WO2004058896A1 - シリコーン樹脂組成物 - Google Patents
シリコーン樹脂組成物 Download PDFInfo
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- WO2004058896A1 WO2004058896A1 PCT/JP2003/016751 JP0316751W WO2004058896A1 WO 2004058896 A1 WO2004058896 A1 WO 2004058896A1 JP 0316751 W JP0316751 W JP 0316751W WO 2004058896 A1 WO2004058896 A1 WO 2004058896A1
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- 229920002050 silicone resin Polymers 0.000 title claims abstract description 35
- 239000011342 resin composition Substances 0.000 title claims abstract description 32
- -1 polysiloxane Polymers 0.000 claims abstract description 70
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 34
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 12
- 239000004615 ingredient Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 50
- 238000001723 curing Methods 0.000 claims description 31
- 150000001875 compounds Chemical class 0.000 claims description 30
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 28
- 229910052731 fluorine Inorganic materials 0.000 claims description 13
- 239000011737 fluorine Substances 0.000 claims description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 125000001153 fluoro group Chemical group F* 0.000 claims description 12
- 229910000077 silane Inorganic materials 0.000 claims description 12
- 125000003277 amino group Chemical group 0.000 claims description 9
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 9
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 5
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 125000004429 atom Chemical group 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 150000001298 alcohols Chemical class 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 150000001735 carboxylic acids Chemical class 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 150000002923 oximes Chemical class 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 9
- 239000004971 Cross linker Substances 0.000 claims 1
- 238000013008 moisture curing Methods 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 abstract description 10
- 239000004945 silicone rubber Substances 0.000 abstract description 8
- 239000000126 substance Substances 0.000 abstract description 5
- 238000013329 compounding Methods 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 229920001971 elastomer Polymers 0.000 description 10
- 239000005060 rubber Substances 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000003921 oil Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 7
- 229910000019 calcium carbonate Inorganic materials 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 7
- 150000002430 hydrocarbons Chemical group 0.000 description 7
- 238000007654 immersion Methods 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000006229 carbon black Substances 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910021485 fumed silica Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010705 motor oil Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- 239000005909 Kieselgur Substances 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 2
- 229910003849 O-Si Inorganic materials 0.000 description 2
- 229910003872 O—Si Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 238000013006 addition curing Methods 0.000 description 2
- KCZFLPPCFOHPNI-UHFFFAOYSA-N alumane;iron Chemical compound [AlH3].[Fe] KCZFLPPCFOHPNI-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000006114 decarboxylation reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethanethiol Chemical compound CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical group C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 150000003609 titanium compounds Chemical class 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- MULRSDSYPPIODM-UHFFFAOYSA-N 1-[ethylamino(dimethyl)silyl]ethanone Chemical compound CCN[Si](C)(C)C(C)=O MULRSDSYPPIODM-UHFFFAOYSA-N 0.000 description 1
- UAKNKICTJIWFAS-UHFFFAOYSA-N 1-ethyl-1-sulfanylidene-2,3-dihydro-1$l^{5}-phosphole Chemical compound CCP1(=S)CCC=C1 UAKNKICTJIWFAS-UHFFFAOYSA-N 0.000 description 1
- BDQNKCYCTYYMAA-UHFFFAOYSA-N 1-isocyanatonaphthalene Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1 BDQNKCYCTYYMAA-UHFFFAOYSA-N 0.000 description 1
