WO2005048347A2 - Leistungsmodul - Google Patents
Leistungsmodul Download PDFInfo
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- WO2005048347A2 WO2005048347A2 PCT/EP2004/012810 EP2004012810W WO2005048347A2 WO 2005048347 A2 WO2005048347 A2 WO 2005048347A2 EP 2004012810 W EP2004012810 W EP 2004012810W WO 2005048347 A2 WO2005048347 A2 WO 2005048347A2
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- connection
- power module
- circuit units
- circuit unit
- current
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
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Definitions
- the invention is in the field of power electronics, in particular power semiconductor electronics, and relates to a power module with a plurality of circuit units with connection contacts which are electrically connected to one another via at least one current-carrying tab.
- Power modules of this type often have a plurality of circuit units connected in parallel in order to achieve a high current carrying capacity.
- the circuit units can be implemented, for example, on substrates on which power components are arranged which can be electrically contacted via conductor tracks and connection contact points (so-called contact pads). In order to implement the parallel connection of the circuit units, these are connected to one another via current-carrying tabs.
- DE 197 21 061 AI shows a power module with a housing for accommodating several electronic components and with several connection contacts for internal and / or external electrical connection.
- the module comprises several ceramic substrates, on which semiconductor components are arranged and connected to form circuit units.
- the circuit units can be contacted externally via a connection block, which also connects the circuit units to one another.
- the connection block is comparatively complex and high-rise. Detailed information regarding the circuitry of the circuit units cannot be found in DE 197 21 061 AI.
- the object of the present invention is to provide a power module and a method for its production, in which the current-carrying tab has only a small footprint and is simple to use with the circuit unit by means of common Binding techniques and can be connected without affecting the other components of the module.
- connection contacts are based on the basic idea of designing the current-carrying tab in several parts, a first part being permanently electrically connected separately and independently of the other parts to the circuit unit or to conductor tracks or connection pads (generally referred to as connection contacts) provided thereon.
- the first part has a foot region which is connected to the connection contact and a neck region which preferably extends essentially perpendicular to the circuit unit and which at the end has a simple assembly or electrical connection to a second part of the current-carrying tab allows.
- a preferred further development of the invention provides that the first part is L-shaped and its foot region is connected to the connection contact of the circuit unit.
- the second part is preferably designed as a low-induction conductor track or as a strip conductor and runs essentially parallel to the level of the circuit units.
- the second part preferably causes two or more circuit units to be connected in parallel in that first parts of a plurality of circuit units are connected to it.
- the second part can also lead to an external connection.
- This manufacturing step can be carried out as a pre-assembly step, at a time when the connection contact or the corresponding (foot) area of the first part is still easily accessible from all sides. In this way, inexpensive, proven and reliable connection technologies - eg bonding, soldering or laser welding - can be used.
- Another advantage of the invention is that the electrical connection of the first part to the connection contact can be tested before further assembly.
- a very space-saving, compact design of the power module is achieved by arranging the second part of the current-carrying tab essentially parallel to the level of the circuit units.
- a production-technically preferred embodiment of the method according to the invention provides that a plurality of circuit units are first connected to the first part of their current-carrying tab, the circuit units are arranged on a common carrier and then the respective first parts with the formation of current-carrying tabs with a common second part get connected.
- the circuit units can e.g. can be connected to a common base plate by soldering. They are advantageously positioned by means of a mounting template which, during mounting, is in the plane of the second part of the
- Tab is arranged and, for example, has openings for the passage of the free ends of the first parts.
- FIG. 1 shows the pre-assembly of a circuit unit in a first • assembly sequence
- FIG. 2 shows the pre-assembly of a circuit unit in a varied assembly sequence
- FIG. 3 shows the assembly of several circuit units to form a power module according to the invention
- FIG. 4 shows a circuit diagram with two identically constructed half bridges, which are provided for parallel connection in a power module according to the invention
- FIG. 5 shows a circuit diagram of a half-bridge module with three identically constructed half-bridges that are electrically connected in parallel with one another
- FIG. 6 shows a perspective view of a power module designed as a half-bridge module with a plurality of circuit units electrically connected in parallel by means of current-carrying tabs, with the housing removed,
- FIG. 7 shows a side view of a cross section through the half-bridge module according to FIG. 6.
