WO2006064595A1 - 熱圧着ツール及び熱圧着装置 - Google Patents
熱圧着ツール及び熱圧着装置 Download PDFInfo
- Publication number
- WO2006064595A1 WO2006064595A1 PCT/JP2005/016791 JP2005016791W WO2006064595A1 WO 2006064595 A1 WO2006064595 A1 WO 2006064595A1 JP 2005016791 W JP2005016791 W JP 2005016791W WO 2006064595 A1 WO2006064595 A1 WO 2006064595A1
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- WIPO (PCT)
- Prior art keywords
- main body
- block
- tool
- heater block
- body block
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Definitions
- thermocompression bonding tool and thermocompression bonding apparatus
- the present invention uses a thermocompression bonding tool for pressurizing and heating a circuit board that has been polymerized via an anisotropic conductive member to an electronic component connected to a liquid crystal display panel, and the thermocompression bonding tool, for example.
- the present invention relates to a crimping apparatus.
- a liquid crystal driving IC is first mounted on a predetermined side of the four sides of the outer periphery of the liquid crystal display panel 200 by an outer lead bonder.
- An electronic component 202 such as a tab (TAB: Tape Automated Bonding) is mounted via a tape-like anisotropic conductive member 204 as shown in FIG. 7C to manufacture a liquid crystal display panel 200 with the electronic component.
- TAB Tape Automated Bonding
- the circuit board 203 is electrically connected to the electronic component 202 portion of the liquid crystal display panel 200 with electronic components, and the liquid crystal display panel 200 is assembled. ing.
- an anisotropic conductive member 204 is used for the circuit board 203 and the electronic component 202, as in the connection between the electronic component 202 and the liquid crystal display panel 200.
- thermocompression bonding apparatus in which the circuit board 203 is connected to the electronic component 202 previously connected to the liquid crystal display panel 200, is performed by a thermocompression bonding apparatus.
- the thermocompression bonding apparatus has a backup tool, and the back-up tool is placed in a state where the circuit board 203 and the electronic component 202 are overlapped with each other on the upper end surface.
- a thermocompression bonding tool is provided above the backup tool so as to be driven in the vertical direction.
- the backup tool and the thermocompression bonding tool are provided with a heater, and the thermocompression bonding tool is driven in the downward direction to pressurize the overlapping portion of the circuit board 203 and the electronic component 202. And heated to 150-200 ° C. As a result, the anisotropic conductive member 204 interposed between the circuit board 203 and the electronic component 202 is melted and cured, so that the circuit board 203 and the electronic component are pressure-bonded.
- the thermocompression bonding tool is separated into a main body block and a heater block having a heater and provided with a tool portion on the lower surface side, and the upper surface side of the main body block and the heater block includes a push bolt and a pulling bolt. It is connected by an adjusting mechanism.
- the adjustment mechanism is for partially pushing and pulling a plurality of longitudinal positions of the heater block with respect to the main body block by the push bolts and pull bolts, whereby the heater With the block heated to 300-400 ° C and thermally deformed, the flatness of the tool part provided on the lower surface of the heater block can be adjusted.
- the flatness of the tool part is not sufficient, when the superposed part of the circuit board 203 and the electronic component 202 is pressurized and heated by lowering the thermocompression bonding tool, the superposed part is uniformly pressed throughout. Since it cannot heat, there exists a possibility of causing the crimping
- the main body block and the heater block of the thermocompression bonding tool are made of the same metal material, for example, stainless steel (SUS630) having heat resistance and a relatively high thermal expansion coefficient (linear expansion coefficient). Formed!
- the heater block of the thermocompression bonding tool is heated to 300 to 400 ° C by the heater, the main body block is not heated by the heater, but only heated by heat conduction from the heater block. For this reason, the temperature rise of the main body block is lower than that of the heater block, for example, about 100 to 150 ° C.
- the main body block and the heater block are made of a metal material having the same thermal expansion coefficient.
- the heater block with a high temperature rise has a larger coefficient of thermal expansion (linear expansion coefficient) than the main body block, so that a large thermal stress is generated in the heater block when the temperature rises due to the difference between the two coefficients of thermal expansion.
- the strain generated in the heater block due to thermal stress also increases.
- thermocompression bonding tool it is possible to prevent the flatness of the tool portion from being lowered even when the temperature of the heater block rises by reducing the difference in coefficient of thermal expansion between the main body block and the heater block.
