WO2005112536A1 - 部品実装装置及び部品位置決め装置 - Google Patents
部品実装装置及び部品位置決め装置 Download PDFInfo
- Publication number
- WO2005112536A1 WO2005112536A1 PCT/JP2005/008854 JP2005008854W WO2005112536A1 WO 2005112536 A1 WO2005112536 A1 WO 2005112536A1 JP 2005008854 W JP2005008854 W JP 2005008854W WO 2005112536 A1 WO2005112536 A1 WO 2005112536A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- roller member
- mounting apparatus
- positioning
- component mounting
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53061—Responsive to work or work-related machine element
- Y10T29/53083—Responsive to work or work-related machine element including means to apply magnetic force directly to position or hold work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Definitions
- Component mounting device and component positioning device are Component mounting device and component positioning device
- the present invention relates to, for example, a component mounting apparatus for positioning one electronic component and mounting it on the other electronic component, and a component positioning device for positioning the component.
- a conventional component mounting apparatus 100 includes a moving head 104 that sucks and moves a component M by a nozzle 102, a reference mark 106 provided on the moving head 104, and a nozzle 102.
- a camera 108 for picking up a moving head 104 and a reference mark 106 for picking up and moving a part, and the imaging information power of the camera 108 also detects the position where the part M is picked up from the reference mark 106 provided on the moving head 104.
- An image processing means 110 for calculating the amount of deviation from the suction position of the component M whose relative position between the predetermined reference mark 106 and the nozzle 102 has been detected, and the position of the moving head 104 for correcting the amount of deviation.
- a control means 112 for mounting on a predetermined position that has been adjusted see Patent Document 1 below).
- the component M is sucked by the nozzle 102 of the moving head 104, moves on the camera 108, and the camera 108 moves the component M from the reference mark 106 provided on the moving head 104.
- the suction position is detected, a shift amount is calculated from the relative position between the predetermined reference mark 106 and the nozzle 102, and the detected suction position of the component M, and the movable head 104 is corrected so as to correct the shift amount. Since the position is adjusted and mounted at the predetermined position, the effect of mounting accuracy on the positional deviation of the camera 108 is reduced, and the component M sucked by the moving nozzle 102 can be recognized. It states that the cycle time can be reduced (speeded up).
- Patent Document 1 JP-A-5-63398
- the component mounting apparatus requires facilities such as a camera and an image processing means, and thus has a problem that the configuration of the apparatus is complicated and that the apparatus is expensive.
- the state in which the component is sucked and held by the nozzle is photographed, image analysis is performed, and then positioning is performed in a procedure for correcting the positional deviation of the component. .
- the present invention provides a component mounting apparatus and a component positioning method capable of reducing the manufacturing cost with a simple configuration and greatly improving the mounting speed of a further component. It is an object to provide a component positioning device.
- the invention according to claim 1 has a holding means for holding and horizontally moving a component, and an inclined portion.
- the component held by the holding means contacts the inclined portion to position the component.
- positioning means for performing the positioning.
- the invention according to claim 2 is the component mounting apparatus according to claim 1, wherein the positioning means has a first roller portion rotatably provided with an inclined side surface with which the component contacts. And wherein the horizontal movement speed of the holding means and the horizontal component of the peripheral speed of the first roller member with which the component comes into contact are substantially matched.
- the invention according to claim 3 is the component mounting apparatus according to claim 1, wherein the positioning means has a first roller portion rotatably provided with an inclined side surface with which the component contacts. And an auxiliary roller member rotatably provided at a position facing the first roller member and having an inclined side surface with which the component comes into contact.
- the invention according to claim 4 is the component mounting apparatus according to claim 3, wherein the horizontal movement speed of the holding means and the first roller member or Z and the auxiliary roller member, with which the component comes into contact. It is characterized in that the horizontal component of the peripheral velocity is substantially matched.
- the invention described in claim 5 is the component mounting apparatus according to any one of claims 2 to 4, wherein the first roller member or Z and the auxiliary roller member move horizontally of the holding means.
- a first rotation axis extending in a direction substantially perpendicular to the direction.
- the invention according to claim 6 is the component mounting apparatus according to claim 5, wherein the first rotation axis of the first roller member and the auxiliary roller member is a common and identical rotation axis. It is characterized by that.
- the invention according to claim 7 is the component mounting apparatus according to any one of claims 2 to 6, further comprising a control unit that controls the holding unit or Z and the first rotation axis.
