WO2004078821A1 - フルオロカーボン変性エポキシ樹脂 - Google Patents
フルオロカーボン変性エポキシ樹脂 Download PDFInfo
- Publication number
- WO2004078821A1 WO2004078821A1 PCT/JP2004/002960 JP2004002960W WO2004078821A1 WO 2004078821 A1 WO2004078821 A1 WO 2004078821A1 JP 2004002960 W JP2004002960 W JP 2004002960W WO 2004078821 A1 WO2004078821 A1 WO 2004078821A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluorocarbon
- epoxy resin
- compound
- modified epoxy
- modified
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
Definitions
- the present invention relates to a fluorocarbon-modified epoxy resin which is excellent in heat resistance and moisture resistance, gives a cured product having little internal stress and excellent colorless transparency, and which is solid at ordinary temperature.
- the most widely used epoxy resin is the bisphenol A type epoxy resin produced by the reaction of bisphenol phenol A with ebichlorohydrin.
- This resin has a wide range of products from liquid to solid depending on the degree of polymerization, and is so reactive that it can be cured with polyamine at room temperature.
- this cured product is excellent in water resistance and tough, it has the disadvantages of poor weather resistance, poor electrical properties, and low heat distortion temperature.
- nopolak phenol-nopolak cresol type epoxy resin is used as an encapsulation resin for ICs, LSIs, or super LSIs, but chlorine contained in the resin is used for IC, LS 1 or super LSIs.
- chlorine contained in the resin is used for IC, LS 1 or super LSIs.
- alicyclic epoxy resins do not contain chlorine and are excellent in electrical properties and heat resistance.
- alicyclic epoxy resin as a curing agent for insulating sealants for electronics and powder coatings with high reactivity of epoxy groups, high Tg of cured products and high transparency, and as a sizing agent for glass fibers Widely used are those having a substituent having a vinyl group, such as 4-vinylcyclohexene-11-oxide.
- EHPE series of Daicel Chemical Industries, Ltd. obtained by epoxidation of the vinyl group of the substituent of a polyether compound having a skeleton obtained by ring-opening polymerization of an oxysilane ring (JP-B-63-31493, JP-B) 4 _ 1 0471, Japanese Patent Publication No.
- EHPE 3150 is a solid epoxy resin and is easy to handle.
- JP-A-8-290572 discloses an epoxy resin such as EHPE series, a fluorocarbon compound having an active hydrogen group, a blend with a curing agent, and a cured product thereof. I have.
- the cured product of EHPE 3150 itself needs to be further improved in electrical properties, and is necessarily sufficient for use in the field of insulating sealants for electronics such as semiconductor encapsulants. I wouldn't say.
- epoxidation that is, the degree of epoxidation is relatively reduced
- leaving a part of the vinyl group of the substituent of the alicyclic epoxy resin of the EHPE series improves the water absorption.
- a new problem has been found that the softening point of this epoxy resin is lowered, that the epoxy resin is very easy to block at room temperature, and that the Tg of this cured product is also greatly reduced.
- JP-A-2-28211 discloses an attempt to improve water absorption by adding an organopolysiloxane compound to a vinyl group of a remaining substituent in the alicyclic epoxy resin of the EHPE series. Has been made. With this method, the water absorption is improved to some extent, but one having sufficient heat resistance has not yet been obtained. Further, in JP-A-3-123775, a small amount of a compound having two epoxy groups in addition to the 4-vinylcyclohexene-111-oxide of the EHP E series is present in the molecule. Although the blocking resistance is improved by forming a crosslinked structure to increase the softening point, this method does not significantly improve the water absorption of the cured product.
- Japanese Patent Application Laid-Open No. 8-290572 The disclosed technique has a problem that a fluorocarbon compound having an active hydrogen group to be blended may bleed out from a cured product, and it is difficult to select an appropriate blending composition. Disclosure of the invention
- the present inventor carried out ring-opening polymerization of an epoxy group in an epoxy compound including 4-vinylcyclohexene 1-oxide alone or, if necessary, other epoxy compounds, using a fluorocarbon compound having an active hydrogen group as an initiator. Later, it was found that by epoxidizing the remaining vinyl group using an epoxidizing agent, it was possible to solve the problems of blocking of epoxy resin at room temperature and water absorption of a cured product, and arrived at the present invention.
