JP4691763B2 - Method for manufacturing printed wiring board - Google Patents

Description

[0001]
【Technical field】
The present invention relates to a printed wiring board on which electronic components and the like are mounted and a method for manufacturing the same.
[0002]
[Prior art]
Conventionally, a printed wiring board having a multilayer conductor pattern has been manufactured by, for example, the following method using a semi-additive method.
First, as shown in FIG. 12A, a wiring board 99 provided with a conductive pattern 97 on the surface of an insulating resin layer 94 is prepared, and a B-stage resin insulating layer 93 is formed on the surface. As shown in FIG. 12B, a carrier 91 having a copper foil 92 attached is laminated on the surface of the resin insulating layer 93. At this time, the copper foil 92 is made to face the resin insulating layer 93. Next, the resin insulation layer 93 is cured by thermocompression bonding with pressure from the thickness direction.
[0003]
Next, as shown in FIG. 12 (c), the carrier 91 is peeled from the copper foil 92. Next, a via hole 90 communicating with the lower conductor pattern 97 is formed in the copper foil 92 and the insulating resin layer 93 by a laser or the like. Next, as shown in FIG. 12D, a resist layer 95 having pattern formation holes 950 is formed on the surface of the copper foil 92. Next, as shown in FIG. 13A, copper plating is deposited in the pattern formation hole 950 and the via hole 90 to form a metal plating pattern layer 96.
[0004]
Next, as shown in FIG. 13B, the resist layer 95 is removed. As a result, the portion of the copper foil 92 that has been disposed under the resist layer 95 is exposed. Next, the exposed portion of the copper foil 92 is removed by etching. As a result, a conductor pattern 91 composed of the metal plating pattern layer 96 and the copper foil 92 remaining therebelow is formed on the surface of the wiring board 94.
Thereafter, as shown in FIG. 13 (c), an insulating resin layer 98 is disposed on the surface of the conductor pattern 91 and heat-pressed.
The printed wiring board 9 is obtained as described above.
[0005]
[Problems to be solved]
However, in the conventional method for manufacturing a printed wiring board, as shown in FIG. 13, plating is deposited relatively thick on a portion where the wiring density (pattern area per unit area) of the conductor pattern to be formed is small. The plating deposited on the portion where the wiring density of the conductor pattern is high is relatively thin. For this reason, it is difficult to form the conductor pattern 91 with a uniform thickness. In addition, the thickness of the insulating resin layer 98 covering the surface is also non-uniform.
Even if the conductor pattern has a uniform thickness, the thickness protrudes from the insulating resin layer. For this reason, the substrate surface cannot be flattened.
[0006]
Furthermore, as shown in FIG. 13C, if the height of the conductor pattern 91 varies, the thickness of the printed wiring board 9 varies when a separate wiring board is laminated thereon.
[0007]
In view of the conventional problems, the present invention is intended to provide a printed wiring board having a uniform thickness without requiring control of the plating thickness for pattern formation and a method for manufacturing the same.
[0008]
[Means for solving problems]
The invention according to claim 1 is a metal layer forming step in which a metal layer is formed on the surface of the carrier, and a roughened surface is formed in advance on the surface opposite to the carrier side of the metal layer by a roughening treatment ; ,
A plating step of forming a conductor pattern by metal plating on the metal layer forming side of the carrier;
A resin layer forming step of forming an insulating resin layer on the conductor pattern forming side of the carrier;
A curing step for curing the insulating resin layer;
Removing the carrier and the metal layer from the surface of the insulating resin layer,
And the thickness of the said carrier is 20-100 micrometers,
The metal layer is removed by etching, and the entire surface of the insulating resin layer on the conductor pattern forming side is a roughened surface formed by transferring the roughened surface of the metal layer, and the roughened surface is exposed to the surface. It is a manufacturing method of the printed wiring board characterized by being made to do .
[0009]
In the present invention, an insulating resin layer is formed on the conductor pattern forming side of the carrier. Since the insulating resin layer is made of a resin in a semi-cured state (B stage), the insulating resin layer follows the uneven surface formed by the carrier and the conductor pattern, fills between the conductor patterns, and reaches the carrier surface. For this reason, the surface of the insulating resin layer has substantially the same height as the conductor pattern. When the insulating resin layer is cured in this state and then the carrier and the metal layer are removed, the surface of the conductor pattern and the surface of the insulating resin layer appear as a continuous, substantially identical surface.
