TW200421958A - Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate - Google Patents

Abstract

Wiring patterns (302) are formed on major surfaces of a resin sheet (301). After providing the major surfaces with mask members (304a, 304b), a through hole (305) is formed to penetrate the resin sheet (301), the wiring patterns (302), and the mask members (304a, 304b). The through hole (305) is filled with a conductor (306). After removing the mask members (304) from the resin sheet (301) to form a projecting portion (306a) at one end of the conductor (306), the projecting portion (306a) is pressed in the thickness direction of the resin sheet (301), so that a nail head portion (306b) is formed at the one end of the conductor (306). Consequently, the connection resistance between the wiring pattern (302) and the conductor (306) can be reduced.

Description

200421958 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a resin substrate having wiring on the main surface or inside, a method for manufacturing a resin multilayer substrate, and a resin substrate. [Prior Art] In recent years, with the miniaturization of electronic devices, a wiring substrate capable of mounting semiconductor elements such as LSIs and passive elements such as laminated ceramic capacitors with high density has been sought. Therefore, it is an important issue for wiring boards to form high-density wiring with a fine wiring pitch. On the other hand, in the "wiring substrate", a resin substrate is often used in consideration of light weight and low dielectric constant. For such a resin substrate, I have known a wiring method of kappa density: transferring a wiring pattern formed on a support such as a metal plate to a resin preform sheet. Fig. 13 is a process cross-sectional view showing a method of forming a wiring pattern in a conventional resin substrate manufacturing method. As shown in FIGS. 13 (a) to (c), conventionally, a resin preform filled with a through-hole conductor 706 previously filled with a resin preform sheet 701, and a support 707 of a wiring pattern 702 was formed by pressure bonding, and self-supported. The body 707 transfers the wiring pattern 702 to the main surface of the 701 (for example, Japanese Patent Application Laid-Open No. 10-84186, paragraph 026 or refer to FIG. 1). However, in the above-mentioned transfer method, when the resin preformed sheet 70 and the support 707 are pressure-bonded, the resin component of the resin preformed sheet 701 is fluidized due to heating during the pressure-bonding, resulting in wiring patterns. The resin component of the resin preform sheet 701 flows between 702 and the via hole conductor 706. Therefore, there is a problem that the connection resistance between the wiring pattern 702 and the via hole conductor 706 increases. O: \ 88 \ 88535 DOC -6- 200421958 The present invention was developed to solve the above problems, and its purpose is to manufacture a grease substrate and a resin multilayer substrate. Minus two The connection resistance between the wiring pattern and the via hole conductor. / 、] REDUCED = Also provides-a kind of resin with small pattern resistance and channel-shaped connection resistance [Abstract] That is, the present invention provides a method for manufacturing a resin substrate, which includes the following steps. Resin in a preform state A wiring pattern is formed on at least one main surface of the sheet, and a mask member (thickness mask member) is formed on one of the main sheets on which the wiring pattern of the resin sheet is formed; ^ »The hole is filled with the conductor by the shielding member; the shielding member is removed from the main surface of the resin sheet, and one end of the conductor is protruded from the main surface of the wiring pattern; along the resin In the thickness direction of the thin plate, one end of the conductor protruding from the main surface of the wiring pattern is pressed so that one end of the conductor forms a nail-like head. According to the manufacturing method of the resin substrate of the present invention, it is formed as a via hole conductor. One end of the conductive body protrudes from the main surface of the wiring pattern, and presses one end of the conductive body along the thickness direction of the resin plate, so that the 7 ends of the conductive body form a nail-like head. The main surface of the wiring pattern is in surface contact with the inner main surface L of the nail-shaped head, and it is known that the electrical connection will increase the contact area between the wiring pattern and the conductor. Therefore, the connection resistance between the wiring pattern and the via hole conductor can be produced. In addition, in the method for manufacturing a resin substrate of the present invention, it is preferable that the conductive body is temporarily dried after the conductive body is protruded from the main surface of the wiring pattern.

