WO2005000579A1 - 積層体およびその製造方法 - Google Patents
積層体およびその製造方法 Download PDFInfo
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- WO2005000579A1 WO2005000579A1 PCT/JP2004/009369 JP2004009369W WO2005000579A1 WO 2005000579 A1 WO2005000579 A1 WO 2005000579A1 JP 2004009369 W JP2004009369 W JP 2004009369W WO 2005000579 A1 WO2005000579 A1 WO 2005000579A1
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- plating
- catalyst
- plating layer
- compound
- cyclic olefin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
- C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
- C08F4/72—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from metals not provided for in group C08F4/44
- C08F4/80—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from metals not provided for in group C08F4/44 selected from iron group metals or platinum group metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/02—Polymerisation in bulk
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon
Definitions
- the present invention relates to a laminated polymer molded body subjected to plating and a method for producing the same.
- the surface of the molded product may be plated to improve the appearance and physical properties and to add a new function.
- plating When applying plating to the surface of a resin molded product, it is common to perform physical etching such as polishing the surface of the molded product or chemical etching using an etchant to ensure the adhesion between the molded product and plating. is there.
- an etchant As an etchant, a solution containing a highly active chromic acid compound has been widely used. In recent years, from the viewpoint of environmental safety, those containing permanganate compounds are being used more and more. .
- the present inventors have used a ruthenium catalyst described in Japanese Patent Application Laid-Open No. 2002-29391 and Japanese Patent Application Publication No. Therefore, when bulk polymerization is carried out in the presence of an inorganic filler, the catalyst activity is unlikely to decrease due to the presence of the filler, and the degree of freedom in designing the type and amount of the filler is increased, and it is possible to obtain a molded article that meets advanced requirements. I found it. Even when an etchant containing a permanganate compound having low activity is used, forming a plating layer on the surface of the molded body ensures that the adhesion between the molded body and the plating layer is excellent. They have found and completed the present invention.
- a laminate in which a plating layer is formed on the surface of a molded product obtained by subjecting a cyclic olefin monomer to bulk polymerization using a ruthenium catalyst in the presence of an inorganic filler.
- the surface of a molded product obtained by bulk polymerization of a cyclic olefin monomer using a ruthenium catalyst in the presence of an inorganic filler is chemically etched with a permanganate compound, and then a plating catalyst is applied. And a method for producing the laminate, wherein electroless plating is performed.
- the molded article used in the present invention is obtained by subjecting a cyclic olefin monomer to bulk ring-opening metathesis polymerization in the presence of an inorganic boiler and a ruthenium catalyst as a metathesis polymerization catalyst.
- Other additives such as solvents, activators, retarders, chain transfer agents, and other organic components can be used in addition to the cyclic olefin monomer B.
- the cyclic olefin monomer used in the present invention is an olefin having an alicyclic structure in the molecule.
- the alicyclic structure is a non-aromatic ring structure having a carbon-carbon bond.Based on the number of rings, a monocyclic ring, a polycyclic ring, a condensed polycyclic ring, a bridged ring, a combination of these rings, and the like can be mentioned.
- the cyclic olefin monomer has a carbon-carbon double bond. However, from the viewpoint of environmental stability such as heat, light, and humidity, the obtained laminate preferably has only one carbon-carbon double bond, particularly an alicyclic structure. Preferably has one carbon-carbon double bond therein.
- the number of carbon atoms constituting the alicyclic structure is not particularly limited, it is usually in the range of 4 to 30, preferably 5 to 20, and more preferably 5 to 15.
- cyclic olefin monomer examples include a norbornene-based monomer and a monocyclic hydrocarbon monomer. These cyclic olefin monomers can be used alone or in combination of two or more. Among these, the combination of a monomer having two alicyclic structures and a monomer having four alicyclic structures as the cyclic olefin monomer has excellent adhesion of the plating layer of the obtained laminate. This is preferred. In this case, the ratio of the monomer having two alicyclic structures / the monomer having four alicyclic structures is usually 5/95 to 95/5, preferably 15/85 to 85Z15, more preferably 25 75 by weight. ⁇ 7525.
- the norbornene monomer is a compound having a norpolene ring structure, and examples thereof include norbornenes, dicyclopentagens, tetracyclododecenes, and benzoindenes. These include hydrocarbon groups such as alkyl groups, alkenyl groups, alkylidene groups, and aryl groups, hydroxy groups, carboxy groups, alkoxyl groups, epoxy groups, glycidyl groups, oxycarbonyl groups, carbonyl groups, and amino groups. , An ester group, and a carboxylic acid anhydride group. Further, in addition to the double bond of the norbornene ring, it may have another double bond.
- norbornene-based monomers include bicyclo [2.2.1] hepter 2-ene (common name norbornene), tricyclo [4. 3. 0. I 2 ' 5 ] decal 3, 7-gen (Common name dicyclopentadiene), tetracyclo [4.4.0. I 2 ' 5.
- I 7 ' 10 dodeca 3-ene (common name tetracyclododecene), 8-ethyl-tetracyclo [4. 4. 0. I 2 '5.
- I 10 '13. 0 1' 9. 0 2 ' 7 ] Trideker 2,4,6,11-tetraene (common name methanotetrahydro Fluorene; MTF), and those having a polar group bonded thereto.