Therefore, according to this manufacturing method, the thickness of the conductor pattern does not affect the pattern formation surface at all, and the conductor pattern and the insulating resin layer can be formed on substantially the same surface. Therefore, it is not necessary to control the plating thickness for pattern formation.
In particular, in the present invention, the metal layer is removed by etching, and the entire surface of the insulating resin layer on the conductor pattern forming side is a roughened surface formed by transferring the roughened surface of the metal layer. The roughened surface is exposed on the surface.
[0010]
The metal layer is removed by etching. As a result, the entire surface on the pattern forming side of the insulating resin layer forms a roughened surface to which the roughened surface of the metal layer is transferred . Further, the roughened surface is exposed on the surface .
For this reason, even when an insulating resin layer is further laminated on the surface of the insulating resin layer, adhesion with the insulating resin layer is improved.
[0011]
When the insulating resin layer is formed on the carrier pattern side of the carrier, the conductor pattern is buried in the insulating resin layer except for the surface facing the carrier. Therefore, a printed wiring board having the same thickness can be manufactured regardless of the height of the conductor pattern.
[0012]
The carrier is not particularly limited as long as it can retain the shape when the printed wiring board is manufactured, and examples thereof include a metal plate such as copper, a synthetic resin plate, and a synthetic resin plate with a reinforcing material.
The thickness of the carrier, Ru 20~100μm der. If the thickness is less than 20 μm, the shape retention function and strength may be reduced, and the relative positional relationship of the pattern may not be maintained when the B stage insulating resin layer liquefies and flows during heating. . If it exceeds 100 μm, the cost required for the carrier may increase.
[0013]
The metal layer formed on the surface of the carrier serves as an electrical lead during subsequent plating formation. As the metal layer, for example, a conductive material such as copper, aluminum, nickel, or solder can be used.
[0014]
The surface of the metal layer can be roughened. The roughening treatment is preferably performed on the surface of the metal layer on the carrier side. This improves the adhesion between the metal layer and the carrier. Also, roughening treatment, to facilities on the opposite side of the surface and the carrier side of the metal layer.
[0015]
As a method for forming a metal layer on the surface of the carrier, a method in which a metal foil is bonded with an adhesive having a thickness of 5 μm or less, and after applying an adhesive having a thickness of 1 μm or less on the surface of the metal carrier, a metal layer is deposited by plating. There is a way.
[0016]
The adhesive strength between the metal layer and the carrier is preferably 2 N / cm or less. This is because if it exceeds 2 N / cm, the conductor pattern may not be peeled off from the carrier during the carrier peeling step and may be carried to the next step while remaining attached. In particular, in the case of adhesion strength in the range of 0.05 to 0.5 N / cm, a more preferable effect can be exhibited. If it is less than 0.05 N / cm, a liquid such as a plating solution penetrates between the carrier and the metal layer and peels off, and mechanical handling becomes inconvenient.
[0017]
In forming a conductor pattern by metal plating on the metal layer forming side of the carrier, for example, a pattern non-formed portion is covered with a resist and electroplating is performed.
As the insulating resin layer, a semi-cured (B stage) resin such as a prepreg is used. As the resin component, a thermosetting resin such as an epoxy resin, a phenol resin, a bismaleimide torazine resin, a polyphenylene resin, a polyphenylene ether resin, a polyimide resin, or a mixture thereof can be used. The insulating resin layer may include a reinforcing material such as glass cloth or glass fiber.
[0018]
The insulating resin layer is preferably thicker than the conductor pattern. As a result, a printed wiring board having a uniform thickness can be manufactured regardless of the thickness of the conductor pattern.
The thickness of the insulating resin layer is preferably 0.005 to 0.05 mm thicker than the thickness of the conductor pattern. If the thickness is less than 0.005 mm, it may be difficult to produce a printed wiring board having a uniform thickness. If the thickness exceeds 0.05 mm, thinning of the printed wiring board may be hindered.