- the present invention is a thermocompression bonding nozzle that pressurizes and superimposes the superposed portions of two parts,
- thermocompression bonding tool is characterized by being formed of a material with a low coefficient of thermal expansion! /.
- the present invention is a thermocompression bonding tool for pressurizing and heating a superposed portion of two parts
- a tool part is provided on the lower surface side, and an upper surface side is provided with a heater block attached to the main body block via an adjustment mechanism that adjusts the flatness in the longitudinal direction of the tool part, and the heater block is compared with the main body block.
- the tool part is formed separately from the heater block by a metal material harder than the heater block, and is formed on the lower surface of the heater block.
- the thermocompression bonding tool is attached so as to be movable in the longitudinal direction relative to the thermal expansion of the thermocompression bonding tool.
- thermocompression bonding apparatus for heating and crimping
- thermocompression bonding tool The thermocompression bonding tool
- thermocompression bonding apparatus is characterized by being formed of a material having a low coefficient of thermal expansion.
- FIG. 1 is a schematic configuration diagram showing a thermocompression bonding apparatus according to an embodiment of the present invention.
- Figure 2 is a front view of the thermocompression bonding tool.
- FIG. 3 is an enlarged cross-sectional view showing a part of the connection structure between the main body block and the tool mounting member.
- FIG. 4 is an enlarged cross-sectional view showing a part of the connection structure between the main body block and the heater block.
- FIG. 5 is a side view of a heater block showing another embodiment of the present invention.
- Fig. 6 is an enlarged cross-sectional view showing the mounting structure of the tool part to the heater block.
- FIG. 7A is a plan view showing a state in which electronic components are connected to the liquid crystal panel.
- FIG. 7B is a plan view of a state in which the circuit board is connected to the electronic components connected to the liquid crystal panel.
- FIG. 7C is a side view of the circuit board connected to the electronic components connected to the liquid crystal panel.
- FIGS. 1 to 5 An embodiment of the present invention will be described with reference to FIGS. 1 to 5.
- FIG. 1 is a schematic configuration diagram of a thermocompression bonding apparatus according to the present invention, and this thermocompression bonding apparatus has a flat backup tool 2 erected on a base 1.
- a thermocompression bonding tool 3 is provided above the backup tool 2 so as to move up and down along the linear guide 4.
- the thermocompression bonding tool 3 can be driven in the vertical direction along the linear guide 4 as described later by a Z drive source 5 indicated by a chain line in FIG.
- An electric heater (not shown) is provided on the upper part of the backup tool 2, and the backup tool 2 is heated to about 50 to 100 ° C.
- the thermocompression bonding tool 3 has a prismatic main body block 6.
- the body block 6 is made of a heat-resistant metal material such as stainless steel SUS630 (JIS standard).
- a tool attachment member 7 is provided on the upper surface of the main body block 6.
- the tool mounting member 7 has an inverted L-shaped side surface, and mounting portions 8 are provided at the three longitudinal ends of the horizontal side and at the center.
- the connecting portion 9 is provided in the above.
- a through hole 28 penetrating in the longitudinal direction is formed below the center of the main body block 6 in the height direction. Cooling gas is supplied from one end opening of the through hole 28 by an air supply tube (not shown), and the opening force at the other end flows out.
- the main body block 6 is cooled, and the degree of cooling is higher on the lower side in the height direction than on the upper side, so that the lower side of the main body block 6 in the height direction as described later. Even if there is, the lower surface side and the upper surface side can be maintained at substantially the same temperature. That is, it is possible to prevent the main body block 6 from being distorted or warped due to a temperature difference between the lower surface side and the upper surface side.
- a tongue piece 11 is provided in an L shape at the lower end of each attachment portion 8, and the tongue piece 11 is elongated along the longitudinal direction of the main body block 6 and has a long hole 12. Formed. Then, the tongue piece 11 attaches a sheet-like heat insulating material 11 a to the upper surface of the main body block 6 by a screw 13 screwed into a screw hole 10 formed to open from the elongated hole 12 to the upper surface of the main body block 6. Are connected through.
- the tool attachment member 7 is attached to the main body block 6 through the long hole 12 of the tongue piece 11 provided in the attachment portion 8, the tool attachment member 7 and the main body block 6 are thermally expanded. Even if there is a difference in rate, the screw 13 and the long hole 12 move relatively. For this reason, even if the tool mounting member 7 and the main body block 6 expand due to different thermal expansion coefficients, stress is generated between them, and distortion due to the stress can be prevented.
- a pair of receiving members 14 spaced apart in the horizontal direction are provided along the vertical direction on the outer surface of the other vertical side of the tool mounting member 7. .
