WO2006001207A1 - フレキシブルディスプレイ用基板 - Google Patents
フレキシブルディスプレイ用基板 Download PDFInfo
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- WO2006001207A1 WO2006001207A1 PCT/JP2005/010984 JP2005010984W WO2006001207A1 WO 2006001207 A1 WO2006001207 A1 WO 2006001207A1 JP 2005010984 W JP2005010984 W JP 2005010984W WO 2006001207 A1 WO2006001207 A1 WO 2006001207A1
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- Prior art keywords
- resin
- inorganic layered
- layered compound
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
- C08J3/21—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase
- C08J3/215—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase at least one additive being also premixed with a liquid phase
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a substrate for a flexible display, a manufacturing method thereof, and a flexible display.
- Akita
- a flexible display is one of displays such as liquid crystal displays and organic EL displays. Flexible displays are expected to be used in a wide range of applications due to their ability to be placed on the curved surface of equipment casings.
- a flexible display usually includes a substrate, a transparent electrode formed thereon, and a display material.
- a substrate for example, polyethylene terephthalate, polyforce-ponate, polyolefin, and polyethersulfone are known. (For example, Japanese Laid-Open Patent Publication No. 2 0 0 3- 1 7 2 4 4)
- the above-mentioned substrate has a large coefficient of thermal expansion, and the flexure display using this may cause cracks in the transparent electrode due to changes in the ambient temperature, resulting in increased resistance and further disconnection. there were.
- An object of the present invention is to provide a substrate suitable for a flexible display having sufficient flexibility and a low coefficient of thermal expansion.
- the present invention has a resin composition layer containing an inorganic layered composite and a resin, and the amount of the inorganic layered compound is 10% by weight or more based on the total amount of the resin and the inorganic layered compound.
- a flexible display substrate which is 0% by weight or less.
- the present invention also provides a display including the above-mentioned substrate for flexure display and an electrode.
- the present invention has a resin composition layer containing a resin and an inorganic layered compound, and the amount of the inorganic layered compound is 10% by weight or more and 70% by weight or less based on the total amount of the resin and the inorganic layered compound.
- the use of the resin composition as a flexible display substrate is provided.
- the substrate for flexible displays of the present invention (hereinafter referred to as “substrate”) has a resin composition layer containing an inorganic layered compound and a resin.
- the inorganic layered compound may be an inorganic compound having a layered structure in which unit crystal layers are stacked on each other, and preferably has swelling and cleavage when mixed with a solvent.
- Such inorganic layered compounds are clay minerals that swell and cleave when mixed with a solvent.
- smectite, kaolinite, dickite, nacrite, octalosite, antigolite, chrysotile, pie mouth It is phyllite, montmorillonite, hectorite, tetrasilicmy power, sodium teniolite, muscovite, margarite, .talc, vermiculite, phlogopite, zansophyllite, chlorite.
- smectai koji, kaolinite, montmorillonite, hectorite, tetrasilicmy power, sodium teniolite, and talc are preferable.
- the inorganic layered compounds may be used alone or in combination of two or more.
- the inorganic layered compound has an average particle size sufficiently smaller than the wavelength of visible light (about 400 nm to about 80 nm), for example, 30 nm or less.
- the inorganic layered compound has an average particle diameter of preferably 50 nm or more, more preferably 100 nm or more, and preferably 30 O nm or less, and more preferably 20 nm or less. .
- the substrate containing the inorganic layered compound having the average particle diameter has a low coefficient of thermal expansion and a high visible light transmittance, for example, 80% or more.
- the average particle size L (nm) may be measured by a dynamic light scattering method by dispersing the inorganic layered compound in a solvent.
- the inorganic layered compound may have an aspect ratio of usually 50 or more, preferably 100 or more, and usually 30 or less, preferably 20.00 or less.
- An inorganic layered compound having an aspect ratio in this range easily aligns with the resin, and the resulting substrate has high transparency.