- the monocyclic hydrocarbon monomer is a cyclic olebuin monomer having one alicyclic structure, and examples thereof include cyclobutene, cyclopentene, cyclohexene, 3,4-dimethylcyclopentene, ⁇ 3-methylcyclohexene, 2- (2-methylbutyl) monocyclic cycloalkenes such as 1-cyclohexene, cyclooctene, cycloheptene, and butylcyclohexene; fats such as 1,4-cyclohexadiene and 1,5_cyclooctadiene Acyclic non-conjugated diene; alicyclic conjugated diene such as cyclopentadiene, cyclohexadiene, and 1,3-cyclooctadiene;
- the above-mentioned cyclic olefin monomer is polymerized in the presence of an inorganic filler.
- the inorganic filler used in the present invention is not particularly limited as long as it can form a so-called sea-island structure by phase separation with the polymer in the molded article. Because of the excellent adhesion between the molded product and the plating layer, inorganic substances that are dissolved or decomposed by a chemical etching agent (acid, alkali, oxidizing agent, etc.) used for chemical etching, which is a pretreatment for plating, Particles and metal particles are preferred as the inorganic filler.
- a chemical etching agent ascid, alkali, oxidizing agent, etc.
- Particles and metal particles are preferred as the inorganic filler.
- These inorganic fillers are generally added as a functional additive such as a coloring agent; a modifying agent having a modifying effect such as an increase in strength, an improvement in flame retardancy, or an increase in linear expansion coefficient. is there.
- the inorganic filler located on the surface of the compact is dissolved or decomposed by the chemical etching agent, and has a function of roughening the surface of the compact, and the inorganic filler located inside the compact exhibits its intended function. Improve the performance of molded articles.
- Inorganic particles include aluminum hydroxide, magnesium hydroxide, sodium hydroxide, calcium hydroxide, ferrous hydroxide, ferric hydroxide, cuprous hydroxide, cupric hydroxide, and hydroxide hydroxide.
- Metal hydroxides such as stannous and stannic hydroxide; silicon oxide (silica), aluminum oxide, zirconia, zinc oxide, magnesium oxide, titanium oxide, sodium oxide, calcium oxide, ferrous oxide, oxide ferric, cuprous oxide, cupric oxide, tin oxide, Kojiwerai preparative (2 M g ⁇ ⁇ 2 a 1 2 0 3 ⁇ 5 S i 0 2), and metal oxides such as antimony oxide; sodium chloride , Sodium bromide Platinum, calcium chloride, aluminum chloride, ferrous chloride, ferric chloride, cuprous chloride, cupric chloride, stannous chloride, stannic chloride, chlorosilane, ammonium chloride, antimony trichloride, etc.
- Metal chlorides metal sulfates such as sodium hydrogen sulfate, sodium sulfate, calcium sulfate, and ammonium sulfate; nitrates such as sodium nitrate and calcium nitrate; sodium dihydrogen phosphate, sodium hydrogen phosphate; Phosphates such as sodium phosphate, ammonium phosphate and sodium polyphosphate; hydrated magnesium silicate (talc) and silicates (minerals) such as mica; antimonates such as sodium antimonate Carbonates such as sodium hydrogen carbonate, sodium carbonate, and calcium carbonate; sodium hydrogen sulfite, Sodium sulfite such as sodium sulfite; sodium hypophosphite; hypophosphite such as ammonium hypophosphite; phosphite such as sodium phosphite; sodium hypochlorite; Hypohalites such as calcium hypochlorite and sodium hypobromite; thiosulfites such as sodium thiosul
- Metal particles such as aluminum, nickel, magnesium, copper, zinc, and iron can also be used as the inorganic filler.
- the inorganic boiler is preferably in the form of particles.
- the inorganic filler is in the form of particles, it is observed with a scanning electron microscope to measure the major axis of 100 particles of the inorganic filler, and the number average of the particles is calculated from the average of the obtained values.
- the particle size is from 0.001 to 100 ⁇ , preferably from 0.01 to 50 ⁇ , more preferably from 0.1 to 20 ⁇ , particularly preferably from 0.5 to 10 ⁇ . It is. Completion This is because the adhesion between the shape and the plating layer is stably improved.
- the amount of the inorganic filler to be used is generally 1 to 500 parts by weight, preferably 5 to 400 parts by weight, more preferably 10 to 300 parts by weight, per 100 parts by weight of the cyclic olefin monomer. Particularly preferably, it is 20 to 200 parts by weight. If the amount is too small, the adhesion between the molded body and the plating layer is not sufficiently good, and if the amount is too large, the strength of the obtained laminate is reduced, and so on the contrary.
- the ruthenium catalyst used in the present invention is not particularly limited as long as it is a catalyst containing ruthenium as a main component of a metal component and capable of subjecting the above-mentioned cyclic olefin monomer to metathesis ring-opening polymerization.
- Examples of the ruthenium catalyst include a complex formed by bonding a plurality of ions, atoms, polyatomic ions and Z or a compound with a ruthenium atom as a central atom.
- a ruthenium carbene complex is particularly preferred.
- the luteuum carbene complex has excellent catalytic activity during bulk polymerization, and thus has excellent molded product productivity. Further, it is relatively stable to oxygen and moisture in the air and is hardly deactivated, so that production is possible even in the atmosphere, which is preferable.
- the ruthenium carbene complex is preferably represented by the following formula (1) or (2).
- R 1 and R 2 may be the same or different, and represent a hydrogen atom; a halogen atom; or a halogen atom, an oxygen atom, or a nitrogen atom.
- X 1 and X 2 may be the same or different and have any anionic coordination Indicates a child.
