WO2006013257A1 - Dispositif de microstructuration de surface - Google Patents
Dispositif de microstructuration de surface Download PDFInfo
- Publication number
- WO2006013257A1 WO2006013257A1 PCT/FR2005/001680 FR2005001680W WO2006013257A1 WO 2006013257 A1 WO2006013257 A1 WO 2006013257A1 FR 2005001680 W FR2005001680 W FR 2005001680W WO 2006013257 A1 WO2006013257 A1 WO 2006013257A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- module
- plate
- control unit
- window
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
Definitions
- the present invention relates to the technical field of microstructuring the surface of various substrates such as, for example, glass, metal or silicon plates.
- the invention relates more particularly to the production, on the surface of materials, of structures having dimensions smaller than one millimeter.
- the invention is more particularly concerned with producing structures having dimensions of between 1 ⁇ m and 100 ⁇ m.
- the laser ablation etching technique has the advantage of offering a very high level of precision of realization, but requires the use of lasers of high power thus presenting a high cost, which makes prohibitive the use of this technique for the realization of microstructured substrates intended to have a short duration of use or to constitute disposable components, as is particularly the case for the production of microstructure glass substrates, used for optical microscopy analyzes.
- the second technique mentioned, namely photolithography consists in depositing a thickness of photosensitive resin on the surface of the substrate to be machined or microstructured.
- the resin layer is partially insolated in a pattern corresponding to the projection in plan of the microstructuration to be carried out, then, once this insolation operation is carried out, the substrate is developed to remove the insolated resin and preserve the part of the resin that has not been insolated.
- a chemical etching of the substrate is carried out, for example with hydrofluoric acid, which will attack the parts of the substrate which are not covered by the resin.
- the substrate is washed so as to remove any trace of resin from the latter, as well as traces of acid used.
- microstructuring device that is able to carry out all the steps of a microstructuration of surface by photolithography, having a reasonable size, without requiring the setting up of a clean room, while presenting a reasonable cost price.
- Such a device will also have to offer a very great flexibility of use, and allow to realize, quickly and simply, different types of microstructuring from one substrate to another, depending on the needs.
- the invention relates to a device for microstructuring the surface of at least one substrate, characterized in that it comprises a carrier chassis comprising at least:
- An automatic insolation module by means of a laser beam of the resin layer on the substrate according to a programmed pattern
- a module for chemical etching of the substrate
- a module for cleaning the substrate And a control unit which ensures an automatic or semi-automatic coordinated operation of the support means and the different modules or means of the device in order to ensure microstructuring of the surface of the substrate according to a programmed scheme.
- the invention offers the possibility, to a user, little experienced in the technique of microstructuration, to obtain, with a minimum of manipulations, a microstructured substrate according to its needs.
- the fg. 1 is a schematic section of a device for microstructuring surfaces according to the invention.
- Fig. 2 is a top view of the microstructuring device according to FIG. 1.
- a microstructuring device as illustrated in FIGS. 1 and 2 and generally designated by the reference 1, comprises a carrier frame 2 on which are adapted the different functional units, for performing the various steps of a microstructuration of a substrate by maskless photolithography.
- the chassis 2 comprises, in its lower part, a compartment 3 of chemistry which integrates the different modules chemistry to achieve the chemical part of microstnicturation, as will appear later.
- the frame 2 further comprises an optical compartment 4 disposed above the chemistry compartment 3 and connected thereto by a column 5 constituting the frame 2.
- the device 1 also comprises means 6 of support at least one substrate, integral with the frame 2.
- the support means 6 comprise an arm 10 which is fitted on a column 11 fixed to the frame 2.
- the arm 10 has a substantially horizontal orientation and is adapted to the frame 2 so as to be mobile, at least in vertical translation axis Dl. According to the illustrated example, this movement is ensured by a translational movement of the column 11, parallel to the axis D1, under the effect of an actuator 12 such as, for example but not exclusively, an electric jack driven by the control unit 7.
- the means for supporting at least one substrate further comprise a pivoting head 13 adapted to the end of the arm 10 opposite the column 11.
- the pivoting head 13 is connected to the arm 10, so as to be rotatable about a horizontal axis D2.
- the head 13 is then rotated by an actuator, such as for example but not exclusively, an electric gear motor 14, disposed within the arm 10 as shown in fig. 3.
