WO2004077905A1 - 電子部品の製造方法、および基体シート - Google Patents
電子部品の製造方法、および基体シート Download PDFInfo
- Publication number
- WO2004077905A1 WO2004077905A1 PCT/JP2004/002266 JP2004002266W WO2004077905A1 WO 2004077905 A1 WO2004077905 A1 WO 2004077905A1 JP 2004002266 W JP2004002266 W JP 2004002266W WO 2004077905 A1 WO2004077905 A1 WO 2004077905A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin
- conductor
- wiring pattern
- layer
- base sheet
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Definitions
- the present invention relates to a method for manufacturing an electronic component and a base sheet, and more particularly to a method for manufacturing an electronic component in which a conductor portion such as a wiring pattern is covered with a resin, and a base sheet.
- 5A and 5B are process explanatory views showing a conventional method for manufacturing each layer of an electronic component.
- a laser is irradiated to the surface of the insulating layer 1 to make a hole. Then, after the hole 2 is formed by laser processing, the hole 2 is filled with a conductive paste, or a film or a columnar conductor is formed inside the hole 2 by fitting.
- a conductor 4 is formed on the surface of the insulating layer 3 formed in advance by plating or etching. After the conductor 4 is formed by these steps, the surface of the conductor 4 is coated with an insulating resin 5 by spin coating (for example, see Patent Document 1).
- a through hole is formed by a carbon dioxide laser or the like, and a via hole conductor is formed by filling a paste containing a powder of a low-resistance metal such as gold, silver, copper, or aluminum into the through hole.
- a low-resistance metal such as gold, silver, copper, or aluminum
- the resin layer is disposed so as to be in contact with the surface on which the conductive protrusions are present, and lamination is performed to form a thermosetting insulating resin layer.
- a method is disclosed in which a conductive body is brought into contact with a group of wirings by a vacuum press to obtain a laminate (for example, see Patent Document 5).
- Patent Document 6 Further disclosed is a method of manufacturing a wiring board in which a spacer for maintaining the thickness of an insulating resin layer at a predetermined thickness is sandwiched between a transfer master and a base substrate for transferring and forming wiring and pressure-bonded.
- a hole is formed in the insulating layer 1 by laser processing, and a conductor is simply formed inside the hole 2, and the thickness of the entire layer is not controlled. .
- a resin is applied by spin coating to form an insulating resin layer so as to cover the conductor.
- the presence or absence of the conductor 4 causes undulation on the surface of the above-mentioned resin. It was difficult to set the thickness of the entire layer uniformly. ⁇
- a method for controlling the thickness of the entire layer has not been disclosed in a method in which a bump is formed on a wiring of a substrate by a conductive paste and then the bump is penetrated into a molding resin by pressing. Furthermore, in Japanese Patent Application Laid-Open No. 2002-1384881, via-hole conductors are only formed by filling the paste, and the thickness of the entire layer is not controlled.
- Japanese Patent Publication No. 6 _ 5 7 4 5 5 it is necessary to release the release film from the surface of the insulating layer after the pressing process is completed. And the surface of the insulating layer may be deformed. And, as in Fig. 5B, the resin is applied to cover the conductors, causing undulations on the surface of the insulating resin, making it difficult to set the thickness of the entire layer uniformly. Was likely to be.
- thermosetting insulating resin layer since the PET film is peeled off, an external force acts on the thermosetting insulating resin layer, and the surface of the thermosetting insulating resin layer is exposed. There is a possibility that deformation or the like may occur. For this reason, it may be difficult to set the thickness of the entire layer uniformly.
- the thickness of the conductor can be set at a predetermined position, although the thickness can be set. Therefore, it was difficult to perform interlayer connection.
- the present invention focuses on the above-mentioned conventional problems, and provides a method for manufacturing an electronic component, which can make the thickness of an insulating layer uniform and minimize the amount of resin used for forming the insulating layer, and a base sheet.