- HKQYAHHRYZOXLI-UHFFFAOYSA-N 1-phenyl-1-trimethylsilylurea Chemical compound C[Si](C)(C)N(C(N)=O)C1=CC=CC=C1 HKQYAHHRYZOXLI-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- WGGNJZRNHUJNEM-UHFFFAOYSA-N 2,2,4,4,6,6-hexamethyl-1,3,5,2,4,6-triazatrisilinane Chemical compound C[Si]1(C)N[Si](C)(C)N[Si](C)(C)N1 WGGNJZRNHUJNEM-UHFFFAOYSA-N 0.000 description 1
- KNHJIEOCVVIBIV-UHFFFAOYSA-N 2,3-dimethylphenyl isocyanate Chemical compound CC1=CC=CC(N=C=O)=C1C KNHJIEOCVVIBIV-UHFFFAOYSA-N 0.000 description 1
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LFSAPCRASZRSKS-UHFFFAOYSA-N 2-methylcyclohexan-1-one Chemical compound CC1CCCCC1=O LFSAPCRASZRSKS-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- YMKWWHFRGALXLE-UHFFFAOYSA-N 4-methyl-1-phenyl-2,3-dihydro-1$l^{5}-phosphole 1-oxide Chemical compound C1CC(C)=CP1(=O)C1=CC=CC=C1 YMKWWHFRGALXLE-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- STUPVELWKGXMQS-UHFFFAOYSA-N CC1=CP(=O)CC1 Chemical compound CC1=CP(=O)CC1 STUPVELWKGXMQS-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- UQBRAHLFLCMLBA-UHFFFAOYSA-N N=C=O.N=C=O.CC1=CC=CC(C)=C1 Chemical compound N=C=O.N=C=O.CC1=CC=CC(C)=C1 UQBRAHLFLCMLBA-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- GJWAPAVRQYYSTK-UHFFFAOYSA-N [(dimethyl-$l^{3}-silanyl)amino]-dimethylsilicon Chemical compound C[Si](C)N[Si](C)C GJWAPAVRQYYSTK-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- SXSNZRHGAMVNJE-UHFFFAOYSA-N chloro-[[[chloromethyl(dimethyl)silyl]amino]-dimethylsilyl]methane Chemical compound ClC[Si](C)(C)N[Si](C)(C)CCl SXSNZRHGAMVNJE-UHFFFAOYSA-N 0.000 description 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- XXKOQQBKBHUATC-UHFFFAOYSA-N cyclohexylmethylcyclohexane Chemical compound C1CCCCC1CC1CCCCC1 XXKOQQBKBHUATC-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- AOJHDNSYXUZCCE-UHFFFAOYSA-N dimethylsilyloxy(trimethyl)silane Chemical compound C[SiH](C)O[Si](C)(C)C AOJHDNSYXUZCCE-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- HAMGRBXTJNITHG-UHFFFAOYSA-N methyl isocyanate Chemical compound CN=C=O HAMGRBXTJNITHG-UHFFFAOYSA-N 0.000 description 1
- ZWXYOPPJTRVTST-UHFFFAOYSA-N methyl-tris(prop-1-en-2-yloxy)silane Chemical compound CC(=C)O[Si](C)(OC(C)=C)OC(C)=C ZWXYOPPJTRVTST-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- LPMDNOPQLGRDMA-UHFFFAOYSA-N n'-butylmethanediimine Chemical compound CCCCN=C=N LPMDNOPQLGRDMA-UHFFFAOYSA-N 0.000 description 1
- OIQFOVMTLWDQIZ-UHFFFAOYSA-N n'-naphthalen-1-ylmethanediimine Chemical compound C1=CC=C2C(N=C=N)=CC=CC2=C1 OIQFOVMTLWDQIZ-UHFFFAOYSA-N 0.000 description 1
- HDNXAGOHLKHJOA-UHFFFAOYSA-N n-[bis(cyclohexylamino)-methylsilyl]cyclohexanamine Chemical compound C1CCCCC1N[Si](NC1CCCCC1)(C)NC1CCCCC1 HDNXAGOHLKHJOA-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- HNHVTXYLRVGMHD-UHFFFAOYSA-N n-butyl isocyanate Chemical compound CCCCN=C=O HNHVTXYLRVGMHD-UHFFFAOYSA-N 0.000 description 1
- LWFWUJCJKPUZLV-UHFFFAOYSA-N n-trimethylsilylacetamide Chemical compound CC(=O)N[Si](C)(C)C LWFWUJCJKPUZLV-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 1
- SDKTUKJXHDZWMB-UHFFFAOYSA-N phosphoric acid zirconium Chemical class [Zr].P(O)(O)(O)=O SDKTUKJXHDZWMB-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
Definitions
- the present invention relates to a silicone resin composition and a cured product thereof, and more particularly to a cured product having a high elongation and excellent heat resistance, oil resistance, water resistance and chemical resistance in the field of, for example, an automobile. It is intended to provide a silicone resin composition and a cured product thereof.
- the present invention provides a silicone resin composition that gives a silicone cured rubber having high elongation, heat resistance, oil resistance, and chemical resistance, which are characteristics particularly required for automotive applications.
- the purpose is to provide things.
- the component (b) 0.1 to 200 parts by weight of the component (b): the carbodiimide compound, and 100 parts by weight of the component (c) ):
- This relates to a silicone resin composition mixed with an organic silicon crosslinking agent.