O: \ 88 \ 88535.DOC 200421958 Then add the conductor _ along the thickness of the resin sheet. In a preferred direction, after the resin sheet is hardened, pressure is applied along one end of the thickness of the resin sheet. In the state where the conductor-end protrudes from the main surface of the wiring pattern, the conductor is temporarily dried to obtain a certain degree of hardening. When the conductor protrusion is pressed, a nail-shaped head with a moderate expansion can be formed. unit. In addition, by hardening the resin sheet in advance and applying pressure to the conductor projections, it is possible to prevent the j-resin sheet from being deformed and the volume resistance of the conductor from increasing. In addition, the present invention provides a method for manufacturing a resin multilayer substrate, which includes: a process of manufacturing a plurality of resin substrates by using the resin substrate manufacturing method of the present invention; a preparation process including an adhesive layer of a resin sheet in which a conductor is embedded; The process of combining the main surface of the resin substrate and the main surface of the adhesive layer into one, and crimping the resin substrate and the adhesive layer in such a manner that the adhesive layer is disposed between the two substrates. According to the method for manufacturing a resin multilayer substrate of the present invention, since a resin substrate having a small connection resistance between a wiring pattern and a via hole conductor is used as a constituent layer of the multilayer substrate, it can be arranged on the multilayer substrate with low resistance through the via hole. The upper wiring patterns are connected to each other to form a resin multilayer substrate having excellent electrical characteristics. In addition, the present invention provides a resin substrate including a resin layer, a wiring pattern formed on at least one main surface of the resin layer, and a resin layer which is electrically connected to the wiring pattern in a thickness direction. The via hole V body is characterized in that one of the via hole conductors and the wiring pattern has a nail-shaped head on the connection side, and the main surface of the wiring pattern is formed by surface contact.

O: \ 88 \ 88535.DOC 200421958 Electrical connection is made on the inner main surface of the nail-shaped head that breaks the hole-conductor end. Since the resin substrate of the present invention has a main surface on the exposed side of the wiring pattern, the main surface on the inner side of the nail-shaped head formed at one end of the channel hole conductor is connected privately by the surface contact 〃, the wiring pattern and the channel hole conductor The contact area is increased, thereby reducing the contact resistance between the wiring pattern and the via hole conductor. [Embodiment] The method of manufacturing a resin substrate and a method of manufacturing a resin multilayer substrate according to the present invention will be described below based on a desired embodiment. (Embodiment 1) An embodiment of a resin substrate manufacturing method according to the present invention will be described with reference to Figs. 1 to 7. First, as shown in FIG. 1 (a), a resin sheet 101 in a state of a preform is prepared. Next, as shown in Fig. 1 (b), a wiring pattern 102 is formed on both sides of the resin sheet 101. The resin sheet 101 includes, for example, a mixture of an inorganic filler and a thermosetting resin. As the inorganic filler, for example, Al203, Si02, Ti02, and the like can be used. Using some XI inorganic fillers, while improving the heat dissipation of the resin substrate, the fluidity of the resin substrate can also be adjusted. In addition, as the thermosetting resin, epoxy resin, phenol resin, cyanate resin, and the like can be used. The best is an epoxy resin with good heat and moisture resistance. In addition, the state of the preform refers to a state where the thermosetting resin is not cured. In other words, the resin sheet 101 has a certain fluidity. The resin sheet 1 01 ′ finally forms a part of a resin substrate or a resin multilayer substrate in a hardened state. O: \ 88 \ 88535.DOC -9- 200421958 points. However, in the process of manufacturing the resin substrate or the resin multilayer substrate, in which step the resin sheet 101 is hardened, it is arbitrarily determined according to the purpose. Therefore, the "resin sheet" according to the present invention means that it is in a preformed state at the initial preparation stage, but does not necessarily mean that it must be in a preformed state in subsequent processes. In addition, in Fig. 1 (b), a laser passing hole 103 is formed in advance in the wiring pattern 102 and penetrates through the thickness direction. The formation of the laser beam through the hole ι ′ can prevent reflection of the laser light caused by the wiring pattern 102 when the through-hole is formed by the laser on the resin sheet 101 in the subsequent process. Metals such as Cu, Ag, An, Ag-Pt, and Ag-Pd can be used as the wiring pattern 1 () 2. For the formation of the wiring pattern 102 on the main surface of the resin sheet 101, for example, the following methods can be adopted: The first method: The wiring pattern 102 is formed on the main surface of the resin sheet i 〇 丨 by means of electroplating. This method is to press and harden the resin sheet at a certain temperature and harden, and then form an adhesive layer on the main surface of the resin sheet 101; J When the wiring pattern of 70% steel is to be opened, it is further applied to Form on adhesive

