WO2004106945A1 - 電子部品試験装置 - Google Patents
電子部品試験装置Info
- Publication number
- WO2004106945A1 WO2004106945A1 PCT/JP2004/007363 JP2004007363W WO2004106945A1 WO 2004106945 A1 WO2004106945 A1 WO 2004106945A1 JP 2004007363 W JP2004007363 W JP 2004007363W WO 2004106945 A1 WO2004106945 A1 WO 2004106945A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- moving device
- held
- output terminal
- input
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 abstract 2
Abstract
ICチップ(IC)の入出力端子(HB)をテストヘッドのコンタクト部に押し付けて試験を行う電子部品試験装置であって、ICチップ(IC)の入出力端子(HB)が導出している前面を把持部(414)により把持して移動させるIC移動装置410と、把持される前のICチップ(IC)の前面を撮像する第1のカメラ(415)と、把持されたICチップ(IC)の背面を撮像する第2のカメラ(420)と、第1のカメラ(415)及び第2のカメラ(420)により撮像された画像情報から、IC移動装置(410)に把持されたICチップ(IC)の入出力端子(HB)の位置を算出し、当該算出結果に基づいて、IC移動装置(410)に把持されたICチップ(IC)の入出力端子(HB)のコンタクト部に対する相対的位置を特定する画像処理装置と備え、IC移動装置410は、画像処理装置により特定されたICチップ(IC)の入出力端子(HB)のコンタクト部に対する相対的位置に基づいて、ICチップの位置を補正する。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/558,385 US7511522B2 (en) | 2003-05-30 | 2004-05-28 | Electronic device test apparatus |
JP2005506502A JPWO2004106945A1 (ja) | 2003-05-30 | 2004-05-28 | 電子部品試験装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPPCT/JP03/06835 | 2003-05-30 | ||
PCT/JP2003/006835 WO2004106954A1 (ja) | 2003-05-30 | 2003-05-30 | 電子部品試験装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2004106945A1 true WO2004106945A1 (ja) | 2004-12-09 |
WO2004106945A2 WO2004106945A2 (ja) | 2004-12-09 |
WO2004106945A3 WO2004106945A3 (ja) | 2005-02-17 |
Family
ID=33485800
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/006835 WO2004106954A1 (ja) | 2003-05-30 | 2003-05-30 | 電子部品試験装置 |
PCT/JP2004/007363 WO2004106945A2 (ja) | 2003-05-30 | 2004-05-28 | 電子部品試験装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/006835 WO2004106954A1 (ja) | 2003-05-30 | 2003-05-30 | 電子部品試験装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7511522B2 (ja) |
JP (1) | JPWO2004106945A1 (ja) |
KR (1) | KR100815490B1 (ja) |
CN (1) | CN1788205A (ja) |
AU (1) | AU2003241977A1 (ja) |
TW (1) | TW200504376A (ja) |
WO (2) | WO2004106954A1 (ja) |
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JP2011086880A (ja) * | 2009-10-19 | 2011-04-28 | Advantest Corp | 電子部品実装装置および電子部品の実装方法 |
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TWI418811B (zh) * | 2011-02-14 | 2013-12-11 | Youngtek Electronics Corp | 封裝晶片檢測與分類裝置 |
JP2013024829A (ja) * | 2011-07-26 | 2013-02-04 | Seiko Epson Corp | 電子部品搬送装置及び電子部品搬送方法 |
JP2013053991A (ja) | 2011-09-06 | 2013-03-21 | Seiko Epson Corp | ハンドラー及び部品検査装置 |
US8807318B2 (en) * | 2011-09-20 | 2014-08-19 | International Business Machines Corporation | Multi-generational carrier platform |
JP2013145134A (ja) * | 2012-01-13 | 2013-07-25 | Advantest Corp | ハンドラ装置および試験装置 |
KR101350214B1 (ko) * | 2012-07-06 | 2014-01-16 | 주식회사 미르기술 | 비접촉식 발광다이오드 검사장치와 이를 이용한 검사방법 |
KR101362524B1 (ko) * | 2012-07-27 | 2014-02-17 | 세메스 주식회사 | 전자 부품 수납 장치 |