- the horizontal moving speed of the holding means is V
- the number of rotations of the first roller member or Z and the auxiliary port member is N
- the number of rotations of the first roller member or Z and the auxiliary roller member is from the rotation center of the holding means.
- the invention according to claim 8 is the component mounting apparatus according to any one of claims 2 to 7, wherein the first roller member or Z and the auxiliary roller member are moved in a moving direction of the holding unit.
- a plurality of holding means are provided along the axis, and the holding means has a rotating portion that rotates together with the component about an axis substantially orthogonal to a moving direction of the holding means in a state where the component is held.
- the invention according to claim 9 is the component mounting apparatus according to any one of claims 2 to 8, wherein the movement of the component is based on the first roller member or Z and the auxiliary roller member. On the downstream side in the direction, an application means for applying a paste-like material to the component is provided.
- the invention according to claim 10 is the component mounting apparatus according to claim 9, wherein the application unit is configured to contact an outer peripheral surface rotatably provided with the paste-like material to the component.
- a second roller member for applying the paste-like material to a component wherein a horizontal moving speed of the holding means and a horizontal component of a peripheral speed of the second roller member contacting the component are substantially matched.
- the invention according to claim 11 is the component mounting apparatus according to claim 10, wherein the second roller member extends in a direction substantially orthogonal to a horizontal movement direction of the holding means. It has a rotation axis.
- An invention according to claim 12 is a component positioning device for positioning a moving component, wherein the rotating shaft rotatably provided and the moving component provided at an end of the rotating shaft are in contact with each other. And an inclined side surface for positioning the component in the axial direction of the rotating shaft.
- the component is horizontally moved while being held by the holding means, and is mounted on another component.
- the component when the component is moved by the holding means, the component smoothly moves to a predetermined position along the inclined portion of the positioning means and is positioned. Thereby, the mounting accuracy of the component held by the holding means can be improved.
- the component mounting apparatus can have a simple configuration and the manufacturing cost can be reduced. Further, since the component can be positioned while being horizontally moved by the holding means, the mounting speed of the component can be greatly improved.
- the component is positioned in contact with the inclined side surface of the first roller member while being held by the holding means.
- the horizontal speed of the peripheral speed of the first roller member is at the part where the component comes into contact.
- the relative speed between the directional component and the horizontal movement speed of the part can be made substantially zero. For this reason, even if the component comes into contact with the inclined side surface of the first roller member, the rotational force of the first opening member does not act on the component from the inclined side surface, so that the position of the component can be prevented from shifting.
- the components are positioned by contacting the inclined side surfaces of the first roller member and the auxiliary roller member while the component is held by the holding means. Thereby, positioning can be performed on both sides based on the moving direction of the component. As a result, the mounting accuracy of the components can be greatly increased.
- the first roller member or Z and the auxiliary roller member have the first rotation axis extending in a direction substantially orthogonal to the horizontal movement direction of the holding means. Therefore, by rotating the first rotating shaft, the rotation direction of the first roller member or Z and the auxiliary roller member can easily be matched with the moving direction of the component.
- the first rotating shaft of the first roller member and the auxiliary roller member is the same rotating shaft in common, whereby the number of parts can be reduced, and the number of parts can be reduced. It is possible to prevent the mounting device from being complicated. Also, the manufacturing cost of the component mounting apparatus can be reduced.
- the horizontal movement speed of the holding means is V
- the number of rotations of the first roller member or Z and the auxiliary roller member is N
- the first roller member or Z and the auxiliary roller are
- the horizontal movement speed of the means can be easily matched with the horizontal component of the peripheral speed of the first roller member or Z and the auxiliary roller member with which the parts are in contact.
- the rotating part is further substantially moved together with the component.
- the holding means is moved only in a direction (horizontal direction) perpendicular to the moving direction of the holding means. Positioning in the movement direction can also be performed.
- the application means for applying the paste-like material to the component is provided on the downstream side in the moving direction of the component based on the first roller member or Z and the auxiliary roller member. Therefore, the paste-like material can be applied to the positioned component. As a result, it is possible to improve the positional accuracy when applying the paste-like material to the component.
- the horizontal movement speed of the holding means and the horizontal component of the peripheral speed of the second roller member with which the component comes into contact are substantially matched, so that the second roller member of the component is provided. Since the relative speed with respect to the When laying the cloth, it is possible to prevent misalignment due to the contact of the component with the second roller member.