[0019]
Preferably, the insulating resin layer is cured while pressing the insulating resin layer in the thickness direction. Thereby, an insulating resin layer can be hardened in the state of uniform thickness.
[0020]
The applied pressure of the carrier and the insulating resin layer is preferably 50 to 5000 KPa. If it is less than 50 KPa, the conductor pattern may not be embedded in the insulating resin layer. If it exceeds 5000 KPa, the carrier and the insulating resin of the B stage are in close contact, and the carrier later becomes the insulating resin layer. It is because it will not peel off. The carrier and the insulating resin layer may be partially bonded, but the bonded area is an area where a maximum of 80% of the surface of the conductor pattern can be peeled off satisfactorily. And it is preferable that 20% or more of the conductor pattern height is embedded. As a result, when the carrier is peeled off, the conductor pattern remains attached to the carrier and is not carried to the next process.
[0021]
When the insulating resin layer is formed on the carrier pattern forming side of the carrier, the surface of the insulating resin layer is preferably supported by a hard plate such as a copper plate or a stainless steel plate. Thereby, the surface of the insulating resin layer can be flattened. Moreover, it is preferable to arrange a hard plate on the carrier side. Thereby, a deformation | transformation of a carrier can be suppressed.
[0022]
In removing the carrier from the surface of the metal layer, there is a method of peeling the carrier by hand. In this case, the adhesion strength between the carrier and the metal layer is preferably 2 N / cm or less. Thereby, a carrier can be easily peeled by hand.
Etching is performed to remove the metal layer from the surface of the insulating resin layer, and at this time, the metal layer on the surface of the conductor pattern may be removed.
[0023]
Any of the curing step of curing the insulating resin layer and the removing step of removing the carrier and the metal layer from the surface of the insulating resin layer may be performed first. It is also possible to carry out the removing step first, stack other laminated boards with the insulating resin layer remaining uncured, and collectively heat-press to obtain a multilayer printed wiring board.
[0024]
The invention according to claim 3 is a metal layer forming step in which a metal layer is formed on the surface of the carrier, and a roughened surface is formed in advance on the surface of the metal layer opposite to the carrier side by a roughening treatment. ,
A plating step of forming a conductor pattern by metal plating on the metal layer forming side of the carrier;
A resin layer forming step of obtaining a laminate by forming an insulating resin layer on the conductor pattern forming side of the carrier;
A laminating step of laminating the wiring board and the laminated board while facing the insulating resin layer side of the laminated board on a separate wiring board;
A curing step of curing the insulating resin layer while pressing the wiring board and the laminate in the thickness direction;
Removing the carrier and the metal layer from the surface of the insulating resin layer,
And the thickness of the said carrier is 20-100 micrometers,
The metal layer is removed by etching, and the entire surface of the insulating resin layer on the conductor pattern forming side is a roughened surface formed by transferring the roughened surface of the metal layer, and the roughened surface is exposed to the surface. It is a manufacturing method of the printed wiring board characterized by being made to do .
[0025]
In the present invention, a laminate in which a conductor pattern and an insulating resin layer are formed on the surface of a carrier is used as a laminate, and this is laminated on a separate wiring board. When these are pressed in this state, the insulating resin layer in the laminate follows the surface shape of the separate wiring board. For this reason, according to this manufacturing method, the insulating resin layer can be laminated and pressure-bonded in parallel to the wiring board.
Therefore, a multilayer printed wiring board having substantially the same thickness can be manufactured regardless of the thickness of the conductor pattern.
[0026]
Further, when the metal layer is etched, the surfaces of the insulating resin layer and the conductor pattern existing under the metal layer appear as a continuous and substantially roughened surface. Therefore, according to this manufacturing method, the thickness of the conductor pattern does not affect the pattern formation surface at all, and the conductor pattern and the insulating resin layer can be formed on substantially the same surface. Therefore, it is not necessary to control the plating thickness for pattern formation. Further, by repeating this manufacturing method, a multilayer printed wiring board having a uniform thickness can be manufactured.
[0027]
Further, the entire surface on the conductor pattern forming side in the insulating resin layer is a roughened surface. Therefore, when the wiring board is laminated on the surface, excellent adhesion due to the anchor effect can be exhibited.
[0028]
A laminated board is manufactured by performing the process similar to the metal layer formation process in Claim 1, a plating process, and a resin layer formation process.