TWI472778B (zh) * | 2013-08-30 | 2015-02-11 | Chroma Ate Inc | System - level IC test machine automatic retest method and the test machine |
KR101508433B1 (ko) * | 2013-09-11 | 2015-04-07 | 주식회사 엘지씨엔에스 | Ic칩 리더기 및 그것의 동작 방법 |
KR20170005172A (ko) * | 2013-11-11 | 2017-01-11 | 라스코 게엠베하 | 부품 핸들링 어셈블리 및 부품 핸들링 방법 |
JP2015232446A (ja) * | 2014-06-09 | 2015-12-24 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
EP3329755A1 (en) * | 2015-07-31 | 2018-06-06 | ISMECA Semiconductor Holding SA | An assembly and method for handling components |
CN106959409A (zh) * | 2015-10-30 | 2017-07-18 | 精工爱普生株式会社 | 电子部件搬运装置以及电子部件检查装置 |
JP2017083373A (ja) * | 2015-10-30 | 2017-05-18 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
CN107176450A (zh) * | 2016-03-09 | 2017-09-19 | 精工爱普生株式会社 | 电子部件运送装置、以及电子部件检查装置 |
TW201738577A (zh) * | 2016-03-29 | 2017-11-01 | 三角設計公司 | 積體電路測試點視像對準系統 |
CN107632656A (zh) * | 2016-07-19 | 2018-01-26 | 扬智科技股份有限公司 | 集成电路结构 |
CN107931154B (zh) * | 2016-10-13 | 2019-07-26 | 泰克元有限公司 | 电子部件测试用分选机及其示教点调整方法 |
US10473714B2 (en) * | 2017-03-06 | 2019-11-12 | Asm Technology Singapore Pte Ltd | Method and apparatus for aligning electronic components |
US10297043B2 (en) | 2017-04-07 | 2019-05-21 | Advantest Corporation | Detector for detecting position of IC device and method for the same |
JP6809978B2 (ja) * | 2017-04-28 | 2021-01-06 | 株式会社アドバンテスト | 電子部品試験装置用のキャリア |
US10324127B2 (en) * | 2017-06-08 | 2019-06-18 | Advantest Corporation | Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method |
US11961220B2 (en) * | 2018-01-23 | 2024-04-16 | Texas Instruments Incorporated | Handling integrated circuits in automated testing |
TWI679428B (zh) * | 2019-02-01 | 2019-12-11 | 迅得機械股份有限公司 | 訊號接通裝置及訊號接通方法 |
TWI729822B (zh) * | 2020-05-22 | 2021-06-01 | 美商第一檢測有限公司 | 環境控制設備及晶片測試系統 |
CN113835019B (zh) * | 2021-11-25 | 2022-02-18 | 河北圣昊光电科技有限公司 | 一种芯片自动对位装置及对位方法 |
CN116343213B (zh) * | 2023-05-31 | 2023-08-25 | 成都数之联科技股份有限公司 | 模型训练及芯片的字符识别方法、装置、设备和介质 |
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WO2004106953A1 (ja) * | 2003-05-30 | 2004-12-09 | Advantest Corporation | 電子部品試験装置 |
US6873169B1 (en) * | 2004-03-11 | 2005-03-29 | Mirae Corporation | Carrier module for semiconductor device test handler |
-
2003
- 2003-05-30 AU AU2003241977A patent/AU2003241977A1/en not_active Abandoned
- 2003-05-30 WO PCT/JP2003/006835 patent/WO2004106954A1/ja active Application Filing
-
2004
- 2004-05-26 TW TW093114909A patent/TW200504376A/zh unknown
- 2004-05-28 CN CNA2004800128372A patent/CN1788205A/zh active Pending
- 2004-05-28 JP JP2005506502A patent/JPWO2004106945A1/ja active Pending
- 2004-05-28 KR KR1020057021932A patent/KR100815490B1/ko not_active IP Right Cessation
- 2004-05-28 WO PCT/JP2004/007363 patent/WO2004106945A2/ja active Application Filing
- 2004-05-28 US US10/558,385 patent/US7511522B2/en not_active Expired - Fee Related
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