- a first aspect of the present invention is to form a vinyl group of a fluorocarbon-modified polyether compound obtained by reacting an epoxy group of 4-vinylcyclohexene-1-oxide with an active hydrogen group of a fluorocarbon compound having an active hydrogen group.
- a vinyl group of a fluorocarbon-modified polyether compound obtained by reacting an epoxy group of 4-vinylcyclohexene-1-oxide with an active hydrogen group of a fluorocarbon compound having an active hydrogen group.
- a second aspect of the present invention is that a fluorocarbon compound having an active hydrogen group is represented by the following formula (1):
- R and R ′ are groups having active hydrogen.
- a fluorocarbon-modified epoxy resin according to the present invention which is a compound represented by the formula:
- a third aspect of the present invention is that a fluorocarbon compound having an active hydrogen group represented by the formula (1) is BIS-AF [2,2-bis (4-hydroxyphenyl) -hexafluoro] [Propane] or BIS-B-AF [2,2-bis (4-carboxyphenyl) -hexafluoropropane] according to the second aspect of the present invention, which is a fluorinated mono-bon modified epoxy resin. I do.
- a fourth aspect of the present invention is the fluorocarbon-modified epoxy according to any one of the first to third aspects of the present invention, wherein a Lewis acid is used as a catalyst in the reaction between 4-bicyclocyclohexene-1-oxide and a fluorocarbon compound having an active hydrogen group. Provide resin.
- a fifth aspect of the present invention provides the fluorocarbon-modified epoxy resin according to the fourth aspect, wherein the Lewis acid is a BF 3 complex.
- a sixth aspect of the present invention is the fluorocarbon-modified epoxy resin according to any one of the first to fifth aspects of the present invention, wherein the epoxidizing agent for evoxylating the vinyl group of the fluorocarbon-modified polyether compound is an organic percarboxylic acid.
- the epoxidizing agent for evoxylating the vinyl group of the fluorocarbon-modified polyether compound is an organic percarboxylic acid.
- a seventh aspect of the present invention provides the fluorocarbon-modified epoxy resin according to the sixth aspect, wherein the water content in the organic percarboxylic acid is 0.8% by weight or less.
- An eighth aspect of the present invention provides the fluorocarbon-modified epoxy resin according to the sixth or seventh aspect, wherein the organic percarboxylic acid is peracetic acid.
- a ninth aspect of the present invention provides the fluorcarbon-modified epoxy resin according to the eighth aspect, wherein the peracetic acid is an ethyl acetate solution.
- a tenth aspect of the present invention provides the fluorocarbon-modified epoxy resin according to any one of the first to ninth aspects, wherein the oxysilane oxygen content is 1.0 to 10% by weight.
- FIG. 1 is a 1 H — NMR chart of a fluorocarbon compound having an active hydrogen used in Synthesis Example 1.
- FIG. 2 is a 1 H—NMR chart of the fluorocarbon-modified polyether compound obtained in Synthesis Example 1.
- FIG. 3 shows the fluorocarbon-modified epoxy resin of the present invention obtained in Synthesis Example 1. It is a 1 H—NM R chart of fat. BEST MODE FOR CARRYING OUT THE INVENTION
- the fluorocarbon-modified polyether compound which is a precursor of the fluorocarbon-modified epoxy resin of the present invention, comprises the above-mentioned fluorocarbon compound having an active hydrogen group, 4-vinylcyclohexene 1-oxide and other epoxy resins used as required. It can be obtained by reacting a compound having at least one group in the presence of a catalyst.
- R and R ' which are groups having active hydrogen are OH or COOH or a fluorocarbon unit having 1 to 9 carbon atoms (specifically, one C (CF 3 ) 2 — etc. ⁇ H and COOH via).
- 4-vinylcyclohexene per 1 hydroxyl group or carboxyl group and 1-year-old oxide and at least one other epoxy group used as necessary are used for heat resistance and low water absorption. It is desirable to react the compounds having 3 to 8 epoxy groups in total. If the number is less than 3, the number of epoxy groups per molecule is too small, and crosslinking at the time of curing becomes weak. If the number is more than 9, reduction of water absorption and heat resistance due to the addition of fluorocarbon in the epoxy resin. The degree of improvement in the performance is weakened.
