resistance of the peelable cured film of the composition of the present invention increases. ⁇ ? This is because the peel resistance increases with time.
  • Component (D) is a hydrosilylation reaction catalyst, and is a component that crosslinks (i) and (C) by an addition reaction.
  • the component (D) is not particularly limited as long as it is a catalyst used in the hydrosilylation reaction.
  • chloroplatinic acid Specifically, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefins of chloroplatinic acid Complex, Chloride Complex of platinum acid and ketones, Complex of platinum and alkenylsiloxane, Platinum tetrachloride, Platinum fine powder, Alumina or Silica support on solid platinum, Platinum black, Platinum olefin complex Platinum-carbon catalysts, platinum-based catalysts of thermoplastic organic resin powders such as methyl methacrylate resin, polycarbonate resin, polystyrene resin, and silicone resin containing these platinum-based catalysts; Formula: [R h (0 2 C CH 3 ) 2 ] 2 , R h (0 2 C CH 3 ) 3 , R h 2 (C 8 H 15 0 2 ) 4 , Rh (C 5 H 7 0 2 ) 3 , R h (C 5 H 70 2) (CO) 2, R h (CO) [P h 3 P] (C 5 H 7 0 2), R h
  • a is 0 Is 1, b is 1 or 2, c is an integer from 1 to 4, d is 2, 3, or 4, and n is 0 or 1. );
  • An iridium catalyst represented by 2 in which Z is a chlorine atom, bromine atom, iodine atom, or alkoxy group, E is olefin, and Dien is cyclooctagen). Is done.
  • a chloroplatinic acid a platinum olefin complex, a complex of platinum and butylsiloxane, a complex of chloroplatinic acid and dibutyltetramethyldisiloxane, chloroplatinic acid and tetramethyltetrabutylcyclote
  • a platinum alkenylsiloxane complex such as a complex, a platinum dibutetetramethyldisiloxane complex, or a platinum tetramethyltetrabutylcyclotetrasiloxane complex is particularly preferred.
  • the amount of component (D) added may be a catalytic amount, and is usually the amount of metal contained in component (D) with respect to the total mass of the solvent-free peelable cured film-forming organopolysiloxane composition of the present invention. ⁇ 1,000 ppm, preferably in the range of 5 to 500 ppm. [001 9]
  • the peelable cured film-forming organopolysiloxane composition of the present invention suppresses gelation and curing at room temperature, improves storage stability, and is heat curable.
  • (E) a hydrosilylation reaction inhibitor is preferably contained.
  • hydrosilylation reaction inhibitor examples include acetylene compounds, phenyne compounds, organic nitrogen compounds, organophosphorus compounds, and oxime compounds. Specific examples include 3-methyl-1-pentyne-3-ol, 3,5-dimethyl. 1-Hexin 1 3-ol, 3-Methyl 1 1-Pentene 1 3-ol, Alkynyl alkanols such as fenenoreptynol, etc .; 3—Methinore 3—Pentene 1-in, 3, 5—Dimethylolate 1— Hexin-3-yne, benzotriazol; les, 1-etininole 1-cyclohexanol, meth / levinole cyclosiloxane.
  • the amount of addition reaction inhibitor is usually in the range of 0.001 to 5 parts by weight per 100 parts by weight of component (A), but the type and content of the hydrosilylation catalyst.
  • the amount of alkenyl groups in component (A) and the amount of bonded hydrogen atoms in component (C) may be appropriately selected.
  • the composition of the present invention comprises (A) component, (B) component, (C) component, (D) component and optionally (E) component.
  • an alkali group-containing organopolysiloxane resin may be further blended.
  • a thickener such as silica fine powder may be further blended.
  • known additives such as heat-resistant agents, dyes, and pigments may be further blended so long as the object and effect of the present invention are not impaired.