Any of the curing step of curing the insulating resin layer and the removing step of removing the carrier and the metal layer from the surface of the insulating resin layer may be performed first. It is also possible to carry out the removing step first, stack other laminated boards with the insulating resin layer remaining uncured, and collectively heat-press to obtain a multilayer printed wiring board.
[0029]
The planar direction of the laminated plate includes an X direction and a Y direction orthogonal to the X direction. The difference in shrinkage rate when the insulating resin layer in the X direction and the Y direction is cured is preferably within ± 0.5%. If it exceeds 0.5%, the relative position between the conductor pattern formed on the wiring board and the conductor pattern formed on the carrier may be shifted, and a conduction failure may occur when a through hole is formed between the two. There is. Also, the printed wiring board may be deformed.
[0030]
The separate wiring substrate is a substrate having a conductor pattern, for example, a conductor pattern formed on the surface or inside of an insulating resin layer. The insulating resin layer may be cured before lamination or may be uncured. The separate wiring board is manufactured by performing the metal layer forming step, the plating step, and the resin layer forming step according to claim 1, and further removing the carrier in a semi-cured state or a completely cured state of the insulating resin layer. Further, the metal layer may be removed.
[0031]
When the insulating resin layer of the wiring board is uncured, the difference (AB) between the shrinkage rate A when the insulating resin layer is cured and the shrinkage rate B when the insulating resin layer formed on the carrier is cured. Is preferably within ± 0.5%. If it exceeds 0.5%, the relative position between the conductor pattern formed on the wiring board and the conductor pattern formed on the carrier may be shifted, and a conduction failure may occur when a through hole is formed between the two. There is.
After removing the metal layer, a through hole can be formed.
[0032]
In a printed wiring board having an insulating resin layer and a conductor pattern formed on the surface thereof,
The surface of the conductor pattern protrudes above the surface of the insulating resin layer and constitutes substantially the same roughened surface in which a slight step is formed between both surfaces.
And there exists a printed wiring board characterized by the said level | step difference being 80% or less of the thickness of a conductor pattern.
[0033]
In the printed wiring board of the present invention, the insulating resin layer and the conductor pattern form substantially the same roughened surface. For this reason, when a separate wiring board is laminated on the surface of the printed wiring board, it can be multilayered with a uniform thickness.
Further, the entire surface on the conductor pattern forming side in the insulating resin layer is a roughened surface. Therefore, when an insulating resin layer or a metal layer is laminated on the roughened surface, excellent adhesion due to the anchor effect can be exhibited. As a result, adhesion to a protective film such as a solder resist and a sealing resin such as an overmold resin and an underfill resin is improved. Of course, the connectivity of connection terminals such as wire bonding wires, anisotropic conductive resin, and solder balls is also improved.
[0034]
The above “substantially the same roughened surface” means that the conductor pattern and the insulating resin layer form a roughened surface, and a part of the thickness of the conductor pattern is buried in the insulating resin layer, so that the surface of the conductive pattern is insulated. The case where it protrudes slightly from the resin layer surface.
In this case, a step is formed between the surface of the insulating resin layer and the surface of the conductor pattern. The step is at most 80% of the thickness of the conductor pattern. Thereby, the insulating resin layer and the conductor pattern can form substantially the same surface.
The surface roughness (Rmax.) Of the roughened surface is preferably 0.2 to 5 μm. Thereby, favorable adhesiveness is realizable.
[0035]
Next , the outer surface of the conductor pattern is preferably wider than the inner surface of the conductor pattern. As a result, the width of the conductor pattern is widened, and bonding properties such as wires are improved.
[0036]
Moreover , it is preferable that a separate wiring board is laminated and pressure-bonded on the surface of the insulating resin layer. As a result, multilayered printed wiring boards and high density wiring can be realized.
[0037]
Further, the printed wiring board, it is preferably bonded to the heat diffusion plate, or casing. This improves the heat dissipation of the printed wiring board.
The printed wiring board of the present invention can be provided with a mounting portion for mounting electronic components. For example, terminals such as wires and solder bumps can be bonded to the conductor pattern.