- the aspect ratio Z may be calculated from the above average particle diameter L and the unit thickness a determined from the diffraction peak of the inorganic layered compound measured by the powder X-ray diffraction method according to the following formula.
- the inorganic layered compound is a particle, and the particle may be oriented.
- the inorganic layered compound is, for example, a plate-like particle, and the surface having the largest area may be substantially parallel to the surface of the substrate (for example, the display surface). In this specification, this orientation is referred to as “orientation in the plane direction”.
- a substrate in which the inorganic layered compound is oriented in the plane direction has a lower coefficient of thermal expansion in the plane direction.
- the amount of the inorganic layered compound is 10% by weight or more, preferably 20% by weight or more, and 70% by weight or less, preferably 60% by weight, based on the total amount of the resin and the inorganic layered compound. % Or less.
- the substrate has a low coefficient of thermal expansion.
- the resin is usually a thermoplastic resin, and is preferably transparent to visible light.
- the resin examples include low-density polyethylene, high-density polyethylene, ethylene-propylene copolymer, ethylene monobutene copolymer, ethylene monohexene copolymer, ethylene octene copolymer, ethylene-norbornene copolymer, Polyolefins such as ethylene-dmon copolymer, polypropylene, ethylene monovinyl acetate copolymer, ethylene-methyl methacrylate copolymer, ionomer resin; polyethylene terephthalate, poly pentyl reflate, polyethylene naphthalate Polyester such as Nylon 1, Nylon 1, 6, 6, Metaxylene diamine Adipic acid condensation polymer; Amide resin such as polymethylmethacrylimide; Acrylic resin such as polymethyl methacrylate; Polystyrene, Styrene acrylonitrile Copolymers, Styrene-acrylonitrile-butadiene copolymers, Styrene-acryl
- the resin preferably has excellent heat resistance.
- the glass transition point (Tg) is 1550 ° C or higher, more preferably 1800 ° C or higher, and further preferably 2200 ° C or higher. is there.
- the resin having excellent heat resistance include ethylene-norbornene copolymer, ethylene monomonide copolymer, polyethylene terephthalate, polyethylene naphthalate, cellulose triacetate, cellulose diacetate, polyvinylidene chloride, polyvinylidene fluoride, Polytetrafluoroethylene, Polypinyl alcohol, Ethylene-vinyl alcohol copolymer, Polycar Ponate, Polysulfone, Polyethersulfone, Polyetherether cane
- Liquid crystal resin Coffins may be used alone or in combination of two or more.
- the substrate having the composition layer containing the inorganic layered compound and the resin has an average coefficient of thermal expansion from 20 ° C. to 15 ° C., usually not less than 10 ppm pmZ ° C., preferably 0 pp. mZ ° C or higher, and usually 25 p ⁇ Preferably it is 20 ppm / ° C or less.
- the substrate having the resin composition layer containing the resin having the aspect ratio, the average particle diameter, or the oriented inorganic layered compound and the resin has a small average thermal expansion coefficient and a visible light transmittance of usually 80% or more.
- This substrate is used as a back side substrate or a front side substrate (a visible display side substrate) of a flexible display.
- substrate may have an effect layer which does not contain an inorganic layered compound as layers other than the resin composition layer containing the said inorganic layered compound and resin.
- the resin layer preferably has a thickness smaller than that of the resin composition layer.
- the substrate preferably has at least one other resin composition layer containing an inorganic layered compound and a resin as a layer other than the resin composition layer containing the inorganic layered compound and the resin.
- the resin of the resin composition layer and the resin of the other resin composition layer may be the same type or different types, and preferably the same type. In the case of the same type, adhesion between the resin composition layer and other resin composition layers is improved.
- the amount of the inorganic layered compound in the resin composition layer is 1 with respect to the total amount of the inorganic layered compound and the resin in the resin composition layer. It is 0% by weight or more, preferably 20% by weight or more, 70% by weight or less, preferably 60% by weight or less.