- the preassembly of a circuit unit shown in FIG. 1 in three assembly steps a), b), c) begins with the application of a power component 1, e.g. a power semiconductor, onto a conductor track 2 of a substrate 3, preferably by soldering (assembly step a)). Are on the substrate. additional conductor tracks or connecting contacts 4, 5, 6 are provided.
- the power semiconductor 1 is contacted by means of bonding wires 7, 8.
- connection contacts 4, 5 are then (assembly step c)) with the foot 10, 11 of a first part 12, 14 electrically connected by soldering, laser or ultrasonic welding.
- the parts 12, 14 are L-shaped and project upward with the free end region of the L (neck region) 16, 17 essentially perpendicular to the plane 18 of the circuit unit.
- the connection of the first parts 12, 14 takes place before further assembly and independently of further parts 25, 27 (FIG. 3), which together with the parts 12, 14 will each form a current-carrying tab.
- the connection of the parts 12, 14 to the connection contacts 4, 5 can be pretested at this stage, which enables a considerable increase in the quality of production and reliability.
- the parts 12, 14 are first For example, connected by laser welding to the connection contacts 4, 5 on the substrate 3. Only then is the power semiconductor 1 placed on the substrate 3 and contacted by soldering and via bonding wires 7, 8. This has the advantage that the power semiconductor 1 is produced by laser welding Parts 12, 14 can not be affected and the range of motion for laser welding is not limited.
- FIG. 3 shows two circuit units 20, 21 preassembled according to FIG. 1 or 2. These are arranged on a common base plate 24.
- the free end regions 16, 16 "of the respective first parts 12, 12" are provided with a second part 25 to form a current-carrying tab 26 - for example by pressing, pressing, squeezing, bonding, crimping, riveting, soldering, in particular inductive brazing, welding , especially cold, ultrasonic, laser, inductive or resistance welding, - connected.
- the free end regions 17, 17 ′′ of the respective first parts 14, 14 ′ are connected to a second part 27 to form a current-carrying tab 28.
- the parts 12, 12 "or 14, 14" and 25, 27 thus complement each other - after their separate assembly - to form a current-carrying tab 26, 28 which has the corresponding connection contacts (for example 5 and 5 ") of the circuit units 20 and 21
- the second parts 25 and 27 are spaced apart from one another in parallel or plane-parallel, and the module formed in this way can be introduced into a housing in a manner known per se and, if necessary, cast.
- a mounting template can be used for precise positioning, which has openings exactly where later the end regions 16, 16 "; 17, 17" of the first parts and the second are arranged To penetrate part.
- the circuit units are thus aligned according to the template.
- the assembly of the module according to the invention is thus considerably simplified.
- the quality assurance is improved by the possibility of early testing of the connection between the first parts 12, 14 and the assigned connection contacts.
- the design of the current-carrying tab allows a very compact and space-saving construction of the module.
- a power module according to the invention is designed as a half-bridge module.
- a half-bridge module preferably comprises a plurality of half-bridges, which are each arranged on a substrate. Each half bridge forms a circuit unit.
- FIG. 4 shows a circuit diagram with two such circuit units 31, 32.
- Each of the circuit units 31, 32 comprises two power semiconductors 1, 1 ", which are connected in series with their load paths.
- the power semiconductors 1, 1" can be used, for example, as transistors, thyristors, triacs , FETs, MOSFETs or IGBTs.
- antipa- A free-wheeling diode 9, 9 " is connected in parallel with each load path of a power semiconductor 1, 1 '.
- Each of the circuit units 31, 32 is implemented on a substrate.
- the power semiconductors 1, 1 ′ and the free-wheeling diodes 9, 9 ′′ of a circuit unit 31, 32 are connected to one another in the plane of the respective substrate by means of conductor tracks and to connection contacts.
- Each of these conductor tracks has an inductance. corresponding to inductivities L1 to L5.