- the receiving member 14 is movably engaged with the linear guide 4 provided on a guide portion 16 suspended from the apparatus main body 15.
- the connecting portion 9 provided on the upper surface of the tool attachment member 7 is connected to the drive shaft 5a of the Z drive source 5 such as a cylinder provided with the axis line vertical. Therefore, the thermocompression bonding tool 3 can be driven in the vertical direction, which is the Z direction, by the Z drive source 5.
- a heater block 22 is provided on the lower surface side of the main body block 6 by an adjusting mechanism 21.
- the heater block 22 is formed of a metal material such as a low thermal expansion alloy, such as an Invar alloy or a Kovar alloy, which is a material having a low thermal expansion coefficient compared to the main body block 6. In this embodiment, it is made of Kovar alloy.
- the metal material forming the heater block 22 may be a material other than a low thermal expansion alloy, such as a low thermal expansion super heat resistant alloy (product surface: HRA929) or carbon.
- the former thermal expansion coefficient is 5 is a X 10 _6 Z ° C, the latter thermal expansion coefficient Ru 1 X 10 _6 Z ° C der.
- the adjusting mechanism 21 is configured by a plurality of push bolts 23 and pull bolts 24 that are alternately provided at predetermined intervals in the longitudinal direction of the main body block 6 and the heater block 22.
- the push bolt 23 is screwed into a screw hole 25 formed penetrating in the thickness direction of the main body block 6 and the lower end surface from which the lower surface force of the main body block 6 is also projected. Is brought into contact with the upper surface of the heater block 22.
- the pulling bolt 24 is inserted into a through hole 26 that penetrates in the thickness direction of the main body block 6 and is long along the longitudinal direction of the main body block 6, and protrudes from the through hole 26.
- the leading end is screwed into a screw hole 27 formed in the upper surface of the heater block 22.
- the push bolt 23 is rotated in the screwing direction, the portion corresponding to the push bolt 23 of the heater block 22 can be pressed, and if the pull bolt 24 is rotated in the returning direction, the heater is pressed.
- the part corresponding to the pulling bolt 24 of block 22 can be pulled. The That is, by rotating the push bolt 23 and the pull bolt 24, the portions corresponding to the bolts 23 and 24 of the heater block 22 can be pushed and pulled.
- the push bolt 23 is screwed into the screw hole 25 of the main body block 6, but the tip is in contact with the upper surface of the heater block 22, and the bow I bolt 24 has the tip at the screw hole of the heater block 22.
- the force screwed onto 27 The main body block 6 is passed through a long through hole 26 along this longitudinal direction.
- a tool portion 29 having a T-shaped cross section is integrally formed on the lower surface of the heater block 22 over the entire length in the longitudinal direction.
- the heater block 22 is provided with a plurality of electric heaters 31 penetrating in the width direction at predetermined intervals in the longitudinal direction.
- the heater block 22 is heated to 300-400 ° C by the electric heater 31!
- heat pipes 32 are provided on both side surfaces of the heater block 22 along the longitudinal direction.
- the heat pipe 32 uniformly transmits the heat in the longitudinal direction of the heater block 22.
- the heater block 22 heated by the electric heater 31 has a substantially uniform temperature distribution in the longitudinal direction.
- thermocompression bonding apparatus using the thermocompression bonding tool 3 configured as described above, the circuit board 203 and the electronic component 202 shown in FIGS. 7A to 7C are superposed on the knock-up tool 2 and supplied. After positioning, operate the Z drive source 5 to lower the thermocompression bonding tool 3. As a result, the overlapped portion of the circuit board 203 and the electronic component 202 is pressurized and heated by the backup tool 2 and the tool portion 29 of the thermal compression tool 3.
- the anisotropic conductive member 204 interposed in the superposed portion melts and hardens.
- the part 202 can be fixed.
- thermocompression bonding tool 3 is heated by an electric heater 31 provided in the heater block 22 to 300. Heat to ⁇ 400 ° C.
- the main body block 6 connected to the heater block 22 via the adjusting mechanism 21 only transfers the heat of the heater block 22 by the push bolt 23 and the pull bolt 24. The temperature does not rise.
- a temperature difference of 250 to 300 ° C occurs between the heater block 22 and the main body block 6. Therefore, a difference in thermal expansion coefficient occurs due to the temperature difference, and distortion occurs in the heater block 22 due to the difference. If the heater block 22 is distorted, the tool portion 29 provided on the lower surface of the heater block 22 is also distorted, and the flatness of the lower surface of the tool portion 29 is reduced by the distortion.