- the gear motor is driven by the control unit to rotate the head 13 between a raised position C, shown in solid lines in FIG. 1, and a lowered position D, as illustrated in phantom lines at FIG. 1.
- the means 6 comprise, as means for supporting the substrate, a plate 15 for receiving and fixing the substrate S.
- the plate 15 comprises a cavity 16 in which the substrate is housed.
- the impression 16, which preferably has a shape complementary to that of the substrate S, can be made in different ways to ensure immobilization of the substrate S in the impression 16.
- the impression 16 is in a preferred form made of an elastically deformable material such as, for example, a synthetic elastomer such as silicone, the elasticity of which will be used to immobilize the substrate S in the impression 16.
- the device according to the invention is capable of to allow a microstructuration of substrates that may have different sizes, for this purpose the impression 16 may be modular or the removable plate to allow its change depending on the size of the microstructuring substrate.
- the plate 15 is further adapted to the head 13, so as to be rotatable about a vertical axis D3.
- the head 13 will then include means for rotating the plate 15 on itself along the axis D3.
- the drive means 17 are, for example, constituted by an electric motor, driven by the control unit 7 and adapted to rotate the plate 15 at a speed sufficient to ensure centrifugal spreading of a resin deposited on the substrate S, as will appear later.
- the plate 15 is furthermore equipped with a heating system 18, such as a thermistor whose power supply is controlled by the unit 7 and which forms means for baking and / or drying a layer of resin applied to the substrate S.
- the means 6 for supporting the substrate S and, more particularly, the head 13 and the plate 15, are interposed between the chemical compartment 3 and the optical compartment 4, so that, by the movements of rotation of the head 13, the plate 15 may be placed either in the raised position C facing the optical compartment 4, or in the lowered position D facing the chemical compartment 3.
- the optical compartment 4 is equipped a module 20 of automatic insolation of a resin layer applied to the substrate.
- the insolation module 20 comprises a laser source 21, emitting a laser beam 22, intended to form an insolation spot on the substrate S, as will appear later.
- the module 20 also comprises optical means 23 for focusing the laser beam.
- the optical means 25 for applying and automatically moving the spot, laser 22 are, of course, connected to the control unit 7 which will control its operation.
- the chemistry compartment 3 comprises, as shown in FIG. 2, a module 30 for applying a layer of photosensitive resin on the substrate S, a development module 31, a first cleaning module 32, ten substrate S, a module 33 for etching the substrate S, and a second module 34 cleaning the substrate.
- the plate 35 is rotated by drive means 37 such as an electric gear motor, driven by the control unit 7, so as to allow a sequential placement of each chemistry module 30 to 34 and 36 under the control. receiving plate and attachment 15 of the substrate S, as will appear later.
- drive means 37 such as an electric gear motor, driven by the control unit 7, so as to allow a sequential placement of each chemistry module 30 to 34 and 36 under the control. receiving plate and attachment 15 of the substrate S, as will appear later.
- each chemistry module 30 to 34 and 36 has a substantially identical constitution.
- each chemistry module 30, 31, 32, 33, 34, 36 comprises a window 40, associated with a reservoir 41 of a chemistry bath 42.
- the reservoir 41 is open on top facing the window 40.
- each tank 41 is made in the form of a removable drawer supported by slides 43 fixed on the lower face 35i of the plate 35.
- a peripheral seal 44 intended to seal between the slide 41 and the lower face 35i of the plate 35.
- the window 40 and the reservoir 41 have dimensions sufficient for allow at least partial immersion of the platinum 15 in the chemistry bath 42.
- Each chemistry module 30 to 34 and 36 has, in addition, at least one and, according to the example shown, two shutters 45, 46 motorized closing the window 40.
- the motorized shutters 45, 46 are then controlled in opening and in closing by the control unit 7.
- the flaps 45, 46 are adapted on the upper face 35s of the plate 35, so as to ensure closure of the corresponding window 40. In the closed position, this system provides a seal against dust, light and vapors of the bath 42.
- the plate 15 is fitted on the head 13 via a shaft 47, so as to be placed at a distance from the pivoting head 13, as shown in FIG. 3.
- control unit 7 provides control of the drive means of the plate 35, so that ensure that the photoresist application module 30 is placed facing the pivoting head 13.
