WO2004046233A1 - Composition d'elastomere silicone thermoconductrice - Google Patents

Composition d'elastomere silicone thermoconductrice Download PDF

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Publication number
WO2004046233A1
WO2004046233A1 PCT/JP2003/011457 JP0311457W WO2004046233A1 WO 2004046233 A1 WO2004046233 A1 WO 2004046233A1 JP 0311457 W JP0311457 W JP 0311457W WO 2004046233 A1 WO2004046233 A1 WO 2004046233A1
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groups
terminals
molecular chain
blocked
formula
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PCT/JP2003/011457
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Hiroki Ishikawa
Kazumi Nakayoshi
Ryoto Shima
Katsutoshi Mine
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Dow Corning Toray Silicone Co., Ltd.
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Priority to AU2003260954A priority Critical patent/AU2003260954A1/en
Publication of WO2004046233A1 publication Critical patent/WO2004046233A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Definitions

  • This invention relates to a thermally-conductive silicone elastomer composition. More particularly, this invention relates to a thermally-conductive silicone elastomer composition, which is characterized by a reduced tendency to the loss of curability during storage and which, when cured, forms a silicone elastomer of high thermal conductivity.
  • Thermally-conductive silicone rubber compositions that, when cured, form thermally-conductive silicone rubbers are known in the art.
  • Japanese Laid- Open Patent Application Publications (Kokai) H3-170581 and (Kokai) H7-133432 disclose silicone rubber compositions that contain an organopolysiloxane with at least two alkenyl groups in one molecule, an organopolysiloxane with at least two silicon-bonded hydrogen atoms, a fine silver powder, and a platinum catalyst.
  • these silicone rubber compositions are stored over a long period of time, their curability is worsened and finally is impaired to such a level that the composition becomes unsuitable for use.
  • thermoly conductive silicone elastomer composition comprising:
  • Component (A) comprises an organopolysiloxane with at least two alkenyl groups per molecule.
  • the alkenyl groups of component (A) may include vinyl groups, allyl groups, butenyl groups, pentenyl groups, hexenyl groups and heptenyl groups. Of these, vinyl groups and hexenyl groups are preferred.
  • the bonding positions of the alkenyl groups in component (A) include, for example, the terminals of the molecular chain or side chains of the molecular chain, or both.
  • Organic groups that are bonded with the silicon atoms in addition to the alkenyl groups in component (A) include, for example, substituted or unsubstituted monovalent hydrocarbon groups (other than alkenyl groups) such as alkyl groups, e.g., methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups and heptyl groups; aryl groups, e.g., phenyl groups, tolyl groups, and xylyl groups; aralkyl groups, e.g., benzyl groups and phenethyl groups; 3-chloropropyl groups and 3,3,3-trifluoropropyl groups, or similar halogenated alkyl groups.
  • substituted or unsubstituted monovalent hydrocarbon groups such as alkyl groups, e.g., methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups,
  • the methyl groups and phenyl groups are preferred.
  • the molecular structure of component (A) can be, for example, in a straight-chain form, a straight-chain form having some branches, and in a net-like form.
  • the organopolysiloxane of component (A) may have a mixture of two or more of the abovementioned structures.
  • a viscosity, at 25 °C, of 50 to 500,000 mPa-s is preferred, with 100 to 50,000 mPa-s being particularly preferred.
  • the organopolysiloxane, component (A) can include, for example, copolymers of methylvinylsiloxane and dimetliylsiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, methylvinylpolysiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, copolymers of methylphenylsiloxane and methylvinylsiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, copolymers of methylphenylsiloxane, methylvinylsiloxane, and dimethylsiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, dimethylpolysiloxane blocked with dimethylvinylsiloxy groups at both terminals of the molecular chain, methylvinylpolysiloxane blocked with dimethylvinylsiloxy groups
  • R 1 designates a substituted or non-substituted monovalent hydrocarbon group, e.g., an alkyl group such as a methyl group, ethyl group, propyl group, butyl group, pentyl group, or a hexyl group; an alkenyl group such as a vinyl group, allyl group, butenyl group, pentenyl group, or hexenyl group; an aryl group such as a phenyl group, tolyl group, or xylyl group; an aralkyl group such as a benzyl group or a phenethyl group; or a halogenated alkyl group such as a 3-chloropropyl group or a 3,3,3- trifluoropropyl group.
  • At least two R 1 ' s per molecule of the alkyl group such as a methyl group, ethyl group, propyl group, butyl group, pent
  • Component (B) is used as a crosslinking agent for curing the composition of the invention.
  • Component (B) comprises an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule.
  • the positions of bonding of the hydrogen atoms to silicon atoms in component (B) can be, for example, the terminals of the molecular chain or side chains of the molecular chain, or both.
  • Component (B) may further comprise silicon-bonded organic groups in addition to the silicon-bonded hydrogen atoms. These silicon bonded organic groups may be the same substituted or non-substituted monovalent hydrocarbons as mentioned earlier, except for alkenyl groups. Methyl groups and phenyl groups are preferred.