- the purpose is to provide a part.
- the resin for forming the insulating layer flows outward. This is based on the finding that an insulating layer can be formed with a minimum necessary amount of resin.
- an insulating sheet including a resin is attached to a wiring pattern from above, and the resin is covered with the resin by pressing and heating the insulating sheet, and the wiring pattern has a constant thickness.
- a method for manufacturing an electronic component comprising: forming a projection located outside a component forming region; and indicating a volume occupied by the wiring pattern and the projection in a region including the projection. Then, the amount of the resin necessary for forming the layer is calculated, and according to the amount of the resin, The procedure was to set the thickness of the insulating sheet.
- the protrusion is formed in the same step as the wiring pattern.
- the method for manufacturing an electronic component according to the present invention includes the steps of: bonding an insulating sheet having a resin from above to a conductor portion including a wiring pattern and a columnar conductor; A method for manufacturing an electronic component, comprising covering the conductor portion with the resin by applying pressure and heating to a sheet, and forming a layer having a constant thickness based on the height of the columnar conductor. A protrusion located outside of the conductor, and calculating the amount of the resin necessary for forming the layer by using the occupied volume of the conductor and the protrusion in a region including the protrusion as a guide, The procedure was such that the thickness of the insulating sheet was set according to the amount of the resin. In addition, it is preferable that the dummy pattern and the columnar structure forming the protrusion are formed in the same step as the wiring pattern and the columnar conductor forming the conductor.
- the base sheet according to the present invention sets a component forming region on the surface of the base sheet, forms a conductor portion in the component forming region, and covers the conductor portion outside the component forming region. It is configured so as to form a protrusion for increasing the flow resistance of the insulating resin.
- the base sheet according to the present invention has a component forming region set on the surface of the base sheet, and a conductor portion formed of a columnar conductor that forms an interlayer connection with a wiring pattern is formed in the component forming region.
- a projection is formed outside the formation region to increase the flow resistance of the insulating resin that covers the conductor.
- the protrusion has the same form as the conductor, and more preferably, a plurality of components are formed from the component formation region.
- the insulating sheet is bonded from above the wiring pattern. Then, after bonding the insulating sheet, the insulating sheet is heated by increasing the temperature of the pressing plate located on the back side of the insulating sheet. Pressurization is performed while heating with the pressure plate. For example, the conductor enters into the resin of the insulating sheet. Then, after the columnar conductor is taken into the insulating sheet by the continuation of the pressurization and heating, if the pressurization is stopped at an arbitrary position, a constant layer thickness depending on the pressurization stop position is secured. It becomes possible.
- an insulating sheet is bonded from above the wiring pattern and the columnar conductor. After bonding the insulating sheet, the temperature of the pressure plate located on the back side of the insulating sheet is increased to heat the insulating sheet. If pressure is applied while heating is performed by the pressure plate, the conductor enters the resin in the insulating sheet. When the columnar conductor is taken into the insulation sheet by the continuation of the pressurization and the heating, the head of the columnar conductor comes into contact with the pressurized side of the insulation sheet.
- the columnar conductor By stopping the pressurization and heating of the insulating sheet at the position where the head of the columnar conductor comes into contact with the pressing side of the insulation sheet, the columnar conductor functions as a stopper and the thickness of the insulating sheet (that is, the insulating layer) becomes thicker. It is possible to secure a constant layer thickness following the height of the columnar conductor.
- the resin in the insulating sheet described above becomes fluid by heating, the resin fills the steps and gaps around the wiring pattern and the columnar conductor by pressurizing and heating the insulating sheet, and the electronic component Is formed, that is, diffuses out of the component forming region.
- a protrusion is formed outside the component formation region, and when the resin reaches the protrusion, the flow resistance of the resin increases. Therefore, the protrusion (at the time of pressurization and heating) is used as a boundary. The amount of outward movement of the resin can be reduced.