- connection contacts 4, 5, 6 of the circuit units 31, 32 are connected to one another in an electrically conductive manner.
- a multi-part current-carrying tab corresponding to the current-carrying tabs 26, 28 according to FIG. 3 is preferably used for this purpose.
- each of the circuit units 31, 32 has first parts 121, 131, 141 which are connected to the connection contacts for the negative supply voltage, the phase output or the positive supply voltage.
- the first parts 121, 131, 141 are preferably designed corresponding to the first parts 12, 12 ', 14, 14' according to FIGS. 1 to 3.
- Each of the first parts 121, 131, 141 has an inductance, which is represented in FIG. 4 by substitute inductances L6, L8, L7.
- the inductances L6, L8, L7 of the first parts 121, 131, 141 are preferably between 5 nH and 100 nH, particularly preferably about 20 nH, while in comparison the inductances L 1 to L5, each preferably less than 5 nH, are significantly less noticeable.
- FIG. 5 shows a number of circuit units 31, 32, 33, which preferably have a structure according to the circuit units 31, 32 according to FIG. 4 and are of identical design.
- the corresponding first parts of the circuit units 31, 32, 33 are electrically conductively connected by means of second parts 29, 27, 25.
- the corresponding first parts of the circuit units 31, 32, 33 together with the connecting second part 29, 27 and 25 each form a current-carrying tab.
- the associated second parts 29, 27 and 25, respectively, connecting the first parts of two adjacent circuit units 31, 32, 33 have sections 290, 270, 250 with inductors, which are shown in FIG. 5 as substitute inductors L9, L10 and Lll ,
- the value of these substitute inductances L9, L10, Lll is preferably less than 10 nH, particularly preferably less than 5 nH.
- FIG. 6a shows a perspective view of a power module 40 with six circuit units 20, each having a half-bridge, and comprising a substrate and power elements' and conductor tracks.
- the circuit units 20 are arranged on a base plate 24 and electrically connected in parallel by means of current-carrying tabs 25, 27, 29 according to the invention.
- the circuit units 20 are preferably constructed identically, arranged in a connection direction r in succession and equidistant from one another.
- the substrates 3 can advantageously be arranged in accordance with the statements in the German patent application DE 10 2004 042 367.
- each of the circuit units 20 comprises a half bridge corresponding to the half bridges 31, 32, 33 according to FIGS. 4 and 5.
- Each of the circuit units 20 has first parts 121 for connecting the negative supply voltage, 141 for connecting the positive supply voltage, and 131 for the phase output.
- the first parts 131, 141 and 121 which are connected to one another by means of a second part 25, 27, 29, are preferably arranged in a row one behind the other in the connecting direction r.
- the first parts 121, 141 for supplying the negative or positive supply voltage in the connection direction r are arranged in a row and with alternating polarity in succession.
- the second parts 25, 27, 29 are preferably essentially flat and are arranged parallel to the plane of the circuit units 25 and the base plate 24.
- the second parts 25, 27, 29 have connecting lugs 251, 271 and 291, which are preferably formed in one piece with the respective second parts 25, 27, 29.
- the connecting lugs 251, 271, 291 can thus be punched out of a flat sheet metal in a simple manner using a punching tool and bent into the desired shape.
- the connection tabs 251, 271, 291 are preferably arranged on the side of the relevant second part 25, 29, 27 facing away from the base plate 24.
- two connection lugs 251, 271, 291 of the same electrical potential are arranged in pairs and opposite one another in a direction transverse to the connection direction r. It is advantageous if the connection lugs 271, 291 with different polarity +/- are arranged alternately in succession in the connection direction r.
- the first parts have feet 122, 142 and feet 132 (see FIG. 6b) which are connected to corresponding connection contacts 6, 4 and 5 (see FIG. 6b).
- the arrangement of the esse can be carried out in an advantageous manner according to the statements in DE 10 2004 027 185.
- connection lugs 251 for connecting the phase output are preferably designed for a higher current carrying capacity than the connection lugs 271, 291 for the positive or negative supply voltage. This can be achieved in particular in that the dimensions of the connection lugs 251 in the connection direction r for the phase output are chosen larger than the dimensions of the connection lugs 271, 291 for the connection of the positive or negative supply voltage.
