Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D30/00—Field-effect transistors [FET]
  • H10D30/01—Manufacture or treatment
  • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
  • H10D30/024—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D30/00—Field-effect transistors [FET]
  • H10D30/60—Insulated-gate field-effect transistors [IGFET]
  • H10D30/62—Fin field-effect transistors [FinFET]
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D64/00—Electrodes of devices having potential barriers
  • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
  • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
  • H10D64/311—Gate electrodes for field-effect devices
  • H10D64/411—Gate electrodes for field-effect devices for FETs
  • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
  • H10D64/514—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
  • H10D64/516—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform

Definitions

• the present invention relates to the field of semiconductor devices ; more specifically, it relates to method of fabricating a fin field effect transistor (FinFET).
• FinFET fin field effect transistor
• a vertical fin of crystalline silicon is used to form the body of a transistor and a gate is formed on a sidewall of the body.
• the transistor is generally referred to as a double gated FinFET.
• a first aspect of the present invention is a method of forming a Fin FET device, comprising: (a) providing a semiconductor substrate, (b) forming a dielectric layer on a top surface of the substrate; (c) forming a silicon fin on a top surface of the dielectric layer; (d) forming a protective layer on at least one sidewall of the fin; and (e) removing the protective layer from the at least one sidewall in a channel region of the fin.
• a second aspect of the present invention is a method of forming a FinFET device, comprising: (a) providing a semiconductor substrate, (b) forming a dielectric layer on a top surface of the substrate; (c) forming a silicon fin having sidewalls on a top surface of the dielectric layer; and (d) forming a protective spacer on at least a lower portion of at least one of the sidewalls.
• a third aspect of the present invention is a FinFET device, comprising: a semiconductor substrate, a dielectric layer on a top surface of the substrate; a silicon fin having sidewalls, the fin on a top surface of the dielectric layer; and a protective spacer on at least a lower portion of at least one of the sidewalls.
• FIGs. 1 A through 10A are top views and corresponding FIGs. 1 B through 10B are cross-sectional views illustrating fabrication of a FinFET structure according to a first embodiment of the present invention
• FIG. 1 1 A is a cross-sectional view of a FinFET utilizing a conformal gate as illustrated in FIGs. 10A and 10B after interlevel dielectric (ILD) formation
• FIG. 1 1 B is a cross-sectional view of a FinFET utilizing a damascene planarized gate as after interlevel dielectric (ILD) formation
• ILD interlevel dielectric
• FIGs. 1 2A through 1 6A are top views and corresponding FIGs. 1 2B through 16B are cross-sectional views illustrating fabrication of a FinFET structure according to a second embodiment of the present invention.
• FIGs. 1 7A through 1 7F are cross-sectional views illustrating fabrication of a FinFET structure according to a third embodiment of the present invention.
• FIGs. 1 A through 9A are top views and corresponding FIGs. 1 B through 9B are cross- sectional views illustrating fabrication of a FinFET structure according to a first embodiment of the present invention.
• FIG. 1 B is a cross-sectional view through line 1 B-l B of FIG. 1 A.
• a semiconductor substrate 100 is provided.
• substrate 100 is mono- crystalline silicon.
• Formed on a top surface 105 of substrate 100 is a buried dielectric layer, in the present exampled a buried oxide layer (BOX) 1 10.
• Formed on a top surface 1 1 5 of BOX 1 10 is a silicon layer 120.
• silicon layer 1 20 is about 200 to 2000 A thick. Silicon layer 1 20 may be mono-crystalline- silicon, poly-crystalline silicon or amorphous silicon.
• Substrate 100, BOX 1 10 and silicon layer 1 20 may be obtained as a Silicon-on-lnsulator (SOI) substrate or a SIMOX substrate.
• An etch mask 1 30 is formed on a top surface of silicon layer 1 25.
• etch mask 1 30 is formed by applying a photoresist layer to top surface 125 of silicon layer 1 20 and photo-lithographically patterning the photoresist layer.