- the component (b) 0.1 to 200 parts by weight of the component (b): the carbodiimide compound, and 100 parts by weight of the component (a): the OH group-containing polysiloxane.
- d): relates to a silicone resin composition mixed with an amino group-containing silane compound.
- the present invention is a composition in which at least one of the component (C) and the component (d) is mixed with the component (a) and the component (b) as described above.
- a reaction may occur when each component is mixed and between mixing and before use. .
- any state is meant as long as each component is "mixed”.
- all the components may be divided into at least two parts and used as a composition set.In such a case, the mixture is also referred to as a mixture when the compound exists as it is, It may be in any state when those reactions have progressed.
- the (H) -containing polysiloxane of component (a) is a polysiloxane having two or more OH groups.
- Xane is preferably a liquid in order to be mixed with other components.
- a preferred OH group-containing polysiloxane has the general formula (I):
- RR 2 and R 3 in independently of one another H, showed an OH group or a fluorine good monovalent substituted hydrocarbon group, where, R 1 Contact And R 2 may be different groups on different Si atoms, and R 4 represents H or a monovalent hydrocarbon group optionally substituted with fluorine.
- R 4 is a monovalent hydrocarbon group which may be substituted by fluorine
- at least one of all R 1 and R 2 and R 3 is an OH group.
- n is selected so that the viscosity at 25 ° C. becomes a desired viscosity, and is usually selected so as to be 10 to 100, 000, OOOcp.
- Examples of the monovalent hydrocarbon group which may be substituted with fluorine which R 1 to R 4 may take include a linear or cyclic aliphatic hydrocarbon group having up to 20 carbon atoms, an aryl group, and these Examples include groups in which at least one hydrogen is replaced with fluorine.
- OH group-containing polysiloxane is a ⁇ H group-terminated polysiloxane in which R 3 is a ⁇ H group and R 4 is H and both terminals are OH groups, wherein R 1 and R 2 Is preferably H or a monovalent hydrocarbon group optionally substituted by fluorine.
- R 1 and R 2 are methyl groups, or one is a methyl group and the other is a phenyl group or H are preferred.
- R 1 and R 2 are both methyl groups.
- OH group-containing polysiloxane may be used alone or as a mixture of two or more.
- the viscosity (or n in the formula (I)) of the OH group-containing polysiloxane used in the present invention is not particularly limited as long as it is a liquid within a range in which other components can be mixed, and is usually 10 cp to: 10,000,000,000 cp. And particularly preferably in the range of 100 to 1,000,000, more preferably in the range of 1,000 to 100,000.
- n is selected to have such a viscosity.
- the carbodiimide compound is a known compound, and a compound synthesized by a generally well-known method can be used. For example, it can be synthesized by using an organophosphorus compound or an organometallic compound as a catalyst and subjecting various isocyanate compounds to a decarboxylation condensation reaction in a solvent-free or inert solvent.
- aromatic diisocyanate, aliphatic diisocyanate, alicyclic diisocyanate and a mixture thereof can be used as the organic diisocyanate as a raw material for synthesizing the polycarboimide compound.
- the polycarboimide obtained by such a reaction has an isocyanate group at a terminal, and in the present invention, even such a polyisocyanate group containing a terminal isocyanate group has a modified terminal isocyanate group. Either polycarboimide can be used.
- a compound in which the terminal isocyanate is modified by reacting a monoisocyanate compound with the terminal of a polycarboimide synthesized from diisocyanate can be used.
- a monolithic material for sealing the terminal of polycarboimide is used.
- the socyanate include phenyl isocyanate, tolyl isocyanate, dimethyl phenyl isocyanate, cyclohexyl isocyanate, butyl isocyanate, naphthyl isocyanate, and methyl isocyanate.
- the decarboxylation condensation reaction of the organic dissociate proceeds in the presence of a carpoimidization catalyst.
- a carpoimidization catalyst examples include, for example, triphenyl-2-phospholene-1-oxoxide and 3-methyl-1-oxide.
- Hydrocarbon solvents such as tetrahydrofuran, dioxane, diethylene glycol dimethyl ether; ketone solvents such as 2-methylcyclohexanone, cyclohexanone, cyclohepnone, 2,4-dimethyl-3-heptanone Aromatic hydrocarbon solvents such as benzene, toluene and ethylbenzene; and acetate solvents such as 2-methoxyethyl acetate and diethylene glycol monomethyl ether acetate.