- the compound having 4-bicyclohexene 1-oxide and at least one epoxy group is 1 to 100% by weight of 4-vinylcyclohexene 1-oxide and other epoxy compounds.
- the compound having at least one xyl group is reacted in a proportion of 99 to 0% by weight.
- 4-vinylcyclohexene 1-oxide is less than 1% by weight, the characteristics of the cyclohexane skeleton are not obtained.
- epoxy groups other than 4-vinylcyclohexene 1-oxide and 4-vinylcyclohexene 1-year-old oxide Is less than 10% by weight, preferably less than 5% by weight, and more preferably less than 3% by weight, based on the total amount of the compound having one. If the ratio of the compound having two or more epoxy groups exceeds 10% by weight, a crosslinked structure is formed and the product is gelated, which is not preferable.
- Epoxy compounds having at least one epoxy group that are used as required include glycidyl methacrylate, aliphatic epoxy compounds such as ⁇ -olefin oxide, epoxidized tetrahydrobenzyl alcohol, and 3,4. —Epo
- alicyclic epoxy compounds such as hexane carboxylate and aromatic epoxy compounds such as styrene oxide
- alicyclic epoxy compounds are preferred.
- full Ruorokabon compound having an active hydrogen group as a ring-opening reaction of the initiator of the epoxy groups a specific example in the following chemical formula as an example c is one having a hydroxyl group or force Rupokishiru groups in the molecule.
- n is usually 1 to 20. H 0 - CH, CF one CH 2 - 0 H
- BIS-AF and B1S-B-AF in which the group having an active hydrogen of the formula is OH or COOH are most suitable.
- a fluorine-substituted aliphatic alcohol such as 1H, 1H, 5H-octafluoro-l-pentanol [OFP] is used as an initiator, the epoxy resin produced has a low softening point, and the temperature is reduced to room temperature. May occur.
- n is the number of moles of 4-vinylcyclohexene 1-oxide ring-opened with respect to 1 mole of BIS-AF.
- the epoxy group in the formula is represented by ⁇ Or] position 3.
- the amount of the catalyst varies depending on the type thereof, but it can be used in the range of 0.1 to 10% by weight, preferably 0.1 to 5% by weight based on the starting material.
- the reaction temperature is from 120 to 200 ° C, preferably from 0 to 120 ° C.
- Solvents include ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone; aromatic hydrocarbons such as benzene, toluene and xylene; aliphatic hydrocarbons such as hexane and cyclohexane; and esters such as ethyl acetate. Those having no active hydrogen such as a system solvent are preferable.
- the polyether compound having a vinyl group side chain having the structure of the above formula (2) obtained in the first-stage reaction is reacted with a peracid or hydroperoxide in the second-stage reaction.
- Epoxidation with oxidizing agents such as oxides thus, the fluorocarbon-modified epoxy resin of the present invention can be obtained.
- the obtained fluorocarbon-modified epoxy resin of the present invention is, for example, a compound represented by the above formula (3).
- organic percarboxylic acids specifically, formic acid, peracetic acid, perbenzoic acid, trifluoroperacetic acid and the like can be used.
- organic overpowered ruponic acids those obtained by oxidizing the corresponding aldehydes with air or oxygen have a low moisture content, specifically, 0.8% by weight or less, and are used in the fluorocarbon-modified epoxy resin of the present invention. This is preferable because the epoxidation ratio increases.
- peracetic acid is particularly preferable because it is commercially available at low cost and has high stability.
- Hydrogen peroxide, tertiary butyl hydroxide peroxide, cumene hydroperoxide and the like can be used as the peroxide at the mouth.
- a catalyst can be used if necessary.
- an acid such as sulfuric acid such as sodium carbonate can be used as a catalyst.
- the catalytic effect is obtained by using a mixture of tungstic acid and caustic soda with hydrogen peroxide, an organic acid with hydrogen peroxide, or molybdenum hexacarbonyl with butyl hydroperoxide. Can be obtained.
- the epoxidation reaction is carried out by adjusting the presence or absence of a solvent and the reaction temperature according to the equipment and the physical properties of the raw materials.