- L 1 and L 2 may be the same or different and represent a hetero atom-containing carbene compound or a neutral electron donating compound, and one of them is preferably at least a hetero atom-containing rubene compound.
- the temperature dependence of the polymerization reaction rate of the ruthenium catalyst is large, the storage stability at low temperatures and the polymerization reactivity at high temperatures are excellent, and a molded product with good productivity can be obtained.
- RR 2 , X 1 , XL 1 and L 2 may be combined with each other in any combination to form a polydentate chelating ligand.
- Heteroatoms are atoms other than carbon and hydrogen, and are preferably atoms of Groups 15 and 16 of the Long Periodic Table, and specific examples thereof include N, 0, P, S, and A. and s and Se atoms. Among these, from the viewpoint of obtaining a stable carbene compound, N, 0, P, and S atoms are preferred, and an N atom is particularly preferred. It is preferable that the helium atom-containing benzene compound has a helium atom bonded to both sides of the helium carbon, and that a heterocyclic ring containing a carbene carbon and a hetero atom on both sides thereof is formed. What is constituted is more preferred. Further, it is preferable that a bulky substituent is bonded to the hetero atom adjacent to the carbene carbon.
- Examples of the carbene compound containing a hetero atom include a compound represented by the following formula (3) or (4).
- R 3 to R 6 may be the same or different from each other, and represent a hydrogen atom; a halogen atom; or a carbon atom 1 which may include a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, or a silicon atom)
- R 3 to R 6 may be combined with each other in any combination to form a ring.
- Specific examples of the compounds represented by the above formulas (3) and (4) include 1,3-dimesitylimidazolidine-1-2- ⁇ lidene, and 1,3-di (1-adamantyl) imidazolysine-1-2-ylidene , 1-mouth hexyl 3-mesityl imidazolidine 1-1-ylidene, 1, 3-dimesityloctahydrobenzimidazole-2-ylidene, 1, 3-diisopropyl 1-4-1-imidazoline 1-2-ylidene, 1 , 3-di (1-phenylenyl) -14-imidazoline-12-ylidene, and 1,3-dimesityl-2,3-dihydrobenzimidazole-12-ylidene.
- 1,3,4 triphenyl 2,3,4,5-tetrahydro 1 H— :! 2,4-Triazole-1-5-ylidene, 1,3-Dicyclohexylhexahydropyrimidine-12- ⁇ lidene, N, N, N ', N'-tetraisopropylformamidyliden, 1,3, 4-triphene-north-4,5-dihydro 1H-1,2,4-triazolone-5-ylidene and 3- (2,6-diisopropylphenyl) -1,2,3-dihydrot Azole-2-ylidene can also be used as a carbene compound containing a hetero atom.
- the anionic ligands X 1 and X 2 are ligands having a negative charge when separated from the central metal.
- halogen atoms such as Cl, Br, and I, diketonate groups, substituted cyclopentadienyl groups, alkoxy groups, aryloxy groups, and carboxyl groups.
- a halogen atom is preferable, and a chlorine atom is more preferable.
- the neutral electron donating compound used as L 1 or L 2 is any ligand having a neutral charge when separated from the central metal. May be.
- phosphines, ethers, and pyridines are preferred, and trialkylphosphines are more preferred.
- Examples of the complex compound represented by Formula (1) for example, benzylidene (1, 3 over dimesityl imidazolidine one 2- Iriden) (hexyl phosphine to Torishiku port) ruthenium dichloride de, (1, 3 - di Mesityl imidazolidine-1-ylidene)
- Benzylidenebis (1,3-dicyclohexylimidazolidin-1-ylidene) ruthenium dichloride and benzylidenebis (1,3-diisopropyl-14-midazoline-1-2-ylidene) Ruthenium complex bonded with a carbene compound containing a terrorist atom; and the like.
- examples of the complex compound in which R 1 and L 1 are bonded include compounds represented by the following (5) to (7).
- Examples of the complex compound represented by the formula (2) include (1,3-dimesityl imidazolidine-1-ylidene) (phenylvinylidene) (tricyclohexyl phosphine) ruthenium dichloride, (t-butyl vilidene) ) (1,3-Diisopropyl-1-4_imidazoline-12-ylidene) (tricyclopentylphosphine) ruthenium dichloride and bis (1,3-dicyclohexyl-4-1-imidazoline-2-ylidene) phenirubi Examples include dilidene ruthenium dichloride.
- ruthenium complex compounds can be produced, for example, by the methods described in Organic Letters, vol. 1, p. 953, 1999, and Te trahedron Letters, vol. 40, p. 2247, 1999. it can.
- the amount of the ruthenium catalyst used is usually 1: 2,000 to 1: 2,000,000, preferably 1: 5,000 to 1: 1, in terms of the molar ratio of (ruthenium atom in the catalyst: cyclic olefin monomer). , 1,000,000, more preferably in the range of 1: 10,000 to 1: 500,000.
- the ruthenium catalyst can be used by dissolving it in a small amount of an inert solvent, if necessary.
- an inert solvent examples include linear aliphatic hydrocarbons such as n-pentane, n-hexane, and n-heptane; cyclopentane, cyclohexane, methylcyclohexane, dimethinoresic hexane, and trimethinoresic mouth.