Catalyst layer of Pd. Then, in addition to the predetermined position of the wiring pattern, a photoresist layer is formed on the catalyst layer, and the wiring pattern 102 is deposited on the main surface of the resin sheet 101 by an electroless copper plating method. In addition, it is not necessary to remove the light F € remaining on the main surface of the resin sheet 1 0 1. In addition, after forming a photoresist layer corresponding to the laser passing hole 103 and forming the wiring pattern, the portion of the light P layer and the catalyst layer is removed to thereby form the wiring pattern 102 while also forming the wiring pattern 102. A laser passing hole 103 can be formed. Formed on the main surface of the resin sheet 101 by transfer printing

O: \ 88 \ 88535.DOC -10- 200421958 忡, urinal tea 101. This method is to adhere a metal (such as a copper box) to a main surface of a transfer support such as a PET (polyethylene terephthalate) film or a non-recorded steel plate, and apply an etching treatment to the metal. Thus, a wiring pattern 102 is formed. Thereafter, the transfer support is thermocompression-bonded to the resin sheet 101, and the transfer support is removed from the resin sheet, thereby transferring the wiring pattern 102 to the resin sheet. When the metal foil is etched, a laser passing hole 103 can also be formed at the same time. Further, the wiring pattern 10 2 may be buried in the resin sheet 101 during the transfer. As defined in the present invention, a wiring pattern formed on at least one main surface of a resin sheet, or a wiring pattern formed on at least one main surface of a resin layer "also includes the above-mentioned cases. Second, As shown in Fig. 2, a masking member 104 is disposed on one main surface of the resin sheet 101. The masking member 104 has a function of preventing a conductor from adhering to the main surface of the resin sheet 101 in a conductor filling step described below. The masking member 104 can be, for example, PET (polyethylene terephthalate), pEN (polyethylene terephthalate), etc. Then, the laser is irradiated with the laser passing through the hole 103. A laser is irradiated at a predetermined position of the resin sheet 100 to form a through hole 105 that penetrates the resin substrate 101, the wiring pattern 102, and the masking member 104, as shown in FIG. 3.

