WO2005107243A1 - 撮像装置及び微小レンズアレイの製造方法 - Google Patents
撮像装置及び微小レンズアレイの製造方法 Download PDFInfo
- Publication number
- WO2005107243A1 WO2005107243A1 PCT/JP2005/007864 JP2005007864W WO2005107243A1 WO 2005107243 A1 WO2005107243 A1 WO 2005107243A1 JP 2005007864 W JP2005007864 W JP 2005007864W WO 2005107243 A1 WO2005107243 A1 WO 2005107243A1
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- WIPO (PCT)
- Prior art keywords
- microlens array
- imaging device
- groove
- light
- microlenses
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 13
- 238000006243 chemical reaction Methods 0.000 claims abstract description 13
- 238000003384 imaging method Methods 0.000 claims description 90
- 239000000463 material Substances 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000003973 paint Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- 239000011358 absorbing material Substances 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 238000005192 partition Methods 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000033772 system development Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
Definitions
- the present invention relates to an imaging device.
- the present invention relates to an imaging device in which a microlens array in which a plurality of microlenses is arranged is arranged on the subject side of an imaging device having a large number of pixels. Further, the present invention relates to a method for manufacturing the microlens array.
- a configuration for realizing miniaturization of an imaging system a configuration using a lens array optical system in which a plurality of minute lenses are arranged on a plane is known.
- the imaging system can be made thinner in the direction of the optical axis, and the diameter of each minute lens is small, so that aberrations can be relatively suppressed.
- An imaging system using such a lens array is disclosed in Japanese Patent Publication No. 59-50042.
- This imaging system includes, in order from the subject side, a microlens array in which a plurality of microlenses are arranged in a plane, and a pinhole mask in which a plurality of pinholes corresponding to the microlenses are formed in a plane. And an image plane on which light passing through each pinhole forms an image.
- Each microlens forms a reduced image of the subject on the pinhole mask, and each pinhole passes (samples) different portions of the light of the reduced image. As a result, a subject image is formed on the image plane.
- the resolution of a subject image formed on an image plane depends on the number and density of minute lenses (ie, pinholes). It was difficult to achieve high image quality.
- the arrangement of the constituent units consisting of a pair of microlenses and pinholes determines the arrangement of the sampling points of the obtained image.
- there is a limit to the miniaturization of microlenses and it has been difficult to achieve high resolution.
- the luminous flux reaching the image plane is restricted by the pinhole, the light amount loss is large and there is a problem in sensitivity.
- this imaging device includes a microlens array 111 in which a plurality of microlenses 11 la are arranged in the same plane and an optical signal from each microlens 11 la, as shown in FIG. It comprises a partition layer 112 composed of a lattice-shaped partition 112a for separating so as not to cause interference, and a light receiving element array 113 in which a large number of photoelectric conversion elements 113a are arranged in the same plane.
- One microlens 11 la, a corresponding space separated by a partition 112a, and a plurality of photoelectric conversion elements 113a constitute one imaging unit 115.
- the minute lens 11la forms a subject image on a corresponding plurality of photoelectric conversion elements 113a.
- a captured image is obtained for each imaging unit 115.
- the resolution of this photographed image depends on the number (pixel number) of the photoelectric conversion elements 113a constituting one imaging unit 115. Since the relative positions of the individual microlenses 11 la with respect to the subject are different, the imaging positions of the subject images formed on the plurality of photoelectric conversion elements 113 a are different for each imaging unit 115. As a result, the obtained captured image differs for each imaging unit 115. By performing signal processing on the plurality of different captured images, one image can be obtained.
- each imaging unit 115 the number of pixels constituting each imaging unit 115 is small, so the quality of a captured image obtained from each imaging unit 115 is low.
- reconstructing the image by performing signal processing using the captured images slightly shifted from each other and obtained, it is possible to obtain an image having the same image quality as that obtained by capturing with a large number of photoelectric conversion elements.
