JP5610330B2 - コンベアの搬送性能を強化するシステム - Google Patents
コンベアの搬送性能を強化するシステム Download PDFInfo
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- JP5610330B2 JP5610330B2 JP2008530753A JP2008530753A JP5610330B2 JP 5610330 B2 JP5610330 B2 JP 5610330B2 JP 2008530753 A JP2008530753 A JP 2008530753A JP 2008530753 A JP2008530753 A JP 2008530753A JP 5610330 B2 JP5610330 B2 JP 5610330B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G7/00—Devices for assisting manual moving or tilting heavy loads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Registering Or Overturning Sheets (AREA)
Description
ホイール164及びシャフト160を、同じ材料(1部分として、典型的には金属)から、機械加工で作製する。
外側リング166の組立てを次に行う。
最後に、外側接触面の第2機械加工段階を、行う。
基板が真空ポートを被覆しないとき、真空のスイッチを入れる。
基板が真空ポートの幾つかのみを被覆するとき、真空のスイッチを入れる。
基板が全真空ポートを被覆する(これは、並列ホイール構成に関する場合である)とき、真空のスイッチを入れる。
基板が移動しないとき、真空のスイッチを入れる。
基板がプラットフォーム上で搬送されているとき、真空のスイッチを入れる。
駆動ホイールが回転していないとき、真空のスイッチを入れる。
駆動ホイールが回転しているとき、真空のスイッチを入れる。
基板をモジュール1000全体で、Y方向に能動的に真空予圧駆動ユニット1200で(能動的は、真空“オン”を意味する)搬送する。
基板をモジュール1000全体で、X方向に能動的に真空予圧駆動ユニット1100で(能動的は、真空“オン”を意味する)搬送する。
基板を、真空予圧駆動ユニット1200で(Y方向に)、モジュール1000の中心に搬送し、次にユニット1200の駆動ホイールを停止させる。その後、基板を引続き、X方向に(真空予圧駆動ユニット1100の真空を、“オン”に設定し、真空予圧駆動ユニット1200の真空を“オフ”に設定し、次にユニット1100の駆動ホイールを動作させる)に移動させる。
基板を、(a)真空予圧駆動ユニット1200によって(Y方向に)モジュール1000の中心に移送し(駆動ホイール停止し)、(b)真空予圧回転ユニット1300への真空を“オン”に設定し、その後ユニット1100への真空を“オフ”にして、休止させずにハンドシェークさせ、(c)ホイール1301を動作させて基板を完全に90度回転させ、(d)ユニット1100への真空を“オン”にし、回転ユニット1300への真空を“オフ”にし、(e)ユニット1200のホイールの駆動を作動させて、X方向に基板を移送する。
基板を、X方向に、真空予圧駆動ユニット1200で、モジュール1000の中心に搬送し、停止、回転して、引続きX方向を出る。
1mのストロークに対して約10μmの位置決め精度。
20cm/秒より高速で1%未満の速度リップル。
0.5Gまで加速(ホイール数によって異なる)。
最高約100cm/秒までの速度。
20 基礎構造部
120、820a、820b、820c 駆動ホイール
121、164、1301 ホイール
122 駆動機構
123、180 シャフト
124 ベアリング
125 3偏揺伝達ボックス
154 内側部分
156、166 外側部分
181 交差シャフト
182 磁気伝達ユニット
183 第2磁気伝達ユニット
200 カウンタプレート
201 体積部
205 開口部(スロット)
210 真空ポート
300 空力レール
301 エアクッション
310 圧力ポート
319 流量制限器
382 大気孔
400 列
420 側板
425 調整用アイドラ
430 ベルト
498 真空予圧コンベヤユニット
500、501 空力セクション
510 上面
520 非接触空力プラットホーム
530、600、701、702、704、1001、1001a 非接触プラットホーム
550、756a、756b 真空予圧搬送ユニット
