WO2003098709A8 - Dispositif semi-conducteur comprenant une puce semi-conductrice - Google Patents

Dispositif semi-conducteur comprenant une puce semi-conductrice

Info

Publication number
WO2003098709A8
WO2003098709A8 PCT/JP2003/004821 JP0304821W WO03098709A8 WO 2003098709 A8 WO2003098709 A8 WO 2003098709A8 JP 0304821 W JP0304821 W JP 0304821W WO 03098709 A8 WO03098709 A8 WO 03098709A8
Authority
WO
WIPO (PCT)
Prior art keywords
lead
section
extends
semiconductor chip
sections
Prior art date
Application number
PCT/JP2003/004821
Other languages
English (en)
French (fr)
Other versions
WO2003098709A1 (fr
Inventor
Shinji Isokawa
Original Assignee
Rohm Co Ltd
Shinji Isokawa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd, Shinji Isokawa filed Critical Rohm Co Ltd
Priority to DE60320799T priority Critical patent/DE60320799D1/de
Priority to US10/521,301 priority patent/US7002185B2/en
Priority to KR1020047000385A priority patent/KR100966537B1/ko
Priority to EP03719117A priority patent/EP1528602B1/en
Publication of WO2003098709A1 publication Critical patent/WO2003098709A1/ja
Publication of WO2003098709A8 publication Critical patent/WO2003098709A8/ja

Links

Classifications

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    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Wire Bonding (AREA)
PCT/JP2003/004821 2002-05-21 2003-04-16 Dispositif semi-conducteur comprenant une puce semi-conductrice WO2003098709A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE60320799T DE60320799D1 (de) 2002-05-21 2003-04-16 Halbleitervorrichtung mit halbleiterchip
US10/521,301 US7002185B2 (en) 2002-05-21 2003-04-16 Semiconductor device using semiconductor chip
KR1020047000385A KR100966537B1 (ko) 2002-05-21 2003-04-16 반도체 칩을 사용한 반도체 장치
EP03719117A EP1528602B1 (en) 2002-05-21 2003-04-16 Semiconductor device using semiconductor chip

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-146657 2002-05-21
JP2002146657A JP3877642B2 (ja) 2002-05-21 2002-05-21 半導体チップを使用した半導体装置

Publications (2)

Publication Number Publication Date
WO2003098709A1 WO2003098709A1 (fr) 2003-11-27
WO2003098709A8 true WO2003098709A8 (fr) 2005-03-10

Family

ID=29545144

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/004821 WO2003098709A1 (fr) 2002-05-21 2003-04-16 Dispositif semi-conducteur comprenant une puce semi-conductrice

Country Status (8)

Country Link
US (1) US7002185B2 (ja)
EP (1) EP1528602B1 (ja)
JP (1) JP3877642B2 (ja)
KR (1) KR100966537B1 (ja)
CN (1) CN100362670C (ja)
DE (1) DE60320799D1 (ja)
TW (1) TWI261935B (ja)
WO (1) WO2003098709A1 (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080035947A1 (en) * 2003-12-09 2008-02-14 Weaver Jr Stanton Earl Surface Mount Light Emitting Chip Package
US20060081859A1 (en) * 2004-10-15 2006-04-20 Shyi-Ming Pan Light emitting semiconductor bonding structure and method of manufacturing the same
US8086082B2 (en) 2006-07-14 2011-12-27 Koninklijke Philips Electronics N.V. Methods for mounting an electro-optical component in alignment with an optical element and related structures
JP2008251936A (ja) * 2007-03-30 2008-10-16 Rohm Co Ltd 半導体発光装置
EP2001058A1 (en) * 2007-06-08 2008-12-10 Augux Co., Ltd. Solder-type light-emitting diode chip assembly and method of bonding a solder-type light-emitting diode chip
US8049236B2 (en) * 2008-09-26 2011-11-01 Bridgelux, Inc. Non-global solder mask LED assembly
US8058664B2 (en) * 2008-09-26 2011-11-15 Bridgelux, Inc. Transparent solder mask LED assembly
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TWI261935B (en) 2006-09-11
US7002185B2 (en) 2006-02-21
EP1528602B1 (en) 2008-05-07
CN100362670C (zh) 2008-01-16
TW200308105A (en) 2003-12-16
JP3877642B2 (ja) 2007-02-07
WO2003098709A1 (fr) 2003-11-27
KR20050007282A (ko) 2005-01-17
KR100966537B1 (ko) 2010-06-29
CN1545739A (zh) 2004-11-10
US20050242424A1 (en) 2005-11-03
DE60320799D1 (de) 2008-06-19
EP1528602A4 (en) 2006-08-30
EP1528602A1 (en) 2005-05-04

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