As a means for forming the through hole 105, in addition to the CO2 laser, a YAG laser or an excimer laser can be used. The through hole 105 may be formed by a mechanical puncher. In addition, when the through-holes 105 are formed, if there is no problem of laser reflection due to the wiring pattern io2, it is not necessary to form a laser-passing hole 103 in the wiring pattern 102. Then, as shown in FIG. 4, the conductive member 1060 O: \ 88 \ 88535.DOC-11 · 200421958 Yu Beitong hole 105 is filled with the shielding member 104. The guide ㈣ ^ or the internal shape ζ / Γ11 'is connected to the surface n of the resin substrate and the material to perform its function. Guided by the use of, for example, an electric paste made of metal particles and a thermosetting resin. Metal particles such as AU, Ag, Cu, milk, etc. are used. Heat hardening In February, epoxy resin, phenyl sulfonate, and cyanate resin can be used. In addition, the V electric body 106 is not limited to a conductive paste, and a metal material having a certain fluidity such as a tin ball or a gold ball may be used. In addition, the method for filling the conductive body 106 in the through hole H5 includes, for example, flowing a conductive paste onto the main surface of the masking member 104, and then on the main surface of the masking member 104. To slide the scraper. Next, the mask member 104 is removed from the resin sheet 101. As a result, as shown in Fig. 5, one end of the conductor 106 protrudes from the main surface of the wiring pattern 102 to form a protruding portion 106a. Then, in the state shown in Fig. 5, the protruding portion 106a is pressed in the thickness direction of the resin sheet. At this time, the resin sheet 101 may be cast simultaneously. Pressurizing means eg: Vacuum cleaner $ is available. In the field, it is preferable to cover the protrusions 106a and arrange a protective material such as a PET film on the resin sheet 1G1. This can prevent the wiring pattern 102 or the conductor 106 from being damaged. The above results flatten the protrusions 10 formed on one end of the conductive body 106, and as shown in FIG. 6, a nail-like shape is formed on one end of the conductive body 106). The head portion 106b. In this manner, the upper surface of the wiring pattern 102 is brought into electrical contact with the lower portion of the nail-shaped head portion 106b by surface contact. Furthermore, since the wiring patterns 1 are sandwiched between the resin sheet 101 and the nail-shaped body head 106b of the conductive body 106, the connection strength of the wiring patterns is improved. The 107 shown in Fig. 6 is the contact part of O: \ 88 \ 88535.DOC -12- 200421958. Therefore, the contact area between the wiring pattern 1Q2 and the conductor ⑽ increases, and the connection resistance between the wiring pattern 102 and the conductor 106 is reduced. In addition, when the distance between the wiring patterns 102 is narrow, if the protrusions 10 仏 are pressed while the conductive body 106 is highly fluid, the nail-shaped head 106b is on the main surface of the resin sheet 101. The direction is too wide, which leads to the disadvantage of being connected to the adjacent wiring pattern 102 and causing a short circuit. Therefore, when pressing the protruding portion 10, it is better to temporarily dry the conductor 106 in a state where the protruding portion 106a has been formed, so that the conductor 106 can be hardened to a certain degree. . In this way, after the conductive body 106 is temporarily dried, by pressing the projections 106a ', a nail-shaped head 106a having a moderate expansion can be formed. In addition, if the protrusion 106a is pressurized in a state where the fluidity of the resin sheet 101 is high, the resin sheet 101 will be deformed, and the conductive body 106 will be enlarged in the lateral direction to produce the conductive body 106. The disadvantage of increased volume resistance. Therefore, when pressing the protrusions 106a, it is preferable to harden the resin sheet 101 in advance by heat treatment. In this way, after the resin sheet 101 is hardened, pressure is applied to the protruding portion 106a to prevent an increase in the volume resistance of the conductive body 106. The step of temporarily drying the conductor 106 and the step of curing the resin sheet 101 may be performed simultaneously by one heat treatment. Fig. 7 is a cross-sectional view of a resin substrate manufactured through the above steps. As shown in FIG. 7, the resin substrate 200 includes a resin layer 201 formed by curing a resin sheet in a preformed state, a wiring pattern 202 formed on both main surfaces of the resin layer 201, and penetrating the resin layer 20 in the thickness direction. 