  • the composition of the present invention in terms of the coating of the sheet-like base material it is preferable that the viscosity of the entire composition at 25 ° C 5 0 ' ⁇ 2, is in the range of 000mP a ⁇ s.
  • the composition of the present invention can be produced by simply uniformly mixing the components (A) to (D), the component (E) and other optional components.
  • the order of addition of each component is not particularly limited, but if not used immediately after mixing, separate (A) component, (B) component and (C) component from (D) component. It is preferable to store them separately and mix them immediately before use.
  • the amount of the component (E) is adjusted so that it does not crosslink at room temperature and crosslinks and cures when heated. Also preferred are the compositions.
  • the peelable cured film-forming organopolysiloxane composition of the present invention as described above is applied to paper, corrugated paper, clay coated paper, polyolefin laminated paper, particularly polyethylene laminated paper, synthetic resin film.
  • the coating is applied uniformly on the surface of various sheet-like substrates such as fabrics, synthetic fibers, and metal foils, and heated under conditions sufficient for component (A) and component (C) to undergo hydrosilylation reaction and crosslinking
  • a cured film having excellent slipping property and appropriate peeling resistance against the adhesive substance is formed.
  • the cured film is characterized by excellent adhesion to a sheet-like substrate.
  • the curing temperature of the peelable cured film-forming organopolysiloxane composition of the present invention on a sheet-like substrate is generally 50 to 200 ° C, but the heat resistance of the sheet-like substrate is appropriate. If the temperature is good, it may be 200 ° C or higher.
  • the heating method is not particularly limited, and examples include heating in a hot air circulating oven, passing through a long heating furnace, and heat ray radiation using an infrared lamp or a halogen lamp. Further, curing may be performed by using both heating and ultraviolet irradiation.
  • the sheet-like substrate to which the peelable cured film-forming organopolysiloxane composition of the present invention is applied is preferably a polyolefin-laminated paper, more preferably a polyethylene-laminated paper.
  • Polyethylene laminated paper may have a polyethylene surface treated with corona discharge.
  • the coater for applying the peelable cured film-forming organopolysiloxane composition of the present invention to the surface of the sheet-like substrate is not particularly limited, and is a roll coater, a gravure coater, an air coater. Examples include one-piece, force-one ten-flow coater, and offset transfer port single-coater.
  • the adhesive material applied to the peelable sheet obtained by applying and curing the peelable cured film-forming organopolysiloxane composition of the present invention on the surface of the sheet-like substrate is various adhesives, various adhesives, etc. Acrylic resin adhesives, rubber adhesives, silicone adhesives; acrylic resin adhesives, synthetic rubber adhesives, silicone adhesives, epoxy resin adhesives, polyurethane adhesives .
  • examples include sticky foods such as wax and salmon, glue, and bird rice cake.
  • the composition of the present invention is useful for forming a cured film excellent in slipperiness on the surface and peelability to adhesive substances, and is particularly suitable for process paper, asphalt wrapping paper, various types of blasting. It is suitable as a film peelable cured film forming agent.
  • a sheet-like substrate having a peelable film obtained by curing the present invention composition can be suitably used particularly for process paper, adhesive substance wrapping paper, adhesive tape, adhesive label, and the like.
  • Solvent-free peelable cured film-forming organopolysiloxane composition was applied to the surface of polyethylene laminate paper using a printing suitability tester [manufactured by Meiji Seisakusho; R 1-2], 0.8 gZm in terms of siloxane. 2 and after the amount coated becomes (by 3 0 seconds heat treatment at 1 3 0 ° C in a hot air circulation oven to form a cured film.
  • ⁇ acrylic solvent type pressure-sensitive adhesive to the cured film surface [Toyo Ink Mfg. Co., Ltd., trade name: Orivine BPS-5 1 2 7] was applied evenly using an applicator so that the wet thickness would be 70 ⁇ , and dried by heating at a temperature of 70 ° C for 2 minutes.