- ether solvents such as tetrahydrofuran, dioxane, diethylene glycol dimethyl ether
- ketone solvents such as 2-methylcyclohexanone, cyclohexanone, cyclohepnone, 2,4-dimethyl-3-heptanone
- Aromatic hydrocarbon solvents such as benzene, toluene and ethylbenzene
- acetate solvents such as 2-methoxye
- polycarboimide examples include V-O2, V_O4, V-O6, E-O1, E-O2 available from Nisshinbo Co., Ltd. under the trade name of "Carpolite”. And oil-based types such as V-01, V-03, V-05, V07, V09 and the like.
- V-01, V-03, V-05, V07, V09 and the like oil-based types such as V-01, V-03, V-05, V07, V09 and the like.
- the structure of the main chain, the structure of the terminal group, the ratio of the carbodiimide group contained in one molecule, the dilution ratio, and the like are different, and can be appropriately selected and used.
- carbodiimide compound one kind may be used alone, or two or more kinds may be used in combination.
- Component (b) The amount of the carbodiimide compound to be used, even if it is used in a very small amount, will improve the physical properties of the cured resin, the engine oil resistance, and the long life coolant resistance, but the effect will be substantially clear
- the amount is preferably at least 0.1 part by weight based on 100 parts by weight of the component (a): OH group-containing polysiloxane. More preferably, the amount is 1 part by weight or more.
- the component (b) can be used in a large amount as long as it is compatible with the component (a), but usually not more than 200 parts by weight per 100 parts by weight of the component (a). Is preferably 100 parts by weight or less, more preferably 50 parts by weight or less. Therefore, as a usual use range, the component (a) is used in an amount of 100 to 200 parts by weight with respect to 100 parts by weight of the component (a).
- an organic silicon cross-linking agent those known as curing agents for condensed one-part liquid silicone rubber are suitably used. These curing agents are used for one-pack silicone rubber and cure and condense with moisture to remove carboxylic acids, alcohols, oximes, amines, amides, aminoxys, ketones, hydrogen molecules or water. Compounds that release.
- X 1 is each independently H, ⁇ H, alkoxy, oxymo, alkenoxy, amino, amido, aminoxy or acyloxy.
- X 2 is each independently a hydrocarbon group having up to about 20 carbon atoms, for example, Ci Cz. Alkyl group, C 2 ⁇ C 2. It is an alkenyl group, an aryl group having up to 20 carbon atoms or a fluoroalkyl group.
- a is 0, 1 or 2, preferably 0 or 1.
- X 1 is preferably a hydrolyzable group, an alkoxy group, an oxymo group, an alkenoxy group
- R is an alkyl group) and a dialkylaminooxy group (such as a dimethylaminooxy group).
- X 2 is preferably ( ⁇ ⁇ (: 8 alkyl, C 2 -C S alkenyl, Hue group, more preferably a methyl group, Echiru group, a vinyl group.
- a cyclic aminoxysiloxane in which an aminoxy group is bonded to Si of the cyclic siloxane is also mentioned.
- each R may be the same or different and is an alkyl group such as methyl or ethyl, or an aryl group; (1 is about 3 to 10; p is 0 ⁇ p ⁇ Q —2, preferably 0 ⁇ p ⁇ Q—3.]
- each R is the same or different and is an alkyl group such as methyl or ethyl, or an aryl group;
- Q is about 3 to 10; and
- p is 0 ⁇ p ⁇ q — 1, preferably 0 ⁇ p ⁇ q—2.
- Q is typically 4, where p is 0, 1 or 2. These can be used in mixtures.
- R bonded to the Si atom and R bonded to the N may be the same or different from each other, and are preferably a methyl group, an ethyl group or a phenyl group, and more preferably Is at least R bonded to Si is a methyl group.
- organic silicon crosslinking agents examples include methyltriacetoxysilane, vinyltriacetoxysilane, methyltrialkoxysilane (e.g., methyltrimethoxysilane), vinyltrialkoxysilane (e.g., vinyltrimethoxysilane), methyltri (methylethylketoximo).
- Silane biertri (methylethylketoximo) silane, tetra (methylethylketoximo) silane, methyltri (cyclohexylamino) silane, methyltri (isopropenoxy) silane, vinyltri (isoprobenoxy) silane, dimethyl
- amidosilane eg, methylcarbonyl N-ethylaminodimethylsilane
- methylvinyldiamidesilane eg, methylcarbodilu-N-ethylaminomethylvinylsilane.
- Component (c) may be a single compound or a mixture of two or more types.
