DE602005022418D1 - Harzformkörper mit verringerter dielektrischer verlusttangente und herstellungsverfahren dafür - Google Patents

Harzformkörper mit verringerter dielektrischer verlusttangente und herstellungsverfahren dafür

Info

Publication number
DE602005022418D1
DE602005022418D1 DE602005022418T DE602005022418T DE602005022418D1 DE 602005022418 D1 DE602005022418 D1 DE 602005022418D1 DE 602005022418 T DE602005022418 T DE 602005022418T DE 602005022418 T DE602005022418 T DE 602005022418T DE 602005022418 D1 DE602005022418 D1 DE 602005022418D1
Authority
DE
Germany
Prior art keywords
manufacturing
resin molded
dielectric loss
method therefor
molded bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005022418T
Other languages
English (en)
Inventor
Naoto Ikegawa
Satoshi Okamoto
Shiro Katagiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Sumitomo Chemical Co Ltd
Original Assignee
Panasonic Electric Works Co Ltd
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co Ltd, Sumitomo Chemical Co Ltd filed Critical Panasonic Electric Works Co Ltd
Publication of DE602005022418D1 publication Critical patent/DE602005022418D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/08—Heat treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C08L23/30—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment by oxidation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
    • C08G63/605—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds the hydroxy and carboxylic groups being bound to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/78—Preparation processes
    • C08G63/82—Preparation processes characterised by the catalyst used
    • C08G63/87—Non-metals or inter-compounds thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C08L23/0884—Epoxide containing esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE602005022418T 2004-03-10 2005-03-03 Harzformkörper mit verringerter dielektrischer verlusttangente und herstellungsverfahren dafür Active DE602005022418D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004068009 2004-03-10
PCT/JP2005/004168 WO2005085347A1 (en) 2004-03-10 2005-03-03 Resin molded article with reduced dielectric loss tangent and production method therefor

Publications (1)

Publication Number Publication Date
DE602005022418D1 true DE602005022418D1 (de) 2010-09-02

Family

ID=34918425

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005022418T Active DE602005022418D1 (de) 2004-03-10 2005-03-03 Harzformkörper mit verringerter dielektrischer verlusttangente und herstellungsverfahren dafür

Country Status (7)

Country Link
US (1) US20070182059A1 (de)
EP (1) EP1730234B1 (de)
KR (1) KR100788861B1 (de)
CN (1) CN100436538C (de)
DE (1) DE602005022418D1 (de)
TW (1) TWI281937B (de)
WO (1) WO2005085347A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120035323A1 (en) * 2009-04-14 2012-02-09 Arkema Inc. Polyolefin/polylactic acid blends
US9862809B2 (en) 2015-07-31 2018-01-09 Ticona Llc Camera module
US10407605B2 (en) 2015-07-31 2019-09-10 Ticona Llc Thermally conductive polymer composition
TWI708806B (zh) * 2015-08-17 2020-11-01 美商堤康那責任有限公司 用於相機模組之液晶聚合物組合物
US10633535B2 (en) 2017-02-06 2020-04-28 Ticona Llc Polyester polymer compositions
JP7110058B2 (ja) * 2017-10-18 2022-08-01 Ntn株式会社 カバーおよび車載用フィン型アンテナ装置
KR102627886B1 (ko) 2017-12-05 2024-01-19 티코나 엘엘씨 카메라 모듈에 사용하기 위한 방향족 중합체 조성물
WO2019155419A1 (en) 2018-02-08 2019-08-15 Celanese Sales Germany Gmbh Polymer composite containing recycled carbon fibers
CN111741841B (zh) 2018-02-20 2023-05-30 提克纳有限责任公司 导热聚合物组合物
US11505647B2 (en) * 2018-06-26 2022-11-22 Eneos Corporation Resin molded article comprising wholly aromatic liquid crystalline polyester resin capable of reducing dielectric loss tangent by heat treatment and electrical and electronic component
CN112739772B (zh) * 2018-09-20 2022-12-02 东丽株式会社 热塑性聚酯树脂组合物及成型品
US11086200B2 (en) 2019-03-20 2021-08-10 Ticona Llc Polymer composition for use in a camera module
CN113710738A (zh) 2019-03-20 2021-11-26 提克纳有限责任公司 用于相机模块的致动器组件
CN111117169A (zh) * 2019-12-26 2020-05-08 江苏沃特特种材料制造有限公司 一种高介电常数液晶聚合物及其制备方法
CN114650648A (zh) * 2020-12-21 2022-06-21 3M创新有限公司 贴附了3d成型的电磁屏蔽膜的电路板、可3d成型的电磁屏蔽膜和3d成型的电磁屏蔽膜