- the second roller member has the second rotation shaft extending in a direction substantially orthogonal to the horizontal movement direction of the holding means.
- the component when the component is moved, the component comes into contact with the inclined side surface, whereby the component is positioned in the axial direction of the rotating shaft.
- the component positioning device when the component positioning device is used for the component mounting device, the mounting accuracy of the component to be mounted can be improved.
- the component positioning device can have a simple configuration, and the manufacturing cost can be reduced.
- the component can be positioned while being moved, when the component positioning device is used in the component mounting device, the mounting speed of the component can be greatly improved.
- FIG. 1 is a schematic configuration diagram of a component mounting apparatus according to a first embodiment of the present invention.
- FIG. 2 is a view taken in the direction of arrows BB in FIG. 1.
- FIG. 3 is a diagram showing a peripheral speed of a positioning unit included in the component mounting apparatus according to the first embodiment of the present invention.
- FIG. 4 (A) is a conceptual diagram showing, from above, the positioning of a component by the component mounting apparatus according to the first embodiment of the present invention
- FIG. 4 (B) is a component mounting according to the first embodiment of the present invention.
- FIG. 4 is a conceptual diagram showing the positioning of components by the device, as well as the lateral force.
- FIG. 5 is a perspective view showing an electronic component being transported by the component mounting apparatus according to the first embodiment of the present invention.
- FIG. 6 is a schematic configuration diagram of a positioning unit included in a component mounting apparatus according to a second embodiment of the present invention.
- FIG. 7 is a schematic configuration diagram of a component mounting apparatus according to a third embodiment of the present invention.
- FIG. 8 is a schematic configuration diagram of a component mounting apparatus according to the related art. Explanation of reference numerals
- Control unit (control means)
- the component mounting apparatus 10 of the present embodiment includes a base 12 fixed to a floor surface G.
- a component supply stage 14 to which an electronic component (component) M is supplied is provided on the upper surface of the base portion 12.
- the electronic component M is supplied to the upper surface of the component supply stage 14 by a component supply unit (not shown) or the like.
- a mounting stage 16 is provided on the upper surface of the base 12.
- Another electronic component P on which the electronic component M is mounted is mounted on the mounting stage 16 by a component mounting means (not shown).
- an operation shaft 18 which also extends near the component supply stage 14 to the vicinity of the mounting stage 16.
- a suction head (holding means) 20 is attached to the operation shaft 18 so as to be movable in the axial direction (horizontal direction, arrow X direction in FIG. 1).
- the suction head 20 is configured to move horizontally on the operation shaft 18 by rotating the operation shaft 18.
- the suction head 20 is configured to be able to move in a direction (vertical direction, arrow Y direction in FIG. 1) substantially orthogonal to the axial direction of the operation shaft 18.
- the suction head 20 moves in the horizontal direction (the direction of the arrow X in FIG. 1) on the operation shaft 18.
- the head body 22 has a suction nozzle 24 attached to the head body 22 for sucking the electronic component M.
- the head body 22 has a suction hose having one end connected to the suction nozzle 24 (not shown).
- the electronic component M can be suction-held by the suction nozzle 24 by air suction by an external suction pump (not shown) to which the other end of the suction hose is connected.
- suction head 20 has been described as an example in which the suction head 20 can be moved in the horizontal direction in accordance with the rotation of the operation shaft 18, the suction head 20 is not limited to this. It may be configured to be movable in the direction (horizontal direction).
- a positioning roller device 26 is provided on the upper surface of the base 12 and between the component supply stage 14 and the component mounting stage 16.
- the positioning roller device 26 includes a first support member 28, a first rotation shaft 32 rotatably mounted on the first support member 28, and a first roller member 30 mounted on the first rotation shaft 32. It is configured.
- the first rotating shaft 32 is disposed so that its axial direction extends in a direction substantially orthogonal to the axial direction of the operation shaft 18 (the direction of arrow Z in FIG. 2).
- the first roller member 30 is configured to rotate with the rotation of the first rotation shaft 32, and includes a cylindrical roller portion main body 34 and a positioning portion integrally formed with the roller portion main body 34 and having an inclined side surface 36A. 36 and. Further, the positioning portion 36 has a flat portion 36B continuous with the inclined side surface 36A.
- an application roller device 40 for applying a paste-like material (for example, an adhesive) to the electronic component M sucked and held by the suction nozzle 24 becomes detachable. It is provided as follows.