- the amount of component (c) used should be such that cross-linking curing (particularly curing by moisture) occurs. It may be used. However, if the amount is too small, curing may be insufficient, and even if the curing is performed, the storage stability is poor.If the amount is too large, the effect of delaying the curing is remarkable, which may cause a problem in use. . Accordingly, the amount is usually from 0.01 to 50 parts by weight, preferably from 0.1 to 20 parts by weight, based on 100 parts by weight of the component (a).
- the silicone resin composition in the first embodiment is a mixture of the component (a), the component (b) and the component (c).
- the mixing causes a reaction between the components, and Part or all of each of (a) to (c) may be changed.
- the OH group-containing polysiloxane of the component (a) reacts with the organic silicon cross-linking agent of the component (c), and the organic silicon cross-linking agent is bonded to the siloxane end. Even if they do not react, they may be partially reacted or all reacted.
- reaction of the carbodiimide compound is not always clear, and both cases in which the reaction occurs and those in which the reaction does not occur are included in the scope of the present invention.
- the silicone resin composition of the first embodiment is preferably cured by moisture to give a rubber-like cured product.
- the silicone resin composition may contain, for example, a curing catalyst, a filler, an adhesion improving agent, and the like, if necessary, and these can be mixed using an ordinary kneader.
- a curing catalyst for example, a filler, an adhesion improving agent, and the like, if necessary, and these can be mixed using an ordinary kneader.
- the curing proceeds due to the moisture in the air, so it is necessary to replace with nitrogen in the kneader, and when storing the silicone resin composition in a container, it is necessary to store it in a closed container.
- the curing conditions are the same as those for ordinary condensation type one-part silicone resin compositions, and are, for example, temperatures of 100 ° C. or lower, preferably 80 ° C. or lower, more preferably 60 ° C. or lower. Humidity below 10 ° C, for example in the range above 10 ° C, preferably above 0 ° C
- the curing may be performed for 0.1 to 240 hours under the curing conditions of% to 100%. Usually, it may be performed in a normal atmosphere at room temperature or ambient temperature.
- known fillers such as fumed silica, surface-treated fumed silica, precipitated silica, diatomaceous earth, quartz powder, calcium carbonate, calcium carbonate,
- known fillers such as fumed silica, surface-treated fumed silica, precipitated silica, diatomaceous earth, quartz powder, calcium carbonate, calcium carbonate,
- magnesium oxide, titanium oxide, iron oxide, silicates (or composite oxides) such as iron or aluminum, silane coupling agents as adhesion promoters, and organotin compounds as curing accelerators organic A titanium compound and an amine compound may be blended.
- the component (d) described below may be mixed with the silicone resin composition of the first embodiment, but most of the component (d) often functions as a silane coupling agent when moisture is cured.
- component (d) an amino group-containing silane compound in addition to component (a) and component (b).
- silazane compound examples include linear silazanes and cyclic silazanes. Can be.
- linear silazane compound for example, a compound represented by the general formula
- R is H or an alkyl group, etc., r is 0 or 1 or more, for example an integer up to about 10)
- R is H or a methyl group
- r is 0 or 2.
- R is H or an alkyl group, and r is 3 or more, for example, an integer up to about 10).
- R is H or a methyl group, and r is 4 in a typical example.
- amino group-containing silane compounds that can also be used as component (d) include, for example, 3- [N-aryl-1-N (2-aminoethyl)] aminopropyltrimethoxysilane, P- [N- (aminoethyl) amino Methyl] phenethyltrimethoxysilane, N— (2-aminoethyl) -13-aminopropylmethyldimethoxysilane, N— (2-aminoethyl) -13-aminopropylmethyldimethoxysilane, N—
- 1,3_bis (chloromethyl) 1,1,3,3-tetramethyldisilazane ⁇ , ⁇ -bis [(methyldimethoxysilyl) propyl] amine, ⁇ , ⁇ -bis [3- (methyldimethoxysilyl) Propyl] ethylenediamine, ⁇ , ⁇ -bis [3- (trimethoxysilyl) propyl] amine, ⁇ , ⁇ -bis [3- (trimethoxysilyl) propyl] ethylenediamine, hexamethylcyclotrisilazane, hexamethyldisilazane Octamethylcyclotetrasilazane, tetramethyldisilazane, ⁇ — [(3-trimethoxysilyl) propyl] diethylenetriamine, ⁇ — [(3-trimethoxysilyl) propyl] triethylenetetramine, ⁇ —3— Trimethoxysilylpropyl 1
- the amount of component (d) used may be such that the composition containing components (a), (b) and (d) is cured by heating, but too little may result in insufficient curing. Therefore, the amount is usually 0.01 part by weight or more, preferably 0.1 part by weight or more based on 100 parts by weight of the component (a). On the other hand, if the amount is too large, the physical properties of the obtained cured product may be remarkably deteriorated. Accordingly, the amount is usually, for example, 0.01 to 100 parts by weight, preferably 0.1 to 50 parts by weight, per 100 parts by weight of the component (a).