- Alicyclic hydrocarbons such as xane, ethyl cyclohexane, ethynolecyclohexane, decahydronaphthalene, dicycloheptane, tricyclodecane, hexahydroindenecyclohexane, and cyclooctane; benzene, toluene, and xylene
- fragrance Group hydrocarbons nitrogen-containing hydrocarbons such as nitromethane, nitrobenzene, and acetonitrile
- oxygen-containing hydrocarbons such as getyl ether and tetrahydrofuran; and the like.
- aromatic hydrocarbons, chain aliphatic hydrocarbons, and alicyclic hydrocarbons which are excellent in the solubility of the ruthenium catalyst and are widely used industrially are preferable.
- a liquid antioxidant, a plasticizer or an elastomer may be used as the inert solvent.
- An activator (co-catalyst) or a retarder may be used in combination with the ruthenium catalyst for the purpose of controlling the polymerization activity or improving the polymerization reaction rate.
- the activator include (partially) alkylated, (partially) halide, (partially) alkoxylated and (partially) aryloxy compounds of aluminum, scandium, tin, titanium, and zirconium. Can be (where "(part)" is these
- the compound may be classified into a plurality of “compounds”.
- Specific examples of the activator include trialkoxyaluminum, trienoxyminium, dialkoxyalkylaluminum, alkoxydialkylaluminum, trialkylaluminum, dialkoxyaluminum chloride, alkoxyalkylaluminum chloride, and dialkylaluminum chloride.
- the retarder is a compound that is more easily coordinated to ruthenium than a monomer, and examples thereof include triphenylphosphine.
- the amount of the activator or the retarder used is usually a molar ratio of a force (metal atom in the ruthenium catalyst: activator) that is set arbitrarily according to the compound to be used and the purpose, and is usually from 1: 0.05 to 1: 1. : 100, preferably 1: 0.2 to 1:20, more preferably 1: 0.5 to 1:10.
- the activator is preferably used by dissolving it in the cyclic olefin monomer.
- the activator may be suspended or dissolved in a small amount of a solvent as long as the properties of the intended laminate are not substantially impaired. Can be used.
- a chain transfer agent can be added to the polymerization reaction system.
- the chain transfer agent for example, a compound having a carbon-carbon double bond may be used. You can. Specific examples thereof include bürnorbornenes such as 2-burnorbornene; aliphatic olefins such as 1-hexene and 2-hexene; aromatic olefins such as styrene, butylstyrene, and stilbene; Alicyclic olefins, such as vinylcyclohexene; vinyl ethers, such as ethylbutyl ether; vinyl ketones, such as methylbutyl ketone; ethylenically unsaturated esters, such as aryl acetate and aryl methacrylate; . Of these, byurnorbornenes and bursic hexene are both chain transfer agents and cyclic olefin monomers, but mainly act as chain transfer
- the amount of the chain transfer agent to be used is usually 0.01 to 10% by weight based on the cyclic olefin monomer. / 0 , preferably 0.05-5 weight. / 0 , more preferably 0.1 to 2 weight. / 0 . When the amount of the chain transfer agent is within this range, a molded article can be obtained efficiently.
- a crosslinking agent can be further added for the purpose of improving the physical properties of the molded article and the laminate.
- the crosslinking agent include a radical generator, an epoxy compound, an isocyanate group-containing compound, a carboxyl group-containing compound, an acid anhydride group-containing compound, an amino group-containing compound, and a Lewis acid.
- These crosslinking agents can be used alone or in combination of two or more.
- the use of a radical generator, an epoxy compound, an isocyanate group-containing compound, a carboxyl group-containing compound, and an acid anhydride group-containing compound is preferable, and the use of a radical generator, an epoxy compound, and an isocyanate group-containing compound is more preferable.
- a radical generator such as an organic peroxide diazo compound or an epoxy compound.
- organic components such as an organic filler, an antioxidant, an ultraviolet absorber, and a light stabilizer can be added to the cyclic olefin monomer in addition to the components described above.
- Organic fillers include natural rubber, polybutadiene, polyisoprene, styrene butadiene copolymer (SBR), styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene copolymer (SIS), and acrylic acid.
- SBR styrene butadiene copolymer
- SBS styrene-butadiene-styrene block copolymer
- SIS styrene-isoprene-styrene copolymer
- acrylic acid acrylic acid
- ABS -Toluene butadiene-styrene copolymer
- NBR Mouth-Torinole rubber
- EPDM Ethylene-propylene diene terpolymer
- EVA Ethylene monoacetate copolymer
- Polysulfuric synthetic rubber Acrylic rubber, Urethane rubber, Fluorine rubber, Silicone rubber, Polyesternole Elastomers, polyolefin-based thermoplastic elastomers, polyvinyl chloride-based thermoplastic elastomers, melamine resins, urea resins, and guanamine resins; cellulose nitrate, cellulose acetate, cellulose acetate butyrate, cellulose acetate propionate, and ethyl cellulose Cellulose-based resins such as melamine polyphosphate, melam polyphosphate, melem polyphosphate, and salts such as melamine-melam polymellate double salt.
- organic components include phenol-based antioxidants, phosphorus-based antioxidants, and amine-based antioxidants for various plastics, such as rubber antioxidants; benzotriazole-based UV absorbers, and benzophenone-based UV absorbers.
- a light stabilizer such as a salicylate-based ultraviolet absorber, a cyanoacrylate-based ultraviolet absorber, an oxanilide-based ultraviolet absorber, a hindered amine-based ultraviolet absorber, and a benzoate-based ultraviolet absorber.
- the amount of these other organic components to be used is usually 0.0001 to 100 parts by weight based on 100 parts by weight of the cyclic olefin monomer.