- control unit 7 controls the raising of the head to the intermediate position E in which the substrate S is located above the resin bath 42 while being in the container 41.
- the unit 7 then triggers the operation the motor 17 to drive the plate 15 in rotation on itself and provide a spreading and a centrifugal distribution of the resin on the surface of the substrate S.
- control unit 7 ensures an opening of the motorized shutters 45 and 46 and an extraction of the plate from the container 41 by the control of the actuator 12, so as to raise the pivoting head 13 to the position D.
- the control unit then places the head 13 is in the raised position C, substrate S facing upwards facing the exposure module 20.
- the plate 15 is brought into abutment by the actuator 12 driven by the unit 7, against a support member 51 integral with the exposure module 20 and forming means of adjusting the relative position of the means for handling the substrate relative to the means for applying and moving the laser spot.
- control unit 7 or the user of the device 1 ensures the adjustment of the optical part.
- This optical adjustment is provided by the illumination of the substrate by means of a pattern to adjust the focus of the laser spot.
- the projection of the target is carried out by means of a safelight.
- the device 1 comprises an opaque removable housing 52 diagrammatically in phantom with the fIg. 1 to protect the set from light and dust.
- photosensitive resins two types can be used, namely either a positive resin or a negative resin.
- These photosensitive resins are distinguished from each other in that, for so-called positive photosensitive resins, the insolated part of the resin is eliminated, whereas for the so-called negative photosensitive resins, it is the non-insolated part. of the resin that is removed.
- control unit 7 places the pivoting head
- the control unit 7 places the pivoting head in raised position C and the user has the possibility of recovering the cleaned and microstructured substrate S at the footprint 16 of the plate 15.
- the sixth chemistry module 36 could be implemented to ensure ultimate rinsing of the substrate after cleaning in the second cleaning module.
- this is only an example of a mode of implementation of the microstructuring device 1 according to the invention, because different other treatment sequences could be envisaged without departing from the scope of the present invention.
- the substrate has been maintained on the same plate 15, forming the support means of the substrate, throughout its treatment.
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Micromachines (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Surface Treatment Of Glass (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007519831A JP2008506145A (ja) | 2004-07-05 | 2005-07-01 | 表面微細構造化装置 |
US11/631,311 US20080149272A1 (en) | 2004-07-05 | 2005-07-01 | Surface Microstructuring Device |
CA002572725A CA2572725A1 (fr) | 2004-07-05 | 2005-07-01 | Dispositif de microstructuration de surface |
EP05783993A EP1779200A1 (fr) | 2004-07-05 | 2005-07-01 | Dispositif de microstructuration de surface |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0407426 | 2004-07-05 | ||
FR0407426A FR2872502B1 (fr) | 2004-07-05 | 2004-07-05 | Dispositif de microstructuration de surface |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006013257A1 true WO2006013257A1 (fr) | 2006-02-09 |
Family
ID=34947679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2005/001680 WO2006013257A1 (fr) | 2004-07-05 | 2005-07-01 | Dispositif de microstructuration de surface |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080149272A1 (fr) |
EP (1) | EP1779200A1 (fr) |
JP (1) | JP2008506145A (fr) |
CA (1) | CA2572725A1 (fr) |
FR (1) | FR2872502B1 (fr) |
WO (1) | WO2006013257A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2906401A1 (fr) * | 2006-09-26 | 2008-03-28 | Commissariat Energie Atomique | Procede de depot d'une couche polymere sur une face non plane d'un support par trempage. |