- crosstalk In the imaging device shown in FIG. 12, light from the minute lens 11 la enters the photoelectric conversion element 113 a of the adjacent imaging unit 115 that does not correspond to the minute lens 11 la (this phenomenon is referred to as “crosstalk”). ), Stray light is generated, and it is impossible to reconstruct a high-quality image, or light loss occurs.
- the partition layer 112 is provided to prevent this crosstalk.
- the thickness of the partition 112a (the thickness in a direction parallel to the surface on which the photoelectric conversion elements 113a are arranged) is large, and the number of the photoelectric conversion elements 113a included in one imaging unit 115 is reduced, and the image quality is reduced. Reduce. Therefore, the thickness of the partition 112a is preferably small.
- An imaging device includes an imaging device having a plurality of pixels having a photoelectric conversion function and a plurality of microlenses for forming a subject image on the plurality of pixels of the imaging device.
- the microlens array includes a lattice-shaped groove between the adjacent microlenses, and the depth of the groove is greater than half the thickness of the microlens array.
- a microlens array having a plurality of microlenses having a spherical surface or an aspherical surface on one surface and a flat surface on the other surface is obtained by resin molding. And irradiating the other surface light of the microlens array to form grooves in the other surface in a lattice pattern.
- a second manufacturing method of the imaging device of the present invention includes a plurality of microlenses having a spherical surface or an aspherical surface on one surface, a lattice-like groove on the other surface, and the other surface being Removing the groove to obtain a flat lens array, and a step of injecting a solution obtained by dissolving a black paint in a solvent into the groove to perform black processing on the side surface of the groove.
- FIG. 1 is a partially cutaway perspective view of an imaging device according to Embodiment 1 of the present invention.
- FIG. 2 is a perspective view of a microlens array used in the imaging device according to Embodiment 1 of the present invention, as viewed from the surface force on the solid-state imaging device side.
- FIG. 3 is a cross-sectional view of the microlens array taken along line III-III in FIG. 2 in Embodiment 1 of the present invention.
- FIG. 4 is a cross-sectional view showing how stray light is generated when the depth of the groove of the microlens array is half the thickness of the microlens array.
- FIG. 5 is a cross-sectional view showing how stray light is suppressed when the depth of the groove of the microlens array is 70% of the thickness of the microlens array.
- FIG. 6 is a cross-sectional view of another microlens array used in the imaging device according to Embodiment 1 of the present invention.
- FIG. 7 is a cross-sectional view of a microlens array used in the imaging device according to Embodiment 2 of the present invention.
- FIG. 8 is a cross-sectional view of another microlens array used for the imaging device according to Embodiment 2 of the present invention.
- FIG. 9 is a partially cutaway perspective view of an imaging device according to Embodiment 3 of the present invention.
- FIG. 10 is a cross-sectional view of a microlens array used in an imaging device according to Embodiment 3 of the present invention.
- FIG. 11A is a cross-sectional view showing one step of an example of the method for manufacturing a microlens array of the present invention.
- FIG. 11B is a cross-sectional view showing one step of an example of the method for manufacturing a microlens array of the present invention.
- FIG. 11C is a cross-sectional view showing one step of an example of the method for manufacturing a microlens array of the present invention.
- FIG. 11D is a cross-sectional view showing one step of an example of the method for manufacturing a microlens array of the present invention.
- FIG. 12 is an exploded perspective view showing a schematic configuration of a conventional imaging device.
- the material of the microlens array is made of a light-transmitting resin. As a result, it is possible to capture clear images with little light loss. Also, by using a resin material, the production is easy.
- the microlens array is a plano-convex lens array in which the microlens is formed on one surface, and the groove is formed on the other surface. It is preferable that the other surface faces the image sensor. Thus, the effects of stray light and crosstalk can be sufficiently reduced within the limited thickness range.
- a light-absorbing material is provided on a side surface of the groove. Thereby, stray light and crosstalk can be further reduced.
- the light absorbing material is preferably black. Thereby, stray light and crosstalk can be further reduced.