- a reaction solution containing a cyclic olefin monomer and the above-described components is first prepared, and then subjected to bulk polymerization.
- the method for preparing the reaction solution is not limited.
- a solution containing a cyclic olefin monomer hereinafter sometimes referred to as a “monomer solution”
- a solution in which a ruthenium catalyst is dissolved or dispersed in an appropriate solvent (catalyst) Liquid and separately prepared and mixed immediately before the reaction.
- the inorganic filler and various additives may be added to the monomer liquid or the catalyst liquid. Further, they can be added to a reaction solution obtained by mixing a monomer solution and a catalyst solution.
- reaction solution containing a predetermined amount of one component of a monomer, a ruthenium catalyst, and, if necessary, other components such as a chain transfer agent is poured into a mold. And curing by reaction injection molding.
- a conventionally known mold for example, a mold having a split mold structure, that is, a mold having a core mold and a cavity mold can be used.
- the reaction solution is injected into the cavity (cavity) of the above to cause bulk polymerization.
- the core mold and the cavity mold are manufactured so as to form voids that match the shape of the target molded product.
- the shape, material, size, etc. of the mold are not particularly limited, but the polymerization rate can be increased by using a metal mold.
- a high polymerization rate is preferable because a large amount of inorganic filler collects on the surface of the molded body, so that the surface of the molded body can be easily roughened by chemical etching, which is a pretreatment for plating.
- the reaction solution is injected into the mold cavity to promote bulk polymerization.
- the temperature of the mold is preferably from 110 to 300, more preferably from 120 to 300 ° C, and particularly to a temperature 30 ° C or more, preferably 50 ° C or more higher than the Tg of the obtained molded body. This is preferable because the surface of the molded body can be easily roughened by chemical etching.
- the filling pressure (injection pressure) for filling the reaction solution into the cavity is usually 0.01 to 10 MPa, preferably 0.02 to 5 MPa. If the filling pressure is too low, the transfer surface formed on the inner peripheral surface of the cavity tends to be poorly transferred.If the filling pressure is too high, the rigidity of the mold must be increased, which is not economical. Absent.
- the clamping pressure is usually in the range of 0.01 to 1 OMPa.
- the polymerization time may be appropriately selected, but is usually from 10 seconds to 20 minutes, preferably within 5 minutes.
- a plating layer is formed on the surface of the thus obtained molded body.
- the plating layer is usually formed by electroless plating, and if necessary, the thickness of the plating layer may be further increased by electrolytic plating.
- the adhesion between the molded product and the plating layer can be improved by heating and pressing the plating layer.
- a plating catalyst such as silver, palladium, zinc, or cobalt
- Such pretreatments include a degreasing step, a chemical etching step, a catalyst application step, and an activation step.
- general methods are employed as these pretreatment methods.
- the oily dirt adhering to the surface of the compact is Remove by a method such as chemical degreasing, emulsion degreasing, electrolytic degreasing, or mechanical degreasing and clean.
- a chemical etching solution containing a permanganate compound, a chromate compound, a ferric chloride compound, or the like is used.
- a laminate obtained by etching the molded body using a permanganese oxide compound is preferable because it exhibits excellent adhesion to the plating layer.
- an etching method using a permanganate compound concretely, an aqueous solution of an alkaline solution such as an aqueous solution of a permanganate solution or an aqueous solution of sodium permanganate is brought into contact with the molded body, and then, the hydroxyamamine sulfate is added thereto.
- a method of performing a neutralization-reduction treatment with an acidic aqueous solution such as a mixed solution with sulfuric acid may be used.
- a metal such as silver, palladium, zinc, or cobalt or a complex thereof is dissolved in water or an organic solvent such as alcohol or chloroform in a weight of 0.01 to 10 wt. %
- a solution concentration of acid, alkali metal, complexing agent, reducing agent, etc., if necessary
- reducing the metal plating the surface of the compact Attach and activate the catalyst.
- a plating-inducing substance is brought into contact with the surface of the compact after chemical etching and before the catalyst application step.
- the plating inducing substance known substances can be used.
- a conductive material composed of a mixture of a conductive biopolymer or a precursor thereof and water or a polar solvent (Japanese Patent Application Laid-Open No. 200-260) No. 14)
- a composition comprising a soluble palladium salt, a water-soluble solvent and water
- Japanese Patent Laid-Open No. 7-131135 Japanese Patent Laid-Open No.
- JP-A-2000-147,762 a compound having a metal atom such as an amino group, a thiol group, a carboxyl group, or a cyano group, a compound having a functional group capable of chelating with metal ion, or a metal atom;
- Compounds having an unshared electron pair such as a heterocyclic compound having a coordinating ability with a metal ion (WO 03/072851).
- compounds having an unshared electron pair are preferred from the viewpoint of good adhesion to the molded article.
- Preferred compounds having an unshared electron pair include imidazoles such as 2-methylimidazole and 1- (2-aminoethyl) -12-methylimidazole; pyrazoles such as pyrazole and 3-amino-4-cyanovirazole; Triazoles such as 1,4-triazole and 2-amino-1,2,4-triazole; and And triazines such as 2-aminotriazine.
- the compact After the pretreatment as described above is applied to the compact, the compact is immersed in a plating bath containing an electroless plating solution to perform electroless plating.
- the conditions for electroless plating can be set according to the plating solution.
- electroless plating solution used in the electroless plating method
- a known self-catalytic electroless plating solution can be used.