- the occupied volume of the conductor and the protrusion in the region including the protrusion is first calculated, and the amount of resin that covers the conductor and forms a new layer by guiding this value is determined. calculate. If the thickness of the insulating sheet is determined based on this amount of resin, it is possible to prevent a large amount of resin from flowing out of the area including the protrusion, and to minimize The area including the protrusion can be covered with the amount of resin. By using such a procedure, it is possible to minimize the surplus portion around the conductor portion, and it is possible to reduce the amount of resin used. In addition to the above effects, it is possible to set an appropriate amount of resin, so that it is possible to eliminate the bias of the resin caused by the excess resin during pressurization, or It is possible to prevent delamination occurring due to shortage.
- the projection is formed in the same step as the conductor, it is not necessary to separately form the conductor and the projection, and the manufacturing process can be omitted. Furthermore, since the protrusion and the columnar conductor have the same height, when applying pressure while heating the insulating sheet, a uniform layer can be formed without inclination between the protrusion and the columnar conductor. Will be possible. If the component forming region is formed in a multi-piece form so that a plurality of electronic components are formed, the amount of resin used can be suppressed, and a large number of electronic components having a uniform layer thickness can be manufactured. . BRIEF DESCRIPTION OF THE FIGURES
- FIG. 1A and 1B are explanatory views showing the form of the base sheet according to the present embodiment.
- FIG. 1A is a plan view
- FIG. 1B is a cross-sectional view taken along line 1B-1B in FIG. 1A. Is shown.
- 2A to 2C are process explanatory diagrams showing a procedure for forming a base sheet.
- 3A to 3C are explanatory diagrams showing the procedure of the method for manufacturing an electronic component according to the present embodiment.
- FIG. 4 is a flowchart for setting the resin thickness.
- 5A and 5B are explanatory diagrams illustrating a conventional method for manufacturing each layer of an electronic component.
- BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a method for manufacturing an electronic component and a base sheet according to the present invention will be described below in detail with reference to the drawings.
- FIG. 1A and 1B are explanatory views showing the form of the base sheet according to the present embodiment.
- FIG. 1A is a plan view
- FIG. 1B is a cross-sectional view taken along line 1B-1B in FIG. 1A. Is shown.
- a wiring pattern 14 and a columnar conductor 16 serving as a connection between eyebrows are formed on a surface 12 thereof.
- the conductor 18 is composed of the wiring pattern 14 and the columnar conductor 16.
- a component forming area 20 is set at the center thereof, and the above-mentioned conductors 18 are arranged in a plurality in the component forming area 20, thereby achieving multi-piece picking of electronic components.
- the above-mentioned conductors 18 are arranged in a plurality in the component forming area 20, thereby achieving multi-piece picking of electronic components.
- a projection 22 is formed outside the component formation region 20 so as to surround the component formation region 20, and the projection 22 contributes to the manufacture of an electronic component.
- a columnar structure 26 is formed outside the component formation region 20 so as to surround the component formation region 20, and the projection 22 contributes to the manufacture of an electronic component.
- a columnar structure 26 is formed outside the component formation region 20 so as to surround the component formation region 20, and the projection 22 contributes to the manufacture of an electronic component.
- a columnar structure 26 is made of the same material and the same thickness, and are formed by the same process.
- the dummy pattern 24 and the wiring pattern 14 and the columnar structure 26 and the columnar conductor 16 have the same material and the same thickness.
- the material is not limited, and may be made of a different material or have a different thickness.
- FIG. 2A to 2C are process explanatory views showing a procedure for forming a base sheet.
- the left side of the drawing shows a manufacturing process of a conductor portion in a component forming region, and the right side of the drawing shows the same process as the above-described conductor portion.
- the projection side formed by is shown.