[0038]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1
A printed wiring board according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 7, the printed wiring board 8 of this example has an insulating resin layer 1 and a conductor pattern 2 formed on the surface thereof. The outer surface of the conductor pattern 2 constitutes a roughened surface 10 that is substantially the same as the surface of the insulating resin layer 1.
[0039]
Next, a method for manufacturing a printed wiring board will be described.
First, as shown in FIG. 1, a metal layer 22 is formed on the surface of the carrier 3. The carrier 3 is a copper plate having a thickness of 0.07 mm. The metal layer 22 is a copper foil having a thickness of 0.003 mm. A roughened surface 221 is formed on the surface of the metal layer 22 opposite to the carrier 3 side.
[0040]
Next, as shown in FIG. 2, a photosensitive resist film 4 is coated on the metal layer forming side of the carrier 3 and light is irradiated while masking the pattern forming portion, and the pattern forming portion is removed and the pattern is not formed. Light cure the part. Next, development is performed, the pattern forming portion is removed, and the pattern forming hole 40 is opened.
Next, as shown in FIG. 3, electrolytic copper plating is performed to form a conductor pattern 2 having a thickness of about 0.02 mm in the pattern forming hole 40.
Next, as shown in FIG. 4, the resist film 4 is removed by thin film processing.
[0041]
Next, as shown in FIG. 5, the insulating resin layer 1 is formed on the side of the carrier 3 where the conductor pattern 2 is formed. The insulating resin layer 1 is made of a B-stage prepreg. A prepreg is a glass cloth impregnated with an epoxy resin. The same number of fiber bundles of glass cloth are arranged per unit length in the X direction and the Y direction. The fiber density of the fiber bundle constituting the X direction is the same as that of the Y direction. The thickness of the insulating resin layer 1 is 0.06 mm, which is larger than the thickness of the conductor pattern 2.
[0042]
Next, a hard plate such as a stainless steel plate is disposed on the surface of the insulating resin layer 1, and in this state, the insulating resin layer 1 and the carrier 3 are pressed at a pressure of 900 KPa in the thickness direction at 185 ° C. Heat. Thereby, the insulating resin layer 1 is hardened.
The adhesion strength between the carrier 3 and the metal layer 22 at this time was 0.1 N / cm. Then, as shown in FIG. 6, the carrier 3 is removed from the surface of the metal layer 22 by hand.
Next, as shown in FIG. 7, the metal layer 22 is removed by etching. At this time, the surfaces of the conductor pattern 2 and the insulating resin layer 1 under the metal layer 22 appear, and become substantially the same roughened surface 10 with few steps. The conductor pattern 2 leaves at least a thickness of 0.018 mm.
The printed wiring board 8 is obtained as described above.
[0043]
In this example, the insulating resin layer 1 is formed on the side of the carrier 3 where the conductor pattern 2 is formed. The insulating resin layer 1 is soft because it is made of B-stage resin, and the insulating resin layer 1 follows an uneven surface formed by the carrier 3 and the conductor pattern 2. For this reason, the insulating resin layer 1 forms a surface having substantially the same height as the conductor pattern 2. When the insulating resin layer 1 is cured in this state and the carrier 3 is removed, the surfaces of the conductor pattern 2 and the insulating resin layer 1 appear as substantially the same roughened surface 10.
Accordingly, the conductor pattern 2 and the insulating resin layer 1 can be formed on substantially the same roughened surface, and it is not necessary to control the plating thickness for pattern formation.
[0044]
When the insulating resin layer 1 is formed on the conductor pattern 2 side of the carrier 3, the conductor pattern 2 is embedded in the insulating resin layer 1 except for the surface facing the carrier 3. Therefore, the printed wiring board 8 having substantially the same thickness can be manufactured regardless of the height of the conductor pattern.
Further, as shown in FIGS. 3 and 7, the roughened surface 221 of the metal layer 22 is transferred to the insulating resin layer 1. For this reason, the adhesiveness of the insulating resin layer 1 formed on the solder resist or the sealing resin is remarkably improved.