- the amount of the inorganic layered compound in the other resin composition layer is usually 0.1% by weight or more, preferably 0.3%, based on the total amount of the inorganic layered compound and the resin in the other resin composition layer. % By weight, usually 10% by weight or less, preferably 5 layers % Or less.
- the substrate has a thickness of usually not less than, preferably not less than 5, more preferably not less than 10, usually not more than 500,000 zm, preferably not more than 300, more preferably not more than 2500 / xm. .
- a substrate having a thickness in the above range has sufficient flexibility, mechanical strength, and transparency.
- the thickness of each layer is 0.5 ⁇ m or more, preferably the above, more preferably 1.5 m or more, and usually 200 Below, it is preferably 150 m or less, more preferably 100 m or less.
- the thickness of the resin composition layer is the thickness of the other resin composition layer (when there are a plurality of other resin composition layers, the total of these). Larger is preferred.
- the substrate may contain additives such as UV absorbers, colorants, and antioxidants.
- the solvent examples include water, alcohols (for example, methanol), dimethylformamide, dimethylsulfoxide, dichloromethane, black mouth form, toluene, acetone, and N-methylpyrrolidone.
- the inorganic layered compound those described above may be used.
- the inorganic layered compound is preferably surface-treated from the viewpoint of improving dispersibility, and for example, a surface-treated with a quaternary ammonium salt is preferable.
- the resin those described above may be used.
- the total amount of the inorganic layered compound and the resin is usually 5% by weight or more, preferably 10% by weight or more, and usually 50% by weight or less, preferably 35% by weight or less, based on the solvent.
- the total amount of the inorganic layered compound and the resin is within the above range. If it exists, the board
- the mixture of the inorganic layered compound, the resin and the solvent may be performed, for example, by methods 1 to 4, preferably methods 1 to 3.
- Method 1 Mixing a solution in which a resin is dissolved in a solvent and a dispersion obtained by adding an inorganic layered compound to the solvent to swell and cleave the inorganic layered compound
- Method 2 Add an inorganic layered compound to the solvent and add an inorganic layered compound
- Method 3 swell and cleave the inorganic layered compound by adding the inorganic layered compound to the solution in which the resin is added to the solvent.
- Method 4 Inorganic layered layer The compound and resin are heat-kneaded and the resulting mixture and solvent are mixed.
- the plate may be any material that does not dissolve in the solvent of the previous period, or that does not break when peeling as described later.
- the plate is glass, metal, or resin.
- Application is direct gravure, reverse gravure and micro gravure; roll coating such as two-port one-beat beat coating, bottom feed three-bar reverse coating; doc evening blade and die coating, dip coating, bar coating This can be done by ticking. These may be performed alone or in combination.
- the coating is preferably performed by roll coating or a doctor blade.
- the inorganic layered compound can be oriented by a force (shear) in a direction parallel to the surface of the substrate (for example, the display surface). Drying may be performed by reduced pressure drying, hot air drying, infrared drying, or the like.
- the substrate obtained by peeling off the layers may be stretched. Stretching may be uniaxial or biaxial. By stretching, the inorganic layered compound is oriented in the plane direction of the substrate.
- the above mixed solution is applied to a plate and dried to form the first layer, and then the mixed solution is applied to the first layer and dried to form the second layer. After forming (repeating these operations as necessary to form a layer), the layer is peeled off from the plate. Can be manufactured.
- the substrate having two or more layers may be produced by a method of preparing two or more layers and laminating them.
- the interface between the two layers may be subjected to corona treatment, anchor coating treatment or the like.
- the substrate may be produced by, for example, a method of applying a mixture of a solvent, an inorganic layered compound, and a resin to a flexible plate and drying it.
- the flexible display of the present invention includes the substrate and electrodes (anode, cathode).
- the flexure display is, for example, a flexible organic EL display or a flexible liquid crystal display.
- a flexible organic EL display usually has an anode, a cathode, and a light emitting layer.