- FIG. 2A first, in order to form the base sheet 10, a power supply film for use in the plating method is formed on the front surface 12 (not shown). After the formation of the power supply film, a wiring pattern 14 and a dummy pattern 24 are formed on the surface 12 by bonding a dry film serving as a resist, exposing the resist, or performing a plating process.
- FIG. 1 first, in order to form the base sheet 10, a power supply film for use in the plating method is formed on the front surface 12 (not shown). After the formation of the power supply film, a wiring pattern 14 and a dummy pattern 24 are formed on the surface 12 by bonding a dry film serving as a resist
- FIG. 2B shows a state in which the wiring pattern 14 and the dummy pattern 24 are formed. Then, after forming these patterns, similarly, a dry film is bonded, an exposure to the dry film, a plating step, etc. are performed, and a columnar conductor 16 and a columnar shape are formed above the wiring pattern 14 and the dummy pattern 24.
- the structure 26 may be formed.
- FIG. 2C shows a state where these columnar conductors 16 and 26 are formed.
- the present invention is not limited to this, and the columnar conductor 16 is directly formed without forming the wiring pattern 14.
- the columnar structure 26 may be formed directly without forming the dummy pattern 24 or the dummy pattern 24.
- the conductor portion 18 and the protruding portion 22 it is not necessary to separately form the conductor portion 18 and the protruding portion 22, so that the number of manufacturing steps can be reduced, and the columnar conductor 16 and the columnar structure 26 can be achieved.
- the lower side of the surface 12 of the base sheet 10 is not shown, but a plurality of wiring patterns 14 are laminated and the columnar conductor 16 is connected between the plurality of wiring patterns 14 by interlayer connection. It may be in such a form.
- thermoplastic insulating sheet is formed from above the base sheet 10 to a thermosetting insulating sheet in the B-stage state.
- the copper foil 30 with resin 28 is lowered along the direction of arrow 32 in the figure.
- the resin 28 is a thermoplastic resin such as polyolefin, fluorine resin, liquid crystal polymer, polyether ketone, polyphenylene sulfide, It is preferable to use a curable resin such as an unsaturated polyester resin, a polyimide resin, an epoxy resin, a bismaleimide triazine resin, a phenol resin, a polyphenylene oxide, or a polyvinylbenzyl ether.
- these resins 28 may appropriately contain a filler for the purpose of adjusting characteristics such as fluidity.
- the B-stage base sheet is a sheet obtained by stopping the thermosetting resin at an intermediate stage, and is further melted once upon further heating and is completely cured.
- the heating temperature is more desirably higher than the melting point or softening point of the resin.
- a pressure means (not shown) for pressing the copper foil 30 with the resin 28 is provided on the opposite side of the copper foil 30 on which the resin 28 is formed.
- the copper foil 30 with resin 28 can be pressed against the sheet 10 while heating it (so-called hot pressing under vacuum).
- the copper foil 30 with the resin 28 is set to have an area that covers at least a region of the base sheet 10 that includes at least the protrusion 22. From the viewpoint of minimizing the use amount of the resin 28 and reducing the production cost, the thickness of the resin 28 is set through the following steps.
- FIG. 4 is a flowchart for setting the resin thickness.
- the conductor 18 and the projection are formed.
- the volume occupied by 22 is calculated (step 100).
- the amount of resin enough to cover the conductor portion 18 is calculated (step 110).
- the resin amount calculated taking into account the variation of each component is corrected (Step 120), and then the corrected resin amount is corrected.
- the thickness of the resin 28 attached to the copper foil 30 may be set based on the equation (Step 130).
- the copper foil 30 with the resin 28 is lowered along the direction of the arrow 32 from the state of FIG. 3A.
- the foil 30 starts to contact the columnar conductor 16 and the columnar structure 26.
- the resin 28 pressed by the columnar conductor 16 moves in the direction of the arrow 34, and the columnar conductor 16 enters the inside of the resin 28. Go.