- the half-bridge module has a section 45 in the connection direction r in which none of the second parts 25, 27, 29 is provided with connecting lugs 251, 271 or 291.
- an area is created above the second parts 25, 27, 29, which is free of main electrical connections and can be used, for example, to accommodate control circuits or sensors.
- FIG. 6b shows a view corresponding to FIG. 6a, but with a power module 40 rotated by 180 °.
- This view reveals the first parts 131, which are connected to connection contacts 5 for connecting the phase outputs.
- the first parts 131 are arranged opposite the first parts 121, 141 in a direction transverse to the connection direction r.
- FIG. 7 shows a side view of a cross section through a power module 40, which corresponds to the power module 40 according to FIGS. 6a and 6b, but also has a housing.
- the cross section runs transversely to the connection direction r between a connection plate 271 and an adjacent connection plate 291 with a view of the connection plate 271 against the connection direction r.
- the housing 40 comprises a housing body 41 and the base plate 24.
- a substrate is connected to the base plate 24, which comprises a circuit unit 20.
- the circuit unit 20 has conductor tracks 2 in addition to the power semiconductors (not shown).
- a first part 121 connects the circuit unit 20 to a second part 27. Accordingly, a further first part 131 connects the circuit unit 20 to a second part 25.
- the arrangement comprises three second parts 25, 27, 29, which are guided parallel to one another and are electrically insulated from one another by means of insulating foils 51, 52.
- the second parts 25, 27, 29 have connection lugs 251, 271, 291, of which only connection lugs 271 can be seen in FIG.
- the connecting lugs 271 as well as the non-recognizable connecting lugs 251, 291 are led out of the housing body 41 through openings 44.
- the connection lugs can first be inserted through the openings 44 and then bent into their final position.
- Each of the second parts 25, 27, 29 has a continuous, preferably lower section 252, 272, 292, which is spaced apart from the circuit units 20 to be connected to one another.
- the continuous sections 252, 272, 292 are provided to connect corresponding first parts of the circuit units 20 to be electrically connected in parallel, and preferably extend in the connection direction r from the first to the last of the circuit units 20.
- the continuous sections run here 252, 272, 292 are preferably plane-parallel to one another and plane-parallel to the plane of the base plate 24.
- the continuous sections 252, 272, 292 are the second Parts 25, 27, 29 are arranged inside the housing, particularly preferably inside the housing body 41.
- the housing can be encapsulated by means of a casting compound, which preferably extends from the base plate 24 to beyond the continuous section 252 of the second part 25 which is the most distant from the base plate 24.
- the continuous sections 252, 272, 292 are thus enclosed by the potting compound.
- the connecting lugs of the second parts protrude from the sealing compound.
- connection lug (neg. Supply voltage)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04797835A EP1683197A2 (de) | 2003-11-11 | 2004-11-11 | Leistungsmodul |
JP2006538800A JP2007511083A (ja) | 2003-11-11 | 2004-11-11 | パワーモジュール |
US11/381,881 US7656672B2 (en) | 2003-11-11 | 2006-05-05 | Power module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10352671.4 | 2003-11-11 | ||
DE10352671A DE10352671A1 (de) | 2003-11-11 | 2003-11-11 | Leistungsmodul |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/381,881 Continuation US7656672B2 (en) | 2003-11-11 | 2006-05-05 | Power module |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005048347A2 true WO2005048347A2 (de) | 2005-05-26 |
WO2005048347A3 WO2005048347A3 (de) | 2005-08-11 |