555 真空予圧コンベヤ
560、710、720、730、740、770、780、790、1100、1200 真空予圧駆動ユニット
565 直線運動機構
566 真空パッド
567 細長スロット
752 単一運動システム
754 三方ギヤボックス
911、912、921、931、941、942、951 真空ポート
1000、1000a モジュール
1210 主真空管路
1110a、1110b、1210a、1210b 並列構成ユニット
1211 弁
1220、1230 主加圧エア管路
1300、1300a 真空予圧回転ユニット
2000 非接触トラック
3000 制御ボックス
Claims (25)
- 略平坦な物体(10)を、搬送及び操作するシステムであって、前記システムは、
少なくとも1つの真空予圧駆動ホイール(120)と少なくとも1つのカウンタプレート(200)から構成される1つまたは複数の駆動ユニット、及び、
前記物体(10)を支持するための少なくとも1列の複数ホイール(120a)又は空力レール(300)、を備え、
前記カウンタプレート(200)は前記真空予圧駆動ホイール(120)の両側に配置され、前記カウンタプレート(200)のそれぞれは前記物体(10)を吸引するための、1つまたは複数の真空ポート(210)を含み、前記真空ポート(210)は前記真空予圧駆動ホイール(120)に隣接しており、
前記カウンタプレート(200)、及び、
前記真空予圧駆動ホイール(120)、及び、前記少なくとも1列の複数ホイール(120a)又は空力レール(300)、
のうちの一方のみを昇降できるように、前記カウンタプレート(200)は前記真空予圧駆動ホイール(120)、及び、前記少なくとも1列の複数ホイール(120a)又は空力レール(300)とは分離して支持され、
各駆動ユニットの前記真空ポート(210)は、制御可能な弁(1211)を通じて真空源に接続できる主真空管路(1210)に流体工学的に接続され、
前記カウンタプレート(200)には、周辺圧力ポート(310)が更に含まれ、前記周辺圧力ポート(310)が圧力源に接続されると、支持エアクッションが局所的に作成されて前記物体に反発力が付与され、前記物体と前記システムとの間の物理的接触が防止され、前記周辺圧力ポート(310)は前記真空予圧駆動ホイール(120)との位置関係において前記真空ポート(210)よりも遠くに配置されており、
前記主真空管路(1210)が前記真空源に接続されると、前記物体(10)を前記真空予圧駆動ホイール(120)に向かって吸引する力が強まり、その結果、前記物体(10)を水平方向に駆動する力が強まることを特徴とするシステム。 - 制御可能な弁(1231)を介して前記主真空管路に接続する加圧エア供給配管(1230)を更に備える、請求項1に記載のシステム。
- 前記真空ポートは、流量制限器(219)を介して前記真空源に連通すること、を特徴とする請求項1に記載のシステム。
- 前記周辺圧力ポート(310)は、流量制限器(319)を介して前記圧力源と連通すること、を特徴とする請求項1に記載のシステム。
- 前記駆動ユニットには、共通シャフト(123)を有して並列に配列した真空予圧駆動ホイール(120)を含むこと、を特徴とする請求項1に記載のシステム。
- 前記共通シャフトの真空予圧駆動ホイールと前記シャフトを一体化し、単一の金属片から機械加工で作成すること、を特徴とする請求項5に記載のシステム。
- 前記共通シャフトの各真空予圧駆動ホイールには、摩擦を高める非金属製リング(156,166)を備えること、を特徴とする請求項6に記載のシステム。
- 各駆動ユニットを、モータ(122)で別々に駆動すること、を特徴とする請求項5に記載のシステム。
- 各駆動ユニットの前記モータ(122)を、前記駆動ユニットの共通シャフトに直接接続すること、を特徴とする請求項8に記載のシステム。
- 2つ以上の隣接した駆動ユニットを、共通のモータ(122)で駆動すること、を特徴とする請求項5に記載のシステム。
- 2つ以上の隣接した駆動ユニットを、別々のモータ(122a、122b)で駆動し、電子的に同期させること、を特徴とする請求項5に記載のシステム。
- 2つ以上の駆動ユニットを、共通軸に沿って略平行に整列させ、別々に動作可能にして差動駆動させること、を特徴とする請求項5に記載のシステム。
- 少なくとも幾つかの前記駆動ユニットには、運動制御用エンコーダ(1222)を更に備えること、を特徴とする請求項5に記載のシステム。
- 各駆動ユニット(400)には、次々と配列する真空予圧駆動ホイールを含むこと、を特徴とする請求項1に記載のシステム。