- the application roller device 40 includes a second support member 42, a second rotation shaft 46 rotatably mounted on the second support member 42, and a second roller member 44 mounted on the second rotation shaft 46. It is configured.
- the second rotating shaft 46 is arranged so that the axial direction thereof extends in a direction substantially orthogonal to the axial direction of the operation shaft 18 (the direction of the arrow Z in FIG. 2).
- the second roller member 44 is a cylindrical roller, and is configured to rotate with the rotation of the second rotation shaft 46.
- the application roller device 40 may be removed from the component mounting device 10 if it is unnecessary if it is appropriately provided as needed.
- the component mounting apparatus 10 has a control unit (control means) 48,
- the rotation of the head 20 (horizontal movement), the vertical movement of the suction head 20, and the rotation of the first rotation shaft 32 and the second rotation shaft 46 can be controlled by the control unit 48.
- an electronic component M is supplied to the upper surface of the component supply stage 14 by component supply means (not shown).
- the suction head 20 is controlled by the control unit 48 and moves downward (in the direction of arrow D in FIG. 1).
- a suction pump (not shown) operates, and air is sucked by a suction hose (not shown), so that the suction nozzle 24 holds the electronic component M by suction.
- the suction force of the suction nozzle 24 does not fall from the suction nozzle 24 and the positioning direction. It is set so that it can be moved with respect to the suction nozzle 24.
- the suction head 20 is controlled by the control unit 48 and moves upward (in the direction of the arrow U in FIG. 1), and further moves horizontally as described later.
- the operation shaft 18 is rotated by the control unit 48, and the suction head 20 is mounted. It moves in the horizontal direction (the direction of the arrow X in Fig. 1) with a force toward stage 16
- the suction head 20 moves in the horizontal direction in a state where the electronic component M is suction-held by the suction nozzle 24, the electronic component M enters the region of the inclined side surface 36A of the positioning section 36 while being transported in the horizontal direction. At this time, a part of the electronic component M comes into contact with the inclined side surface 36A, and the electronic component M moves in a predetermined direction (along arrow Z1 in FIG.
- the component mounting apparatus 10 can be simplified, and the manufacturing cost can be reduced. can do.
- the electronic component M is horizontally moved by the suction head 20 (transported state). Thus, since the electronic component M can be positioned, the mounting speed of the electronic component M can be greatly improved.
- At least one force of the operating shaft 18 or the first rotating shaft 32 The horizontal moving speed of the electronic component M (the horizontal moving speed of the suction head 20) and the first roller member 30 ( The control unit 48 controls the peripheral speed of the first rotating shaft 32) so that the horizontal component is substantially the same.
- the rotation speed of the first roller member 30 is N
- the peripheral speed of the contact point T (on the transfer line) with the inclined side surface 36A of the electronic component M is Vr
- the rotation speed of the first roller member 30 is Assuming that the shortest distance from the center O to the transport line of the electronic component M is A, the rotational center force of the first roller member 30 is also the distance R ( ⁇ ) from the contact point T of the electronic component M to:
- Vry Vr-COS ......... (3)
- control unit 48 controls the drive of the suction head 20 (operating shaft 18) or the first roller member 30 (first rotating shaft 32) so that the transport speed V of the electronic component ⁇ becomes 2 ⁇ AN.
- the control unit 48 controls the drive of the suction head 20 (operating shaft 18) or the first roller member 30 (first rotating shaft 32) so that the transport speed V of the electronic component ⁇ becomes 2 ⁇ AN.
- the speed relative to the speed can be made substantially zero. As a result, even when the electronic component M comes into contact with the inclined side surface 36A of the first roller member 30, the rotational force of the first roller member 30 does not act on the electronic component M from the inclined side surface 36A. Can be prevented.
- the electronic component M is positioned by the same first roller member 30 even when a plurality of suction heads 20 are provided on the operation shaft 18 and a plurality of suction heads 20 may be provided. In addition, it is possible to prevent variation in the position between the electronic components, and to improve the positioning accuracy.
- the electronic component M positioned by the first roller member 30 is transported in the horizontal direction (the direction of the arrow X in FIG. 1) while being sucked and held by the suction head 20.
- the electronic component M comes into contact with the outer peripheral surface of the second roller member 44, and the paste-like material s that has been previously attached to the outer peripheral surface is applied to the electronic component M as shown in FIG. Since the electronic component M to which the paste-like material S is applied is already positioned, the positional accuracy of the application position where the paste-like material S is applied can be improved.