- the heater block 22 is made of a material having a lower thermal expansion coefficient than the main body block 6.
- the main body block 6 was formed of SUS630
- the heater block 22 was formed of a Kovar alloy that is a low thermal expansion alloy.
- Kovar alloy has a coefficient of thermal expansion approximately one third that of SUS630.
- the heater block 22 rises in temperature to 300 to 400 ° C, while the temperature rise in the main body block 6 is about one third, 100 to 150 ° C. Even if a temperature difference of ⁇ 300 ° C. occurs, the coefficient of thermal expansion of the heater block 22 and the main body block 6 can be made substantially the same.
- the thermal expansion coefficients of the heater block 22 and the main body block 6 are substantially the same, even if they are connected by the push bolt 23 and the pulling bolt 24 of the adjusting mechanism 21, the heater block 22 and the main body block 6 are connected. Therefore, the tool portion 29 provided on the lower surface of the heater block 22 is hardly distorted.
- the heater block 22 is hardly distorted.
- the push bolt 23 presses the tip against the upper surface of the heater block 22, and the pulling bolt 24 extends in the longitudinal direction of the main body block 6. It is inserted through a through hole 26 that is formed along the long side.
- the adjustment mechanism 21 connects the main body block 6 and the heater block 22, they can be moved relatively, and this also causes thermal distortion to the main body block 6 and the heater block 22. Difficult to occur.
- the through hole 28 penetrating in the longitudinal direction is formed below the center in the height direction of the main body block 6 and the cooling gas is allowed to flow through the through hole 28, the heat from the heater block 22 is It is possible to cool the lower surface side of the main body block 6 that is easily transmitted. Therefore, since the temperature difference between the upper surface side and the lower surface side of the heater block 22 can be reduced, it is possible to prevent thermal distortion and warpage from occurring in the main body block 6 due to this.
- the force for forcibly flowing the cooling gas through the through hole 28 is not limited to the forced flow of the cooling gas.
- the temperature rise on the lower surface side of the main body block 6 can be made lower than that on the upper surface side by the outside air circulating in the
- the heater block 22 is heated by a plurality of electric heaters 31 provided at predetermined intervals in the longitudinal direction. For this reason, there is a possibility that the portion of the heater block 22 between the electric heaters 31 or both ends in the longitudinal direction will vary in temperature from other portions, and distortion may occur due to the variation.
- the heater block 22 is provided with a heat pipe 32 along the longitudinal direction so that the temperature in the longitudinal direction of the heater block 22 is made uniform. Therefore, even if the heater block 22 is heated by a plurality of electric heaters 31, if a temperature difference occurs in the longitudinal direction and distortion occurs due to the temperature difference!
- a tool attachment member 7 is provided on the upper surface of the main body block 6. For this reason, a temperature difference also occurs between the body block 6 and the tool mounting member 7, and the temperature difference Therefore, there is a case where the main body block 6 is distorted and the heater block 22 is distorted due to the distortion.
- the tool attachment member 7 forms a long hole 12 in the tongue piece 11 provided at the lower end of the attachment portion 8, and the main body block 6 is screwed through the long hole 12 by the screw 13. They are connected. That is, the tongue 11 of the mounting portion 8 is connected to the main body block 6 by the screw 13 so as to be relatively movable.
- the tool portion 29 is integrally formed on the lower surface of the heater block 22.
- the heater block 22 is made of Kovar alloy, which is a low thermal expansion alloy having a lower thermal expansion coefficient than the main body block 6.
- the hardness of the tool part 29 formed integrally with the heater block 22 by Kovar alloy may be lower than that of the SUS630 forming the main body block 6. For this reason, the tool part 29 may be damaged early.
- the lower end surface of the heater block 22 is a flat surface, which is harder than the heater block 22 and made of a metal material, for example, the same metal material as the main body block 6.
- a tool part 29A having a T-shaped cross section with SUS630 is provided.
- both side portions of the tool portion 29A provided on the lower surface of the heater block 22 are held by the L-shaped pressing member 34, and the screw 36 is passed through the through hole 35 formed in the pressing member 34.
- the screw 36 is screwed into a screw hole 37 formed in the lower surface of the heater block 22.