- the resin 28 tends to spread in the direction of the arrow 34, that is, outside the component formation region 20 by the above operation, but a protrusion 22 is formed outside the component formation region 20. Therefore, the flow resistance of the resin 28 that is going to pass through the protrusion 22 increases.
- the resin 28 that is going to move outward is in a state of being dammed by the protrusion 22, and most of the resin 28 remains in the region including the protrusion 22. This makes it possible to make the thickness of the resin 28 constant in a region including the protrusion 22.
- the inventor conducted various comparative studies to verify the effects of the present invention.
- the protrusions 22 are removed from the outside of the component forming region 20.
- a recess 36 is formed in the resin 28, and the component formation shown in FIG. It is understood that it becomes difficult to form the resin 28 having a constant thickness in the region.
- the projections 22 outside the component forming region 20 By forming the projections 22 outside the component forming region 20 to increase the flow resistance of the resin 28, the amount of the resin 28 flowing outward can be suppressed, and the amount of excess resin can be reduced. Can be done. In addition, since the diffusion region of the resin is suppressed, it is possible to reduce the size of an apparatus for manufacturing electronic components and the like, and to reduce the area occupied by the equipment.
- the conductor portion is configured by the wiring pattern and the columnar conductor.
- the present invention is not limited to this embodiment.
- the columnar conductor may be provided on the surface of the base sheet. Even if only the wiring pattern and the protrusion are formed without forming a pattern, the resin thickness sufficient to obtain the required film thickness is calculated from the occupied volume of the region including the protrusion, and this thickness is applied to the insulating sheet. It goes without saying that it is good.
- the above-described protrusions are described as one row in the present embodiment, but the present invention is not limited to this arrangement, and may be a plurality of rows according to, for example, manufacturing conditions and other conditions.
- a method for manufacturing an electronic component comprising: forming a layer having a predetermined thickness, comprising: forming a projection located outside a component formation region; and occupying a volume of the wiring pattern and the projection in an area including the projection.
- the amount of the resin necessary for forming the layer is calculated using the above as a guideline, and the thickness of the insulating sheet is set according to the amount of the resin. More specifically, the wiring pattern and the columnar conductor are used.
- An insulating sheet provided with a resin is attached to the conductor portion made of from above, and the conductor portion is covered with the resin by pressing and heating the insulating sheet using the columnar conductor as a stopper, and
- a method for manufacturing an electronic component in which a layer having a constant thickness is formed based on the height of a body comprising: forming a projection located outside a component forming area; Volume occupied by the conductor and the protrusion
- the amount of the resin necessary for forming the layer is calculated by using the above as a guideline, and the thickness of the insulating sheet is set according to the amount of the resin, so that the thickness of the insulating layer can be made uniform and In addition, the amount of resin used to form the insulating layer can be minimized.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004800050240A CN100534265C (zh) | 2003-02-27 | 2004-02-26 | 电子部件的制造方法 |