1 and electrically connect the via hole conductors 206 of the wiring pattern 202 provided on both main surfaces of the resin layer 20 1 respectively. O: \ 88 \ 88S35 DOC -13- 200421958 A nail-shaped head 206b is formed at one end of the channel hole conductor 206. The main surface of the exposed side of the wiring pattern 202 is electrically connected to the inner main surface of the nail-shaped head portion 206b formed at one end of the via hole conductor 206 through surface contact. In FIG. 7, a portion indicated by a reference numeral 207 is a part of the surface contact. When the resin substrate 200 is directly used as a circuit element mounting substrate, a fully cured resin is used as the resin layer 201. As described later, when the resin multilayer substrate is manufactured using the resin substrate 200, the resin layer may be either fully cured or cured to some extent. (Embodiment 2) In this embodiment, another embodiment of the method for manufacturing a resin substrate according to the present invention will be described based on Figs. 8 to 9. First, as shown in FIG. 8 (a), wiring patterns 302 are formed on both main surfaces of a resin sheet 3101 in a preformed state. A laser passing hole 303 is formed in the wiring pattern 302 and penetrates the wiring pattern 302 in the thickness direction. Next, as shown in Fig. 8 (b), mask members 304a and 304b are arranged on both main surfaces of the resin sheet 301. Furthermore, as shown in FIG. 8 (c), the laser beam is irradiated through the hole 3 0 through the laser passing hole (^ laser to form a through mask member 304 a, a wiring pattern 302, a resin sheet 3 01, and a mask member. The through hole 305 of 304b. Then, as shown in FIG. 8 (d), the through hole 305 is filled with the conductive member 306 through the shielding member 304a. In other words, the masking member is removed by the flame-retarded resin sheet 3〇1. The results are shown in Fig. 8 (e). Both ends of the conductive body 306 protrude from the main surface of the wiring pattern 302, and the protrusions 306a are formed on the two sides of the resin sheet 301. O: \ 88 \ 88535.DOC -14- 200421958 Finally, in the state shown in Fig. 8 (e), the dog lifting portion 306a is pressed in the thickness direction of the resin sheet 301. This result makes the conductor 3 〇6 The protrusions W 306a formed at both ends are flattened, as shown in FIG. 8 (a), and nail-shaped heads 306b are formed at both ends of the conductor. FIG. As shown in FIG. 9, the resin substrate 400 includes a resin layer 401 obtained by curing a resin sheet in a preform state, and wiring patterns formed on both main surfaces of the resin layer 401. 402. A via hole conductor 406 that penetrates the resin layer 401 in the thickness direction and electrically connects the wiring pattern 402. A nail-shaped head 406b is formed on both ends of the via hole conductor 406, and the wiring pattern 402 is exposed. The main surface on the next side is electrically connected to the inner main surface of the nail-shaped head 406b formed at both ends of the channel hole conductor 406 by surface contact. The place where the number 407 in Figure 9 is for surface contact In addition, the respective constituent elements in this embodiment are the same as those in the first embodiment, so detailed descriptions are omitted. (Embodiment 3) Next, a method for manufacturing a resin multilayer substrate according to the present invention will be described based on FIG. 10 to FIG. 12. A plurality of resin substrates 200 shown in FIG. 6 are manufactured by the resin substrate manufacturing method shown in Embodiment 1. Also, as shown in FIG. 10, an adhesive layer 500 including a resin sheet 501 with a conductive body 506 is prepared. The resin sheet 501 and the conductor 506 can be the same resin sheet 501 and the conductor 506 as in Embodiment 1. The adhesive layer 500 can be made, for example, as follows. First, as shown in Figure U (a) OA88 \ 88535. DOC -15- 200421958 is not 'in Masking members 504 are affixed to both main surfaces of the resin sheet 50i in a molded state. Secondly, as shown in FIG. 103), a laser-cut sheet 501 and a masking member 504 are formed by a laser. Then, as shown in FIG. 1 i (c), the conductive body 506 is filled inside the through hole 505 and dried at a certain time and temperature. Then, as shown in FIG. 11 (d) As shown, the masking member 504 is removed from the resin sheet 501 to form an adhesive layer 50.