CN107665827B (zh) * | 2016-07-29 | 2020-01-24 | 上海微电子装备(集团)股份有限公司 | 芯片键合装置和方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059352A (ja) * | 1983-09-12 | 1985-04-05 | Seiko Epson Corp | ポジデベロツパ− |
US4590094A (en) * | 1984-10-29 | 1986-05-20 | International Business Machines Corporation | Inverted apply using bubble dispense |
US5202716A (en) * | 1988-02-12 | 1993-04-13 | Tokyo Electron Limited | Resist process system |
US6187134B1 (en) * | 1999-07-09 | 2001-02-13 | The Board Of Trustees Of The Leland Stanford Junior University | Reusable wafer support for semiconductor processing |
US6240874B1 (en) * | 1999-05-27 | 2001-06-05 | Advanced Micro Devices, Inc. | Integrated edge exposure and hot/cool plate for a wafer track system |
US6246706B1 (en) * | 1999-05-27 | 2001-06-12 | Spectra Physics Lasers, Inc. | Laser writing method and apparatus |
EP1184895A2 (fr) * | 2000-09-01 | 2002-03-06 | Dainippon Screen Mfg. Co., Ltd. | Dispositif de traitement de substrat et procédé d'inspection de substrat |
JP2002251794A (ja) * | 2001-02-23 | 2002-09-06 | Ricoh Co Ltd | フォトレジスト除去装置 |
WO2002103781A1 (fr) * | 2001-06-14 | 2002-12-27 | Tokyo Electron Limited | Support de plaquette |
US20030102084A1 (en) * | 1999-03-19 | 2003-06-05 | Livesay William R. | Cluster tool for wafer processing having an electron beam exposure module |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3326717A (en) * | 1962-12-10 | 1967-06-20 | Ibm | Circuit fabrication |
JP2665202B2 (ja) * | 1995-05-31 | 1997-10-22 | 九州日本電気株式会社 | 半導体ウェハ処理装置 |
JPH11145251A (ja) * | 1997-08-15 | 1999-05-28 | Tokyo Electron Ltd | 基板処理装置 |
JP4915033B2 (ja) * | 2000-06-15 | 2012-04-11 | 株式会社ニコン | 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法 |
JP2003068611A (ja) * | 2001-08-24 | 2003-03-07 | Canon Inc | 露光装置及び半導体デバイスの製造方法 |
JP4219799B2 (ja) * | 2003-02-26 | 2009-02-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2004
- 2004-07-05 FR FR0407426A patent/FR2872502B1/fr not_active Expired - Fee Related
-
2005
- 2005-07-01 CA CA002572725A patent/CA2572725A1/fr not_active Abandoned
- 2005-07-01 EP EP05783993A patent/EP1779200A1/fr not_active Withdrawn
- 2005-07-01 US US11/631,311 patent/US20080149272A1/en not_active Abandoned
- 2005-07-01 WO PCT/FR2005/001680 patent/WO2006013257A1/fr active Application Filing
- 2005-07-01 JP JP2007519831A patent/JP2008506145A/ja active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059352A (ja) * | 1983-09-12 | 1985-04-05 | Seiko Epson Corp | ポジデベロツパ− |
US4590094A (en) * | 1984-10-29 | 1986-05-20 | International Business Machines Corporation | Inverted apply using bubble dispense |
US5202716A (en) * | 1988-02-12 | 1993-04-13 | Tokyo Electron Limited | Resist process system |
US20030102084A1 (en) * | 1999-03-19 | 2003-06-05 | Livesay William R. | Cluster tool for wafer processing having an electron beam exposure module |
US6240874B1 (en) * | 1999-05-27 | 2001-06-05 | Advanced Micro Devices, Inc. | Integrated edge exposure and hot/cool plate for a wafer track system |
US6246706B1 (en) * | 1999-05-27 | 2001-06-12 | Spectra Physics Lasers, Inc. | Laser writing method and apparatus |
US6187134B1 (en) * | 1999-07-09 | 2001-02-13 | The Board Of Trustees Of The Leland Stanford Junior University | Reusable wafer support for semiconductor processing |
EP1184895A2 (fr) * | 2000-09-01 | 2002-03-06 | Dainippon Screen Mfg. Co., Ltd. | Dispositif de traitement de substrat et procédé d'inspection de substrat |
JP2002251794A (ja) * | 2001-02-23 | 2002-09-06 | Ricoh Co Ltd | フォトレジスト除去装置 |
WO2002103781A1 (fr) * | 2001-06-14 | 2002-12-27 | Tokyo Electron Limited | Support de plaquette |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 009, no. 190 (P - 378) 7 August 1985 (1985-08-07) * |
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 01 14 January 2003 (2003-01-14) * |
Also Published As
Publication number | Publication date |
---|---|
FR2872502A1 (fr) | 2006-01-06 |
JP2008506145A (ja) | 2008-02-28 |
CA2572725A1 (fr) | 2006-02-09 |
US20080149272A1 (en) | 2008-06-26 |
EP1779200A1 (fr) | 2007-05-02 |
FR2872502B1 (fr) | 2006-11-10 |
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