- the drive of the second rotating shaft 46 is controlled by the control unit 48 so that the peripheral speed of the second roller member 44 is substantially the same as the transport speed V of the electronic component M. Even when the electronic component M comes into contact with the outer peripheral surface of the member 44, the relative speed of the electronic component M to the second roller member 44 becomes substantially zero, so that the outer peripheral surface force of the second roller member 44 applies a rotational force to the electronic component M. There is no. As a result, it is possible to prevent the electronic component M positioned by the first roller member 30 from coming into contact with the second roller member 44 during the application of the paste material S and being displaced. Further, since the paste-like material S is applied from the second roller member 44 while the electronic component M is being conveyed, there is no time loss before the electronic component M is mounted. .
- the electronic component M that is positioned and to which the paste-like material S is applied It is mounted on another electronic component P mounted on the mounting stage 16.
- the mounting accuracy can be significantly improved.
- the component mounting apparatus is configured such that the first rotation shaft 32 of the component mounting apparatus 10 according to the first embodiment passes through the first roller member 30.
- An auxiliary roller member 50 is attached to the first rotating shaft 32 so as to face the first roller member 30.
- the auxiliary roller member 50 has the same configuration as the first roller member 30 and includes a cylindrical roller portion main body 52 and a positioning portion 54 integrally formed with the roller portion main body 52 and having an inclined side surface 54A. I have. Further, the positioning portion 54 has a flat portion 54B continuous with the inclined side surface 54A.
- the first roller member 30 and the auxiliary roller member 50 are provided on the first rotating shaft 32 such that the positioning portions 36 and 54 thereof are opposed to each other. .
- the electronic component M comes into contact with at least one of the inclined side surface 36A of the first roller member 30 or the inclined side surface 54A of the auxiliary roller member 50, and the both sides of the transport line. (Arrow Z1 side and arrow Z2 side in Fig. 6). Thereby, the positioning accuracy of the electronic component M can be greatly increased.
- the common first rotating shaft 32 is used as the rotating shaft of the first roller member 30 and the auxiliary roller member 50, the number of components can be reduced, and the manufacturing cost of the component mounting apparatus can be reduced. it can.
- the suction nozzle (rotating unit) 24 It is configured to be rotatable with respect to the pad body 22. That is, a rotating shaft (not shown) extending in a direction (arrow Y direction in FIG. 7) substantially perpendicular to the axial direction of the operating shaft 18 (arrow X direction in FIG. 7) can be rotated by the head main body 22.
- the suction nozzle 24 is attached to the rotating shaft (not shown).
- the rotation axis (not shown) is driven and controlled by the control unit 48.
- a plurality of positioning roller devices are arranged on the base 12 along the axial direction of the operation shaft 18. That is, the positioning roller device 62 is provided on the downstream side of the positioning roller device 26 in the electronic component conveyance direction.
- the configuration of the positioning roller device 62 newly provided in the component mounting apparatus 60 of the present embodiment is the same as the configuration of the positioning roller device 26 provided in the component mounting apparatus 10 of the first embodiment. Detailed description is omitted.
- the configuration in which the application roller device 40 (see FIG. 1) is not provided is shown.
- the present invention is not limited to this configuration, as in the component mounting apparatus 10 of the first embodiment.
- a configuration in which the application roller device 40 is provided downstream of the positioning roller device 30 in the electronic component transport direction may be employed.
- the control unit 48 The rotating shaft (not shown) of the suction head 20 is driven to rotate by about 90 °.
- the electronic component M sucked and held by the suction nozzle 24 is rotated by about 90 °.
- the electronic component M rotated by about 90 ° is conveyed in the horizontal direction while being suction-held by the suction nozzle 24, and is positioned by the positioning roller device 62 in a direction orthogonal to the conveyance direction.