- electroless copper plating solution using ammonium hypophosphite, hypophosphorous acid, ammonium borohydride, hydrazine, and formalin as reducing agents and non-electrolytic solution using sodium hypophosphite as reducing agent
- Electroless plating solutions such as a plating solution, an electroless plating solution, an electroless silver plating solution, and an electroless nickel-cobalt-phosphorus plating solution using sodium hypophosphite as a reducing agent can be used.
- Known complexing agents such as tartaric acid, ethylenediaminetetraacetic acid, citric acid, and acetic acid, and buffers such as boric acid.
- PH adjusting agents such as caustic soda and the like may be added as appropriate.
- the thickness of the plating layer formed on the surface of the molded body as described above, and the thickness can be arbitrarily set according to the use of the laminate on which the plating layer is formed.
- the plating layer may be formed so as to cover the entire surface of the molded body, or may be formed in an arbitrary pattern on the surface of the molded body.
- the method of forming a plating layer in a pattern is as follows: (1) After applying electroless dissolution to the entire surface of the molded body, a resist pattern is formed thereon by using a plating resist, and the resist pattern is formed through the resist pattern. (2) forming a metal layer by electrolytic plating, removing the resist, removing unnecessary electroless plating by etching, and forming a patterned plating layer; and A method of forming a metal pattern by applying electroless plating to a desired pattern in the surface of the metal. In either method, if necessary, a further plating layer may be grown by electroplating on the plating layer formed by electroless plating.
- the initiator pattern comprising the plating inducer described above is used.
- the method of adhesion include a method of dissolving or suspending a plating inducing substance in a solvent as necessary and attaching the substance directly to the surface of the molded body in a pattern.
- the adhesion method include a known adhesion method such as an ink jet method in which a liquid is sprayed and projected, a screen printing method in which printing is performed through a mask, and a dispenser application method in which a liquid is directly applied.
- the plating inducer may be water; ethers such as tetrahydrofuran; alcohols such as ethanol diisopropanol; It is preferably used by dissolving or suspending it in a polar substance such as ketones such as tyl ketone; and cellosolves such as ethyl acetate sorbacetate.
- the plating inducer as described above When the plating inducer as described above is used, it is selectively applied to the place where the plating inducer is attached, so that after forming the initiator pattern with the plating inducer, the above-described plating catalyst is applied and the electroless plating is performed. By performing the electroplating as needed, a patterned plating layer can be formed on the surface of the molded body.
- an annealing treatment can be performed to enhance the adhesion between the molded body and the plating layer. This is particularly effective when the amount of the inorganic filler is at least 70 parts by weight, preferably at least 80 parts by weight, based on 100 parts by weight of the total cyclic olefin monomer.
- the annealing temperature is usually higher than the Tg of the polymer constituting the molded article obtained by polymerization, and the upper limit of the heating temperature is usually Tg + 200, preferably T g + 150 ° C.
- the annealing time is usually 1 to 120 minutes, preferably 3 to 60 minutes, more preferably 5 to 45 minutes.
- the laminate obtained in this way has various properties such as dielectric properties (low dielectric constant, low dielectric loss tangent), heat resistance, low water absorption, and chemical resistance, as well as adhesion to the plating layer.
- Electronic components such as pre-preda, printed wiring board, insulating sheet, interlayer insulating film, antenna board, bumper, etc. It can be suitably used for a molded article having decorative decoration.
- the polymerization conversion rate was determined by thermogravimetric analysis (TGA: under nitrogen atmosphere, at a heating rate of 10 ° CZ for 30 ° C to 260 ° C), and the amount of gas generated from the compact was measured. Was calculated.
- Polymerization conversion rate (C) 100— (Gas amount X ((weight of inorganic filler + weight of monomer) Z (weight of monomer))
- the adhesion strength (P) between the molded product and the plating layer was measured for the flat laminate having the plating layer formed thereon in accordance with JIS test method C5012. The measurement of the adhesion strength was performed before and after the flat molded body was annealed at 170 ° C. for 30 minutes. From the adhesion strength, the adhesion was judged according to the following criteria.
- the test piece obtained by cutting the laminated body into 2 OmmX 20 mm was put into a thermo-hygrostat at 60 ° C x 95% RH for 1000 hours, and the difference (D) in dielectric loss tangent before and after the test was determined. Judgment was based on ⁇ : D ⁇ 0.001
- the dielectric loss tangent was measured at 1 GHz using RF Impedance Material 'Analyzer E4991A (Agilent' Technology Co., Ltd.).
- Benzylidene (1,3-dimesitylimidazolidine-1-ylidene) (tricyclohexynolephosphine) Dissolve 0.17 parts of ruthenium dichloride and 0.26 parts of triphenylphenylphosphine in 3.67 parts of toluene.
- a ruthenium catalyst solution having a ruthenium concentration of 0.05 mol Z liter was prepared.
- a phenolic antioxidant (trade name: Irganox 1330, manufactured by Ciba-Geigy) were added to a monomer mixture of 70 parts of tetracycline dodecene (TCD) and 30 parts of norbornene (NB).
- SIS styrene-isoprene-styrene copolymer
- SO-E2 silica
- Aluminate-based dispersion 1 part of an agent (AL-M, manufactured by Ajinomoto Co.) and 1 part of vinyltrimethoxysilane were added, and the mixture was stirred with a planetary stirrer for 5 minutes.