- an electron transport layer between the cathode and the light emitting layer (the anode, the light emitting layer, the electron transport layer, and the cathode in this order)
- B Having a hole transport layer between the anode and the light-emitting layer (Anode, hole transport layer, light-emitting layer, 'having a cathode in this order.)
- C Between the cathode and the light-emitting layer And an electron transport layer and a hole transport layer between the anode and the light emitting layer (having an anode, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode in this order).
- an anode, a hole transport layer, a light-emitting layer, and an electron transport layer are sequentially formed on the substrate, and then the obtained laminate and another substrate are formed.
- What is necessary is just to manufacture what formed the cathode by the method of pile
- One of the substrate used for this method and the other substrate is transparent.
- the anode is, for example, a conductive metal oxide, a translucent thin metal layer, indium oxide, zinc oxide, tin oxide, indium tin oxide (ITO), indium Um ⁇ zinc ⁇ oxide, gold, platinum, silver, copper.
- the anode may be formed by vacuum deposition, sputtering, ion plating, or plating. Further, the anode may be a transparent conductive organic layer, or polyaniline or a derivative thereof, or polythiophene or a derivative thereof.
- the hole transport layer may be, for example, polyvinyl carbazole or a derivative thereof, polysilane or a derivative thereof, a polysiloxane derivative having an aromatic amine compound group in a side chain or a main chain, polyaniline or a derivative thereof, polythiophene or the like Derivatives, poly (p-phenylenevinylene) or derivatives thereof, or poly (2,5-chainylenevinylene) or derivatives thereof.
- the hole transport layer may be formed by a coating method (a mixed solution of these compounds and a polymer binder is used as a raw material).
- the light emitting layer may be an organic EL material, and may be either a low molecular compound or a high molecular compound.
- Low molecular weight compounds include, for example, naphthalene derivatives, anthracene or derivatives thereof, perylene or derivatives thereof, dyes such as polymethine, xanthene, coumarin, and cyanine, metal complexes of 8-hydroxyquinoline or derivatives thereof, Aromatic amines, tetraphenylcyclopentagen or derivatives thereof, or tetraphenylbutadiene or derivatives thereof. (Japanese Unexamined Patent Publication Nos. 57-51781 and 59-194393).
- the light emitting layer may be formed by a vacuum deposition method (powder is used as a raw material) or a coating method (a solution is used as a raw material).
- the polymer compound include poly (p-phenylene biylene), polyfluorene, and polyparaphenylene derivatives. (J pn. J. Ap 1. Phy s. 30, L 1941, 1991; Adv. Mater. 4, 36, 1992).
- the electron transport layer may be, for example, an oxadiazole derivative, anthraquinodimethane or a derivative thereof, benzoquinone or a derivative thereof, naphthoquinone or a derivative thereof Derivatives, anthraquinones or derivatives thereof, tetracyananthracinodimene or derivatives thereof, fluorenone derivatives, diphenyldiethylene ethylene or derivatives thereof, diphenoquinone derivatives, or metal complexes of 8-hydroxyquinoline or derivatives thereof Polyquinoline or a derivative thereof, polyquinoxaline or a derivative thereof, or polyfluorene or a derivative thereof.
- the electron transport layer may be formed by a vacuum deposition method (powder is used as a raw material) or a coating method (a solution is used as a raw material).
- the cathode is, for example, a material with a low work function, such as lithium, sodium, potassium, solevidium, cesium, beryllium, magnesium, force ⁇ / sym, strut n-tium, barium, aluminum, scandium, vanadium, zinc, yttrium.
- Metals such as indium, cerium, samarium, europium, terbium, ytterbium, alloys containing two or more of these, one or more of these, gold, silver, platinum, copper, manganese, titanium, conol, nickel, tungsten And an alloy containing at least one of tin, graphite, or a graphite intercalation compound.
- the cathode may be formed by a vacuum evaporation method, a sputtering method, or a method in which a metal thin film is thermocompression bonded.
