DE602005009276D1 - Gegenstand mit eingegossenem Einsatz und Herstellungsverfahren - Google Patents

Gegenstand mit eingegossenem Einsatz und Herstellungsverfahren

Info

Publication number
DE602005009276D1
DE602005009276D1 DE602005009276T DE602005009276T DE602005009276D1 DE 602005009276 D1 DE602005009276 D1 DE 602005009276D1 DE 602005009276 T DE602005009276 T DE 602005009276T DE 602005009276 T DE602005009276 T DE 602005009276T DE 602005009276 D1 DE602005009276 D1 DE 602005009276D1
Authority
DE
Germany
Prior art keywords
manufacturing process
encapsulated insert
encapsulated
insert
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005009276T
Other languages
English (en)
Inventor
Hitoshi Takanashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of DE602005009276D1 publication Critical patent/DE602005009276D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14377—Coating a portion of the article, e.g. the edge of the article using an additional insert, e.g. a fastening element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/22—Nonparticulate element embedded or inlaid in substrate and visible
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
DE602005009276T 2004-04-13 2005-04-07 Gegenstand mit eingegossenem Einsatz und Herstellungsverfahren Active DE602005009276D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004117838A JP4189753B2 (ja) 2004-04-13 2004-04-13 インサート成形品及びインサート成形品の製造方法

Publications (1)

Publication Number Publication Date
DE602005009276D1 true DE602005009276D1 (de) 2008-10-09

Family

ID=34934880

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005009276T Active DE602005009276D1 (de) 2004-04-13 2005-04-07 Gegenstand mit eingegossenem Einsatz und Herstellungsverfahren

Country Status (5)

Country Link
US (1) US7560153B2 (de)
EP (1) EP1587183B1 (de)
JP (1) JP4189753B2 (de)
CN (1) CN100417508C (de)
DE (1) DE602005009276D1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4679327B2 (ja) 2005-10-12 2011-04-27 株式会社リコー 画像形成装置
JP4720648B2 (ja) * 2006-06-29 2011-07-13 住友電装株式会社 樹脂成形品の製造方法
DE102006047938A1 (de) * 2006-10-10 2008-04-17 Robert Bosch Gmbh Gespritztes Kunststoffbauteil mit Einlegeteil
JP2010105337A (ja) * 2008-10-31 2010-05-13 Nissha Printing Co Ltd インサート２色成形方法および２色成形金型装置並びにインサート２色成形品
JP5509737B2 (ja) * 2009-03-25 2014-06-04 アイシン精機株式会社 ソレノイドバルブの取付構造
KR101101491B1 (ko) * 2010-02-25 2012-01-03 삼성전기주식회사 안테나 패턴 프레임, 전자장치 케이스 및 이의 제조금형
KR101053336B1 (ko) * 2010-03-15 2011-08-01 삼성전기주식회사 안테나 패턴 프레임, 전자장치 케이스 및 이의 제조금형
JP5626047B2 (ja) * 2011-03-15 2014-11-19 住友電装株式会社 機器用コネクタ
JP5569442B2 (ja) * 2011-03-15 2014-08-13 住友電装株式会社 機器用コネクタ
JP5846802B2 (ja) * 2011-08-11 2016-01-20 矢崎総業株式会社 コネクタおよびそのコネクタの製造方法
JP5661087B2 (ja) 2012-11-30 2015-01-28 東海興業株式会社 インサート成形品、インサート成形方法、及びインサート成形装置
JP6155057B2 (ja) * 2013-03-08 2017-06-28 Ｋｙｂ株式会社 バスバーユニット製造方法及びバスバーユニット
EP3243629B1 (de) * 2015-05-13 2019-08-07 Stefan Pfaff Werkzeug- und Formenbau GmbH Co KG Positionierverfahren für dichtungsprofile
WO2017042346A1 (de) * 2015-09-10 2017-03-16 Stefan Pfaff Werkzeug- Und Formenbau Gmbh & Co. Kg Herstellungs- und positionierverfahren für dichtungsprofile
JP6610413B2 (ja) * 2016-04-26 2019-11-27 中西金属工業株式会社 インサート成形品の製造方法
JP6605417B2 (ja) * 2016-08-31 2019-11-13 東海興業株式会社 樹脂成形品及びその製造方法
FR3059202B1 (fr) * 2016-11-18 2019-08-16 Continental Automotive France Procede de fabrication sur une plaque de maintien d'un module electronique avec des formes de positionnement depassant du surmoulage final
DK3388143T3 (da) * 2017-04-10 2020-01-02 Gemue Gebr Mueller Appbau Gmbh & Co Kg Fremgangsmåde til fremstilling af en elastomer-membran
US10768358B2 (en) * 2017-08-17 2020-09-08 Dura Operating, Llc Printed film with mounted light emitting diodes encapsulated in light guide
JP7317471B2 (ja) * 2018-04-17 2023-07-31 本田技研工業株式会社 成形体及び成形型
CN109016328A (zh) * 2018-05-29 2018-12-18 广东联塑科技实业有限公司 一种带钢骨架pe阀体的制备方法
JP7077928B2 (ja) * 2018-12-06 2022-05-31 住友電装株式会社 コネクタ及びその製造方法
JP2024053588A (ja) 2022-10-04 2024-04-16 矢崎総業株式会社 樹脂成形品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2030764U (zh) * 1987-07-14 1989-01-11 施吾铨 带保险丝插头
DE19504828C2 (de) * 1995-02-14 2000-05-25 Fritz Richard Gmbh & Co Kg Verfahren zum Herstellen und Verbinden eines Rahmens mit einer Glasscheibe und Vorrichtung zum Durchführen des Verfahrens
JP3870467B2 (ja) 1996-03-12 2007-01-17 株式会社デンソー 電気接続部を有する成形品とその成形方法
CN2296079Y (zh) * 1997-11-05 1998-10-28 中国航天工业总公司第二研究院二○三所 万能电源插座
JP3980204B2 (ja) * 1998-06-10 2007-09-26 アスモ株式会社 樹脂成形品におけるターミナルのインサート成形方法、コネクタ、及びモータ
JP3997852B2 (ja) * 2002-06-28 2007-10-24 住友電装株式会社 インサート成形コネクタ

Also Published As

Publication number Publication date
EP1587183A1 (de) 2005-10-19
CN100417508C (zh) 2008-09-10
EP1587183B1 (de) 2008-08-27
US7560153B2 (en) 2009-07-14
CN1683140A (zh) 2005-10-19
JP2005297387A (ja) 2005-10-27
JP4189753B2 (ja) 2008-12-03
US20050227036A1 (en) 2005-10-13

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Legal Events

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