- an electroless plated catalyst containing P dC 1 2 HS to -202 B (manufactured by Hitachi Chemical Co., Ltd.) was immersed for 10 minutes at room temperature, washed with water, an electroless plated L I. Immerse in a 59 plating solution (manufactured by Hitachi Chemical Co., Ltd.) at 70 for 30 minutes, and further perform copper sulfate electrolytic plating to form a 20-m-thick plating layer on the surface of the plate-like molded body, and form the plate-like laminate. Obtained.
- the obtained plate-shaped laminate was annealed at 170 ° C. for 30 minutes in an inert oven, and the adhesion strength before and after the annealing was measured. Table 11 shows the results.
- a flat molded product was obtained in the same manner as in Example 1 except that SIS was not added as another organic component.
- Table 11 shows the polymerization conversion property, insulation reliability, and solvent resistance of the obtained flat molded product. Further, a plating layer was formed in the same manner as in Example 1 to obtain a plate-like laminate, and the adhesion strength before and after annealing was measured. Table 11 shows the results.
- a flat molded product was obtained in the same manner as in Example 2 except that the inorganic boiler was replaced with aluminum hydroxide (Heidilite H-34, manufactured by Showa Denko KK).
- Table 11 shows the polymerization conversion property, insulation reliability, and solvent resistance of the obtained flat molded product. Further, a plating layer was formed in the same manner as in Example 1 to obtain a plate-like laminate, and the adhesion strength before and after annealing was measured. Table 11 shows the results.
- Cyclic olefin monomer is only 100 parts of tetracyclododecene (TCD)
- TCD tetracyclododecene
- a flat molded product was obtained in the same manner as in Example 2 except that only 100 parts of dicyclopentadiene (DCP) was used as the cyclic olefin monomer.
- DCP dicyclopentadiene
- Table 1 shows the polymerization conversion property, insulation reliability, and ff solvent resistance of the obtained flat molded product.
- a plating layer was formed in the same manner as in Example 1 to obtain a flat plate laminate, and the adhesion strength before and after annealing was measured. Table 11 shows the results.
- a flat molded product was obtained in the same manner as in Example 5, except that the amount of silica was changed to 50 parts and the mold temperature 20 was changed to 150 ° C.
- Table 11 shows the polymerization conversion property, insulation reliability, and solvent resistance of the obtained flat molded product. Further, a plating layer was formed in the same manner as in Example 1 to obtain a flat plate laminate, and the adhesion strength before and after annealing was measured. Table 11 shows the results.
- the catalyst was changed to 10 mM tris-dodecylammonium molybdate, and 46 mM getyl aluminum chloride (chlorine content: 4.6 mmo1) and 1,3-dichloro-2-propanol were used as catalyst activators.
- a plate-like molded body was obtained in the same manner as in Example 1 except that 9 mM was added.
- Table 11 shows the polymerization transfer property, insulation reliability, and solvent resistance of the obtained flat molded product. Further, a plating layer was formed in the same manner as in Example 1 to obtain a flat plate laminate, and the adhesion strength before and after annealing was measured. Table 11 shows the results.
- a flat molded product was obtained in the same manner as in Comparative Example 1, except that the monomer was changed to 100 parts of dicyclopentadiene and the mold temperature was changed to 150 ° C.
- Table 11 shows the polymerization conversion property, insulation reliability, and solvent resistance of the obtained flat molded product.
- a plating layer was formed in the same manner as in Example 1 to obtain a flat plate laminate, and the adhesion strength before and after annealing was measured. The results are shown in Table 1.
- a flat molded product was obtained in the same manner as in Comparative Example 2 except that SIS was not added as another organic component.
- Table 1 shows the polymerization conversion property, insulation reliability, and solvent resistance of the obtained flat molded product. Further, a plating layer was formed in the same manner as in Example 1 to obtain a flat plate laminate, and the results of measuring the adhesion strength before and after annealing were shown in Table 11.
- a flat molded body was produced in the same manner as in Comparative Example 3 except that the inorganic filler was changed to aluminum hydroxide (Heidilite H-34, manufactured by Showa Denko) and the mold temperature was set to 200 ° C. did.
- Table 11 shows the polymerization conversion property, insulation reliability, and solvent resistance of the obtained flat molded product. Further, a plating layer was formed in the same manner as in Example 1 to obtain a flat laminated body, and the adhesion strength before and after annealing was measured. Table 11 shows the results.
- Example 1 in the laminate of the present invention (Examples 1 to 6), excellent adhesion between the plating layer and the molded body was obtained by permanganate etching, and high insulation reliability was obtained. It turns out that it shows solvent resistance. Furthermore, compared to the case where a monomer having two carbon-carbon double bonds such as dicyclopentadiene is used (Example 5), tetracyclododecene having one carbon-carbon double bond is used. It can be seen that the case of using (Example 4) is superior in adhesion after anneal treatment, insulation reliability, and solvent resistance. When norbornene, a monomer having two alicyclic structures, and tetracyclododecene, a monomer having four alicyclic structures, are used, It turns out that it is excellent (Examples 1-3).