Family
ID=34584987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/012810 WO2005048347A2 (de) | 2003-11-11 | 2004-11-11 | Leistungsmodul |
Country Status (5)
Country | Link |
---|---|
US (1) | US7656672B2 (de) |
EP (1) | EP1683197A2 (de) |
JP (1) | JP2007511083A (de) |
DE (1) | DE10352671A1 (de) |
WO (1) | WO2005048347A2 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1868244A1 (de) | 2006-06-15 | 2007-12-19 | Kabushiki Kaisha Toyota Jidoshokki | Halbleiterbauteil |
EP1930945A1 (de) * | 2006-12-05 | 2008-06-11 | SEMIKRON Elektronik GmbH & Co. KG | Leistungshalbleitermodul |
JP2008205058A (ja) * | 2007-02-19 | 2008-09-04 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
DE102008049193B4 (de) * | 2007-09-27 | 2014-09-25 | Infineon Technologies Ag | Niederinduktive Leistungshalbleiteranordnung |
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DE102005039278A1 (de) * | 2005-08-19 | 2007-02-22 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Leitungselement |
JP5702988B2 (ja) * | 2010-01-29 | 2015-04-15 | 株式会社 日立パワーデバイス | 半導体パワーモジュール及びそれが搭載される電力変換装置並びに半導体パワーモジュール搭載用水路形成体の製造方法 |
JP5512377B2 (ja) * | 2010-04-28 | 2014-06-04 | 本田技研工業株式会社 | 回路基板 |
EP2416168B1 (de) * | 2010-07-26 | 2013-05-15 | Semikron | Prüfstand für leistungs-elektronische Blöcke |
US8563364B2 (en) | 2011-09-29 | 2013-10-22 | Infineon Technologies Ag | Method for producing a power semiconductor arrangement |
US8586420B2 (en) | 2011-09-29 | 2013-11-19 | Infineon Technologies Ag | Power semiconductor arrangement and method for producing a power semiconductor arrangement |
JP6320433B2 (ja) | 2014-02-11 | 2018-05-09 | 三菱電機株式会社 | 電力用半導体モジュール |
DE102014110617B4 (de) * | 2014-07-28 | 2023-05-04 | Infineon Technologies Ag | Leistungshalbleitermodulsystem mit hoher Isolationsfestigkeit und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung mit einer hohen Isolationsfestigkeit |
WO2016056320A1 (ja) * | 2014-10-10 | 2016-04-14 | 富士電機株式会社 | 半導体装置及びバスバー |
JP6672908B2 (ja) * | 2016-03-10 | 2020-03-25 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
EP3392908B1 (de) * | 2017-04-20 | 2019-07-24 | Infineon Technologies AG | Leistungshalbleiteranordnung mit einem stapel von eine verbesserte geometrie aufweisenden anschlussplatten zur gemeinsamen elektrischen kontaktierungen mehrerer, gleichartiger leistungshalbleiter-schaltelemente |
US11056860B2 (en) | 2019-10-11 | 2021-07-06 | Eaton Intelligent Power Limited | Bus structure for parallel connected power switches |
US20220109376A1 (en) * | 2020-10-01 | 2022-04-07 | Zf Friedrichshafen Ag | Half-bridge for an electric drive of an electric vehicle or a hybrid vehicle, power module for an inverter and inverter |
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JPS54161335A (en) | 1978-06-09 | 1979-12-20 | Konishiroku Photo Ind Co Ltd | Treatment of color photographic photosensitive material of silver halide |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1868244A1 (de) | 2006-06-15 | 2007-12-19 | Kabushiki Kaisha Toyota Jidoshokki | Halbleiterbauteil |
US7709947B2 (en) | 2006-06-15 | 2010-05-04 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor device having semiconductor element with back electrode on insulating substrate |
EP1930945A1 (de) * | 2006-12-05 | 2008-06-11 | SEMIKRON Elektronik GmbH & Co. KG | Leistungshalbleitermodul |
JP2008205058A (ja) * | 2007-02-19 | 2008-09-04 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
DE102008049193B4 (de) * | 2007-09-27 | 2014-09-25 | Infineon Technologies Ag | Niederinduktive Leistungshalbleiteranordnung |
Also Published As
Publication number | Publication date |
---|---|
JP2007511083A (ja) | 2007-04-26 |
EP1683197A2 (de) | 2006-07-26 |
US20070119820A1 (en) | 2007-05-31 |
WO2005048347A3 (de) | 2005-08-11 |
DE10352671A1 (de) | 2005-06-23 |
US7656672B2 (en) | 2010-02-02 |
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