  • component (B) may be, for example, in a straight chain form, a straight chain form having some branches, a branched chain form, or a net-like chain form.
  • Component (B) may comprise a mixture of two or more organopolysiloxanes with different molecular structures.
  • a viscosity at 25 °C of 1 to 500,000 mPa-s is desirable, with 5 to 1000 mPa-s being preferred.
  • Component (B) can include, for example, a methylhydrogenpolysiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, copolymers of methylhydrogenpolysiloxane and dimethylsiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, copolymers of methylphenylsiloxane and methylhydrogensiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, copolymers of methylphenylsiloxane, methylhydrogensiloxane, and dimethylsiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, dimethylpolysiloxane blocked with dimethymydrogensiloxy groups at both terminals of the molecular chain, methylhydrogenpolysiloxane blocked with dimethy ydrogensiloxy groups at both terminals of the molecular chain
  • R 2 may comprise hydrogen atoms or a substituted or non-substituted monovalent hydrocarbons, other than alkenyl groups.
  • the monovalent hydrocarbons that represent R 2 may be the same as specified earlier.
  • At least two R 2 's per molecule of the silicone resins should be hydrogen atoms.
  • component (B) be used in the composition of the invention in an amount of 0.3 to 10 moles of the silicon-bonded hydrogen atoms per 1 mole of the alkenyl groups in component (A). If component (B) is used in an amount below the lower recommended limit of the range, the composition will have a tendency to insufficient curing. If component (B) is used in an amount exceeding the recommended upper limit, the obtained silicone elastomer will have reduced heat-resistant properties.
  • Component (C) is a thermally conductive filler that imparts thermoconductive properties to a silicone elastomer obtained by curing the composition.
  • Component (C) can be represented by a fine powder of gold, silver, nickel, copper, etc.; a fine powder of metal, such as gold, silver, nickel, or copper having particles electroplated or coated by vapor deposition with ceramics, glass, quartz, organic resin, or the like; metal compounds such as aluminum oxide, aluminum nitride, zinc oxide, or the like. These fillers can be used in combinations of two or more. For obtaining a silicone elastomer with high thermal conductivity of 3 W/mK or more, it is preferable to use component (C) in the form of a fine silver powder.
  • the powder particles may have a spherical, flake-like, or a branched flake-like form.
  • an average size of particles of component (C) be within the range of 1 to 100 ⁇ m, preferably 1 to 50 ⁇ m.
  • component (C) it is recommended to use component (C) in the composition of the present invention in an amount of 50 to 5,000 parts by weight, preferably 300 to 3,000 parts by weight, for each 100 pats by weight of component (A). If component (C) is used in an amount below the lower recommended limit of the above range, it would be difficult to impart to the obtained silicone elastomer sufficient thermoconductive properties. If the amount of component (C) exceeds the upper recommended limit of the range, it will be difficult to prepare a composition with uniform properties and to handle the obtained composition.
  • Component (D) is a phenol-type or benzotriazole-type compound, or combination thereof, which is used in the composition for controlling changes in curing properties with the lapse of time during storage.
  • the benzotriazole compounds can be represented by 1H- benzotriazole, 4- methyl-lH- benzotriazole, 5-methyl-lH- benzotriazole, 2- (2'-hydroxy-5'-methylphenyl)- benzotriazole, 2- (2'-hydroxy-3',5'-di-tert-butyl-phenyl) benzotriazole, 2- (2'-hydroxy-3'- tert-butyl-5'-methyl-phenyl)- 5-chlorobenzotriazole, 2- (2'-hydroxy-3' 5 5'-di-tert-butyl- phenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-5'-tert-octyl-phenyl) benzotriazole, 2- (2'- hydroxy-3 ⁇ 5'-di-tert-amylphenyl) benzotriazole, 2- [2'-hydroxy-3 '- (3",4",5",6"- tetrahydr
  • component (D) it is recommended to use component (D) in the composition in an amount that in weight units is within the range of 10 to 10,000 ppm relative to the weight of the composition. If this component is used in an amount below the lower recommended limit of the range, it will be difficult to control changes of curing properties of the composition with the lapse of time. If the content of component (D) exceeds the upper recommended limit of the range, curing of the composition will be significantly delayed.
  • Component (E) of the composition of the invention is a platinum-type catalyst used for acceleration of curing.
  • the platinum catalyst of component (E) can be represented by the following compounds: platinum black, platinum on an aluminum powder carrier, platinum on a silica powder carrier, platinum on a carbon powder carrier, a chloroplatinic acid, an alcoholic solution of a chloroplatinic acid, a platinum-olefin complex, and aforementioned platinum-type catalysts in the form of fine powders dispersed in thermoplastic resins such a methacrylate resin, carbonate resin, polystyrene resin, silicone resin, etc.
  • component (E) is an enyne compound or alkyne alcohol, or combination thereof, used for adjusting curing properties and for improving conditions of handling of the composition.
  • the enyne compound can be represented by 3-methyl-3-penten-l-yne and 3,5-din ⁇ ethyl-3-hexen-l-yne.
  • the alkyne alcohol can be represented by 2-methyl-3- butyn-2-ol, 3 -dimethyl- l-hexyn-3-ol, and 2-phenyl-3-butyn-2-ol.