- the width of the groove increases as approaching the imaging element.
- the groove is filled with a second material having a light transmittance smaller than that of the first material constituting the microlens array.
- the second material includes a material having a light absorbing action.
- the second material has a larger refractive index than the first material. This makes it difficult for total reflection to occur at the interface between the first material and the second material, and light that has entered the first material force at this interface is more likely to enter the second material. As a result, light is reflected at the interface. The stray light generated by the above can be prevented.
- the microlens array is manufactured by resin molding. Thereby, it is possible to efficiently manufacture the micro lens array.
- a step of further injecting a solution obtained by dissolving a black paint in a solvent into the groove and subjecting the side surface of the groove to black processing is preferable to provide This makes it possible to easily and efficiently perform black coating on the side surface of the groove.
- FIG. 1 is a partially cutaway perspective view of an imaging device according to Embodiment 1 of the present invention.
- 1 is a microlens array in which a plurality of microlenses la having a spherical or aspherical surface are arranged in the same plane in the vertical and horizontal directions, 3 is a large number of pixels 3a having photoelectric conversion arranged in the same plane in the vertical and horizontal directions.
- Solid-state imaging device for example, CCD
- a plurality of pixels 3a correspond to one microlens la, and these constitute one imaging unit 5.
- the minute lens la forms a subject image on a corresponding plurality of pixels 3a.
- the minute lens la is formed on the surface (subject side) of the minute lens array 1 opposite to the solid-state imaging device 3.
- FIG. 2 is a perspective view of the microlens array 1 as viewed from the surface force on the solid-state imaging device side.
- FIG. 3 is a cross-sectional view of the microlens array 1 taken along the line III-III in FIG.
- the microlens array 1 is made of light-transmitting resin, and has a plurality of microlenses la formed on one surface (the surface on the subject side), and the other surface (the surface on the solid-state image sensor 3 side) is substantially flat. Is a plano-convex lens array.
- slit grooves 20 are formed in a lattice shape along the boundary between the adjacent imaging units 5.
- a pillar portion 22 is formed by the lattice-shaped groove 20.
- the micro lens la and the column portion 22 correspond one-to-one. Light from the subject is condensed by the minute lens la, transmitted through the inside of the column 22, emitted from the emission section 23 facing the minute lens la, and incident on the solid-state imaging device 3 opposed to the emission section 23. .
- the side surface of the pillar portion 22 (that is, the side surface of the groove 20. Vertical) has a light-absorbing black paint 25. The stray light incident on this side surface is absorbed by the black paint 25, and does not pass through and enter the adjacent column 22.
- the depth of the groove 20 (the height of the column portion 22) is deeper than half the thickness of the microlens array 1.
- FIG. 4 is a cross-sectional view showing how stray light is generated when the depth D of the groove 20 of the microlens array 1 is half the thickness H of the microlens array 1.
- the light beam L 1 obliquely incident on the microlens la reaches the exit portion 23 of the column portion 22 which is not substantially separated by the groove 20 and does not correspond to the incident microlens la. Therefore, if a high-luminance object exists in the direction of the incident angle of the light beam L1, the generation of stray light may be a problem.
- FIG. 5 is a cross-sectional view showing how stray light is suppressed when the depth D of the groove 20 of the microlens array 1 is 70% of the thickness H of the microlens array 1.
- the stray light is most likely to be generated when the light beam L3 is incident.
- the stray light generated in this case is much larger than when the light beam L1 is incident in FIG. Reduced.
- the depth D of the groove 20 is set to be greater than half the thickness H of the microlens array 1 (D
- the thickness H of the microlens array 1 is defined by the thickness of the microlens array 1 excluding the protruding portions of the microlenses 1a, as shown in FIGS.
- the black coating 25 is applied to the side surface of the groove 20 .