Thereafter, as shown in FIG. 12, the resin substrate 2000 and the adhesive layer 5000 are stacked on top of each other and pressure-bonded to form a resin multilayer substrate 600. The conductive body 506 in which the adhesive layer 5⑼ is embedded in the resin multilayer substrate 600 is electrically connected to the wiring pattern 202 or the conductive body 206 of the resin substrate 200. When the resin substrate 200 and the adhesive layer 500 are pressure-bonded, all the resin substrates 200 and the adhesive layer 500 may be laminated together and then pressure-bonded, or the resin substrate 200 and the adhesive layer 500 may be sequentially laminated. , Crimp and repeat.

In addition, the resin substrate 200 and the adhesive layer 500 are bonded by a thermocompression bonding method. At this time, as described above, the resin sheet 200 1 ′ constituting the resin substrate 2000 may be either fully cured or cured to some extent. On the other hand, in order for the adhesive layer 500 to adhere between the resin substrates 200, it is preferable not to harden the resin sheet 501 constituting the adhesive layer too much before thermocompression bonding. Sex. After thermocompression bonding, the resin substrate 200 and the adhesive layer 500 are completely hardened. Thus, according to the method for manufacturing a resin substrate and the method for manufacturing a multilayer resin substrate according to the present invention, a low-resistance circuit pattern can be formed on the resin substrate or the multilayer resin substrate. It is characterized in that one end of a conductor that functions as a conductive conductor of a channel hole is protruded from the main surface of the wiring pattern, and one of the conductors is slapped along the thickness of the resin O: \ 88 \ 88535 DOC -16- 200421958口 阿, ^ electric pressure (cake pressure, a nail-shaped head is formed at one end of the conductor so the main surface of the wiring pattern and the inner side of the nail-shaped head are electrically connected by surface contact, the wiring pattern and the conductor The contact area of the wiring pattern is increased. Therefore, the wiring pattern and the via hole conductor can be connected reliably and with low resistance. The wiring pattern is sandwiched between the resin sheet and the nail-shaped head of the conductor. The bonding strength between the thin plates is improved. Therefore, the X! —Structure pair improves the bonding strength of a resin substrate having a surface wiring pattern for connection to a main substrate, or a surface wiring pattern for mounting a surface mount component, and a resin multilayer substrate. It is of great benefit to increase it. Furthermore, in a state where one end of the conductor protrudes from the main surface of the wiring pattern, the conductor is temporarily dried to a certain degree of hardness. When the conductor protrusion is pressed, a nail-shaped head with a moderate expansion can be formed. In addition, the resin sheet is hardened in advance, and then the conductor protrusion is pressed, thereby preventing deformation of the resin sheet and the conductor. The volume resistance increases. EXAMPLES The present invention will be described below with reference to specific examples. (Example 1) First, a mixture of silicon dioxide (SiO2 powder) and liquid epoxy resin was prepared to have a thickness of 400 μm. The preformed epoxy sheet was used as a resin sheet. The preformed epoxy sheet was then pressed in the thickness direction for 5 minutes under conditions of 17.0 and 0.2 MPa to form an epoxy substrate having a thickness of 350 μm. Secondly, "Pd catalyst is applied to the two main surfaces of the epoxy substrate to activate it", and then, a photosensitive protection containing novolac resin is added to the Pd catalyst layer.

O: \ B8 \ 88535.DOC -17- 200421958 The material ’forms a photoresist layer. After pre-baking the photoresist layer, a photomask having a light-transmitting pattern in the shape of the wiring pattern is contacted on the photoresist layer and exposed. Then, after the Lischola solution was developed, post-baking was performed to pattern the photoresist layer. Thereby, in addition to the wiring formation predetermined position, a photoresist layer is formed on the pd catalyst layer. After that, the epoxy substrate was immersed in an electroless copper foil, and the wiring pattern having a thickness of 15 mm was deposited on the Pd catalyst layer not covered with the photoresist layer. Then, the photoresist layer and the catalyst layer were removed by an aqueous solution of sodium hydroxide, and a laser passing hole having a diameter of 200 pm was formed at the pre-position of the spring pattern. Successively, on both main surfaces of the epoxy substrate, a _ 溥 film with a thickness of 20 ceramics was attached via a laser through hole and a laser body was formed to form a through-ρEτ film, a wiring pattern, and an epoxy substrate. Of through holes. Then, a conductive polymer (αε1244 manufactured by TATSUta Electric Wire Co., Ltd.) was filled inside the through hole with another PET film through a doctor blade. After that, the PET film is removed from the epoxy substrate. As a result, of the paste: the end protrudes from the main surface of the wiring pattern to form a protruding portion. Of course, in this state. Heat treatment was carried out at 100 C for 30 minutes, so that the conductive paste was temporarily dried. After removal ', PET films are arranged on both main surfaces of the epoxy substrate so as to cover the protruding portions of the conductive paste. Then, go to 170. Under conditions of 0 and 10 MPa, the protruding portion was pressed for 6 G minutes in the thickness direction of the epoxy substrate. As a result, the conductive paste is thermally hardened to form a via-hole conductor, and a nail-like head is formed at both ends of the via-hole conductor. Alas. Finally, the pET film on the epoxy substrate was removed to prepare a resin substrate. (Example 2)