  • component (E) it is recommended to use component (E) in the composition of the invention in an amount that in weight units is within the range of l0 to l0,000 ppm relative to the weight of the composition. If this component is used in an amount below the lower recommended limit of the range, it will be more difficult to adjust the curing properties of the obtained composition and to handle the composition. If the content of component (E) exceeds the upper recommended limit of the range, curing of the composition will be significantly delayed.
  • the composition of the invention is prepared by uniformly mixing aforementioned components (A) through (F).
  • the composition may also be combined with an adhesion promoting agent, such as vinyltrimethoxysilane, vmyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, 3- trimethacryloxypropyltrimethoxysilane, 3-glycidoxypropyl-trimethoxysilane, or a similar alkoxysilane compound; a siloxane oligomer of the following formula:
  • siloxane oligomer of the following formula:
  • siloxane oligomer of the following formula:
  • siloxane oligomer of the following formula:
  • siloxane oligomer of the following formula:
  • a and b are integers equal to or greater than 1, or similar siloxane oligomers having, per molecule, at least one silicon bonded alkoxy group and either a silicon-bonded hydrogen atom or an alkenyl group.
  • the adhesion-imparting agent is used in the composition of the invention as an optional component. When present, it is recommended to add the adhesion-imparting agent in an amount of 20 parts by weight or less, preferably 0.5 to 10 parts by weight for each 100 parts by weight of component (A). Without the use of the adhesion-imparting agent, the obtained silicone elastomer will either have poor adhesive properties or show a tendency of changing contact resistance and spatial conductivity in time. If the adhesion- imparting agent is used in an amount that exceeds the aforementioned upper recommended limit, the silicone elastomer composition will become unstable in storage, while the silicone elastomer obtained after curing will have physical properties varying with the lapse of time.
  • the composition may contain an inorganic filler as another optional component.
  • a filler may be represented by fumed silica, crystalline silica, baked silica, wet-process silica, carbon black, or an inorganic filler surface-treated with an organoalkoxysilane, organochlorosilane, organodisilazane, or a similar organic silicone compound. It is recommended to add the inorganic filler in an amount of not more than 50 parts by weight for each 100 parts by weight of component (A).
  • Curing of the composition turns it into a silicone rubber, silicone gel, or a similar silicone elastomer.
  • the composition is suitable for use as a heat- radiation adhesive agent, heat-radiation die-bonding agent, heat-radiation paste, electromagnetic-wave shield, etc., as well as a starting material for manufacturing heat- radiating sheets and electromagnetic-wave absorbing sheets.
  • thermoconductive silicone elastomer composition was heated for 30 min. at 150 °C and formed into a 1 cm-thick sheet.
  • a coefficient of thermal conductivity of the obtained silicone elastomer sheet was measured by a room-temperature thermal conductivity measuring system (UNITHERM MODEL 2022). Hardness
  • thermoconductive silicone rubber composition was divided into two parts. One part was cured by heating for 30 min. at 150 °C, and the obtained silicone rubber was tested with regard to hardness and thermal conductivity. The remaining part was stored under cold conditions, and one month later was removed from the storage, cured for 30 min. at 150 °C, and the obtained silicone rubber was tested with regard to hardness and thermal conductivity. The results are shown in Table 1.
  • thermoconductive silicone rubber composition was produced by the same method as in Example 1 with the exception that 2,6-di-tert-butyl-4-methylphenol was used instead of IH-benzotriazole.
  • the obtained thermoconductive silicone rubber composition was evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • thermoconductive silicone rubber composition was produced by the same method as in Example 1 with the exception that IH-benzotriazole was not added.
  • the obtained thermoconductive silicone rubber composition was evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • thermoconductive silicone rubber composition was divided into two parts. One part was cured by heating for 30 min. at 150 °C, and the obtained silicone rubber was tested with regard to hardness and thermal conductivity. The remaining part was stored under cold conditions, and one month later was removed from the storage, cured for 30 min. at 150 °C, and the obtained silicone rubber was tested with regard to hardness and thermal conductivity. The results are shown in Table 2.
  • Example 4
  • thermoconductive silicone rubber composition was produced by the same method as in Example 3 with the exception that 2,6-di-tert-butyl-4-methylphenol was used instead of IH-benzotriazole.
  • the obtained thermoconductive silicone rubber composition was evaluated in the same manner as in Example 3. The results are shown in Table 2.
  • thermoconductive silicone rubber composition was produced by the same method as in Example 3 with the exception that IH-benzotriazole was not added.
  • the obtained thermoconductive silicone rubber composition was evaluated in the same manner as in Example 3. The results are shown in Table 2. Table 2
  • thermoconductive silicone elastomer composition of the invention is characterized by a reduced tendency to the loss of curability during storage and when cured, forms a silicone elastomer of high thermal conductivity.