- the side surface of the groove 20 has an absorption function and an attenuating light effect. Even in the case where processing is acceptable, a sufficient shielding effect can be obtained similarly. Even if the side surface of the groove 20 is not subjected to the special processing as described above, and if the side surface 24 of the groove 20 is a rough surface that is necessary and sufficient, stray light can be obtained simply by providing the groove 20 as shown in FIG. Can reduce the effects of
- the minute lens la forms a subject image on the solid-state imaging device 3.
- Each pixel 3a of the solid-state imaging device 3 photoelectrically converts incident light.
- the images obtained for each imaging unit 5 are slightly different because the relative positions of the minute lens la and the pixel 3a with respect to the subject are different for each imaging unit 5.
- the number of pixels 3a included in one imaging unit 5 can be greatly reduced High resolution beyond Images can be obtained.
- FIG. 7 is a cross-sectional view of the microlens array 1 used in the imaging device according to the second embodiment.
- the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
- the width (dimension in the direction parallel to the plane on which the minute lenses la are arranged) of the lattice-shaped grooves 20 formed in the minute lens array 1 is solid from the minute lens la side.
- the difference from Embodiment 1 in which the width of the groove 20 is almost constant is that the width gradually increases toward the surface side facing the imaging element 3.
- the light absorbing black coating 25 is applied to the side surface of the groove 20, which is the same as the microlens array 1 of FIG.
- the black paint on the side surface 24 of the groove 20 can be omitted as shown in FIG.
- the stray light emitted from the column 22 into the groove 20 is incident on the side surface 24 of the adjacent column 22, the incident angle increases, and the possibility of reflection without entering the column 22 increases. Because the effect of stray light can be sufficiently reduced.
- FIG. 9 is a partially cutaway perspective view of an imaging device according to Embodiment 3 of the present invention.
- FIG. 10 is a sectional view of the microlens array 1 used in the imaging device according to the third embodiment.
- the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
- the black resin is formed in the slit grooves 20 formed in a lattice shape along the boundary between the adjacent imaging units 5 on the surface of the microlens array 1 on the solid-state imaging device 3 side.
- 30 is filled.
- the resin 30 is made of a material having a light transmittance smaller than that of the material of the microlens array 1 including the microlens la.
- the light incident on the groove 20 is absorbed by the black resin 30. Therefore, the light does not pass through the black resin 30 and enter the adjacent pillar 22.
- the strength of the microlens array 1 is increased, so that the handling becomes easier when assembling the apparatus.
- the refractive index of the material of the resin 30 is larger than the refractive index of the material of the microlens array 1, the light incident from the column 22 to the interface between the column 22 and the resin 30 The light is totally reflected at this interface, and the stray light is easily absorbed by the resin 30, so that the influence of the stray light can be further reduced.
- 11A to 11D are sectional views showing an example of a method for manufacturing the microlens array 1 of the present invention in the order of steps. Using this, a method for manufacturing the microlens array 1 will be described.
- a plano-convex microlens array 1 having a plurality of microlenses la on one side and a plane lb on the other side is formed by resin molding (eg, injection molding). Form.
- grooves 20 are laid out in a grid pattern from the plane lb side by a laser beam.
- FIG. 11C by increasing the content of the black paint in the solution 27, and by repeating Z or the steps of FIG. 11C and FIG.
- the microlens array 1 in which the inside is filled with the resin can be obtained.
- the processing of the groove 20 is performed simultaneously with the formation of the microlens la that cannot be formed by the laser beam. It can also be done in form.