[0045]
Further, as shown in FIG. 8D, the outer surface 27 of the conductor pattern 2 can be made wider than the inner surface 28. That is, as shown in FIG. 8A, a taper 41 is attached to the pattern forming hole 40 of the resist film 4 so that the opening diameter gradually decreases toward the outside. In this case, as shown in FIG. 8 (b), the conductor pattern 2 formed in the pattern forming hole 40 gradually increases toward the outside, and therefore, in FIGS. 8 (c) and 8 (d). As shown, the conductor pattern 2 having the outer surface 27 wider than the inner surface 28 is formed. Of course, the shape of the conductor pattern 2 can be reversed.
[0046]
Embodiment 2
In this example, a method for manufacturing a printed wiring board in which four layers of conductor patterns are laminated will be described.
First, as shown in FIG. 9A, a wiring board 83 and a laminated board 84 to be arranged on the upper and lower surfaces thereof are prepared.
In manufacturing the wiring board 83, a copper foil is attached to the surface of the insulating resin layer 6 in which a glass cloth is impregnated with an epoxy resin, and etching is performed to form the conductor pattern 7. The insulating resin layer 6 is completely cured in advance.
[0047]
The laminated plate 84 is obtained by forming the metal layer 22, the conductor pattern 2, and the insulating resin layer 1 on the carrier 3. In manufacturing the laminated board 84, the same process as the method shown in FIGS. 1 to 5 of the first embodiment is performed, but the applied pressure is heated at 125 ° C. at 100 KPa and semi-cured (B It is different in that it is in the stage) state. At this stage, the insulating resin layer 1 remains in the B stage.
[0048]
Next, as shown in FIG. 9B, a laminated plate 84 is laminated on the upper and lower surfaces of the wiring board 83. At this time, the insulating resin layer 1 side of the laminated board 84 is opposed to the wiring board 83.
Next, as shown in FIG. 9C, these are heated at 185 ° C. while applying a pressure of 2500 KPa from the thickness direction. As a result, the insulating resin layer 1 and the conductor pattern 2 are pressure-cured on the upper and lower surfaces of the wiring board 83.
At this time, the adhesion strength between the carrier 3 and the metal layer 22 was 0.2 N / cm.
[0049]
Then, as shown in FIG. 9D, the carrier 3 is peeled off from the metal layer 22 by hand.
Next, as shown in FIG. 9E, the metal layer 22 is removed by etching.
Next, the through hole 80 is drilled and plated to impart conductivity to the through hole. This drilling can also be performed immediately after the carrier 3 is peeled off.
As described above, the printed wiring board 85 having four conductor layers is obtained.
[0050]
In this example, as shown in FIG. 9B, the B-stage insulating resin layer 1 is laminated on a separate wiring board 83. When these are pressed in the thickness direction in this state, the insulating resin layer 1 follows the surface shape of the separate wiring board 83. For this reason, according to this manufacturing method, the insulating resin layer 1 can be laminated and pressure-bonded to the wiring board 83 in the parallel direction. Therefore, the printed wiring board 85 having the same thickness can be manufactured regardless of the thickness of the conductor pattern 2.
[0051]
The printed wiring board 85 of this example has four layers of conductor patterns 2, 7, 7, and 2, but it may be a multilayer having more layers. Also in this case, as shown in FIG. 9, a multilayer printed wiring board having a uniform thickness and a flat surface can be manufactured by repeating the manufacturing method of this example.
If the laminated board 84 is disposed only on one side of the wiring board 83 and laminated and crimped, a printed wiring board having three conductor layers can be obtained.
[0052]
Embodiment 3
As shown in FIG. 10, the method of manufacturing the printed wiring board of this example is substantially the same as that of the second embodiment. (FIG. 10 (a), (b)), and the point which is heat-pressed after that (FIG. 10 (c)) differs.
Also in this example, the same effects as those of the second embodiment can be obtained.
[0053]
Embodiment 4
As shown in FIG. 11, the method of manufacturing the printed wiring board of this example is substantially the same as that of the second embodiment. Fig. 11 (a)), thermocompression bonding (Fig. 11 (b)). The two laminated plates 84 have the conductor pattern 2 disposed on the upper side. As shown in FIG. 11C, the obtained printed wiring board 88 has its lower surface bonded to a conductive part such as a heat diffusing plate or a metal casing 89 with an adhesive or the like.