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  • Health & Medical Sciences (AREA)
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Abstract

L'invention concerne une composition d'élastomère silicone thermoconductrice comprenant : (A) un organopolysiloxane contenant au moins deux groupes alcényle liés au silicium par molécule, (B) un organopolysiloxane comprenant au moins deux atomes d'hydrogènes liés au silicium par molécule, (C) une charge thermoconductrice, (D) un composé phénol et/ou un composé benzotriazole, (E) un catalyseur platine et (f) un composé enyne et/ou un alcynol.
PCT/JP2003/011457 2002-11-21 2003-09-08 Composition d'elastomere silicone thermoconductrice WO2004046233A1 (fr)

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JP2002337566A JP4676671B2 (ja) 2002-11-21 2002-11-21 熱伝導性シリコーンエラストマー組成物
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US7393547B2 (en) 2001-04-11 2008-07-01 Helix Medical, Llc Antimicrobial elastomer composition and method for making
US7520897B2 (en) 2001-04-11 2009-04-21 Helix Medical, Llc Medical devices having antimicrobial properties
US8317861B2 (en) 2001-04-11 2012-11-27 Helix Medical, Llc Antimicrobial indwelling voice prosthesis
EP2892945B1 (fr) * 2012-09-07 2017-02-01 Dow Corning Toray Co., Ltd. Composition de silicone durcissable et dispositif semi-conducteur optique
CN107636078A (zh) * 2015-06-09 2018-01-26 信越化学工业株式会社 加成固化性硅橡胶组合物和固化物
CN109486191A (zh) * 2018-09-04 2019-03-19 苏州泰吉诺新材料科技有限公司 一种室温固化的高性能导热电磁屏蔽材料及其生产工艺
US10774184B2 (en) 2016-02-23 2020-09-15 Dow Silicones Corporation Low temperature cure silicone elastomer
US10844196B2 (en) 2016-10-26 2020-11-24 Shin-Etsu Chemical Co., Ltd. Thermally-conductive silicone composition
US11319412B2 (en) 2016-10-31 2022-05-03 Dow Toray Co., Ltd. Thermally conductive silicone compound
CN115637050A (zh) * 2021-07-20 2023-01-24 中蓝晨光化工研究设计院有限公司 一种导热硅氧烷组合物
CN115746362A (zh) * 2022-09-09 2023-03-07 东莞市零度导热材料有限公司 一种吸波导热片及其制备方法

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JP4803365B2 (ja) * 2006-02-22 2011-10-26 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法
JP5565758B2 (ja) * 2011-06-29 2014-08-06 信越化学工業株式会社 硬化性でグリース状の熱伝導性シリコーン組成物および半導体装置
KR101911690B1 (ko) * 2012-12-07 2018-10-25 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 광반도체 디바이스
JP6679870B2 (ja) * 2015-10-05 2020-04-15 三菱マテリアル株式会社 放熱シート
JP6943028B2 (ja) * 2017-06-15 2021-09-29 信越化学工業株式会社 熱伝導性シリコーン組成物
WO2019155846A1 (fr) * 2018-02-09 2019-08-15 信越化学工業株式会社 Composition de silicone thermoconductrice, produit durci, dispositif à semi-conducteur et procédé de production de dispositif à semi-conducteur
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