WO2005093738A1 - 光ディスクにおける接着剤の延展方法 - Google Patents
光ディスクにおける接着剤の延展方法 Download PDFInfo
- Publication number
- WO2005093738A1 WO2005093738A1 PCT/JP2005/005830 JP2005005830W WO2005093738A1 WO 2005093738 A1 WO2005093738 A1 WO 2005093738A1 JP 2005005830 W JP2005005830 W JP 2005005830W WO 2005093738 A1 WO2005093738 A1 WO 2005093738A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- disk substrate
- peripheral end
- spreading
- outer peripheral
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
- B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
- B29C65/7808—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
- B29C65/7811—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots for centring purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
- B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
- B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1406—Ultraviolet [UV] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
Definitions
- the present invention relates to a method for spreading an adhesive when bonding optical disks, and more particularly, for a high-density recording medium such as a DVD-ROM, a DVD-R, a DVD-RW and a next-generation disk HD-DVD.
- the present invention relates to a method for spreading an adhesive when pasting optical disks.
- the present invention relates to a method for spreading an adhesive for uniformly spreading an adhesive interposed between two disk substrates.
- optical disks such as DVD-ROM, DVD-R, and DVD-RW have a disk-shaped resin disk substrate that is 0.6 mm thick, has an outer shape of 120 mm, and has a central hole. It is specified that the inside diameter is 15 mm.
- step 1 mounting step
- step 2 application step
- an adhesive R is applied to the first disk substrate D1.
- the adhesive R which is an ultraviolet curable resin, is gently discharged from the discharge nozzle N while the spinner 3 on which the first disk substrate D1 is placed is rotated at a low speed, and is applied onto the first disk substrate D1.
- the trajectory of the discharged adhesive R on the first disk substrate D1 has a different force depending on how the discharge nozzle N moves.For example, when a donut-shaped trajectory as shown in the figure is used. Does not need to move the discharge nozzle N.
- step 3 (overlapping step), the second disk substrate D2 is placed on the first disk substrate D1 to which the adhesive R has been applied.
- the second disk substrate D2 may be a transparent substrate to which no information signal is applied, or a substrate to which an information signal is applied (in this case, the substrate is usually not transparent because it has a reflective film).
- step 4 spreading step
- spreading is performed so that the adhesive R interposed between the two disk substrates Dl and D2 spreads evenly and uniformly on the substrates.
- This extension is performed when the spinner 3 is rotated at a high speed (usually the rotation speed is set) in a state in which the bonded circular resin substrate in which the two disk substrates Dl and D2 are united, that is, the bonded disk D is placed on the spinner 3. (Several thousand rpm or more, rotation time is about several seconds). Due to this rotation, the excess adhesive R existing between the two disk substrates Dl and D2 is released to the outside together with the spreading, and at the same time, the air (such as air bubbles) trapped between the two disk substrates Dl and D2 is released. It is discharged outside.
- step 5 (curing step), the bonded disk D (that is, the first disk substrate D1 and the second disk substrate D2 bonded and integrated) is rotated (for example, at about 60 rpm) or Do not rotate! In the ⁇ state, irradiate ultraviolet rays to cure the adhesive R.
- the bonded disc D is illuminated by an ultraviolet light source L having a reflecting mirror on the back surface, so that curing is efficiently performed.
- the curing step differs depending on the type of the adhesive R used, and it goes without saying that a curing method suitable for the characteristics of the adhesive R used is employed.
- the bonding step is completed as described above.
- the step 4 extension step is to spread the adhesive R evenly and uniformly on the substrate, and is an extremely important step among all the steps.
- the thickness variation force reaches ⁇ (10 / zm to 15 m).
- this variation in the adhesive layer affects the optical path of the laser beam when recording and reading information on the optical disk, and it is important that the recording and reproduction functions are not fully exhibited.
- DVD + R9 (8.5 GB on one side, two layers) and the next generation disc, HD—DVD (AOD—Advanced Optical Disc: 15 GB on one side), require strict film thickness standards (eg, DVD + R9 allows only ⁇ 5 m, and HD-DVD allows only ⁇ 3 m, but it is extremely difficult to achieve this.
- the standard for conventional DVD-ROM (playback only) is ⁇ 15 ⁇ m.
- Patent Document 1 JP-A-9 245386
- the adhesive R is interposed between the two disk substrates Dl and D2, and the adhesive R is rotated on the spinner 3 so that the adhesive R is centrifugally applied.