  • the laminated paper was laminated to this, 2
  • a load of 0 g / cm 2 was applied, and the mixture was left for 24 hours under conditions of a temperature of 25 ° C and a humidity of 60%. After that, using a tensile tester, pull the laminated paper in the opposite direction under the conditions of an angle of 180 degrees, a peeling speed of 0.3 mZm in or a peeling speed of 10 O m / min, and the force required for peeling ( gf) was measured.
  • the sample width was 5 cm when the peel speed was 0.3 m / min and 2.5 cm when the peel speed was 100 mZrn in.
  • Two cured films were formed under the same conditions as in the above measurement of the peel resistance value. These hardened films are superposed so that the hardened film surfaces are in contact with each other, and pulled with a high-speed peel tester under the conditions of a load of 200 g and a tensile speed of 5 m / min. It was measured. Furthermore, the force required for pulling (g) / 200 (g) was calculated as the dynamic friction coefficient of the cured film.
  • (D) chloroplatinic acid '1,3-dibulol-1,1,3,3-tetramethyldisiloxane complex (platinum metal content 0.6% by weight) was added with a platinum metal content of 100 ppm.
  • a solvent-free peelable cured film-forming organopolysiloxane composition having a viscosity of 90 mPa ⁇ s was obtained.
  • the kinetic friction coefficient and peel resistance value of the obtained composition were measured, and the results are shown in Table 1.
  • Viscosity is 1, 0 0 0, OOO mPas and molecular chain end is trimethyl Dimethylsiloxane blocked with siloxy group 6.0 parts
  • (D) chloroplatinic acid-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (platinum metal content 0.6% by weight) has a platinum metal content of 100 ppm.
  • a solvent-free peelable cured film-forming organopolysiloxane composition having a viscosity of 12 OmPa ⁇ s was obtained by adding and blending in an amount. The resulting composition was measured for dynamic friction coefficient and peel resistance, and the results are shown in Table 1.
  • chloroplatinic acid 1,3-dibule 1,1,3,3-tetramethyldisiloxane complex platinum metal content 0.6% by weight
  • platinum metal content platinum metal content 0.6% by weight
  • An amount of pm was added and mixed to obtain a solvent-free peelable cured film-forming organopolysiloxane composition having a viscosity of 13 O mPa ⁇ s.
  • the dynamic friction coefficient and peel resistance value of the obtained composition were measured, and the results are shown in Table 1.
  • chloroplatinic acid 1,3-dibule-1,1,3,3-tetramethyldisiloxane complex platinum metal content 0.6% by weight
  • platinum metal content platinum metal content 0.6% by weight
  • An amount of pm was added and blended to obtain a solvent-free peelable cured film-forming organopolysiloxane composition having a viscosity of 9 OmPa ⁇ s.
  • the dynamic friction coefficient and peel resistance value of the obtained composition were measured, and the results are shown in Table 1.
  • Example 1 dimethylpolysiloxane raw rubber having a molecular chain end blocked with a bur group, 3.0 parts instead of 3.0 parts dimethylpolysiloxane having a viscosity of 1,00 mPa ⁇ s 3.0 parts
  • a solvent-free peelable cured film-forming organopolysiloxane composition having a viscosity of 7 O mPa ⁇ s was obtained.
  • the dynamic friction coefficient and peel resistance value of the obtained composition were measured, and the results are shown in Table 1.
  • Methyl phenyl polysiloxane containing 5 mol% diphenylsiloxane units (viscosity 3, OO OmP a s) 1. 8 parts, with molecular chain ends blocked with dimethylvinylsiloxy groups and trimethylsiloxy groups (C) viscosity 2 0 m P a ⁇ s both molecular chain terminals bets Rimechirushirokishi group blocking Mechiruhai de Logistics polysiloxane (Kei atom bound water atom content 1.6 wt 0/0) 2.0 parts, (E) 0.3 part of 1-ethyl-1-cyclohexanol was mixed uniformly.