- the application roller device 40 may be appropriately provided as in the component mounting apparatus 10 of the first embodiment, and the auxiliary roller member 50 may be appropriately provided as in the component mounting apparatus of the second embodiment. Good.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/576,837 US7726012B2 (en) | 2004-05-17 | 2005-05-16 | Component-mounting apparatus and component-positioning unit having roller member with sloped positioning surface |
JP2006518520A JP3985169B2 (ja) | 2004-05-17 | 2005-05-16 | 部品実装装置 |
CNB2005800006844A CN100471381C (zh) | 2004-05-17 | 2005-05-16 | 组件安装装置和组件定位单元 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-147043 | 2004-05-17 | ||
JP2004147043 | 2004-05-17 |
Publications (1)
Publication Number | Publication Date |
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WO2005112536A1 true WO2005112536A1 (ja) | 2005-11-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/008854 WO2005112536A1 (ja) | 2004-05-17 | 2005-05-16 | 部品実装装置及び部品位置決め装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7726012B2 (ja) |
JP (1) | JP3985169B2 (ja) |
KR (1) | KR100753336B1 (ja) |
CN (1) | CN100471381C (ja) |
WO (1) | WO2005112536A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109792859A (zh) * | 2016-10-05 | 2019-05-21 | 株式会社富士 | 元件安装机 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4384439B2 (ja) * | 2002-11-21 | 2009-12-16 | 富士機械製造株式会社 | 対基板作業機、対基板作業システムおよび対基板作業機用作業ヘッド使用準備処理プログラム |
ITUD20070156A1 (it) * | 2007-09-04 | 2009-03-05 | Baccini S P A | Disositivo di posizionamento per posizionare uno o piu' wafer a base di silicio, in particolare per celle fotovoltaiche, in un'unita' di deposizione del metallo |
Citations (4)
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JPH0326428A (ja) * | 1989-06-23 | 1991-02-05 | Matsushita Electric Works Ltd | 部品装着機の位置決めチャック |
JPH08203949A (ja) * | 1995-01-26 | 1996-08-09 | Sony Corp | ワイヤーボンディング装置 |
JP2000133993A (ja) * | 1998-10-28 | 2000-05-12 | Sony Corp | 電子部品の位置決め装置 |
JP2002203709A (ja) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | 複合電子部品の製造方法及びその装置 |
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JP3058708B2 (ja) * | 1991-04-09 | 2000-07-04 | 松下電器産業株式会社 | 部品装着機 |
JPH0563398A (ja) | 1991-08-22 | 1993-03-12 | Philips Gloeilampenfab:Nv | 部品実装方法及び部品実装装置 |
US5741114A (en) * | 1992-08-07 | 1998-04-21 | Yamaha Hatsudoki Kabushiki Kaisha | Method for mounting components and apparatus therefor |
DE19919924A1 (de) * | 1999-04-30 | 2000-11-16 | Siemens Ag | Verfahren zum Betrieb eines Bestückautomaten, Bestückautomat, auswechselbare Komponente für einen Bestückautomaten und System aus einem Bestückautomaten und einer auswechselbaren Komponente |
US6729018B1 (en) * | 1999-09-03 | 2004-05-04 | Matsushita Electric Industrial Co., Ltd. | Apparatus for mounting components |
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2005
- 2005-05-16 JP JP2006518520A patent/JP3985169B2/ja active Active
- 2005-05-16 US US10/576,837 patent/US7726012B2/en active Active
- 2005-05-16 CN CNB2005800006844A patent/CN100471381C/zh active Active
- 2005-05-16 WO PCT/JP2005/008854 patent/WO2005112536A1/ja active Application Filing
- 2005-05-16 KR KR1020067005378A patent/KR100753336B1/ko active IP Right Grant
Patent Citations (4)
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JPH0326428A (ja) * | 1989-06-23 | 1991-02-05 | Matsushita Electric Works Ltd | 部品装着機の位置決めチャック |
JPH08203949A (ja) * | 1995-01-26 | 1996-08-09 | Sony Corp | ワイヤーボンディング装置 |
JP2000133993A (ja) * | 1998-10-28 | 2000-05-12 | Sony Corp | 電子部品の位置決め装置 |
JP2002203709A (ja) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | 複合電子部品の製造方法及びその装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109792859A (zh) * | 2016-10-05 | 2019-05-21 | 株式会社富士 | 元件安装机 |
EP3525564A4 (en) * | 2016-10-05 | 2019-10-16 | Fuji Corporation | COMPONENT ASSEMBLY MACHINE |
CN109792859B (zh) * | 2016-10-05 | 2021-03-16 | 株式会社富士 | 元件安装机 |
Also Published As
Publication number | Publication date |
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JPWO2005112536A1 (ja) | 2008-03-27 |
KR20060053001A (ko) | 2006-05-19 |
CN1820561A (zh) | 2006-08-16 |
JP3985169B2 (ja) | 2007-10-03 |
CN100471381C (zh) | 2009-03-18 |
US20080244899A1 (en) | 2008-10-09 |
US7726012B2 (en) | 2010-06-01 |
KR100753336B1 (ko) | 2007-08-30 |
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