- the silicone resin composition in the second embodiment is a mixture of the component (a), the component (b) and the component (d).
- the mixing causes a reaction between the components, and Part or all of each of (a), (b) and (d) may be changed.
- the component (d) is a silane coupling agent type
- the alkoxy group portion may react with the OH group-containing polysiloxane of the component (a). It may be either partially reacted, all reacted, or any.
- reaction of the carbodiimide compound is not always clear, and both cases in which the reaction occurs and those in which the reaction does not occur are included in the scope of the present invention.
- the silicone resin composition of the second embodiment is cured by heating to give a rubber-like cured product.
- the silicone resin composition may contain a curing catalyst, a filler, an adhesion improver, and the like, if necessary, and these can be mixed using a usual kneader.
- the curing conditions are usually 20 ° C or higher, preferably 40 ° C or higher, for example, 50 ° C or higher, usually 250 ° C or lower, preferably 200 ° C or lower, for 0.1 hour to 24 hours. What is necessary is just to apply and harden.
- a known filler such as fumed silica may be used, if necessary, to improve the physical properties of the silicone cured composition.
- silane coupling agent as an enhancer and an organotin compound, an organic titanium compound, or an amine compound may be added as a curing accelerator.
- the components (a), (b), (d) and the materials to be added as needed may be mixed before use, and may be stored as a mixed one-component type and distributed. It may be divided into two or more packs and stored as a two-pack or three-pack type. In particular, when the curing speed is fast, it is preferable to divide and store and distribute as a two-part type (or more than two parts). The division may be performed according to the purpose. For example, a two-pack type is divided into a pack containing the component (a) and the component (b) and a pack containing the component (a) and the component (d). be able to. At the time of use, it may be kneaded with a static mixer, a dynamic mixer, or the like, if necessary, and cured under the above-described curing conditions.
- Example 1 Example 1
- the test method was based on J IS K6258, and Mobil Oil Mobi 11 Turb 5W-50 SJ / CF (1000CC) was put in a glass container, and obtained in each Example and Comparative Example. Three dumbbell-shaped silicone cured products were placed in each case.
- the test method is based on J IS K6258, and 1000 cc of Mitsubishi Motors Co., Ltd. Jacques Super Long Life is put in a glass container. Each of the three dumbbell-shaped No. 3 pieces obtained was inserted.
- component (a) 20000 cp of OH-terminated polydimethylsiloxane and 6000 cp of OH-terminated polydimethylsiloxane (weight ratio 70:30)
- Cab—O—Si TS530, calcium carbonate, carbon black, and iron'aluminum silicate were charged in the amounts shown in Table 1 and kneaded for 1 hour. Thereafter, the mixture was heated to 120 ° C and kneaded for another hour.
- component (c) After cooling, it is filled with nitrogen, and tetra (methylethylketoximo) silane and vinyltri (methylethylketoximo) silane are used as component (c), and polycarboimide Carbod ilite V manufactured by Nisshinbo Co., Ltd. is used as component (b).
- component (b) polycarboimide Carbod ilite V manufactured by Nisshinbo Co., Ltd.
- the silicone rubber composition was charged into a Teflon-coated mold having a capacity of 15 cm ⁇ 15 cm ⁇ 0.2 cm, a release paper was placed thereon, and a flat mold was further placed thereon. At a pressure of 100 kgf / cm 2 for 1 hour. After removal, the flat mold was removed, and the silicone resin composition was cured in a constant temperature and humidity chamber at a temperature of 25 ° C and a humidity of 65% to obtain a cured rubber.
- the component (b) was a polycarboimide Carbo di 1ite V_04B manufactured by Nisshinbo Industries, Ltd., and the component (d) was 3-aminopropyltriethoxysilane or N, N-bis [(methyldimethoxysilyl).