- the field of application of the present invention is not particularly limited, it can be preferably used for a thin imaging device such as a card-shaped camera device.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
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Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2006519509A JPWO2005107243A1 (ja) | 2004-04-28 | 2005-04-26 | 撮像装置及び微小レンズアレイの製造方法 |
US10/570,051 US7894139B2 (en) | 2004-04-28 | 2005-04-26 | Imaging apparatus and method for manufacturing microlens array |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004134302 | 2004-04-28 | ||
JP2004-134302 | 2004-04-28 |
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WO2005107243A1 true WO2005107243A1 (ja) | 2005-11-10 |
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PCT/JP2005/007864 WO2005107243A1 (ja) | 2004-04-28 | 2005-04-26 | 撮像装置及び微小レンズアレイの製造方法 |
Country Status (4)
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US (1) | US7894139B2 (ja) |
JP (1) | JPWO2005107243A1 (ja) |
CN (1) | CN1860780A (ja) |
WO (1) | WO2005107243A1 (ja) |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06224398A (ja) * | 1993-01-27 | 1994-08-12 | Sharp Corp | 固体撮像素子及びその製造方法 |
JPH09307697A (ja) * | 1996-05-14 | 1997-11-28 | Ricoh Opt Ind Co Ltd | マイクロレンズアレイおよびイメージセンサおよび光画像伝送素子 |
JPH1022488A (ja) * | 1996-03-11 | 1998-01-23 | Eastman Kodak Co | 無機レンズ配列を有する固体画像化器 |
JP2000307090A (ja) * | 1999-04-16 | 2000-11-02 | Toppan Printing Co Ltd | 固体撮像素子用マイクロレンズアレイ及びそれを用いた固体撮像素子並びにそれらの製造方法 |
JP2001068657A (ja) * | 1999-08-26 | 2001-03-16 | Nec Kyushu Ltd | 固体撮像素子の製造方法 |
JP2002280532A (ja) * | 2001-03-14 | 2002-09-27 | Sharp Corp | 固体撮像装置 |
JP2003078826A (ja) * | 2001-09-06 | 2003-03-14 | Sony Corp | 固体撮像素子 |
JP2003204053A (ja) * | 2001-03-05 | 2003-07-18 | Canon Inc | 撮像モジュール及び該撮像モジュールの製造方法、デジタルカメラ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4175844A (en) * | 1975-10-19 | 1979-11-27 | Yeda Research & Development Co. Ltd. | Optical imaging system |
US4507197A (en) | 1982-08-09 | 1985-03-26 | Jim Walter Corporation | Apparatus and method for producing shot-free mineral wool |
JP3687366B2 (ja) * | 1998-10-23 | 2005-08-24 | セイコーエプソン株式会社 | 光学基板及びその製造方法並びに表示装置 |
JP3821614B2 (ja) | 1999-08-20 | 2006-09-13 | 独立行政法人科学技術振興機構 | 画像入力装置 |
WO2002003136A1 (fr) * | 2000-07-03 | 2002-01-10 | Seiko Epson Corporation | Procede de fabrication d'un ecran de transmission et ecran de transmission ainsi fabrique |
US20040012698A1 (en) * | 2001-03-05 | 2004-01-22 | Yasuo Suda | Image pickup model and image pickup device |
-
2005
- 2005-04-26 JP JP2006519509A patent/JPWO2005107243A1/ja active Pending
- 2005-04-26 WO PCT/JP2005/007864 patent/WO2005107243A1/ja active Application Filing
- 2005-04-26 CN CNA2005800011414A patent/CN1860780A/zh active Pending