- 前記駆動ユニットを、容易に2方向以上に搬送するよう配列すること、を特徴とする請求項1に記載のシステム。
- 前記駆動ユニット(1100,1200)を、容易に略直交方向に搬送するよう配列すること、を特徴とする請求項15に記載のシステム。
- 少なくとも1つの回転駆動ユニットには、円に沿って分布し、前記円の接線と同方向に駆動し、容易に前記物体を回転させる真空予圧駆動ホイール(1310)を含むこと、を特徴とする請求項15に記載のシステム。
- 前記少なくとも1つの回転駆動ユニットを、ベベルギヤ伝動ボックス(1320)で駆動させること、を特徴とする請求項17に記載のシステム。
- 昇降機構を、前記1つ又は複数の駆動ユニットの1つ又は複数に備えて、前記駆動ユニットを昇降させること、を特徴とする請求項1に記載のシステム。
- 昇降機構を、前記1つ又は複数の駆動ユニットの1つ又は複数に備えて、前記真空予圧駆動ホイールを昇降させること、を特徴とする請求項1に記載のシステム。
- 各駆動ユニットの動作を制御する制御ユニット(1222)を更に備えること、を特徴とする請求項1に記載のシステム。
- 近接センサを更に備えること、を特徴とする請求項1に記載のシステム。
- 前記1つ又は複数の駆動ユニット(550)を、前記システムから分離可能にすること、を特徴とする請求項1に記載のシステム。
- 前記真空予圧駆動ホイールは、前記1つ又は複数のカウンタプレートの上面から上に50〜500μmの範囲で突出すること、を特徴とする請求項1に記載のシステム。
- 駆動ユニットの前記真空予圧駆動ホイールには、各々二重ホイール(820c)を含むこと、を特徴とする請求項1に記載のシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71695605P | 2005-09-15 | 2005-09-15 | |
US60/716,956 | 2005-09-15 | ||
PCT/IL2006/001085 WO2007032011A2 (en) | 2005-09-15 | 2006-09-14 | A system for enhancing performance of conveyors |
Publications (2)
Publication Number | Publication Date |
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JP2009517302A JP2009517302A (ja) | 2009-04-30 |
JP5610330B2 true JP5610330B2 (ja) | 2014-10-22 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008530753A Active JP5610330B2 (ja) | 2005-09-15 | 2006-09-14 | コンベアの搬送性能を強化するシステム |
Country Status (7)
Country | Link |
---|---|
US (1) | US7857121B2 (ja) |
EP (1) | EP1934121A4 (ja) |
JP (1) | JP5610330B2 (ja) |
KR (1) | KR20080059207A (ja) |
CN (1) | CN101541651B (ja) |
TW (1) | TWI401201B (ja) |
WO (1) | WO2007032011A2 (ja) |
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KR20080059207A (ko) | 2008-06-26 |
TWI401201B (zh) | 2013-07-11 |
US7857121B2 (en) | 2010-12-28 |
EP1934121A4 (en) | 2011-09-28 |
CN101541651A (zh) | 2009-09-23 |
CN101541651B (zh) | 2012-10-31 |
EP1934121A2 (en) | 2008-06-25 |
JP2009517302A (ja) | 2009-04-30 |
US20080302637A1 (en) | 2008-12-11 |
WO2007032011A3 (en) | 2009-04-09 |
TW200823138A (en) | 2008-06-01 |
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