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Abstract

L'invention concerne une composition de polyorganosiloxane sans solvant malléable laquelle permet de former un film de revêtement durci excellent en termes de propriétés de glissement et de capacité à se détacher d'une matière adhésive. L'invention concerne également une base ressemblant à une feuille ayant un tel film de revêtement durci et un procédé servant à produire une telle base ressemblant à une feuille. L'invention concerne précisément une composition de polyorganosiloxane sans solvant servant à former un film de revêtement durci détachable laquelle est caractérisée en ce qu'elle est composée d'un polyorganosiloxane (A) ayant une viscosité de 20-300 mPa s et contenant au moins deux groupes alcényle liés à des atomes de silicium et au moins deux groupes phényle liés à des atomes de silicium dans une molécule, un polyorganosiloxane (B) ayant une viscosité qui n'est pas inférieure à 100 000 mPa s, un polyorganohydrogénosiloxane (C) ayant une viscosité de 1-1 000 mPa s et contenant au moins trois atomes d'hydrogène liés à des atomes de silicium dans une molécule et un catalyseur d'hydrosilylation (D).
PCT/JP2005/024287 2004-12-28 2005-12-28 Composition de polyorganosiloxane sans solvant servant a former un film de revetement durci detachable WO2006070947A1 (fr)

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JP2007302775A (ja) * 2006-05-11 2007-11-22 Shin Etsu Chem Co Ltd 硬化性シリコ−ン離型剤組成物及びそれを用いた調理用シート
JP2008195939A (ja) * 2007-02-15 2008-08-28 Wacker Chemie Ag 低い摩擦係数を有する付加架橋可能なシリコーン材料
JP2010168425A (ja) * 2009-01-20 2010-08-05 Lintec Corp 基材レス両面粘着シート
WO2011002101A2 (fr) 2009-07-01 2011-01-06 Dow Corning Toray Co., Ltd. Composition d'organopolysiloxane durcissable et article en feuille comprenant une couche durcie obtenue à partir de celle-ci
JP2013500765A (ja) * 2009-09-02 2013-01-10 カーディアック ペースメイカーズ， インコーポレイテッド 溶剤を用いずに医療用電気リード本体にコーティングを形成する方法
JP2013170262A (ja) * 2012-02-23 2013-09-02 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーンエマルジョン剥離剤組成物及び剥離フィルム
EP2639273A2 (fr) 2012-03-13 2013-09-18 Shin-Etsu Chemical Co., Ltd. Composition de caoutchouc en silicone
WO2014058073A2 (fr) 2012-10-09 2014-04-17 Dow Corning Toray Co., Ltd. Composition d'organopolysiloxane durcissable, article en forme de feuille ayant une couche durcie formée à partir de ladite composition, et stratifié
CN104704071A (zh) * 2012-10-09 2015-06-10 道康宁东丽株式会社 剥离层合物及其制备方法
WO2019142894A1 (fr) * 2018-01-22 2019-07-25 信越化学工業株式会社 Composition d'agent de libération de silicone durcissable sans solvant et feuille de libération
WO2019146518A1 (fr) * 2018-01-25 2019-08-01 信越化学工業株式会社 Composition antiadhésive à base de silicone, exempte de solvant et procédé de production de feuille antiadhésive