- Propyl] amine was further charged in the amount shown in Table 5 and kneaded at 25 ° C for 1 hour to obtain a silicone rubber composition.
- a 15 cm ⁇ 15 cm ⁇ 0.2 cm mold coated with the silicone rubber composition in Teflon. 55 g is charged into a mold having a tee, and a flat mold is further placed thereon, and pressed with a press at 80 ° C. at a pressure of 100 kgf / cm 2 for 1 hour to harden the silicone resin composition.
- the cured rubber was obtained.
- a silicone resin set was prepared in the same manner as in Examples 4 to 7, except that the composition was changed to the composition shown in Table 7.
- the silicone resin composition containing the carbodiimide compound of the present invention has excellent elongation, heat resistance, oil resistance, and chemical resistance, which are characteristics particularly required for automotive applications, and anti-aging properties. It is possible to provide a silicone resin composition which gives a silicone cured rubber excellent in excellentness.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03768240A EP1584660A4 (en) | 2002-12-26 | 2003-12-25 | Silicone resin COMPOSITION |
AU2003292811A AU2003292811A1 (en) | 2002-12-26 | 2003-12-25 | Silicone resin composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2002377219A JP2004204146A (ja) | 2002-12-26 | 2002-12-26 | シリコーン樹脂組成物 |
JP2002-377219 | 2002-12-26 |
Publications (1)
Publication Number | Publication Date |
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WO2004058896A1 true WO2004058896A1 (ja) | 2004-07-15 |
Family
ID=32652720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2003/016751 WO2004058896A1 (ja) | 2002-12-26 | 2003-12-25 | シリコーン樹脂組成物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6972314B2 (ja) |
EP (1) | EP1584660A4 (ja) |
JP (1) | JP2004204146A (ja) |
AU (1) | AU2003292811A1 (ja) |
WO (1) | WO2004058896A1 (ja) |
Cited By (1)
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WO2021261147A1 (ja) * | 2020-06-26 | 2021-12-30 | デクセリアルズ株式会社 | 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート |
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JP5068451B2 (ja) * | 2005-11-24 | 2012-11-07 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 室温硬化性ポリオルガノシロキサン組成物 |
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US20100038859A1 (en) * | 2008-08-13 | 2010-02-18 | Temic Automotive Of North America, Inc. | Method of preparing amine-cured silicone compositions resistant to hydrocarbon fluid and uses thereof |
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WO2013071078A1 (en) | 2011-11-10 | 2013-05-16 | Momentive Performance Materials, Inc. | Moisture curable organopolysiloxane composition |
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EP2791198A4 (en) | 2011-12-15 | 2015-06-17 | Momentive Performance Mat Inc | HUMIDITY-CURABLE ORGANOPOLYSILOXANE COMPOSITIONS |
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EP2994501A2 (en) | 2013-05-10 | 2016-03-16 | Momentive Performance Materials Inc. | Non-metal catalyzed room temperature moisture curable organopolysiloxane compositions |
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CN110358299B (zh) * | 2019-07-15 | 2021-04-02 | 浙江新安化工集团股份有限公司 | 一种杂化改性硅橡胶及其制备方法和应用 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2973334A (en) * | 1956-10-17 | 1961-02-28 | Ici Ltd | Composition comprising an organopolysiloxane resin and a carbodimide |
JPS5291100A (en) * | 1976-01-23 | 1977-08-01 | Bayer Ag | Polysiloxaneepolycarbodiimido copolymer |
JPS5417961A (en) * | 1977-07-07 | 1979-02-09 | Bayer Ag | Organopolysiloxane improved with polycarbodiimide |
JPS5562961A (en) * | 1978-11-02 | 1980-05-12 | Bayer Ag | Organic polysiloxane contained composition |
