FR2872502B1 - Dispositif de microstructuration de surface - Google Patents

Dispositif de microstructuration de surface

Info

Publication number
FR2872502B1
FR2872502B1 FR0407426A FR0407426A FR2872502B1 FR 2872502 B1 FR2872502 B1 FR 2872502B1 FR 0407426 A FR0407426 A FR 0407426A FR 0407426 A FR0407426 A FR 0407426A FR 2872502 B1 FR2872502 B1 FR 2872502B1
Authority
FR
France
Prior art keywords
surface microstructuring
microstructuring device
microstructuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0407426A
Other languages
English (en)
Other versions
FR2872502A1 (fr
Inventor
Djamel Bouraya
Christophe Place
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique CNRS
Ecole Normale Superieure de Lyon
Original Assignee
Centre National de la Recherche Scientifique CNRS
Ecole Normale Superieure de Lyon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre National de la Recherche Scientifique CNRS, Ecole Normale Superieure de Lyon filed Critical Centre National de la Recherche Scientifique CNRS
Priority to FR0407426A priority Critical patent/FR2872502B1/fr
Priority to PCT/FR2005/001680 priority patent/WO2006013257A1/fr
Priority to CA002572725A priority patent/CA2572725A1/fr
Priority to US11/631,311 priority patent/US20080149272A1/en
Priority to JP2007519831A priority patent/JP2008506145A/ja
Priority to EP05783993A priority patent/EP1779200A1/fr
Publication of FR2872502A1 publication Critical patent/FR2872502A1/fr
Application granted granted Critical
Publication of FR2872502B1 publication Critical patent/FR2872502B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Surface Treatment Of Glass (AREA)
FR0407426A 2004-07-05 2004-07-05 Dispositif de microstructuration de surface Expired - Fee Related FR2872502B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR0407426A FR2872502B1 (fr) 2004-07-05 2004-07-05 Dispositif de microstructuration de surface
PCT/FR2005/001680 WO2006013257A1 (fr) 2004-07-05 2005-07-01 Dispositif de microstructuration de surface
CA002572725A CA2572725A1 (fr) 2004-07-05 2005-07-01 Dispositif de microstructuration de surface
US11/631,311 US20080149272A1 (en) 2004-07-05 2005-07-01 Surface Microstructuring Device
JP2007519831A JP2008506145A (ja) 2004-07-05 2005-07-01 表面微細構造化装置
EP05783993A EP1779200A1 (fr) 2004-07-05 2005-07-01 Dispositif de microstructuration de surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0407426A FR2872502B1 (fr) 2004-07-05 2004-07-05 Dispositif de microstructuration de surface

Publications (2)

Publication Number Publication Date
FR2872502A1 FR2872502A1 (fr) 2006-01-06
FR2872502B1 true FR2872502B1 (fr) 2006-11-10

Family

ID=34947679

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0407426A Expired - Fee Related FR2872502B1 (fr) 2004-07-05 2004-07-05 Dispositif de microstructuration de surface

Country Status (6)

Country Link
US (1) US20080149272A1 (fr)
EP (1) EP1779200A1 (fr)
JP (1) JP2008506145A (fr)
CA (1) CA2572725A1 (fr)
FR (1) FR2872502B1 (fr)
WO (1) WO2006013257A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2906401A1 (fr) * 2006-09-26 2008-03-28 Commissariat Energie Atomique Procede de depot d'une couche polymere sur une face non plane d'un support par trempage.
CN107665827B (zh) * 2016-07-29 2020-01-24 上海微电子装备（集团）股份有限公司 芯片键合装置和方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3326717A (en) * 1962-12-10 1967-06-20 Ibm Circuit fabrication
JPS6059352A (ja) * 1983-09-12 1985-04-05 Seiko Epson Corp ポジデベロツパ−
US4590094A (en) * 1984-10-29 1986-05-20 International Business Machines Corporation Inverted apply using bubble dispense
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
JP2665202B2 (ja) * 1995-05-31 1997-10-22 九州日本電気株式会社 半導体ウェハ処理装置
JPH11145251A (ja) * 1997-08-15 1999-05-28 Tokyo Electron Ltd 基板処理装置
AU3888400A (en) * 1999-03-19 2000-10-09 Electron Vision Corporation Cluster tool for wafer processing having an electron beam exposure module
US6240874B1 (en) * 1999-05-27 2001-06-05 Advanced Micro Devices, Inc. Integrated edge exposure and hot/cool plate for a wafer track system
US6246706B1 (en) * 1999-05-27 2001-06-12 Spectra Physics Lasers, Inc. Laser writing method and apparatus
US6187134B1 (en) * 1999-07-09 2001-02-13 The Board Of Trustees Of The Leland Stanford Junior University Reusable wafer support for semiconductor processing
JP4915033B2 (ja) * 2000-06-15 2012-04-11 株式会社ニコン 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法
JP4004248B2 (ja) * 2000-09-01 2007-11-07 大日本スクリーン製造株式会社 基板処理装置および基板検査方法
JP2002251794A (ja) * 2001-02-23 2002-09-06 Ricoh Co Ltd フォトレジスト除去装置
JP2002373929A (ja) * 2001-06-14 2002-12-26 Tokyo Electron Ltd ウエハ支持体
JP2003068611A (ja) * 2001-08-24 2003-03-07 Canon Inc 露光装置及び半導体デバイスの製造方法
JP4219799B2 (ja) * 2003-02-26 2009-02-04 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
CA2572725A1 (fr) 2006-02-09
US20080149272A1 (en) 2008-06-26
FR2872502A1 (fr) 2006-01-06
EP1779200A1 (fr) 2007-05-02
WO2006013257A1 (fr) 2006-02-09
JP2008506145A (ja) 2008-02-28

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Legal Events

Date Code Title Description
TQ Partial transmission of property
ST Notification of lapse

Effective date: 20150331