- the disadvantage that the thickness (that is, the film thickness) of the adhesive R at the position of the outer peripheral edge of the disk substrate becomes somewhat thicker than other portions cannot be avoided. In other words, the film thickness becomes uneven, and both disk substrates Dl and D2 take the shape as shown in FIG.
- the variation in the film thickness often reaches 10 m to 15 m, and it is quite difficult to keep it within ⁇ 3 m.
- the adhesive R gradually moves from the inner peripheral end to the outer peripheral end of the donut-shaped disk substrate due to centrifugal force, but only the adhesive R having kinetic energy whose centrifugal force is larger than the surface tension jumps out from the outer peripheral end. Will be.
- the present invention has been made based on strong background art, and has been made in order to overcome the problems of the background art described above.
- the present invention provides a method for spreading an adhesive, which can spread an adhesive (usually a UV-curable resin) uniformly between two disk substrates without unevenness in film thickness in an optical disk laminating step.
- the purpose is to provide.
- the present inventor has made intensive studies on the background of the above problem, and as a result, during extension, the upper surface of the outer peripheral end of the disk substrate was positively pressed, thereby causing the above-described problem.
- the inventors have found that the points can be solved, and have completed the present invention based on this finding.
- the present invention provides (1) a method for spreading an adhesive in an optical disk in which an adhesive is interposed between two disk substrates having a center hole and the disk substrate is rotated to spread the adhesive.
- the present invention also relates to a method of spreading an adhesive for pressing the upper surface of the outer peripheral end portion of the disk substrate at the time of spreading.
- the present invention resides in (2) the method for spreading an adhesive according to (1), wherein the upper surface of the outer peripheral end of the disk substrate is pressed by blowing air.
- the present invention also resides in (3) the method for spreading an adhesive according to the above (2), wherein the blowing pressure is changed depending on a radial position of the disk substrate when the air is blown.
- the present invention resides in (4) the adhesive spreading method according to the above (1), wherein, at the time of spreading, the end face side force of the outer peripheral end of the disk substrate also sucks the adhesive.
- the suction of the adhesive is performed by arranging a suction device along the periphery of the disk substrate and suctioning the adhesive by the suction device. It depends on the method of spreading the adhesive described.
- the hot air is blown onto the upper surface of the disk substrate so that the temperature increases from the inner peripheral end side to the outer peripheral end side of the disk substrate during the extension.
- the method of spreading the adhesive As described in (1) above The method of spreading the adhesive.
- the operation of blowing the hot air is performed by arranging a plurality of dryers along the radial direction of the disk substrate and changing the temperature of the hot air to be injected by the dryer power.
- the method for spreading an adhesive according to (6) is performed by arranging a plurality of dryers along the radial direction of the disk substrate and changing the temperature of the hot air to be injected by the dryer power.
- the present invention provides (8) the method of (8), wherein, at the time of the extension, the hot air is blown onto the upper surface of the disk substrate so that the flow rate increases from the inner peripheral end side to the outer peripheral end side. It depends on the method of spreading the adhesive described in 1).
- the operation of blowing the hot air is performed by arranging a plurality of dryers along a radial direction of the disk substrate and changing a flow rate of the hot air injected by the dryer power.
- the method for spreading the adhesive according to the above (8) exists.
- the adhesive at the position of the outer peripheral end between both disc substrates is pushed out to the outside, and the outer peripheral end is pressed. Can be prevented from accumulating in a large amount.
- the UV-curable resin can be spread evenly between the two disk substrates.For example, if the upper surface of the outer peripheral end is pressed by blowing air, it can be pressed without contacting the disk substrate. , Do not damage the disc substrate.
- a suction device is arranged so as to cover the periphery of the disk substrate, and when the adhesive is sucked from the end face of the outer peripheral end of the disk substrate during extension, the adhesive is more reliably applied to the two disks. It can be spread evenly between the substrates.
- FIG. 1 shows an apparatus used in a first embodiment of a method for spreading an adhesive (usually an ultraviolet-curable resin) of the present invention.
- FIG. 1 (A) is a plan view including the film thickness stabilizing device 1 and a bonding disc D
- FIG. 1 (B) is a front view.
- the spinner 3 has a rotation shaft 31 and a disk-shaped rotation holding table 32 on which the bonding disc D is placed.
- a substantially frustoconical boss 33 whose tip end is thinned is protruded.