- the light emission pattern can be changed by changing the arrangement of the anode and cathode.
- the planar anode and cathode may be arranged so as to overlap.
- a mask having a specific pattern window is installed on the surface of the flexible display showing the above-mentioned planar light emission. Either one or both of the anode and the cathode that emit light may be formed in a specific pattern.
- the display may be either passive drive or active drive (for example, combined with TFT).
- the flexible display can be used as a display device such as a computer, a TV, a mobile terminal, a mobile phone, a force navigation, a viewfinder of a video camera.
- the flexible display since the flexible display is self-luminous and thin, it can be suitably used as a planar light source for backlight of a liquid crystal display device or a planar illumination light source.
- Example 1 The total light transmittance of the sample was measured using a halogen lamp, and this was taken as the visible light transmittance.
- Example 1 The total light transmittance of the sample was measured using a halogen lamp, and this was taken as the visible light transmittance.
- PES polyethersulfone
- NMP N-methylpyrrolidone
- the mixture D was applied with a doctor blade (application gap: 0.48 mm, width: about 9 cm), and dried under reduced pressure at 190 ° C for 10 minutes to remove the solvent. Thereafter, the glass plate was taken out of the dryer and cooled at room temperature for 1 minute. Next, the mixture C was applied with a doctor blade (application gap: 0.72 mm, width: about 10 cm), and dried under reduced pressure at 190 ° C. for 10 hours or more to completely remove the solvent. The glass plate was taken out of the dryer to produce a substrate having three layers containing smectite and PES.
- the thickness of the substrate is 12 ⁇ m (the total thickness of the layer formed by applying and drying the mixture C is 8 m, and the thickness of the layer formed by applying and drying the mixture D is It was 4 m.) It was easy to peel off from the glass plate and had sufficient flexibility.
- the substrate before stretching had an average thermal expansion coefficient of 20 ° (: ⁇ 150 ° C of 19.7 pmZt: and a total light transmittance of 95%.
- the average coefficient of thermal expansion (MD) from 8 ° C to 150 ° C was 8ppmZ ° C
- the average coefficient of thermal expansion (TD) from 20 ° C to 150 ° C was 12ppm / ⁇ C.
- the flexible display does not lose its function as a display device due to changes in ambient temperature.
- the solution A prepared in the same manner as in Example 1 was applied on a glass plate whose surface had been cleaned with a doctor blade (application gap: 0.24 mm, width: about 8 cm). The solvent was removed by drying under reduced pressure for 10 minutes. Thereafter, the glass plate was taken out of the dryer and cooled at room temperature for 1 minute.
- Solution A was applied onto the formed layer with a doctor blade (application gap: 0.48 mm, width: about 9 cm), and the solvent was removed by drying at 190 ° (:, 10 minutes under reduced pressure. Remove the plate from the dryer, cool it under room temperature air for 1 minute, and apply solution A with a doctor blade (applying gap: 0.72 mm, width: approx. 10 cm) and dry under reduced pressure for 190 hours or more for 10 hours. The glass plate was taken out of the dryer, and a substrate having three layers containing PES was produced.
- the substrate had a thickness of 12 m, could be easily peeled off from the glass plate, and had sufficient flexibility.