O: \ 88 \ 88535.DOC -18- 200421958 First, a pre-formed epoxy film with a thickness of 400 μm mixed with stone dioxide and liquid epoxy resin was prepared as a resin sheet. Next, prepare a PET film with a thickness of 80 μm, and apply an acrylic resin-based adhesive with a thickness of 20 μm to one main surface of the PET film to make a PET film with an adhesive with a thickness of 100 μm. Used as a support for transfer. Then, on the main surface of the PET film coated with the adhesive, a copper foil with a thickness of 18 μm was roughened on both sides of the adhesive. Then, a protective material containing novolac resin was spin-coated on the copper foil to form a photoresist layer. Then, after pre-baking the photoresist layer, a photomask having a light-transmitting pattern having the same shape as the wiring pattern is contacted on the photoresist layer and exposed. Then, after development with a boric acid solution, post-baking is performed to pattern the photoresist layer. Next, the portion of the copper foil that is not covered by the photoresist layer is etched by an aqueous solution of ferric chloride, and then the photoresist layer remaining on the wiring pattern is removed by an aqueous solution of sodium hydroxide, and a diameter of 2 is formed on the PET film. The wiring pattern of the laser passing through the hole. Thereafter, the ρET film having the wiring pattern formed thereon was crimped onto both main surfaces of the epoxy preform by a vacuum press. The pressurization conditions were: 120. 〇, 10 MPa, 5 minutes. In this case, a preform is formed by removing a pET film from an epoxy plate of the preform, and forming a preform wiring pattern on both main surfaces of the% oxygen preform. The PET film was removed from the resin sheet. Then, the epoxy preform was heat-treated at a temperature of 1 70 C for 5 minutes, and the preform made the epoxy preform thermally hardened. Finally, as in the first embodiment, by placing a mask member, forming a through hole,

O: \ 88 \ 88535.DOC -19- 200421958: "Electric μ & deshielding parts, resin sheet pressing and other processes, resins with channel hole conductors with" nail-shaped heads formed at both ends "are obtained Substrate. (Example 3) First, a film-shaped epoxy preform sheet having a thickness of 100 而成, which is a mixture of oxidized stone oxide and liquid epoxy resin, was prepared as a resin sheet. Secondly, a PET film having a thickness of 20 ^ η was attached to both main surfaces of the epoxy preform sheet to be used as a masking member. Then, a through hole having a diameter of __ is formed through the CO2 thunder body to penetrate the epoxy preform sheet and the PET film. Then, a conductive paste (AE1244, manufactured by Tatsuda Electric Wire Co., Ltd.) is filled in the through hole to be used as a conductor, and heat-treated at a temperature of 60 t for 30 minutes to temporarily dry the conductive paste. Then, the pET film was removed from the epoxy preform to prepare an adhesive layer. Finally, the resin substrate is produced in the same manner as in Example 1. Then, three resin substrates and two adhesive layers are alternately laminated and pressure-bonded, so that the resin substrate becomes the uppermost layer and the lowermost layer. The pressing conditions were: first, thermal compression bonding was performed at 80 ° C, 10 MPa for 5 minutes, and after the adhesive layer was semi-hardened, thermal compression bonding was performed at 60 ° C, 20 MPa for 60 minutes. Thereby, a resin multilayer substrate in which a resin substrate and an adhesive layer are laminated is manufactured. Industrial Applicability In summary, the method for manufacturing a resin substrate according to the present invention is suitable for manufacturing a resin substrate or a resin multilayer substrate having a low-resistance circuit pattern. It enables high-density mounting of passive components such as LSI semiconductor components or multilayer ceramic capacitors. O: \ 88 \ 88535.DOC -20- 200421958 [Brief description of the drawings] Figures 10) and (b) are embodiments of the present invention! Process sectional view of the resin substrate manufacturing method shown. Fig. 2 is a process sectional view of a method for manufacturing a resin substrate according to an embodiment of the present invention. Fig. 3 is a process sectional view of a resin substrate manufacturing method shown in the first embodiment of the present invention. Fig. 4 is a process sectional view of a method for manufacturing a resin substrate according to an embodiment of the present invention. Fig. 5 is a process sectional view of a method for manufacturing a resin substrate according to an embodiment of the present invention. Fig. 6 is a process sectional view of a resin substrate manufacturing method shown in an embodiment of the present invention. FIG. 7 is a cross-sectional view of a resin substrate that is not included in the conventional embodiment of the present invention. 8 (a) to 8 (f) are cross-sectional views showing the steps of the method for manufacturing a resin substrate according to the second embodiment of the present invention. Fig. 9 is a sectional view of a resin substrate shown in a second embodiment of the present invention. Fig. 10 is a process sectional view of a method for manufacturing a resin multilayer substrate according to a third embodiment of the present invention. 11 (a) -11 (d) are cross-sectional views showing the steps of a method for manufacturing a resin multilayer substrate according to a third embodiment of the present invention. Fig. 12 is a process sectional view of a method for manufacturing a resin multilayer substrate according to a third embodiment of the present invention. 13 (a) -13 (c) are process cross-sectional views of a conventional resin substrate manufacturing method. O: \ 88 \ 8853S.doc -21-200421958 [Description of Symbols Representing Drawings] 101, 301, 501 Resin Sheet 102 > 202 > 302 > 402 > 702 Wiring Patterns 103, 303 Laser Passing Holes 104 , 304a, 304b, 504 Masking members 105, 305, 505 Through holes 106, 206, 306, 406, 506 Conductor 106a Protrusions 106b, 206b, 306a, 406b Nail-shaped head 200, 400 Resin substrate 20, 401 Resin Layer 500 Adhesive layer 600 Multilayer substrate 701 Resin preform sheet 706 Channel hole conductor 707 Support O: \ 88 \ 88535.DOC * 22