JP2020100763A (ja) * 2018-12-25 2020-07-02 信越化学工業株式会社 シリコーン剥離剤組成物、剥離紙及び剥離フィルム
JP2020100764A (ja) * 2018-12-25 2020-07-02 信越化学工業株式会社 シリコーン剥離剤組成物、剥離紙及び剥離フィルム
CN115038757A (zh) * 2019-12-20 2022-09-09 陶氏东丽株式会社 固化性弹性体组合物及其固化物、具备固化物的膜、具备膜的层叠体及其制造方法、具有固化物的电子元器件或显示装置、固化性弹性体组合物的设计方法、以及换能器设备的设计方法

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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007302775A (ja) * 2006-05-11 2007-11-22 Shin Etsu Chem Co Ltd 硬化性シリコ−ン離型剤組成物及びそれを用いた調理用シート
JP2008195939A (ja) * 2007-02-15 2008-08-28 Wacker Chemie Ag 低い摩擦係数を有する付加架橋可能なシリコーン材料
JP2010168425A (ja) * 2009-01-20 2010-08-05 Lintec Corp 基材レス両面粘着シート
WO2011002101A2 (fr) 2009-07-01 2011-01-06 Dow Corning Toray Co., Ltd. Composition d'organopolysiloxane durcissable et article en feuille comprenant une couche durcie obtenue à partir de celle-ci
JP2013500765A (ja) * 2009-09-02 2013-01-10 カーディアック ペースメイカーズ， インコーポレイテッド 溶剤を用いずに医療用電気リード本体にコーティングを形成する方法
US8753708B2 (en) 2009-09-02 2014-06-17 Cardiac Pacemakers, Inc. Solventless method for forming a coating on a medical electrical lead body
JP2013170262A (ja) * 2012-02-23 2013-09-02 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーンエマルジョン剥離剤組成物及び剥離フィルム
EP2639273A2 (fr) 2012-03-13 2013-09-18 Shin-Etsu Chemical Co., Ltd. Composition de caoutchouc en silicone
WO2014058073A2 (fr) 2012-10-09 2014-04-17 Dow Corning Toray Co., Ltd. Composition d'organopolysiloxane durcissable, article en forme de feuille ayant une couche durcie formée à partir de ladite composition, et stratifié
CN104704071A (zh) * 2012-10-09 2015-06-10 道康宁东丽株式会社 剥离层合物及其制备方法
WO2019142894A1 (fr) * 2018-01-22 2019-07-25 信越化学工業株式会社 Composition d'agent de libération de silicone durcissable sans solvant et feuille de libération
JPWO2019142894A1 (ja) * 2018-01-22 2021-02-04 信越化学工業株式会社 無溶剤型硬化性シリコーン剥離剤組成物及び剥離シート
WO2019146518A1 (fr) * 2018-01-25 2019-08-01 信越化学工業株式会社 Composition antiadhésive à base de silicone, exempte de solvant et procédé de production de feuille antiadhésive
JPWO2019146518A1 (ja) * 2018-01-25 2021-02-12 信越化学工業株式会社 無溶剤型シリコーン剥離剤組成物、剥離シート及びその製造方法
JP7103375B2 (ja) 2018-01-25 2022-07-20 信越化学工業株式会社 無溶剤型シリコーン剥離剤組成物、剥離シート及びその製造方法
JP2020100763A (ja) * 2018-12-25 2020-07-02 信越化学工業株式会社 シリコーン剥離剤組成物、剥離紙及び剥離フィルム
WO2020137835A1 (fr) * 2018-12-25 2020-07-02 信越化学工業株式会社 Composition d'agent de décollement, feuille de décollement, et film de décollement
JP2020100764A (ja) * 2018-12-25 2020-07-02 信越化学工業株式会社 シリコーン剥離剤組成物、剥離紙及び剥離フィルム
JP6990167B2 (ja) 2018-12-25 2022-01-12 信越化学工業株式会社 シリコーン剥離剤組成物、剥離紙及び剥離フィルム
CN115038757A (zh) * 2019-12-20 2022-09-09 陶氏东丽株式会社 固化性弹性体组合物及其固化物、具备固化物的膜、具备膜的层叠体及其制造方法、具有固化物的电子元器件或显示装置、固化性弹性体组合物的设计方法、以及换能器设备的设计方法
CN115038757B (zh) * 2019-12-20 2024-04-05 陶氏东丽株式会社 固化性弹性体组合物及换能器设备的设计方法

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