[0054]
Although this printed wiring board 88 has two conductor pattern layers, there is no conductor pattern layer on the lower side. That is, it is a two-layer wiring board with one side insulated. It is also possible to directly attach a conductive part such as a heat diffusing plate or a metal casing 89 to the surface where the conductor pattern is not formed. This makes it possible to obtain a printed wiring board that is compact and has good thermal diffusivity.
[0055]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the control of the plating thickness for pattern formation is unnecessary, and the printed wiring board of uniform thickness and its manufacturing method can be provided.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram for illustrating a method for manufacturing a printed wiring board in Embodiment 1;
FIG. 2 is an explanatory diagram for illustrating a printed wiring board manufacturing method following FIG. 1;
FIG. 3 is an explanatory diagram for illustrating a method for manufacturing a printed wiring board, following FIG. 2;
FIG. 4 is an explanatory diagram for illustrating a printed wiring board manufacturing method following FIG. 3;
FIG. 5 is an explanatory diagram for illustrating a printed wiring board manufacturing method following FIG. 4;
FIG. 6 is an explanatory diagram for illustrating a method for manufacturing a printed wiring board, following FIG. 5;
7 is a cross-sectional explanatory view of a printed wiring board in Embodiment 1; FIG.
8A to 8D are explanatory views (a) to (d) for illustrating a method for forming a conductor pattern having an outer surface wider than an inner surface in Embodiment 1. FIG.
FIGS. 9A to 9E are explanatory views (a) to (e) for illustrating a method for manufacturing a multilayer printed wiring board in Embodiment 2. FIGS.
10A to 10D are explanatory views (a) to (d) of a method for manufacturing a printed wiring board according to Embodiment 3.
11A to 11C are explanatory views (a) to (c) of a method for manufacturing a printed wiring board according to Embodiment 4.
FIGS. 12A to 12D are explanatory views (a) to (d) for illustrating a printed wiring board manufacturing method in a conventional example.
FIG. 13 is an explanatory diagram (a) to (c) for illustrating a method for manufacturing a printed wiring board, following FIG. 12;
[Explanation of symbols]
1,6. . . Insulating resin layer,
10. . . Approximately the same roughened surface,
2,7. . . Conductor pattern,
22. . . Metal layer,
3. . . Career,
4). . . Resist film,
40. . . Hole for pattern formation,
8, 85. . . Printed wiring board,
80. . . Through hole,
83. . . Wiring board,
84. . . Laminated board,

Claims (3)

Forming a metal layer on the surface of the carrier and forming a roughened surface in advance on the surface opposite to the carrier side of the metal layer by a roughening treatment ;
A plating step of forming a conductor pattern by metal plating on the metal layer forming side of the carrier;
A resin layer forming step of forming an insulating resin layer on the conductor pattern forming side of the carrier;
A curing step for curing the insulating resin layer;
Removing the carrier and the metal layer from the surface of the insulating resin layer,
And the thickness of the said carrier is 20-100 micrometers,
The metal layer is removed by etching, and the entire surface of the insulating resin layer on the conductor pattern forming side is a roughened surface formed by transferring the roughened surface of the metal layer, and the roughened surface is exposed to the surface. A method for producing a printed wiring board, comprising:   2. The method for manufacturing a printed wiring board according to claim 1, wherein the curing of the insulating resin layer is performed while pressing the insulating resin layer in a thickness direction. Forming a metal layer on the surface of the carrier and forming a roughened surface in advance on the surface opposite to the carrier side of the metal layer by a roughening treatment ;
A plating step of forming a conductor pattern by metal plating on the metal layer forming side of the carrier;
A resin layer forming step of obtaining a laminate by forming an insulating resin layer on the conductor pattern forming side of the carrier;
A laminating step of laminating the wiring board and the laminated board while facing the insulating resin layer side of the laminated board on a separate wiring board;
A curing step of curing the insulating resin layer while pressing the wiring board and the laminate in the thickness direction;
Removing the carrier and the metal layer from the surface of the insulating resin layer,
And the thickness of the said carrier is 20-100 micrometers,
The metal layer is removed by etching, and the entire surface of the insulating resin layer on the conductor pattern forming side is a roughened surface formed by transferring the roughened surface of the metal layer, and the roughened surface is exposed to the surface. A method for producing a printed wiring board, comprising:

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