- the bonded disc D is, for example, a disc-shaped first disc substrate D1 having a center hole formed by using polycarbonate resin, and a disc-shaped first disc substrate formed in the same manner as the first disc substrate D1. It has two disk substrates D2.
- An adhesive for example, an ultraviolet curing resin is interposed between the first disk substrate D1 and the second disk substrate D2.
- the application of the adhesive R to the first disk substrate D1 is performed as in Step 2 (coating step) in the optical disk laminating step described above.
- a film thickness stabilizing device 1 is installed to press the upper surface of the outer peripheral end of the second disk substrate D2 with air.
- the film thickness stabilizing apparatus 1 has a compressor 13, and the air compressed by the compressor 13 is cleaned through a HEPA filter, and is passed through an air introduction pipe 12 to an air blowing section 11 From the second disk substrate D2.
- the upper surface of the outer peripheral end of the second disk substrate D2 is pressed by the blowing pressure of the air.
- it is effective to press the upper surface of the outer peripheral end of the second disk substrate D2 using, for example, a blower without using the compressor 13.
- the air blowing section 11 is formed in a long shape, and is arranged with its longitudinal direction along the radial direction of the bonding disc D.
- the air blowing section 11 has a number of blowing holes (not shown), and air is blown downward from the blowing holes.
- the air blown out from the blowing holes can be air having a gradual force as it goes to the outer peripheral end side (see FIG. 2 (A)).
- the bonded disk D is rotated at a high speed, for example, 3000 rpm while being mounted on the rotation holding table 32 of the spinner 3, and the upper surface of the outer peripheral end of the second disk substrate D2 is fixed to a film thickness stabilizing device.
- the adhesive R interposed between the first disk substrate D1 and the second disk substrate D2 and present at the outer peripheral end is blown outward from the end face side of the outer peripheral end.
- the film thickness of the adhesive R is kept uniform without any deviation.
- the bonded first disk substrate D1 and second disk substrate D2 also have a uniform thickness as a whole, resulting in a high-quality optical disk.
- the outer peripheral end upper surface of the second disk substrate D2 can be pressed in a non-contact state, and the second disk substrate upper surface can be pressed. Does not hurt.
- FIG. 3 shows a device used in a second embodiment of the adhesive spreading method of the present invention.
- the second embodiment in addition to the device of the first embodiment, along the periphery of the laminated disc D Sucking I device 2 was arranged.
- FIG. 3 (A) is a plan view including a film thickness stabilizing device 1, a bonding disk D, and a suction device 2, and FIG. 3 (B) is a front view.
- the suction device 2 is arranged along the periphery of the bonded disc D mounted on the spinner 3.
- the suction device 2 has an annular suction portion 2A and a base 2B that are arranged so as to surround the bonded disc D along the periphery.
- a flow path 21 having a circular cross section is formed inside the annular suction portion 2A.
- a suction slit 22 having a constant width is formed over the entire circumference inside the annular suction portion 2A.
- the slit is used to avoid the problem that the adhesive scale blown off by the centrifugal force hits the part without the hole unlike the hole and sticks to the rebound disk.
- suction force acts in addition to centrifugal force, and the adhesive R present on the outer peripheral end of the bonded disc D is more reliably blown outward.
- the adhesive R sucked from the suction slit 22 flows into the flow path 21 and is discharged from the base 2B to another place through the arc-shaped flow path 21.
- a suction device 2 specifically, an annular suction portion 2 A is arranged along the periphery of the bonding disk D, and when the film is extended, the suction device 2 is moved from the film thickness stabilizing device 1 to the bonding disk D. At the same time, air is blown onto the outer peripheral end upper surface and pressed. By sucking the adhesive R, the adhesive R interposed between the two disk substrates can be uniformly spread without bias.
- FIG. 4 shows an apparatus used in a third embodiment of the method for spreading an ultraviolet curable resin according to the present invention.
- the third embodiment differs from the first embodiment only in that the air blowing section 11 of the first embodiment is improved.
- the film thickness stabilizing apparatus 1A used in the third embodiment is configured to blow hot air (air having a temperature equal to or higher than room temperature) from a dryer 1 la to: L If provided in the air blowing section 11A. It is a device that performs.
- a heating coil is provided in each of the dryers l la to l lf, and the heating coil heats the air sent from the air introduction pipe 12 to generate hot air.
- the dryers 11a to: Llf are set so that the inner peripheral end side force of the bonded disc D also increases in temperature toward the outer peripheral end side. I do.