Claims (1)

200421958 Patent application park:-A method for manufacturing a resin substrate, comprising the following steps: forming a wiring pattern on at least one main surface of a resin sheet in a preformed state; and forming the wiring pattern on the resin One of the thin plates is mainly provided with a masking member having a certain thickness; a hole penetrating through the resin sheet, a wiring pattern, and a masking portion has been formed thereon; a dry penetrating body is filled with a conductor through the masking member; Removing the masking member from the upper resin sheet in such a manner that one end of the conductor protrudes from the main surface of the wiring; and forming the conductor formed from the main surface of the wiring pattern in the thickness direction of the resin sheet Add M at one end to form a head with one end of the 纟 conductor. 2. The method for manufacturing a resin substrate according to the item 丨 of the patent application, wherein in a state where one end of the conductor protrudes from the main surface of the wiring pattern, after the conductor is temporarily dried, the resin sheet is placed in the thickness direction of the resin sheet. One end of the conductor is pressurized. 3. The method for manufacturing a resin substrate according to item 1 or 2 of the patent application, wherein after the resin sheet is hardened, one end of the conductor is pressed in the thickness direction of the resin sheet. 4. A method for manufacturing a resin multilayer substrate, comprising: a process of manufacturing a plurality of resin substrates by the method for manufacturing a resin substrate as described in item 1 of the scope of patent application; O: \ 88 \ 8853S.DOC 200421958 A process of an adhesive layer made of a resin substrate of a conductor; and bonding the main surfaces of the resin substrates to the main surface of the adhesive layer to arrange an adhesive layer between the two resin substrates, The process of bonding the resin substrates to the adhesive laminate. 5. · A resin substrate comprising: a resin layer, a wiring pattern formed on at least one main surface of the resin layer, and a via hole conductor penetrating the resin layer in a thickness direction and electrically connected to the wiring pattern. The channel hole conductor has a nail-shaped head at one end connected to the wiring pattern; the main surface of the wiring pattern and the inner main surface of the nail-shaped head formed at the end of the channel hole conductor are electrically contacted by surface contact; Sexual connection. O: \ 88 \ 88535.DOC 2-