JPS5562962A (en) * | 1978-11-02 | 1980-05-12 | Bayer Ag | Organopolysiloxane elastomer containing polycarbodiimideepolysiloxane copolymer |
JPH0476058A (ja) * | 1990-07-18 | 1992-03-10 | Toshiba Silicone Co Ltd | 室温硬化性シリコーンシール剤組成物 |
JPH107806A (ja) * | 1996-06-25 | 1998-01-13 | Japan Synthetic Rubber Co Ltd | 熱硬化性樹脂組成物 |
US5741839A (en) * | 1995-05-02 | 1998-04-21 | Huels Silicone Gmbh | Storage-stable alkoxy-crosslinking RTV1 systems |
JPH1121443A (ja) * | 1997-06-30 | 1999-01-26 | Tonen Corp | オルガノポリシロキサン系流体組成物 |
JP2002053759A (ja) * | 2000-06-05 | 2002-02-19 | Rohm & Haas Co | 耐摩耗性コーティング組成物およびコーティングの製造法 |
JP2002226708A (ja) * | 2001-01-30 | 2002-08-14 | Three Bond Co Ltd | 自動車用室温硬化性シール材組成物 |
JP2003174025A (ja) * | 2001-12-07 | 2003-06-20 | Hitachi Chem Co Ltd | シリカ系被膜、シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2941956A (en) * | 1956-08-15 | 1960-06-21 | Socony Mobil Oil Co Inc | Regeneration of contact material |
US3334067A (en) * | 1966-04-08 | 1967-08-01 | Dow Corning | Method of making one component room temperature curing siloxane rubbers |
US3689454A (en) * | 1971-01-06 | 1972-09-05 | Gen Electric | Curable compositions |
-
2002
- 2002-12-26 JP JP2002377219A patent/JP2004204146A/ja active Pending
-
2003
- 2003-09-08 US US10/656,119 patent/US6972314B2/en not_active Expired - Lifetime
- 2003-12-25 WO PCT/JP2003/016751 patent/WO2004058896A1/ja active Application Filing
- 2003-12-25 AU AU2003292811A patent/AU2003292811A1/en not_active Abandoned
- 2003-12-25 EP EP03768240A patent/EP1584660A4/en not_active Withdrawn
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2973334A (en) * | 1956-10-17 | 1961-02-28 | Ici Ltd | Composition comprising an organopolysiloxane resin and a carbodimide |
JPS5291100A (en) * | 1976-01-23 | 1977-08-01 | Bayer Ag | Polysiloxaneepolycarbodiimido copolymer |
JPS5417961A (en) * | 1977-07-07 | 1979-02-09 | Bayer Ag | Organopolysiloxane improved with polycarbodiimide |
JPS5562961A (en) * | 1978-11-02 | 1980-05-12 | Bayer Ag | Organic polysiloxane contained composition |
JPS5562962A (en) * | 1978-11-02 | 1980-05-12 | Bayer Ag | Organopolysiloxane elastomer containing polycarbodiimideepolysiloxane copolymer |
JPH0476058A (ja) * | 1990-07-18 | 1992-03-10 | Toshiba Silicone Co Ltd | 室温硬化性シリコーンシール剤組成物 |
US5741839A (en) * | 1995-05-02 | 1998-04-21 | Huels Silicone Gmbh | Storage-stable alkoxy-crosslinking RTV1 systems |
JPH107806A (ja) * | 1996-06-25 | 1998-01-13 | Japan Synthetic Rubber Co Ltd | 熱硬化性樹脂組成物 |
JPH1121443A (ja) * | 1997-06-30 | 1999-01-26 | Tonen Corp | オルガノポリシロキサン系流体組成物 |
JP2002053759A (ja) * | 2000-06-05 | 2002-02-19 | Rohm & Haas Co | 耐摩耗性コーティング組成物およびコーティングの製造法 |
JP2002226708A (ja) * | 2001-01-30 | 2002-08-14 | Three Bond Co Ltd | 自動車用室温硬化性シール材組成物 |
JP2003174025A (ja) * | 2001-12-07 | 2003-06-20 | Hitachi Chem Co Ltd | シリカ系被膜、シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1584660A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021261147A1 (ja) * | 2020-06-26 | 2021-12-30 | デクセリアルズ株式会社 | 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート |
JP6997834B1 (ja) | 2020-06-26 | 2022-01-24 | デクセリアルズ株式会社 | 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート |
JP2022024210A (ja) * | 2020-06-26 | 2022-02-09 | デクセリアルズ株式会社 | 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート |
US11692118B2 (en) | 2020-06-26 | 2023-07-04 | Dexerials Corporation | Thermally conductive resin composition and thermally conductive sheet using the same |
Also Published As
Publication number | Publication date |
---|---|
EP1584660A4 (en) | 2006-03-29 |
EP1584660A1 (en) | 2005-10-12 |
JP2004204146A (ja) | 2004-07-22 |
AU2003292811A1 (en) | 2004-07-22 |
US20040127669A1 (en) | 2004-07-01 |
US6972314B2 (en) | 2005-12-06 |
AU2003292811A8 (en) | 2004-07-22 |
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