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Abstract
Description
Claims
Priority Applications (3)
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JP2005511117A JP4904814B2 (ja) | 2003-06-27 | 2004-06-25 | 積層体およびその製造方法 |
US10/562,395 US20060154099A1 (en) | 2003-06-27 | 2004-06-25 | Multilayer body and method for producing same |
EP04746838A EP1640153A4 (en) | 2003-06-27 | 2004-06-25 | MULTILAYER BODY AND METHOD FOR PRODUCING THE SAME |
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US (1) | US20060154099A1 (ja) |
EP (1) | EP1640153A4 (ja) |
JP (1) | JP4904814B2 (ja) |
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JP2008094923A (ja) * | 2006-10-11 | 2008-04-24 | Kanto Gakuin Univ Surface Engineering Research Institute | シクロオレフィンポリマー材の表面改質方法、該方法を用いて得られた表面改質シクロオレフィンポリマー材、該表面改質シクロオレフィンポリマー材に金属皮膜を形成する方法及び金属皮膜付シクロオレフィンポリマー材 |
JP2011099157A (ja) * | 2009-11-09 | 2011-05-19 | Sankyo Kasei Co Ltd | 成形回路部品 |
WO2013018506A1 (ja) * | 2011-07-29 | 2013-02-07 | 日本ゼオン株式会社 | 重合性組成物、樹脂成形体及びその製造方法、並びに積層体 |
JP2021529855A (ja) * | 2018-06-29 | 2021-11-04 | プロメラス, エルエルシー | 3dプリント材料としてのポリシクロオレフィン単量体および光酸発生化合物により活性化する触媒 |
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DE602005022418D1 (de) * | 2004-03-10 | 2010-09-02 | Panasonic Elec Works Co Ltd | Harzformkörper mit verringerter dielektrischer verlusttangente und herstellungsverfahren dafür |
GB0619539D0 (en) | 2006-10-04 | 2006-11-15 | Hexcel Composites Ltd | Curable resin films |
US8039544B2 (en) * | 2007-09-04 | 2011-10-18 | General Electric Company | Coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine |
US7994238B2 (en) * | 2007-09-04 | 2011-08-09 | General Electric Company | Article and associated method |
US7906568B2 (en) * | 2007-09-04 | 2011-03-15 | General Electric Company | Coupling agent composition and associated method |
US8039543B2 (en) * | 2007-09-04 | 2011-10-18 | General Electric Company | Composition comprising a coupling agent and a cycloolefin, the coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine |
US7902279B2 (en) * | 2007-12-04 | 2011-03-08 | General Electric Company | Composition, article, and associated method |
US7879963B2 (en) * | 2007-12-18 | 2011-02-01 | General Electric Company | Composition, article, and associated method |
JP2009197125A (ja) * | 2008-02-21 | 2009-09-03 | Nisshin Chem Ind Co Ltd | 車両内装材用コーティング組成物及び車両内装材 |
WO2016038878A1 (ja) * | 2014-09-09 | 2016-03-17 | パナソニックIpマネジメント株式会社 | 硬化性組成物、プリプレグ、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
JP2017031276A (ja) * | 2015-07-30 | 2017-02-09 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板 |
CN109652977B (zh) * | 2018-12-07 | 2021-05-25 | 苏州大学 | 一种阻燃型耐紫外芳纶纤维 |
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- 2004-06-25 EP EP04746838A patent/EP1640153A4/en not_active Withdrawn
- 2004-06-25 WO PCT/JP2004/009369 patent/WO2005000579A1/ja active Application Filing
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Cited By (8)
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JP2008094923A (ja) * | 2006-10-11 | 2008-04-24 | Kanto Gakuin Univ Surface Engineering Research Institute | シクロオレフィンポリマー材の表面改質方法、該方法を用いて得られた表面改質シクロオレフィンポリマー材、該表面改質シクロオレフィンポリマー材に金属皮膜を形成する方法及び金属皮膜付シクロオレフィンポリマー材 |
JP4738308B2 (ja) * | 2006-10-11 | 2011-08-03 | 株式会社関東学院大学表面工学研究所 | 金属皮膜付シクロオレフィンポリマー材の製造方法及びその製造方法を用いて得られる金属皮膜付シクロオレフィンポリマー材 |
JP2011099157A (ja) * | 2009-11-09 | 2011-05-19 | Sankyo Kasei Co Ltd | 成形回路部品 |
WO2013018506A1 (ja) * | 2011-07-29 | 2013-02-07 | 日本ゼオン株式会社 | 重合性組成物、樹脂成形体及びその製造方法、並びに積層体 |
JPWO2013018506A1 (ja) * | 2011-07-29 | 2015-03-05 | 日本ゼオン株式会社 | 重合性組成物、樹脂成形体及びその製造方法、並びに積層体 |
US8975350B2 (en) | 2011-07-29 | 2015-03-10 | Zeon Corporation | Polymerizable composition, resin moldings and manufacturing process therefor, and laminates |
JP2021529855A (ja) * | 2018-06-29 | 2021-11-04 | プロメラス, エルエルシー | 3dプリント材料としてのポリシクロオレフィン単量体および光酸発生化合物により活性化する触媒 |
JP7456950B2 (ja) | 2018-06-29 | 2024-03-27 | プロメラス, エルエルシー | 3dプリント材料としてのポリシクロオレフィン単量体および光酸発生化合物により活性化する触媒 |
Also Published As
Publication number | Publication date |
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KR20060029147A (ko) | 2006-04-04 |
CN1812883A (zh) | 2006-08-02 |
JPWO2005000579A1 (ja) | 2006-08-03 |
EP1640153A1 (en) | 2006-03-29 |
EP1640153A4 (en) | 2009-09-23 |
JP4904814B2 (ja) | 2012-03-28 |
CN100484755C (zh) | 2009-05-06 |
US20060154099A1 (en) | 2006-07-13 |
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