• FIG. 2B is a cross-sectional view through line 2B-2B of FIG. 2A.
• a reactive ion etch (IE) process (using, for example CF4) is performed to remove unwanted silicon from silicon layer 1 20 above BOX 1 10 and leave a fin 1 35.
• Fin 1 35 has a width W and a height H.
• the height H is the same as the thickness of silicon layer 120 of FIG. 1 B, which is about 500 to 2000 ⁇ . In one example, W is about 50 to 350 A.
• a base surface 140 of fin 1 35 is in direct physical contact with top surface 1 1 5 of BOX 1 10 and this contact and adhesion between the fin and the BOX supports the fin.
• FIG. 3B is a cross-sectional view through line 3B-3B of FIG. 3A.
• mask 1 30 (see FIG. 2B) is removed using a buffered hydrofluoric acid (BHF) causing undercut of BOX 1 10 under base surface 140 of fin 1 35. Fin 1 35 is now supported only by a pedestal 145
• FIG. 4B is a cross-sectional view through line 4B-4B of FIG. 4A.
• a number of cleaning steps including oxidations and BHF strips are performed to clean sidewalls 1 50A and 1 50B and remove crystallographic surface defects from the sidewalls. These cleaning steps cause further undercut of BOX 1 10 under base surface 140 of fin 1 35.
• Fin 1 35 is now supported only by pedestal 1 55.
• the undercut of fin is D on each side of the fin. In one example, D is about 50 to 75 A. Care must be taken not to completely undercut fin 1 35. As the total area of contact between base surface 140 of fin 1 35 and pedestal 1 55 decreases, the fin becomes more easily broken off.
• FIG. 5B is a cross-sectional view through line 5B-5B of FIG. 5A.
• a conformal protective layer 1 60 is formed over sidewalls 1 50A and 1 50B and a top surface 1 50C of fin 1 35 and over exposed top surface 1 1 5 of BOX 1 10.
• Protective layer 160 protects sidewalls 1 50A and 1 50B of fin 1 35 from potential damage from subsequent processing (described infra), and structurally supports the fin.
• protective layer 1 60 is a tetraethoxysilane (TEOS) oxide formed by plasma- enhanced chemical vapor deposition (PECVD) and is about 1 5 to 50 A thick.
• PECVD plasma- enhanced chemical vapor deposition
• protective layer 160 is silicon nitride formed by low-pressure chemical vapor deposition (LPCVD) and is about 1 5 to 50 A thick.
• a series of process steps, necessary to form doping regions, such as source/drain (S/D) regions and to tailor doping levels of channel regions within fin 1 35 are next performed.
• the steps each include: (1 ) masking a region of fin 1 35 with a photoresist mask, (2) performing an ion implantation, (3) removing the photoresist mask (usually in an oxygen plasma), and (4) performing an optional anneal. These four steps can be repeated from 2 to 4 or more times, the exact number of times is dependent upon the dopant level control within fin 1 35 that is required.
• cleans such as a dilute hydrofluoric acid (HF) clean and/or a Huang A clean, and/or Huang B clean are performed.
• An example of an ion-implantation step is illustrated in FIGs. 6A and 6B and described infra. Without protective layer 1 60 in place damage may occur to the surfaces of sidewalls 1 50A and 1 50B and fin 1 35 may be undercut to the point where the fin detaches from BOX 1 10.
• FIG. 6B is a cross-sectional view through line 6B-6B of FIG. 6A.
• a photoresist mask 165 is formed over S/D regions 1 70 of fin 1 35 and an ion implant performed in channel region 1 75 of the fin.
• Ion implant species X may be any species commonly implanted such as B, P, As, and Ge.
• channel region 1 75 is masked and the implant performed into S/D regions 1 70.
• FIG. 7B is a cross-sectional view through line 7B-7B of FIG. 7A.
• a photoresist mask 1 80 is formed over portions of protective layer 160 and BOX layer 1 10 and the protective layer is removed from fin 1 35 where it is not protected by the photoresist mask.