- 2005-04-26 US US10/570,051 patent/US7894139B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06224398A (ja) * | 1993-01-27 | 1994-08-12 | Sharp Corp | 固体撮像素子及びその製造方法 |
JPH1022488A (ja) * | 1996-03-11 | 1998-01-23 | Eastman Kodak Co | 無機レンズ配列を有する固体画像化器 |
JPH09307697A (ja) * | 1996-05-14 | 1997-11-28 | Ricoh Opt Ind Co Ltd | マイクロレンズアレイおよびイメージセンサおよび光画像伝送素子 |
JP2000307090A (ja) * | 1999-04-16 | 2000-11-02 | Toppan Printing Co Ltd | 固体撮像素子用マイクロレンズアレイ及びそれを用いた固体撮像素子並びにそれらの製造方法 |
JP2001068657A (ja) * | 1999-08-26 | 2001-03-16 | Nec Kyushu Ltd | 固体撮像素子の製造方法 |
JP2003204053A (ja) * | 2001-03-05 | 2003-07-18 | Canon Inc | 撮像モジュール及び該撮像モジュールの製造方法、デジタルカメラ |
JP2002280532A (ja) * | 2001-03-14 | 2002-09-27 | Sharp Corp | 固体撮像装置 |
JP2003078826A (ja) * | 2001-09-06 | 2003-03-14 | Sony Corp | 固体撮像素子 |
Cited By (19)
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JP2008047587A (ja) * | 2006-08-11 | 2008-02-28 | Sumitomo Electric Ind Ltd | 光検出装置 |
EP2120451A1 (en) * | 2007-01-30 | 2009-11-18 | Konica Minolta Opto, Inc. | Camera module manufacturing method and camera module |
EP2120451A4 (en) * | 2007-01-30 | 2010-08-25 | Konica Minolta Opto Inc | METHOD FOR MANUFACTURING CAMERA MODULE AND CAMERA MODULE |
JP2011153965A (ja) * | 2010-01-28 | 2011-08-11 | Ricoh Co Ltd | 測距装置、測距用モジュール及びこれを用いた撮像装置及び測距用モジュールの製作方法 |
JP2017046296A (ja) * | 2015-08-28 | 2017-03-02 | 大日本印刷株式会社 | 撮像モジュール、撮像装置 |
US11333802B2 (en) | 2015-09-29 | 2022-05-17 | Dai Nippon Printing Co., Ltd. | Lens sheet, lens sheet unit, imaging module, imaging device |
WO2017056865A1 (ja) * | 2015-09-29 | 2017-04-06 | 大日本印刷株式会社 | レンズシート、レンズシートユニット、撮像モジュール、撮像装置 |
JP2017116634A (ja) * | 2015-12-22 | 2017-06-29 | 大日本印刷株式会社 | レンズシート、撮像モジュール、撮像装置 |
JP2017116633A (ja) * | 2015-12-22 | 2017-06-29 | 大日本印刷株式会社 | レンズシート、撮像モジュール、撮像装置 |
JP2017120327A (ja) * | 2015-12-28 | 2017-07-06 | 大日本印刷株式会社 | レンズシート、撮像モジュール、撮像装置 |
JP2017120303A (ja) * | 2015-12-28 | 2017-07-06 | 大日本印刷株式会社 | レンズシート、撮像モジュール、撮像装置 |
JP2017120326A (ja) * | 2015-12-28 | 2017-07-06 | 大日本印刷株式会社 | レンズシート、撮像モジュール、撮像装置 |
JP2017122868A (ja) * | 2016-01-08 | 2017-07-13 | 大日本印刷株式会社 | レンズシートユニット、撮像モジュール、撮像装置 |
JP2017129675A (ja) * | 2016-01-19 | 2017-07-27 | 大日本印刷株式会社 | レンズシート、撮像モジュール、撮像装置 |
JP2017134123A (ja) * | 2016-01-25 | 2017-08-03 | 大日本印刷株式会社 | レンズシート、撮像モジュール、及び撮像装置 |
JP2017134163A (ja) * | 2016-01-26 | 2017-08-03 | 大日本印刷株式会社 | レンズシート、撮像モジュール、撮像装置 |
JP2017134365A (ja) * | 2016-01-29 | 2017-08-03 | 大日本印刷株式会社 | レンズシート、撮像モジュール、及び撮像装置 |
JP2017158148A (ja) * | 2016-03-04 | 2017-09-07 | 大日本印刷株式会社 | 撮像モジュール、撮像装置 |
JP2018060129A (ja) * | 2016-10-07 | 2018-04-12 | 大日本印刷株式会社 | 光学素子、撮像モジュール、撮像装置 |
Also Published As
Publication number | Publication date |
---|---|
US20090141361A1 (en) | 2009-06-04 |
CN1860780A (zh) | 2006-11-08 |
JPWO2005107243A1 (ja) | 2008-03-21 |
US7894139B2 (en) | 2011-02-22 |
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