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JPH0724328B2 (ja) * 1989-07-03 1995-03-15 ポリプラスチックス株式会社 精密細線回路用成形品の製造方法
US5153986A (en) * 1991-07-17 1992-10-13 International Business Machines Method for fabricating metal core layers for a multi-layer circuit board
US5216073A (en) * 1992-07-01 1993-06-01 Hoechst Celanese Corp. Thermoset LCP blends
ATE169049T1 (de) * 1993-11-30 1998-08-15 Eastman Chem Co Schlagfeste flüssigkristalline polymer enthaltende polymermischungen
FR2731693B1 (fr) * 1995-03-16 1997-05-23 Air Liquide Procede et installation de generation d'azote pour le traitement thermique
EP0734851B1 (de) * 1995-03-31 2004-04-21 Sumitomo Chemical Company Limited Verbundstoff aus Metallfolie und Film aus flüssigkristalliner Polyesterzusammensetzung und Leiterplatte daraus
EP0737707B1 (de) * 1995-04-12 2005-09-28 Sumitomo Chemical Company, Limited Folie aus einer flüssigkristallinen Polyesterzusammensetzung
EP0790279B2 (de) * 1996-02-19 2007-07-18 Sumitomo Chemical Company, Limited Flüssigkristalline Polyesterharz-Zusammensetzung
US5904984A (en) * 1996-10-17 1999-05-18 Siemens Westinghouse Power Corporation Electrical insulation using liquid crystal thermoset epoxy resins
EP0865905B1 (de) * 1997-03-19 2004-09-15 Sumitomo Chemical Company, Limited Laminat aus flüssigkristalliner Polyesterharzzusammensetzung
US6468665B1 (en) * 1998-12-16 2002-10-22 Sumitomo Chemical Company, Limited Process for melt-bonding molded article of liquid crystalline polyester with metal
US6576309B2 (en) * 1999-12-02 2003-06-10 Associated Packaging Enterprises Thermoplastic compositions having high dimensional stability
TWI256959B (en) * 2000-07-31 2006-06-21 Sumitomo Chemical Co Aromatic liquid-crystalline polyester solution composition
JP2004051867A (ja) * 2002-07-23 2004-02-19 Sumitomo Chem Co Ltd 芳香族液晶ポリエステルフィルムおよびその金属積層体
KR20060029147A (ko) * 2003-06-27 2006-04-04 니폰 제온 가부시키가이샤 적층체 및 그 제조방법
US20070190346A1 (en) * 2004-03-10 2007-08-16 Matsushita Electric Works, Ltd. Metal-coated resin molded article and production method therefor

Also Published As

Publication number Publication date
KR100788861B1 (ko) 2007-12-27
CN1930241A (zh) 2007-03-14
US20070182059A1 (en) 2007-08-09
KR20060131916A (ko) 2006-12-20
TW200602423A (en) 2006-01-16
CN100436538C (zh) 2008-11-26
EP1730234A1 (de) 2006-12-13
WO2005085347A8 (en) 2005-11-24
TWI281937B (en) 2007-06-01
WO2005085347A1 (en) 2005-09-15
EP1730234B1 (de) 2010-07-21

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