• protective layer 1 60 comprising silicon nitride
• a fluorine based RIE or a hot phosphoric acid etch may be used.
• protective layer 160 comprising silicon dioxide a fluorine based RIE or a dilute HF acid etch may be used.
• FIG. 8B is a cross-sectional view through line 8B-8B of FIG. 8A.
• a gate dielectric layer 1 85 is formed on exposed sidewalls 1 50A and 1 50B and top surface 1 50C of fin 1 35.
• gate dielectric layer 185 is thermal oxide about 1 5 to 50 A thick.
• FIG. 9B is a cross-sectional view through line 9B-9B of FIG. 9A.
• a gate 1 90 is formed over gate dielectric 1 85 and fin 1 35 in channel region 1 75 of the fin.
• gate 190 is formed by a conformal blanket deposition of a conductive material, a photolithographic masking step and an RIE.
• suitable gate materials include doped and undoped polysilicon and metals such as W or A Since gate 1 90 is formed over both sidewalls 1 50A and 1 50B of fin 1 35, the resultant FinFET will be double gated.
• FIG. 10B is a cross-sectional view through line 1 OB-10B of FIG. 9A.
• any remaining protective layer 160 (see FIG. 9A) is removed using a dilute HF etch or fluorine based RIE or using H3PO4 if protective layer 1 60 is silicon nitride.
• Fin 1 35 is now supported by gate 1 90 until an ILD is deposited over the entire FinFET structure.
• FIG. 1 1 A is a cross-sectional view of a FinFET utilizing a conformal gate as illustrated in FIGs. 10A and 10B after ILD formation.
• an ILD layer 1 95 is deposited on top of gate 190, exposed surfaces of fin 1 35 and exposed surfaces of BOX 1 1 0.
• a chemical-mechanical-polish (CMP) process is performed to planarize a top surface 200 of the ILD layer.
• ILD materials included TEOS PECVD oxide and fluorine doped glass (FSG).
• FSG fluorine doped glass
• 1 1 B is a cross-sectional view of a FinFET utilizing a damascene planarized gate as after interlevel dielectric (ILD) formation.
• ILD 195 is deposited first and gate 190A is formed by a damascene process.
• trenches are formed in an ILD by photo-lithographically patterning a masking layer applied over the ILD, performing a reactive ion etch (RIE) of the ILD, removing the masking layer, depositing a conductive material of sufficient thickness to fill the trench and performing CMP process to co-planarize the top surfaces of the conductive material and the ILD.
• RIE reactive ion etch
• top surface 200 of ILD 1 95 is co-planer with a top surface 205 of gate 190A.
• gate dielectric 1 85 it may be necessary to form gate dielectric 1 85 after the trench is etched.
• the resultant FinFET is completed by making direct contact to gate 1 85 and contacts to the S/D regionsl 70 (see FIG. 6A) of fin 1 35 through vias formed in ILD 195.
• FIGs. 1 2A through 1 6A are top views and corresponding FIGs. 12B through 1 6B are cross-sectional views illustrating fabrication of a FinFET structure according to a second embodiment of the present invention.
• FIG. 12B is a cross-sectional view through line 1 2B-1 2B of FIG. 1 2A.
• the starting point for the second embodiment is immediately after deposition of protective layer 1 60 as described supra in reference to FIGs. 5A and 5B and includes all prior steps illustrated in FIGs. 1 A(B) through 4A(B).
• FIGs. 1 2A and 1 2B are the same as FIGs. 5A and 5B respectively.
• FIG. 1 3B is a cross-sectional view through line 1 3B-1 3B of FIG. 1 3A.
• an RIE of protective layer 1 60 (see FIG. 1 2B) is performed to form supporting spacers 210A and 210B on lower portions 21 5A and 21 5B of sidewalls 1 50A and 1 50B of fin 1 35 respectively.
• Spacers 210A and 210B provide structural support for fin 1 35.
• a series of process steps, necessary to form doping regions, such as source/drain (S/D) regions and tailor channel regions within fin 1 35 are next performed.