- the substrate before stretching had an average coefficient of thermal expansion of 20 to 150 ° C and 60 ppmZ ° C. 9 ⁇
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Application Number | Priority Date | Filing Date | Title |
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GB0701281A GB2430678B (en) | 2004-06-25 | 2005-06-09 | Substrate for flexible displays |
US11/570,684 US7579054B2 (en) | 2004-06-25 | 2005-06-09 | Substrate for flexible displays |
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JP2004-187629 | 2004-06-25 | ||
JP2004187629 | 2004-06-25 |
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WO2006001207A1 true WO2006001207A1 (ja) | 2006-01-05 |
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PCT/JP2005/010984 WO2006001207A1 (ja) | 2004-06-25 | 2005-06-09 | フレキシブルディスプレイ用基板 |
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Country | Link |
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US (1) | US7579054B2 (ja) |
KR (1) | KR101079552B1 (ja) |
CN (1) | CN100573628C (ja) |
GB (1) | GB2430678B (ja) |
TW (1) | TWI344433B (ja) |
WO (1) | WO2006001207A1 (ja) |
Cited By (1)
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WO2022130749A1 (ja) * | 2020-12-14 | 2022-06-23 | パナソニックIpマネジメント株式会社 | 正極スラリーの製造方法及び正極の製造方法 |
Families Citing this family (11)
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JP4388966B2 (ja) * | 2007-03-16 | 2009-12-24 | 富士通株式会社 | 座標入力装置 |
TWI415044B (zh) * | 2008-12-15 | 2013-11-11 | Ind Tech Res Inst | 基板、製造方法、及使用該基板的顯示器 |
KR20110019636A (ko) * | 2009-08-20 | 2011-02-28 | 삼성모바일디스플레이주식회사 | 가요성 표시 장치용 기판 및 그 제조 방법과 상기 기판을 포함하는 유기 발광 표시 장치 |
EP2690124B1 (en) | 2012-07-27 | 2015-09-16 | Samsung Electronics Co., Ltd | Composition Comprising Polyimide Block Copolymer And Inorganic Particles, Method Of Preparing The Same, Article Including The Same, And Display Device Including The Article |
TWI450759B (zh) | 2012-12-07 | 2014-09-01 | Ind Tech Res Inst | 有機分散液及其製法及應用其之塗層組成物 |
KR102110520B1 (ko) | 2013-08-26 | 2020-05-14 | 삼성전자주식회사 | 폴리(이미드-아미드) 코폴리머, 및 폴리(이미드-아미드) 코폴리머를 포함하는 조성물 |
KR102111093B1 (ko) | 2013-08-26 | 2020-05-15 | 삼성전자주식회사 | 폴리(이미드-아미드) 코폴리머, 폴리(이미드-아미드) 코폴리머의 제조 방법, 및 상기 폴리(이미드-아미드)를 포함하는 성형품 |
KR101530378B1 (ko) * | 2014-12-03 | 2015-06-22 | (주)씨앤켐 | 박리층 및 그 제조방법 |
US9899631B2 (en) | 2015-07-08 | 2018-02-20 | Universal Display Corporation | Flexible multilayer scattering substrate used in OLED |
KR101712275B1 (ko) * | 2015-07-10 | 2017-03-03 | 강정남 | 차량내 유리에 부착하여 디스플레이 용도에 사용할 수 있는 특수필름 |
US20190092960A1 (en) * | 2017-09-22 | 2019-03-28 | Acetate International Llc | Substrate with cellulose acetate coating |
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- 2005-06-09 WO PCT/JP2005/010984 patent/WO2006001207A1/ja active Application Filing
- 2005-06-09 CN CNB2005800203024A patent/CN100573628C/zh not_active Expired - Fee Related
- 2005-06-09 KR KR1020077001241A patent/KR101079552B1/ko active IP Right Grant
- 2005-06-09 US US11/570,684 patent/US7579054B2/en active Active
- 2005-06-09 GB GB0701281A patent/GB2430678B/en not_active Expired - Fee Related
- 2005-06-10 TW TW094119237A patent/TWI344433B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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CN1969310A (zh) | 2007-05-23 |
TWI344433B (en) | 2011-07-01 |
TW200611860A (en) | 2006-04-16 |
US20070224366A1 (en) | 2007-09-27 |
KR20070026828A (ko) | 2007-03-08 |
CN100573628C (zh) | 2009-12-23 |
GB2430678B (en) | 2009-05-06 |
KR101079552B1 (ko) | 2011-11-04 |
GB0701281D0 (en) | 2007-02-28 |
US7579054B2 (en) | 2009-08-25 |
GB2430678A (en) | 2007-04-04 |
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