- the reaction temperature range that can be used is determined by the reactivity of the epoxidizing agent used.
- the temperature is preferably 0 to 70 ° C. At temperatures below 0 ° C, the reaction is slow, and at 70 ° C, the decomposition of peracetic acid occurs.
- tertiary butyl hydroperoxide / molybdenum dioxide diacetyl acetonate which is an example of the case where hydroperoxide is used. For that reason, 20 ° C to 150 ° C is preferred.
- the solvent can be used for the purpose of lowering the viscosity of the raw material and stabilizing the epoxidizing agent by dilution.
- an aromatic compound, an ether compound, an ester compound, a ketone compound or the like can be used as a solvent.
- the molar ratio of the epoxidizing agent to the vinyl group to be charged should be 0.9 or more. In the case of peracetic acid, it is preferable to use a molar ratio of 0.95 to 1.2.
- the target compound can be extracted from the crude reaction solution by ordinary chemical engineering means such as concentration.
- the oxysilane oxygen content (also referred to as oxysilane oxygen concentration) is usually 1.0 to 10% by weight.
- FIG. 1 is a 1 H-NMR chart of BIS-AF.
- FIG. 2 shows a 1 H-NMR chart of the fluorocarbon-modified polyether compound.
- FIG. 3 shows a 1 H-NMR chart of the fluorocarbon-modified epoxy resin.
- An epoxy proton due to epoxidation of the vinyl moiety can be confirmed at around 5 ppm.
- the evaluation is a five-point scale. 5: State of falling down if slanted, 4: State of falling downside down, 3: State of re-dispersion when falling upside down, 2: State of upside down If it hits it, it will fall and it will be partially melted and solidified. 1: It is hardened and will not fall completely when hit.
- the epoxy resin synthesized in each of the above Synthesis Examples and Comparative Comparative Examples was dissolved in acetone together with a curing agent and a curing accelerator so that the ratio of epoxy resin: acetone was 3: 1 (weight ratio). It was poured into a container and deacetone was added.
- the unit of the compounding amount of each substance in Table 2 is parts by weight, and the substances indicated by the abbreviations are as follows.
- MH-700 Methylhexahydrofluoric anhydride (Rikashid M H-700 manufactured by Shin Nippon Rika) (curing agent)
- DBU 1,8-diazabicyclo (5,4,0) pendene-7 (curing accelerator)
- Comparative Example 3 in Table 2 100 parts by weight of the epoxy compound not modified with fluorocarbon obtained in Synthesis Comparative Example 1 was used, 15.0 parts by weight of BIS-AF used in Synthesis Example 1 was used, A cured product obtained by mixing 96.5 parts by weight of MH-700 as a curing agent and 1.06 parts by weight of DBU as a curing accelerator was used. As is clear from the results in Table 2, it was modified with fluorocarbon. Not epoxy When the compound is simply mixed with BIS-AF and a curing agent and cured, the fluorocarbon-modified epoxy resin of the present invention is compared with a cured product cured with a curing agent and the like, resulting in a low T g. It turns out that water absorption cannot be compatible. Industrial applicability
- the cured product of the fluorocarbon-modified epoxy resin of the present invention and a curing agent has a high Tg, is excellent in heat resistance, water resistance, weather resistance, and has low water absorption, and thus has excellent LSI encapsulation. It can be used as a material. Also, as an alternative to the conventional uses of epoxy resins such as coil impregnation, there is the advantage that the performance can be adjusted by freely adjusting the degree of polymerization, etc., depending on the compounding ratio. Furthermore, it can be applied to a wide range of applications such as LEDs, semiconductor encapsulation materials, and paints.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Epoxy Compounds (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005503161A JPWO2004078821A1 (ja) | 2003-03-07 | 2004-03-08 | フルオロカーボン変性エポキシ樹脂 |