• S/D source/drain
• the steps each include: (1 ) masking a region of fin 1 35 with a photoresist mask, (2) performing an ion implantation, (3) removing the photoresist mask (usually in an oxygen plasma), and (4) performing an optional anneal. These four steps can be repeated from 2 to 4 or more times, the exact number of times is dependent upon the doping level control within fin 1 35 that is required. Finally cleans such as a dilute hydrofluoric acid (HF) clean and/or a Huang A clean, and/or Huang B clean are performed.
• HF dilute hydrofluoric acid
• FIG. 14B is a cross-sectional view through line 14B-14B of FIG. 14A.
• a photoresist mask 165 is formed over S/D regions 1 70 of fin 1 35 and an ion implant performed in channel region 1 75 of the fin.
• Ion implant species X may be any species commonly implanted such as B, P, As, and Ge.
• channel region 1 75 is masked and the implant performed into S/D regions 1 70.
• FIG. 1 5B is a cross-sectional view through line 1 5B-1 5B of FIG. 1 5A. In FIGs.
• a gate dielectric layer 1 85 is formed on exposed sidewalls 1 50A and 1 50B and top surface 1 50C of fin 1 35.
• gate dielectric layer 1 85 is thermal oxide about 1 5 to 50 A thick.
• Spacers 210A and 210B will be incorporated into the completed FinFET device. Alternatively, support spacers 210A and 210B may be first removed by RIE prior to formation of gate dielectric 185.
• FIG. 16B is a cross-sectional view through line 1 6B-16B of FIG. 1 6A.
• a gate 190 is formed over gate dielectric 1 85 and fin 1 35 in channel region 1 75 of the fin.
• gate 190 is formed by a conformal blanket deposition of a conductive material, a photolithographic masking step and an RIE.
• suitable gate materials include doped and undoped polysilicon and metals such as W or A Since gate 1 90 is formed over both sidewalls 1 50A and 1 50B of fin 1 35, the resultant FinFET will be double gated.
• the FinFET may be completed as describes supra for the first embodiment of the present invention.
• FIGs. 1 7A through 1 7F are cross-sectional views illustrating fabrication of a FinFET structure according to a third embodiment of the present invention.
• a semiconductor substrate 300 is provided.
• Formed on a top surface 305 of substrate 300 is a BOX 310.
• Formed on a top surface 31 5 of BOX 310 is a mandrel layer 320.
• mandrel layer 320 is silicon nitride.
• mandrel layer 320 (see FIG. 1 7A) is photo-lithographically patterned and an RIE performed to form a mandrel 325.
• FIG. 1 7A is photo-lithographically patterned and an RIE performed to form a mandrel 325.
• an amorphous silicon or poly crystalline silicon layer 330 is conformally deposited on a top surface 335, on a sidewall 340 of mandrel 325 and on exposed top surface 31 5 of BOX 310.
• silicon layer 330 is formed by sputtering silicon. Silicon layer 330 is subjected to a high temperature anneal to convert it to a monocrystalline silicon layer.
• silicon layer 330 (see FIG. 1 7C) is an RIE performed to form a fin 345. An inner sidewall 350A of fin 345 is in contact with sidewall 340 of mandrel 335.
• a conformal protective layer 350 is formed over top surface 335 of mandrel 325, a top surface 360 and an outer sidewall 350B of fin 345 and exposed top surface 31 5 of BOX 310.
• an RIE process is performed to form a supporting spacer 365 in contact with a lower portion 370 of outer sidewall 350A of fin 345. Further processing as described supra may be performed to complete a FinFET device. Supporting spacer 365 may be removed later in processing or left in place and incorporated into the completed FinFET device.
• the present invention discloses a method of fabricating FinFETs having very thin fins that have sidewall surfaces that are crystallographically closer to perfect and that overcomes the inherent structural weakness of thin fins.

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• 2003
  • 2003-11-05 US US10/605,905 patent/US6962843B2/en not_active Expired - Lifetime
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