US10/546,873 US7987590B2 (en) | 2003-02-27 | 2004-02-26 | Method for manufacturing an electronic part |
KR1020057015877A KR100751731B1 (ko) | 2003-02-27 | 2004-02-26 | 전자 부품의 제조 방법 및 베이스 시트 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003051225A JP2004265958A (ja) | 2003-02-27 | 2003-02-27 | 電子部品の製造方法、および基体シート |
JP2003-51225 | 2003-02-27 |
Publications (1)
Publication Number | Publication Date |
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WO2004077905A1 true WO2004077905A1 (ja) | 2004-09-10 |
Family
ID=32923362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/002266 WO2004077905A1 (ja) | 2003-02-27 | 2004-02-26 | 電子部品の製造方法、および基体シート |
Country Status (6)
Country | Link |
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US (1) | US7987590B2 (ja) |
JP (1) | JP2004265958A (ja) |
KR (1) | KR100751731B1 (ja) |
CN (1) | CN100534265C (ja) |
TW (1) | TW200425236A (ja) |
WO (1) | WO2004077905A1 (ja) |
Families Citing this family (4)
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JP2006165131A (ja) * | 2004-12-03 | 2006-06-22 | Sony Chem Corp | 多層配線基板の製造方法 |
JP2007103587A (ja) * | 2005-10-03 | 2007-04-19 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
JP4993068B2 (ja) * | 2006-08-21 | 2012-08-08 | 富士電機株式会社 | 絶縁膜形成方法 |
JP6141705B2 (ja) * | 2013-07-03 | 2017-06-07 | 日本特殊陶業株式会社 | 部品内蔵配線基板及びその製造方法 |
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JPH0783179B2 (ja) | 1989-12-14 | 1995-09-06 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
US5057486A (en) | 1990-03-05 | 1991-10-15 | General Electric Company | Synthesis of bi-pb-ca-sr-cu-o oriented polycrystal superconductor |
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JP2001118883A (ja) | 1999-10-18 | 2001-04-27 | Matsushita Electric Ind Co Ltd | 回路基板、電子部品及び電子部品装置の実装方法 |
JP2001177237A (ja) | 1999-12-14 | 2001-06-29 | Hitachi Chem Co Ltd | 層間接続に導電性突起を用いたプリント配線板の製造方法、それを用いた多層プリント配線板及びそれにより得られたプリント配線板、多層プリント配線板 |
JP3844954B2 (ja) | 2000-10-27 | 2006-11-15 | 積水化学工業株式会社 | 金属箔付フィルムの製造方法 |
JP4863032B2 (ja) | 2000-11-02 | 2012-01-25 | 日立化成工業株式会社 | 薄板状物品の加工方法とその加工方法を用いた接続基板の製造方法と接続基板と多層配線板の製造方法と多層配線板と半導体パッケージ用基板の製造方法と半導体パッケージ用基板と半導体パッケージの製造方法と半導体パッケージ |
JP2002368369A (ja) | 2001-06-06 | 2002-12-20 | Yamaichi Electronics Co Ltd | フレキシブルプリント配線板及びその製造方法 |
-
2003
- 2003-02-27 JP JP2003051225A patent/JP2004265958A/ja active Pending
-
2004
- 2004-02-26 KR KR1020057015877A patent/KR100751731B1/ko not_active IP Right Cessation
- 2004-02-26 WO PCT/JP2004/002266 patent/WO2004077905A1/ja active Application Filing
- 2004-02-26 CN CNB2004800050240A patent/CN100534265C/zh not_active Expired - Fee Related
- 2004-02-26 US US10/546,873 patent/US7987590B2/en active Active
- 2004-02-27 TW TW093105210A patent/TW200425236A/zh not_active IP Right Cessation
Patent Citations (5)
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JPH04119655A (ja) * | 1990-09-10 | 1992-04-21 | Ibiden Co Ltd | プリント配線板 |
JPH05299535A (ja) * | 1992-04-23 | 1993-11-12 | Matsushita Electric Works Ltd | 半導体装置 |
JPH0742164U (ja) * | 1993-12-24 | 1995-07-21 | 富士通テン株式会社 | 電子部品実装回路基板 |
JPH07307564A (ja) * | 1994-05-10 | 1995-11-21 | Hitachi Chem Co Ltd | 配線板の製造法 |
JPH1065047A (ja) * | 1996-08-20 | 1998-03-06 | Tokuyama Corp | 半導体素子搭載用パッケージの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2004265958A (ja) | 2004-09-24 |
CN1771768A (zh) | 2006-05-10 |
KR100751731B1 (ko) | 2007-08-24 |
US20060258057A1 (en) | 2006-11-16 |
TW200425236A (en) | 2004-11-16 |
TWI324788B (ja) | 2010-05-11 |
US7987590B2 (en) | 2011-08-02 |
KR20050101565A (ko) | 2005-10-24 |
CN100534265C (zh) | 2009-08-26 |
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