US10/548,093 US20060106177A1 (en) | 2003-03-07 | 2004-03-08 | Fluorocarbon-modified epoxy resin |
EP04718406A EP1602677A1 (en) | 2003-03-07 | 2004-03-08 | Fluorocarbon-modified epoxy resin |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-62458 | 2003-03-07 | ||
JP2003062458 | 2003-03-07 |
Publications (1)
Publication Number | Publication Date |
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WO2004078821A1 true WO2004078821A1 (ja) | 2004-09-16 |
Family
ID=32959010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/002960 WO2004078821A1 (ja) | 2003-03-07 | 2004-03-08 | フルオロカーボン変性エポキシ樹脂 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060106177A1 (ja) |
EP (1) | EP1602677A1 (ja) |
JP (1) | JPWO2004078821A1 (ja) |
KR (1) | KR20050109972A (ja) |
CN (1) | CN1759130A (ja) |
TW (1) | TW200502272A (ja) |
WO (1) | WO2004078821A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101215367B (zh) * | 2007-12-29 | 2010-08-11 | 海洋化工研究院 | 一种含全氟烷基侧链的环氧树脂及其制备方法和应用 |
CN102432436A (zh) * | 2010-09-29 | 2012-05-02 | 中国科学院化学研究所 | 多氟苯基取代的芳香族二酚及其合成方法和应用 |
JP5862329B2 (ja) * | 2012-01-31 | 2016-02-16 | 三菱化学株式会社 | 積層板用エポキシ樹脂組成物、積層板及び集積回路 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03123775A (ja) * | 1988-03-03 | 1991-05-27 | Daicel Chem Ind Ltd | エポキシ化合物の製造方法 |
JPH11189622A (ja) * | 1997-07-07 | 1999-07-13 | Asahi Glass Co Ltd | 含フッ素エポキシ共重合体、該共重合体を含む硬化性組成物 |
JPH11322896A (ja) * | 1998-03-10 | 1999-11-26 | Canon Inc | 含フッ素エポキシ樹脂組成物及びこれを用いた表面改質方法、インクジェット記録ヘッド、インクジェット記録装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3849364A (en) * | 1973-01-10 | 1974-11-19 | Hercules Inc | Finely divided crystalline polymers of 1,4-dihalo-2,3-epoxybutane |
US5140091A (en) * | 1988-03-03 | 1992-08-18 | Daicel Chemical Industries Ltd. | Compositions of polyether compounds, epoxy compounds and processes for production thereof based on 4-vinylcyclohexene-1-oxide |
JP3461291B2 (ja) * | 1998-08-06 | 2003-10-27 | ヤマウチ株式会社 | 熱プレスのクッション材用ゴム、熱プレス用クッション材およびプリント基板の製造方法 |
JP4112863B2 (ja) * | 2000-03-28 | 2008-07-02 | 富士通株式会社 | 接着剤組成物 |
US6831112B2 (en) * | 2000-09-28 | 2004-12-14 | Sanyo Chemical Industries, Ltd. | Polyether, active-hydrogen ingredient, resin-forming composition, and process for producing foam |
-
2004
- 2004-03-08 JP JP2005503161A patent/JPWO2004078821A1/ja active Pending
- 2004-03-08 CN CNA2004800062036A patent/CN1759130A/zh active Pending
- 2004-03-08 EP EP04718406A patent/EP1602677A1/en not_active Withdrawn
- 2004-03-08 KR KR1020057016603A patent/KR20050109972A/ko not_active Application Discontinuation
- 2004-03-08 US US10/548,093 patent/US20060106177A1/en not_active Abandoned
- 2004-03-08 TW TW093105998A patent/TW200502272A/zh unknown
- 2004-03-08 WO PCT/JP2004/002960 patent/WO2004078821A1/ja not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03123775A (ja) * | 1988-03-03 | 1991-05-27 | Daicel Chem Ind Ltd | エポキシ化合物の製造方法 |
JPH11189622A (ja) * | 1997-07-07 | 1999-07-13 | Asahi Glass Co Ltd | 含フッ素エポキシ共重合体、該共重合体を含む硬化性組成物 |
JPH11322896A (ja) * | 1998-03-10 | 1999-11-26 | Canon Inc | 含フッ素エポキシ樹脂組成物及びこれを用いた表面改質方法、インクジェット記録ヘッド、インクジェット記録装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1759130A (zh) | 2006-04-12 |
US20060106177A1 (en) | 2006-05-18 |
JPWO2004078821A1 (ja) | 2006-06-08 |
KR20050109972A (ko) | 2005-11-22 |
EP1602677A1 (en) | 2005-12-07 |
TW200502272A (en) | 2005-01-16 |
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