- the tool portion 29A whose both sides are held by the pressing member 34, is detachable from the heater block 22 and is movable relative to the longitudinal direction. Therefore, even if the temperature of the tool section 29A and the heater block 22 rises and they expand with different thermal expansion coefficients, the tool section 29A is on the lower surface of the heater block 22 with respect to the longitudinal direction of the heater block 22. It expands while moving relatively.
- the thermal expansion coefficients of the heater block 22 and the tool portion 29A are increased when the temperature rises. Due to the difference, distortion can be prevented.
- the heat block 32 is provided on the side surface of the heater block 22 over the entire length in the longitudinal direction, and other parts other than the tool part 29A may have the same configuration as in the above-described one embodiment. Absent.
- the main body block is formed of stainless steel.
- the main body block may be formed of other materials such as ferrous metals other than stainless steel!
- the present invention is not limited to the main bonding of the outer lead bonder, and the anisotropic conductive adhesive film (
- the difference in coefficient of thermal expansion between the heater block and the main body block is reduced. For this reason, when the temperature of the heater block rises, it is possible to prevent a large distortion from being generated in the heater block, so that it is possible to prevent the flatness of the tool portion provided in the heater block from being impaired.
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004364746A JP4323419B2 (ja) | 2004-12-16 | 2004-12-16 | 熱圧着ツール及び熱圧着装置 |
JP2004-364746 | 2004-12-16 |
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WO2006064595A1 true WO2006064595A1 (ja) | 2006-06-22 |
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PCT/JP2005/016791 WO2006064595A1 (ja) | 2004-12-16 | 2005-09-13 | 熱圧着ツール及び熱圧着装置 |
Country Status (4)
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JP (1) | JP4323419B2 (ja) |
KR (1) | KR100897891B1 (ja) |
CN (1) | CN100461359C (ja) |
WO (1) | WO2006064595A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4957482B2 (ja) * | 2007-09-21 | 2012-06-20 | パナソニック株式会社 | 熱圧着装置 |
CN102389973B (zh) * | 2011-10-17 | 2013-11-27 | 中南大学 | 一种应用热膨胀差量的热压加工方法 |
JP7105482B2 (ja) * | 2018-04-03 | 2022-07-25 | 株式会社ブイ・テクノロジー | 石定盤の温度調整装置およびそれを備えた検査装置 |
KR102076786B1 (ko) * | 2019-05-30 | 2020-02-12 | 배병찬 | 이차전지용 실링장치 |
KR20220027743A (ko) * | 2020-08-27 | 2022-03-08 | 김덕군 | 균일한 실링이 가능한 히팅장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1041355A (ja) * | 1996-07-24 | 1998-02-13 | Toray Eng Co Ltd | 熱圧着ツール |
JPH1174319A (ja) * | 1997-08-29 | 1999-03-16 | Nec Corp | 熱圧着装置及びその制御方法 |
JPH11354920A (ja) * | 1998-06-09 | 1999-12-24 | Nippon Avionics Co Ltd | 熱圧着装置 |
JP2001274200A (ja) * | 2000-03-23 | 2001-10-05 | Toshiba Corp | 平面表示装置の製造のためのテープキャリアパッケージの熱圧着装置 |
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JP3885949B2 (ja) * | 2002-07-26 | 2007-02-28 | 芝浦メカトロニクス株式会社 | 熱圧着装置 |
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2004
- 2004-12-16 JP JP2004364746A patent/JP4323419B2/ja active Active
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2005
- 2005-09-13 KR KR1020077009278A patent/KR100897891B1/ko active IP Right Grant
- 2005-09-13 CN CNB2005800424633A patent/CN100461359C/zh active Active
- 2005-09-13 WO PCT/JP2005/016791 patent/WO2006064595A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1041355A (ja) * | 1996-07-24 | 1998-02-13 | Toray Eng Co Ltd | 熱圧着ツール |
JPH1174319A (ja) * | 1997-08-29 | 1999-03-16 | Nec Corp | 熱圧着装置及びその制御方法 |
JPH11354920A (ja) * | 1998-06-09 | 1999-12-24 | Nippon Avionics Co Ltd | 熱圧着装置 |
JP2001274200A (ja) * | 2000-03-23 | 2001-10-05 | Toshiba Corp | 平面表示装置の製造のためのテープキャリアパッケージの熱圧着装置 |
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JP2006173397A (ja) | 2006-06-29 |
CN100461359C (zh) | 2009-02-11 |
CN101076886A (zh) | 2007-11-21 |
KR20070055622A (ko) | 2007-05-30 |
KR100897891B1 (ko) | 2009-05-18 |
JP4323419B2 (ja) | 2009-09-02 |
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