WO2003107496A1 - レーザ加工装置及び該加工装置の制御方法 - Google Patents
レーザ加工装置及び該加工装置の制御方法 Download PDFInfo
- Publication number
- WO2003107496A1 WO2003107496A1 PCT/JP2003/007574 JP0307574W WO03107496A1 WO 2003107496 A1 WO2003107496 A1 WO 2003107496A1 JP 0307574 W JP0307574 W JP 0307574W WO 03107496 A1 WO03107496 A1 WO 03107496A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pulse
- laser
- output
- thinning
- power
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/102—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/517,656 US7902482B2 (en) | 2002-06-14 | 2003-06-13 | Laser machining apparatus and control method for the apparatus |
KR1020047020238A KR100698953B1 (ko) | 2002-06-14 | 2003-06-13 | 레이저 가공장치 및 이 가공장치의 제어방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-173679 | 2002-06-14 | ||
JP2002173679A JP3846573B2 (ja) | 2002-06-14 | 2002-06-14 | レーザ加工装置及び該加工装置の制御方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003107496A1 true WO2003107496A1 (ja) | 2003-12-24 |
Family
ID=29727931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/007574 WO2003107496A1 (ja) | 2002-06-14 | 2003-06-13 | レーザ加工装置及び該加工装置の制御方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7902482B2 (ja) |
JP (1) | JP3846573B2 (ja) |
KR (1) | KR100698953B1 (ja) |
CN (1) | CN100344033C (ja) |
TW (1) | TWI223916B (ja) |
WO (1) | WO2003107496A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602005023981D1 (de) * | 2005-08-01 | 2010-11-18 | Agie Charmilles S A | Verfahren zum Betreiben einer Funkenerosionsmaschine und Funkenerosionsmaschine. |
US7244906B2 (en) * | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
US8173931B2 (en) * | 2008-06-13 | 2012-05-08 | Electro Scientific Industries, Inc. | Automatic recipe management for laser processing a work piece |
JP4942710B2 (ja) * | 2008-07-22 | 2012-05-30 | 三菱電機株式会社 | ガスレーザ用電源装置 |
JP5550648B2 (ja) * | 2009-07-27 | 2014-07-16 | 三菱電機株式会社 | 高周波電源装置 |
TWI393602B (zh) * | 2010-08-04 | 2013-04-21 | Hortek Crystal Co Ltd | 雷射加工製程裝置 |
WO2012053297A1 (ja) * | 2010-10-19 | 2012-04-26 | 三菱電機株式会社 | レーザ加工機制御装置およびレーザ加工機制御方法 |
JP5734158B2 (ja) * | 2011-10-19 | 2015-06-10 | 三菱電機株式会社 | レーザ加工機用電源装置 |
DE102012002470A1 (de) * | 2012-02-03 | 2013-08-08 | Iai Industrial Systems B.V. | CO2-Laser mit schneller Leistungssteuerung |
KR102163606B1 (ko) * | 2013-03-27 | 2020-10-08 | 고쿠리쓰다이가쿠호진 규슈다이가쿠 | 레이저 어닐링 장치 |
KR101628196B1 (ko) * | 2014-07-14 | 2016-06-09 | 한국원자력연구원 | 고에너지 레이저 시스템에서 주변기기 보호장치 |
ES2865411T3 (es) | 2014-11-24 | 2021-10-15 | Fotona D O O | Sistema láser para ablación de tejidos |
JP2018055864A (ja) * | 2016-09-27 | 2018-04-05 | 住友重機械工業株式会社 | 電線およびレーザ装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57186378A (en) * | 1981-05-11 | 1982-11-16 | Mitsubishi Electric Corp | Laser device |
JP2003243749A (ja) * | 2002-02-15 | 2003-08-29 | Mitsubishi Electric Corp | レーザ電源装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4128794A (en) * | 1977-10-11 | 1978-12-05 | The United States Of America As Represented By The United States Department Of Energy | Interferometric correction system for a numerically controlled machine |
JPS5878675U (ja) | 1981-11-21 | 1983-05-27 | 日本赤外線工業株式会社 | レ−ザ装置の電源装置 |
JPS58141689A (ja) * | 1982-02-18 | 1983-08-23 | Mitsubishi Electric Corp | モ−タ制御装置 |
JPH0311904A (ja) * | 1989-06-07 | 1991-01-21 | Mitsubishi Electric Corp | インバータの変調方法 |
JPH0522941A (ja) * | 1991-07-05 | 1993-01-29 | Hitachi Metals Ltd | 高力率コンバータ |
US5329215A (en) * | 1993-02-25 | 1994-07-12 | Ohio Electronic Engravers, Inc. | Apparatus and method for driving a leadscrew |
JPH07111427A (ja) * | 1993-10-08 | 1995-04-25 | Japan Radio Co Ltd | 電子ボリューム |
TW365559B (en) * | 1997-03-21 | 1999-08-01 | Mitsubishi Electric Corp | Gas laser machining apparatus |
JP2000126879A (ja) | 1998-10-26 | 2000-05-09 | Matsushita Electric Ind Co Ltd | レーザ加工装置およびその制御方法 |
JP2001086232A (ja) * | 1999-09-10 | 2001-03-30 | Toyo Commun Equip Co Ltd | 携帯端末のバックライトの制御方法 |
CN1138284C (zh) * | 2000-10-23 | 2004-02-11 | 中国科学院长春光学精密机械与物理研究所 | 片式电阻刻蚀的激光脉宽可调控制方法 |
JP3842665B2 (ja) | 2002-02-15 | 2006-11-08 | 株式会社日本自動車部品総合研究所 | ピエゾアクチュエータ制御装置およびそれを用いた燃料噴射制御システム |
-
2002
- 2002-06-14 JP JP2002173679A patent/JP3846573B2/ja not_active Expired - Lifetime
-
2003
- 2003-06-13 TW TW092116052A patent/TWI223916B/zh not_active IP Right Cessation
- 2003-06-13 KR KR1020047020238A patent/KR100698953B1/ko active IP Right Grant
- 2003-06-13 CN CNB038136880A patent/CN100344033C/zh not_active Expired - Lifetime
- 2003-06-13 WO PCT/JP2003/007574 patent/WO2003107496A1/ja active Application Filing
- 2003-06-13 US US10/517,656 patent/US7902482B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57186378A (en) * | 1981-05-11 | 1982-11-16 | Mitsubishi Electric Corp | Laser device |
JP2003243749A (ja) * | 2002-02-15 | 2003-08-29 | Mitsubishi Electric Corp | レーザ電源装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI223916B (en) | 2004-11-11 |
CN100344033C (zh) | 2007-10-17 |
US20060054602A1 (en) | 2006-03-16 |
TW200402916A (en) | 2004-02-16 |
CN1659751A (zh) | 2005-08-24 |
KR100698953B1 (ko) | 2007-03-23 |
US7902482B2 (en) | 2011-03-08 |
KR20050010904A (ko) | 2005-01-28 |
JP3846573B2 (ja) | 2006-11-15 |
JP2004022696A (ja) | 2004-01-22 |
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