- This setting can be performed by changing the amount of current supplied to the heating coil.
- the first disc substrate D1 and the second disc substrate D2 during the adhesive spreading are formed.
- the viscosity of the adhesive R at the outer peripheral end side becomes lower at the outer peripheral end side, so that the adhesive R at the outer peripheral end of the bonded disc D is easily ejected.
- This method is similar to the first method in that hot air is blown to the bonded disc D. Rather than providing a force temperature gradient, the hot air blown to the second disc substrate D2 is used. This method is to increase the flow rate on the outer peripheral end side of the second disk substrate D2 (see Fig. 5). Increasing the flow rate of hot air increases the amount of heat transmitted to the second disk substrate D2. is there.
- the purpose is to make the viscosity of the adhesive R smaller on the outer peripheral end side. Since it is large, it is necessary to set the temperature and the flow rate in consideration of that.
- the shape of the air blowing section 11 of the film thickness stabilizing device 1 is made long, and the longitudinal direction thereof is arranged along the radial direction of the laminating disc D, and the laminating is performed.
- the force described in the example of blowing air during the spreading of the disc D The present invention is not limited to this.
- the air blowing portion 11 is formed in an annular shape so that the air can be blown on the upper surface of the outer peripheral end portion in the entire circumferential direction of the bonded disc D. Both are possible.
- the spinner 3 is activated, that is, the bonding is performed, in order to suppress the variation in the thickness of the adhesive R in the circumferential direction of the bonding disk D. It is preferable to blow air only while the disk D is rotating! / ,.
- the state force before the rotation of the bonded disc D is hard to vary even if air is blown V.
- the suction device 2 was formed in a ring shape so as to cover the entire periphery of the bonding disc D.
- each of the dryers l la to l lf can be moved in the circumferential direction by shifting the position in the radial direction. Position does not matter much.
- the dryers 11a to 1If may be arranged at intervals of 60 degrees around the center of the bonded disc D.
- the present invention relates to a method of spreading an adhesive when bonding optical disks, but as long as the principle is adhered to, the bonding when bonding thin films in other fields, for example, in the semiconductor field. It can be applied to the spreading of agents and the like, and its application range is wide.
- FIG. 1 is an explanatory view showing an apparatus used in a first embodiment of the adhesive spreading method of the present invention.
- FIG. 1 (A) is a plan view and FIG. ) Is a front view.
- FIG. 2 is an explanatory view showing the state of air blown by a blowing hole force of an air blowing part.
- FIG. 2 (A) shows that the force gradually increases toward the outer peripheral end of the disk substrate.
- Figure 2 (B) shows air that is blown out obliquely.
- FIG. 3 is an explanatory view showing an apparatus used in a second embodiment of the adhesive spreading method of the present invention.
- FIG. 3 (A) is a plan view
- FIG. 3 (B) is a front view.
- FIG. 3 (A) is a plan view
- FIG. 3 (B) is a front view.
- FIG. 4 is an explanatory view showing an apparatus used in a third embodiment of the adhesive spreading method of the present invention.
- FIG. 5 is an explanatory view showing a modification of the device used in the third embodiment of the adhesive spreading method of the present invention.
- FIG. 6 is an explanatory view showing a modification of the film thickness stabilizing device used in the first embodiment of the method for spreading an adhesive of the present invention.
- FIG. 7 is a process chart showing a method of spreading an ultraviolet-curable resin in a conventional optical disk laminating process.
- FIG. 8 is an explanatory view showing a shape of an adhesive after spreading in a conventional optical disk laminating step.
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004-096912 | 2004-03-29 | ||
JP2004096912 | 2004-03-29 |
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WO2005093738A1 true WO2005093738A1 (ja) | 2005-10-06 |
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Citations (9)
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JPS629550A (ja) * | 1985-07-08 | 1987-01-17 | Matsushita Electric Ind Co Ltd | 情報担体デイスクの製造方法 |
JPH09161328A (ja) * | 1995-11-30 | 1997-06-20 | Kitano Eng Kk | 記憶ディスクにおける接着剤の延展方法 |
JPH09297942A (ja) * | 1996-04-30 | 1997-11-18 | Mitsubishi Plastics Ind Ltd | 光ディスクの貼り合わせ方法および貼り合わせ装置 |
JPH1166643A (ja) * | 1997-08-11 | 1999-03-09 | Sony Disc Technol:Kk | 情報記録媒体の製造装置及び情報記録媒体の製造方法 |
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