KR100897891B1 - 열압착 툴 및 열압착 장치 - Google Patents
열압착 툴 및 열압착 장치 Download PDFInfo
- Publication number
- KR100897891B1 KR100897891B1 KR1020077009278A KR20077009278A KR100897891B1 KR 100897891 B1 KR100897891 B1 KR 100897891B1 KR 1020077009278 A KR1020077009278 A KR 1020077009278A KR 20077009278 A KR20077009278 A KR 20077009278A KR 100897891 B1 KR100897891 B1 KR 100897891B1
- Authority
- KR
- South Korea
- Prior art keywords
- tool
- block
- heater block
- body block
- heater
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (9)
- 2개의 부품이 겹치는 부분을 가압 가열하여 압착(壓着)하는 열압착 툴(tool)로서,본체 블록과,하면 측에 툴부가 설치되고, 상면 측이 상기 본체 블록에 상기 툴부의 길이 방향의 평탄도를 조정하는 조정 기구를 통하여 장착된 히터 블록을 구비하고,상기 히터 블록은 상기 본체 블록에 비해 열팽창 계수가 낮은 재료에 의해 형성되어 있으며,상기 본체 블록의 상면에는, 상기 본체 블록의 길이 방향의 팽창에 대하여 상대적으로 이동 가능하게 툴 장착 부재가 연결되어 있는 것을 특징으로 하는 열압착 툴.
- 제1항에 있어서,상기 히터 블록에는 폭방향에 따른 복수개의 히터가 길이 방향으로 소정 간격으로 설치되고, 이들 히터에 의한 길이 방향의 온도 분포를 균일화하는 히트 파이프가 설치되어 있는 것을 특징으로 하는 열압착 툴.
- 제1항에 있어서,상기 본체 블록의 재료는 스테인레스강이며, 상기 히터 블록은 상기 본체 블록의 재료에 비해 열팽창 계수가 낮은 재료로 형성된 것을 특징으로 하는 열압착 툴.
- 2개의 부품이 겹치는 부분을 가압 가열하여 압착하는 열압착 툴로서,본체 블록과,하면 측에 툴부가 구비되고, 상면 측이 상기 본체 블록에 상기 툴부의 길이 방향의 평탄도를 조정하는 조정 기구를 통하여 장착된 히터 블록을 구비하고,상기 히터 블록은 상기 본체 블록에 비해 열팽창 계수가 낮은 재료에 의해 형성되어 있고, 상기 툴부는 상기 히터 블록보다 단단한 금속 재료에 의해 상기 히터 블록과 별체로 형성되고, 또한 상기 히터 블록의 하면에, 서로의 열팽창에 대하여 길이 방향으로 상대적으로 이동 가능하게 장착되어 있는 것을 특징으로 하는 열압착 툴.
- 제1항에 있어서,상기 본체 블록에는 길이 방향으로 관통된 관통공이 형성되어 있는 것을 특징으로 하는 열압착 툴.
- 제5항에 있어서,상기 관통공은 상기 본체 블록의 높이 방향 중앙보다 아래쪽에 형성되어 있는 것을 특징으로 하는 열압착 툴.
- 제1항 또는 제2항에 있어서,상기 히터 블록과 상기 본체 블록은 길이 방향의 팽창에 대하여 상대적으로 이동 가능하게 연결되어 있는 것을 특징으로 하는 열압착 툴.
- 백업 툴 상에 이방성(異方性) 도전 부재를 통하여 중합된 제1 부품과 제2 부품을 탑재하고, 이들 부품의 중합 부분을 열압착 툴로 가압 가열하여 압착하는 열압착 장치로서,상기 열압착 툴은 제1항에 기재된 구성인 것을 특징으로 하는 열압착 장치.
- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004364746A JP4323419B2 (ja) | 2004-12-16 | 2004-12-16 | 熱圧着ツール及び熱圧着装置 |
JPJP-P-2004-00364746 | 2004-12-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070055622A KR20070055622A (ko) | 2007-05-30 |
KR100897891B1 true KR100897891B1 (ko) | 2009-05-18 |
Family
ID=36587658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077009278A KR100897891B1 (ko) | 2004-12-16 | 2005-09-13 | 열압착 툴 및 열압착 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4323419B2 (ko) |
KR (1) | KR100897891B1 (ko) |
CN (1) | CN100461359C (ko) |
WO (1) | WO2006064595A1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4957482B2 (ja) * | 2007-09-21 | 2012-06-20 | パナソニック株式会社 | 熱圧着装置 |
CN102389973B (zh) * | 2011-10-17 | 2013-11-27 | 中南大学 | 一种应用热膨胀差量的热压加工方法 |
JP7105482B2 (ja) * | 2018-04-03 | 2022-07-25 | 株式会社ブイ・テクノロジー | 石定盤の温度調整装置およびそれを備えた検査装置 |
KR102076786B1 (ko) * | 2019-05-30 | 2020-02-12 | 배병찬 | 이차전지용 실링장치 |
KR20220027743A (ko) * | 2020-08-27 | 2022-03-08 | 김덕군 | 균일한 실링이 가능한 히팅장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1041355A (ja) | 1996-07-24 | 1998-02-13 | Toray Eng Co Ltd | 熱圧着ツール |
JPH11354920A (ja) * | 1998-06-09 | 1999-12-24 | Nippon Avionics Co Ltd | 熱圧着装置 |
JP2001274200A (ja) * | 2000-03-23 | 2001-10-05 | Toshiba Corp | 平面表示装置の製造のためのテープキャリアパッケージの熱圧着装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2980073B2 (ja) * | 1997-08-29 | 1999-11-22 | 日本電気株式会社 | 熱圧着装置及びその制御方法 |
JP3885949B2 (ja) * | 2002-07-26 | 2007-02-28 | 芝浦メカトロニクス株式会社 | 熱圧着装置 |
-
2004
- 2004-12-16 JP JP2004364746A patent/JP4323419B2/ja active Active
-
2005
- 2005-09-13 KR KR1020077009278A patent/KR100897891B1/ko active IP Right Grant
- 2005-09-13 WO PCT/JP2005/016791 patent/WO2006064595A1/ja active Application Filing
- 2005-09-13 CN CNB2005800424633A patent/CN100461359C/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1041355A (ja) | 1996-07-24 | 1998-02-13 | Toray Eng Co Ltd | 熱圧着ツール |
JPH11354920A (ja) * | 1998-06-09 | 1999-12-24 | Nippon Avionics Co Ltd | 熱圧着装置 |
JP2001274200A (ja) * | 2000-03-23 | 2001-10-05 | Toshiba Corp | 平面表示装置の製造のためのテープキャリアパッケージの熱圧着装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20070055622A (ko) | 2007-05-30 |
CN100461359C (zh) | 2009-02-11 |
JP2006173397A (ja) | 2006-06-29 |
CN101076886A (zh) | 2007-11-21 |
WO2006064595A1 (ja) | 2006-06-22 |
JP4323419B2 (ja) | 2009-09-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100555873B1 (ko) | 전자부품 압착 장치 및 그 방법 | |
KR100897891B1 (ko) | 열압착 툴 및 열압착 장치 | |
KR101976103B1 (ko) | 열 압착 본딩 장치 | |
US20070084566A1 (en) | Press-bonding apparatus and press-bonding method | |
US6494359B1 (en) | Thermo-compression bonding apparatus for connecting a liquid crystal panel to an external drive circuit | |
KR100756411B1 (ko) | 열압착 공구 및 이를 포함한 열압착 장치 | |
KR20180111538A (ko) | 압착 장치 | |
CN215499777U (zh) | 一种pcb板矫正装置及led显示屏设备 | |
KR100962225B1 (ko) | 다(多) 칩 본딩에 적용되는 칩 본딩방법 | |
KR101959215B1 (ko) | 디스플레이 패널 또는 터치패널의 저추력 본딩장치 | |
KR101679953B1 (ko) | 본딩장치 및 본딩방법 | |
JP2002026494A (ja) | 電子部品の熱圧着装置 | |
JP2021044557A (ja) | 圧着装置 | |
KR100816992B1 (ko) | 이방성도전필름을 이용하는 본딩장치 및 본딩작업방법 | |
JP2004022604A (ja) | 圧着装置、実装装置、表示装置の製造方法、圧着ツールの調整方法 | |
JPH07130795A (ja) | 半導体素子接続方法および半導体素子接続装置 | |
JP2000021930A (ja) | 熱圧着装置 | |
JP2004079926A (ja) | 加熱圧着装置および圧接面の平坦度調整方法 | |
US20240131613A1 (en) | Dual type ultrasonic bonding apparatus and bonding method using the same | |
JP2001274200A (ja) | 平面表示装置の製造のためのテープキャリアパッケージの熱圧着装置 | |
JP2006120815A (ja) | 実装方法 | |
KR101129844B1 (ko) | 열압착 툴 | |
KR0178702B1 (ko) | 열압착 시스템 | |
JP4115661B2 (ja) | 電子部品の熱圧着装置および熱圧着方法 | |
JPH10341076A (ja) | 熱圧着ツールの平面平行度調整機構 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130417 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20140425 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20150316 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20160419 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20170420 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20180417 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20190417 Year of fee payment: 11 |